TA8221AHQ - Toshiba - Product.Network

TA8221AHQ / ALQ

2006-04-28

TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

TA8221AHQ,TA8221ALQ

30W BTL × 2Ch Audio Power Amplifier

The thermal resistance θj−T of TA8221AHQ, TA8221ALQ

package designed for low thermal resistance, has a high efficiency

of heat radiation.

The temperature rise of chip can be reduced, and the influence

from the degradation of the features due to the temperature rise

at the high output can also be reduced.

This stereo audio power IC, designed for car audio use, has two

built−in channels to reduce the characteristic difference between

L and R channels.

It also contains various kind of protection.

Features

• Low thermal resistance

: θj−T = 1.5°C / W (infinite heat sink)

• High power

: POUT (1) = 30W (typ.) / channel

(VCC = 14.4V, f = 1kHz, THD = 10%, RL =2Ω)

OUT (2) = 26W (typ.) / channel

(VCC = 13.2V, f = 1kHz, THD = 10%, RL = 2Ω)

OUT (3) = 19W (typ.) / channel

(VCC = 13.2V, f = 1kHz, THD = 10%, RL = 4Ω)

• Low distortion ratio: THD = 0.04% (typ.) (VCC = 13.2V, f = 1kHz, POUT = 1W, RL = 4Ω, GV = 50dB)

• Low noise: VNO = 0.30mVrms (typ.) (VCC = 13.2V, RL = 4Ω, GV 50dB, Rg = 0Ω, BW = 20Hz~20kHz)

• Built−in stand−by function (with pin(4) set at low, power is turned off.): ISB = 100µA (typ.)

• Built−in muting function (with pin(1) set at low, power is turned off.)

• Built−in various protection circuits

Protection circuits: Thermal shut down, Over voltage, Out→VCC short, Out→GND short and Out−Out short.

• Operating supply voltage: VCC (opr) = 9~18V

TA8221AHQ

TA8221ALQ

Weight

HZIP17−P−2.00 : 9.8g (typ.)

HSIP17−P−2.00 : 9.8g (typ.)

TA8221AHQ / ALQ

2006-04-28

Block Diagram

TA8221AHQ, TA8221ALQ (GV = 50dB)

Cautions And Application Method

(description is made only on the single channel.)

1. Voltage gain adjustment

This IC has the amplifier construction as shown Fig.1. The pre−amp (amp 1) is provided to the primary stage,

and the input voltage is amplified by the flat amps, amp 3 and amp 4 of each channel through the phase amp

(amp 2).

Since the input offset is prevented by pre−amp when VCC is set to on, this circuit can remarkably reduce the pop

noise.

TA8221AHQ / ALQ

2006-04-28

The total closed loop gain GV of this IC can be obtained by expression below when the closed loop voltage gain of

amp 1 is GV1.

(dB)

R2)

(R R1

og20

G+

=l ..... (1)

The closed loop voltage gain of power amp, amp 3

and amp 4 is fixed at GV3≒GV4 = 20dB.

Therefore, the total closed circuit voltage gain GV is

obtained through BTL connection by the expression

below.

V = GV1 + GV3 + 6 (dB) ............... (2)

For example, when Rf = 0Ω, GV is obtained by the

expressions (1) and (2) as shown below.

V≒24 + 20 + 6 = 50dB

The voltage gain is reduced when Rf is increased. (Fig.2)

With the voltage gain reduced, since (1) the oscillation

stability is reduced, and (2) the pop noise changes when

VCC is set to on, refer to the items 3 and 4.

2. Stand−by SW function

By means of controlling pin(4) (stand−by terminal) to high

and low, the power suply can be set to on and off.

The threshold voltage of pin(4) is set at 2.1V (3VBE.),

and the power supply current is about 100µA (typ.) at the

stand−by state.

Control voltage of pin(4): V (SB)

Stand−by Power V

(SB) (V)

On Off 0~2

Off On 3~VCC

Advantage of stand−by SW

(1) Since VCC can directly be controlled to on / off by the microcomputer, the switching relay can be omitted.

(2) Since the control current is microscopic, the switching relay of small current capacity is satisfactory for

switching.

