PE42723 Document Category: Product Specification UltraCMOS(R) SPDT RF Switch, 5-1794 MHz Features Figure 1 * PE42723 Functional Diagram * Supports DOCSIS 3.0/1 requirements * Exceptional harmonics RFC 2fo of -121 dBc @ 17 MHz 3fo of -140 dBc @ 17 MHz * Best in class linearity across frequency band * Low insertion loss and high isolation performance RF1 RF2 Insertion loss of 0.3 dB @ 1218 MHz Isolation of 54 dB @ 204 MHz * High ESD performance of 3 kV HBM CMOS Control Driver * Packaging - 12-lead 3 x 3 x 0.75 mm QFN V1 Applications * Broadband market (DOCSIS 3.0/1) Cable modem Set-top box Residential gateway * Filter bank switching * Relay replacement between DOCSIS 3.0 and DOCSIS 3.1 configurations Product Description The PE42723 is a HaRPTM technology-enhanced reflective SPDT RF switch designed for use in cable applications including DOCSIS 3.0/1 cable modem, set-top box and residential gateway. It delivers high linearity and excellent harmonics performance in the 5-1794 MHz band. It also features low insertion loss and high isolation performance making the PE42723 ideal for DOCSIS 3.1 applications. The PE42723 is manufactured on Peregrine's UltraCMOS(R) process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. (c)2015-2016, Peregrine Semiconductor Corporation. All rights reserved. * Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121 Product Specification DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Absolute Maximum Ratings Exceeding absolute maximum ratings listed in Table 1 may cause permanent damage. Operation should be restricted to the limits in Table 2. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. ESD Precautions When handling this UltraCMOS device, observe the same precautions as with any other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified in Table 1. Latch-up Immunity Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. Table 1 * Absolute Maximum Ratings for PE42723 Parameter/Condition Min Max Unit Supply voltage, VDD -0.3 5.5 V Digital input voltage, V1 -0.3 3.6 V 86 dBmV +150 C ESD voltage HBM(1), all pins 3000 V ESD voltage CDM(2), all pins 500 V RF input power, 75 Storage temperature range -65 Notes: 1) Human body model (MIL-STD 883 Method 3015). 2) Charged device model (JEDEC JESD22-C101). Page 2 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Recommended Operating Conditions Table 2 lists the recommended operating conditions for the PE42723. Devices should not be operated outside the operating conditions listed below. Table 2 * Recommended Operating Conditions for PE42723 Parameter Supply voltage, VDD Min Typ Max Unit 2.3 3.3 5.5 V 130 200 A Supply current, IDD Digital input high, V1 1.17 3.6(1) V Digital input low, V1 -0.3 0.6 V RF input power, CW(2) 80 dBmV RF input power, peak(3) 85 dBmV +85 C Operating temperature range -40 +25 Notes: 1) Maximum digital input voltage is limited to VDD and cannot exceed 3.6V. 2) 100% duty cycle, 75. 3) OFDMA DOCSIS 3.1, single channel, 75. DOC-64524-5 - (01/2016) Page 3 www.psemi.com PE42723 SPDT RF Switch Electrical Specifications Table 3 provides the PE42723 key electrical specifications @ +25 C, VDD = 3.3V, ZS = ZL = 75, unless otherwise specified. Table 3 * PE42723 Electrical Specifications Parameter Path Condition Operating frequency Insertion loss(1) Isolation Return loss(1) 2nd harmonic, 2fo 3rd harmonic, 3fo Input 0.1dB compression point(2) Switching time Min Typ 5 Unit 1794 MHz 0.20 0.45 dB dB dB RFC-RFX 5-204 MHz 204-1218 MHz 1218-1794 MHz All paths 5-204 MHz 204-612 MHz 612-1218 MHz 1218-1794 MHz 50 40 36 54 44 38 34 dB