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Product group:
Heatsinks and active heatsinks for processors > Pin heatsinks
Pin heatsinks /
ICK S R 32,5 x 10
Ø 32,5 x 10 mm, pin heatsinks round
Parameters of article ICK S R 32,5 x 10
Bauform
Rund
R
th
[K/W]
5.54
dissipation loss
[W]
9
mounting method
therm. conductive foil / therm. cond.
adhesive
socket
universal
suitable for processor type
universal
Ø
[mm]
32.5
heigth
[mm]
10
plate thickness
[mm]
3
weight
[g]
9.7
Technical
Drawing
Accessories/ related articles
Thermally conductive foil both sides adhesive /
WLFT 404 D 32
Thermally conductive foil both sides adhesive /
WLFT 405 D 32
Download CAD Drawing
PDF
DXF
IGS
http://www.fischerelektronik.de/index.php?id=114&L=12/27/2010 2:25:35 PM
ICK S R 32,5X
10
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