TA8221AHQ / ALQ

2006-04-28

3. Preventive measure against oscillation

For preventing the oscillation, it is advisable to use C4, the condenser of polyester film having small

characteristic fluctuation of the temperature and the frequency.

The condenser (C6) between input and GND is effective for preventng oscillation which is generated with a

feedback signal from an output stage.

The resistance R to be series applied to C4 is effective for phase correction of high frequency, and improves the

oscillation allowance.

(1) Voltage gain to be used (GV setting)

(2) Capacity value of condenser

(3) Kind of condenser

(4) Layout of printed board

In case of its use with the voltage gain GV reduced or with the feedback amount increased, care must be taken

because the phase−inversion is caused by the high frequency resulting in making the oscillation liable generated.

4. Adjustment of output offset (when the power supply turn on)

As this IC is contructed with DC circuit on the primary stage, it is necessary to lower a input offset or output

offset by agreement with the each leading edge time constant of the input voltage in the primary stage and NF

terminal voltage.

Concretely, monitor the output DC voltage and vary the capacity value in input condenser and NF condenser (see

Fig.4)

(reference) In case of setting the condition (GV = 40dB) with Rf = 470Ω.

TA8221AHQ / ALQ

2006-04-28

5. Muting function

Through setting pin(1) (mute terminal) at about 1V or less, muting

becomes possible.

The interval circuit of IC is shown in Fig.5.

When pin(1) is set to low, Q1 and Q2 are turned to on, the charge

of the ripple condenser is discharged and the bias is cut. The mute

amount of 60dB or over can be obtained.

Since this muting function rapidly discharge the charge of the ripple

filter capacitor of pin(8), the pop noise is generated by the DC

fluctuation of the bias section.

Therefore, this muting function is not appropriate to the audio muting but it

is effective in muting at VCC→on.

6. Rapid ripple discharging circuit at the time of VCC off

This circuit is effective in such a mode where the VCC and the stand−by terminals become high / low

simultaneously ; for instance, for a pop noise produced when the power is turned on / off repeatedly by operating

the ignition key.

If VCC is off, VCC≒7V is detected internally on IC and

(1) The power stage bias circuit is cut, and

(2) Pin(8) : Ripple capacitor is rapidly discharged by turning Q3 on and then Q1 and Q2 on.

(Precaution 1)

When the stand−by terminal was put to the low level after the ripple rapid

discharging circuit was operated (VCC≒7V) at the time when VCC was turned

off, a pop noise may be generated. Therefore, VCC which makes the stand−by

terminal low shall be set at 8V or above so that (1) the stand−by terminal is

put at the low level and (2) the ripple rapid discharging circuit is turned on

when VCC is turned off (in order of (1) and (2)).

An example of application is shown in (Fig.7).

TA8221AHQ / ALQ

2006-04-28

(Precaution 2)

If the falling time constant of the VCC line is large (the fall is gentle), the pop noise may become worse.

In this case, it is possible to prevent the pop noise from beoming worse by reducing the capacity of "ripple rapid

discharging circuit at the time of VCC off" accordign to the following steps :

(a) Short pin(1) (mute terminal) and pin(8) (ripple terminal).

(b) Increase the capacity of ripple capacitor of pin(8).

However, it shall be kept in mind that the time for turning the power on becomes longer as the result of step

(b).

7. External parts list and description

Influence

Sym−

bol

Recom−

mended

Value

Feature Smaller Than

Recommended Value

Larger Than

Recommended Value

Remarks

C1 4.7µF DC blocking Related to pop noise at VCC→on. Related to gain.

Refer to item 4.

Related to pop noise at VCC→on.

C2 47µF

Feedback

condenser

Determination of low cut−off frequency.

C2 =

・・π

C3 220µF

Ripple

reduction

Time constant is small

at VCC→on or off.

Time constant is large

at VCC→on or off.

C4 0.12µF

Oscillation

prevention

Made liable to

oscillate. Oscillation allowance Refer to item 3.

C5 1000µF Ripple filter

For filtering power supply hum and ripple.

Large at using AC rectified power supply.

Small at using DC power supply.

C6 1000PF Oscillation

prevention

Oscillation allowance improved.

Noise reduction Refer to item 3.