dB dB dB RFC-RFX 5-204 MHz 204-612 MHz 612-1218 MHz 1218-1794 MHz 25 18 30 22 14 13 dB dB dB dB fo = 17 MHz Average PCW = 65 dBmV -121 dBc fo = 170 MHz Average PCW = 65 dBmV -121 dBc fo = 900 MHz Average PCW = 65 dBmV -121 dBc fo = 17 MHz Average PCW = 65 dBmV -140 dBc fo = 170 MHz Average PCW = 65 dBmV -132 dBc fo = 900 MHz Average PCW = 65 dBmV -135 dBc 5-1218 MHz 87 dBmV 50% CTRL to 90% or 10% RF 35 s RFX RFX RFC-RFX 0.10 0.30 0.40 Max Notes: 1) High frequency performance can be improved by external matching (see Figure 12-Figure 15). 2) The input 0.1dB compression point is a linearity figure of merit. Refer to Table 2 for the operating RF input power (75). Page 4 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Switching Frequency Control Logic The PE42723 has a maximum 10 kHz switching frequency. Switching frequency describes the time duration between switching events. Switching time is the time duration between the point the control signal reached 50% of the final value and the point the output signal reaches within 10% or 90% of its target value. Table 5 provides the control logic truth table for the PE42723. Table 5 * Truth Table for PE42723 Spurious Performance State V1 RFC-RF1 H RFC-RF2 L The PE42723 spur fundamental occurs around 10 MHz. Its typical performance is -154 dBm/Hz (V1 = H) and -165 dBm/Hz (V1 = L), with 100 kHz bandwidth. Thermal Data Psi-JT (JT), junction top-of-package, is a thermal metric to estimate junction temperature of a device on the customer application PCB (JEDEC JESD51-2). JT = (TJ - TT)/P where JT = junction-to-top of package characterization parameter, C/W TJ = die junction temperature, C TT = package temperature (top surface, in the center), C P = power dissipated by device, Watts Table 4 * Thermal Data for PE42723 Parameter Maximum junction temperature, TJMAX (RF input power, CW = 80 dBmV, +85C ambient) JT Typ Unit 90 C 21 C/W DOC-64524-5 - (01/2016) Page 5 www.psemi.com PE42723 SPDT RF Switch Typical Performance Data Figure 2-Figure 11 show the typical performance data @ +25 C, VDD = 3.3V, ZS = ZL = 75, unless otherwise specified. Figure 2 * Insertion Loss vs Temperature (RFC-RFX)(*) -40 C +25 C +85 C 0 Insertion Loss (dB) -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.6 1.8 2 Frequency (GHz) Note: * High frequency performance can be improved by external matching (see Figure 12-Figure 15). Figure 3 * Insertion Loss vs VDD (RFC-RFX)(*) 2.3V 3.3V 5.5V 0 Insertion Loss (dB) -0.5 -1 -1.5 -2 -2.5 -3 -3.5 -4 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Frequency (GHz) Note: * High frequency performance can be improved by external matching (see Figure 12-Figure 15). Page 6 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Figure 4 * RFC Port Return Loss vs Temperature(*) -40 C +25 C +85 C 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.6 1.8 2 Frequency (GHz) Note: * High frequency performance can be improved by external matching (see Figure 12-Figure 15). Figure 5 * RFC Port Return Loss vs VDD(*) 2.3V 3.3V 5.5V 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Frequency (GHz) Note: * High frequency performance can be improved by external matching (see Figure 12-Figure 15). DOC-64524-5 - (01/2016) Page 7 www.psemi.com PE42723 SPDT RF Switch Figure 6 * Active Port Return Loss vs Temperature(*) -40 C +25 C +85 C 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.6 1.8 2 Frequency (GHz) Note: * High frequency performance can be improved by external matching (see Figure 12-Figure 15). Figure 7 * Active Port Return Loss vs VDD(*) 2.3V 3.3V 5.5V 0 -5 Return Loss (dB) -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Frequency (GHz) Note: * High frequency performance can be improved by external matching (see Figure 12-Figure 15). Page 8 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Figure 8 * Isolation vs Temperature (RFX-RFX) -40 C +25 C +85 C 0 -10 Isolation (dB) -20 -30 -40 -50 -60 -70 -80 -90 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.6 1.8 2 Frequency (GHz) Figure 9 * Isolation vs VDD (RFX-RFX) 2.3V 3.3V 5.5V 0 -10 Isolation (dB) -20 -30 -40 -50 -60 -70 -80 -90 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Frequency (GHz) DOC-64524-5 - (01/2016) Page 9 www.psemi.com PE42723 SPDT RF Switch Figure 10 * Isolation vs Temperature (RFC-RFX) -40 C +25 C +85 C 0 -10 Isolation (dB) -20 -30 -40 -50 -60 -70 -80 -90 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 1.6 1.8 2 Frequency (GHz) Figure 11 * Isolation vs VDD (RFC-RFX) 2.3V 3.3V 5.5V 0 -10 Isolation (dB) -20 -30 -40 -50 -60 -70 -80 -90 0 0.2 0.4 0.6 0.8 1 1.2 1.4 Frequency (GHz) Page 10 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch High Frequency Performance with External Matching High frequency insertion loss and return loss can be improved by inductive matching on the RF ports in the customer application board layout. Figure 12 is a matching network using a 2.2 nH inductor on each RF port. The inductor needs to be placed as close to the device under test (DUT) as possible. Figure 13-Figure 15 show the insertion loss and return loss improvement using a 2.2 nH inductor on RFC port and a 2.2 nH on RF1, RF2 and RFC ports, respectively. Figure 12 * PE42723 Matching Network DUT L = 2.2 nH L = 2.2 nH SPDT PE42723 RF1 RF2 L = 2.2 nH RFC Figure 13 * Insertion Loss (RFC-RFX) With or Without Matching(*) No Matching RFC Matched Only All RF Ports Matched 0 Insertion Loss (dB) -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 -0.8 -0.9 -1 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Frequency (GHz) Note: * For reference only. DOC-64524-5 - (01/2016) Page 11 www.psemi.com PE42723 SPDT RF Switch Figure 14 * RFC Port Return Loss With or Without Matching(*) No Matching RFC Matched Only All RF Ports Matched 0 Return Loss (dB) -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Frequency (GHz) Note: * For reference only. Figure 15 * Active Port Return Loss With or Without Matching(*) No Matching RFC Matched Only All RF Ports Matched 0 Return Loss (dB) -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 Frequency (GHz) Note: * For reference only. Page 12 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Evaluation Kit The PE42723 evaluation board was designed to ease customer evaluation of the PE42723 RF switch. The RF common port is connected through a 75 transmission line via the F-Type connector, J3. RF1 and RF2 ports are connected through 75 transmission lines via F-Type connectors J1 and J2, respectively. A 75 through transmission line is available via F-Type connectors J4 (THRU left) and J5 (THRU right), which can be used to deembed the loss of the PCB. J6 provides DC and digital inputs to the device. Figure 16 * Evaluation Kit Layout for PE42723 DOC-64524-5 - (01/2016) Page 13 www.psemi.com PE42723 SPDT RF Switch Pin Information Table 6 * Pin Descriptions for PE42723 This section provides pinout information for the PE42723. Figure 17 shows the pin map of this device for the available package. Table 6 provides a description for each pin. 1, 3, 7, 9, 10, 12 GND Ground 2 RF1(*) RF port 1 4 NC Do not connect 5 VDD Supply voltage (nominal 3.3V) 6 V1 Digital control logic input 1 8 RF2(*) RF port 2 11 RFC(*) RF common Pad GND GND Pin Name 10 6 3 V1 GND Exposed Ground Pad 5 2 VDD RF1 4 1 NC GND 11 12 GND Pin 1 Dot Marking RFC Figure 17 * Pin Configuration (Top View) Pin No. 9 GND 8 RF2 7 GND Description Exposed pad: ground for proper operation Note: * RF pins 2, 8 and 11 must be at 0 VDC. The RF pins do not require DC blocking capacitors for proper operation if the 0 VDC requirement is met. Page 14 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Packaging Information This section provides packaging data including the moisture sensitivity level, package drawing, package marking and tape-and-reel information. Moisture Sensitivity Level The moisture sensitivity level rating for the PE42723 in the 12-lead 3 x 3 x 0.75 mm QFN package is MSL1. Package Drawing Figure 18 * Package Mechanical Drawing for 12-lead 3 x 3 x 0.75 mm QFN 0.10 C A PIN #1 CORNER 3.00 0.50 (x8) (2X) B 0.400.05 (x12) 0.85 (x12) 1 9 10 12 12 10 1 9 1.65 1.600.05 3.00 7 3 0.25 (x12) 0.10 C (2X) 4 6 BOTTOM VIEW 0.10 C 0.750.05 0.05 C 0.10 0.05 1.65 2.90 Ref. SIDE VIEW 0.05 MAX RECOMMENDED LAND PATTERN C A B C ALL FEATURES SEATING PLANE 6 4 1.600.05 TOP VIEW 2.90 Ref. 3 7 0.230.05 (x12) 0.20 0.50 (x8) C Third Angle Projection Unless otherwise specified dimensions are in millimeters DECIMAL ANGULAR X.X 0.1 1 X.XX 0.05 X.XXX 0.030 Interpret dimensions and tolerance per ASME Y14.5 - 1994 DOC-64524-5 - (01/2016) Page 15 www.psemi.com PE42723 SPDT RF Switch Top-Marking Specification Figure 19 * Package Marking Specifications for PE42723 42723 YYWW ZZZZZZ = YY = WW = ZZZZZZ = Pin 1 indicator Last two digits of assembly year Assembly work week Assembly lot code (maximum six characters) Tape and Reel Specification Figure 20 * Tape and Reel Specifications for 12-lead 3 x 3 x 0.75 mm QFN Direction of Feed Section A-A P1 P0 see note 1 T P2 see note 3 D1 D0 A E F see note 3 B0 A0 K0 A W0 Notes: A0 B0 K0 D0 D1 E F P0 P1 P2 T W0 3.30 3.30 1.10 1.50 + 0.1/ -0.0 1.5 min 1.75 0.10 5.50 0.05 4.00 8.00 2.00 0.05 0.30 0.05 12.00 0.3 1. 10 Sprocket hole pitch cumulative tolerance 0.2 2. Camber in compliance with EIA 481 3. Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole Pin 1 Device Orientation in Tape Page 16 DOC-64524-5 - (01/2016) www.psemi.com PE42723 SPDT RF Switch Ordering Information Table 7 lists the available ordering codes for the PE42723 as well as available shipping methods. Table 7 * Order Codes for PE42723 Order Codes Description Packaging Shipping Method PE42723A-Z PE42723 SPDT RF switch 12-lead 3 x 3 x 0.75 mm QFN 3000 units/T&R EK42723-01 PE42723 Evaluation kit Evaluation kit 1/Box Document Categories Advance Information Product Brief The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. This document contains a shortened version of the datasheet. For the full datasheet, contact sales@psemi.com. Preliminary Specification Not Recommended for New Designs (NRND) This product is in production but is not recommended for new designs. The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). End of Life (EOL) This product is currently going through the EOL process. It has a specific last-time buy date. Obsolete This product is discontinued. Orders are no longer accepted for this product. Sales Contact For additional information, contact Sales at sales@psemi.com. Disclaimers The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. Patent Statement Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com Copyright and Trademark (c)2015-2016, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Product Specification www.psemi.com DOC-64524-5 - (01/2016)