TA8221AHQ / ALQ

2006-04-28

Absolute Maximum Ratings (Ta = 25°C)

Characteristic Symbol Rating Unit

Peak supply voltage (0.2s) VCC (surge) 50 V

DC supply voltage VCC (DC) 25 V

Operating supply voltage VCC (opr) 18 V

Output current (peak) IO (peak) 9 A

Power dissipation PD 50 W

Operating temperature Topr −30~85 °C

Storage temperature Tstg −55~150 °C

Electrical Characteristics

(unless otherwise specified, VCC = 13.2V, RL = 4Ω, f = 1kHz, Ta = 25°C)

Characteristic Symbol

Test

Cir−

cuit

Test Condition Min. Typ. Max. Unit

Quiescent supply current ICCQ ― V

IN = 0 ― 120 250 mA

POUT (1) ― VCC = 14.4V, RL = 2Ω,

THD = 10% ― 30 ―

POUT (2) ― R

L = 2Ω, THD = 10% 17 26 ―

Output power

POUT (3) ― THD = 10% 16 19 ―

Total harmonic distortion THD ― P

OUT = 1W ― 0.04 0.4 %

Voltage gain GV ― ― 48 50 52 dB

Voltage gain ratio ∆GV ― ― −1.0 0 1.0 dB

Output noise voltage VNO ― Rg = 0Ω,

BW = 20Hz~20kHz ― 0.3 0.7 mVrms

Ripple rejection ratio R.R. ― fripple = 100Hz,

Rg = 600Ω 40 54 ― dB

Input resistance RIN ― ― ― 30 ― kΩ

Output offset voltage Voffset ― V

IN = 0 −100 0 100 mV

Current at stand−by state ISB ― ― ― 100 150 µA

Cross talk C.T. ― Rg = 600Ω,

VOUT = 0.775Vrms (0dBm) ― 60 ― dB

Pin(4) control voltage VSB ― Stand−by → off

(power→on) 2.5 ― V

CC V

Pin(1) control voltage V (mute) ― Mute→on

(power→off) ― 1.0 2.0 V

TA8221AHQ / ALQ

2006-04-28

Test circuit

TA8221AHQ, TA8221ALQ (GV = 50dB)

TA8221AHQ / ALQ

2006-04-28

TA8221AHQ / ALQ

2006-04-28

TA8221AHQ / ALQ

2006-04-28

TA8221AHQ / ALQ

2006-04-28

Package Dimensions

Weight : 9.8g (typ.)

TA8221AHQ / ALQ

2006-04-28

Package Dimensions

Weight : 9.8g (typ.)

TA8221AHQ / ALQ

2006-04-28

TA8221AHQ / ALQ

2006-04-28

• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over

current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or

load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the

effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time

and insertion circuit location, are required.

• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or

the negative current resulting from the back electromotive force at power OFF. For details on how to connect a

protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual

IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.

• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection

function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

• Carefully select external components (such as inputs and negative feedback capacitors) and load components

(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as

input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to

a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over

current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

• Over current Protection Circuit

Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all

circumstances. If the Over current protection circuits operate against the over current, clear the over current status

immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum

ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In

addition, depending on the method of use and usage conditions, if over current continues to flow for a long time

after operation, the IC may generate heat resulting in breakdown.

• Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits

operate against the over temperature, clear the heat generation status immediately. Depending on the method of

use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit

to not operate properly or IC breakdown before operation.

• Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, please design the device so that

heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in

IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into

considerate the effect of IC heat radiation with peripheral components.

• Installation to Heat Sink

Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive

mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC

chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of

silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and

heat sink installation, refer to individual technical datasheets or IC databooks.

TA8221AHQ / ALQ

2006-04-28

RESTRICTIONS ON PRODUCT USE 060116EBF

• The information contained herein is subject to change without notice. 021023_D

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc. 021023_A

• The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk. 021023_B

• The products described in this document shall not be used or embedded to any downstream products of which

manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q

• The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which

may result from its use. No license is granted by implication or otherwise under any patent or patent rights of

TOSHIBA or others. 021023_C

• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E

• This product generates heat during normal operation. However, substandard performance or malfunction may

cause the product and its peripherals to reach abnormally high temperatures.

The product is often the final stage (the external output stage) of a circuit. Substandard performance or

malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the

product. 030619_R

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux