FUJITSU SEMICONDUCTOR
DATA SHEET DS07-20101-7E
Resonator
Piezoelectric Resonator
FAR F amil y (C1, C3, C4 series)
■DESCRIPTION
Fujitsu resonators (C1, C3, C4 series) feature originally developed single crystals with a high electromechanical
coupling coefficient (LiTaO3: lithium tantalate , LiNbO3: lithium niobate), the result is compact packaging. Three
series are available: the C3 and C4 series with built-in capacitors for high integration, for exclusive use in
microcomputer clocks; and the C1 series for high precision. All series include the CHIP type device for surface-
mount and the SIP type device for general PC boards.
■FEATURES
• Surface-mount technology can be applied to the CHIP type to increase packaging density. The SIP type is
only half the height of conventional quartz crystal resonators, and can be easily mounted on general PC boards.
• The C3 and C4 series have been developed for exclusive use in microcomputer clocks. They have built-in
capacitors, and the number of components has been reduced to one-third of that of conventional circuits.
• Both the SIP and CHIP types can be shipped in taped packages for automatic mounting.
• The resonators have superior shock and vibration resistance, preventing damage during automatic insertion
process.
■PACKAGE
2
FAR Family (C1, C3, C4 series)
■STANDARD CHARACTERISTICS
*: The capacity of the built-in capacitor is 20±8 pF by standard.
10±4 pF and 30±8 pF types are also av ailab le . Ho wever, the char acteristics of 10±4 pF and 30±8 pF types are specified by
Fujitsu, considering matching data with applied IC (mainly microcomputer).
Series C1 series C3 series C4 series
Parameter
Material Lithium Tantalate (LiTaO3) Lithium Niobate (LiNbO3)
Frequency 3.58 to 16 MHz 3 to 16 MHz
Standard frequency See “■ Standard frequency.”
Initial frequency
tolerance
±0.05% (G)
±0.1% (J)
±0.3% (K)
±0.5% (M)
±0.1% (J)
±0.3% (K)
±0.5% (M)
±0.5% (M)
±0.3% (K)
±1% (L)
Temperature
characteristics
(–20 to 60°C) ±0.02% ±0.05% ±0.5%
Capacity of built-in
capacitor — 20±8 pF (standard)*
Aging stability Within ±0.1%
Operating temperature –30 to 85°C
Storage temperature –40 to 100°C
Standard measuring
circuit
R
30 pF
R:
Resonator
75 Ω75 Ω
OSC LM
(Resonant frequency and serial
resonant resistance)
3 MHz to 10 MHz max.
IC; 1/6MB84069B x 2
10 MHz to 16 MHz
IC; MC74HC04
VCC; 5 VDC
R; Resonator
C1, C2: Loading capacitors
(built-in)
R: Resonator
C1C2
1 MΩ
R
FAR
R
75 Ω75 Ω
C1C2
LM
(Serial resonant resistance)
(Oscillation frequency)
OSC
3
FAR Family (C1, C3, C4 series)
■STANDARD FREQUENCY
• Package sizes and resonant resistance
There are two package sizes according to frequency:
For resonant resistance, standard values are specified according to frequency:
Note: For resonant resistance other than the standard values, they are specified by Fujitsu considering matching data with
applied IC (mainly micro computer).
■NOTES ON USE
• Handle carefully.
• Solder under the following conditions.
CHIP type: 5 seconds max. at 230°C (PCB)
SIP type: 10 seconds max. at 260°C
Do not apply extreme heat to the resonator. Recommended preheating for the CHIP type is 150°C for one
minute.
• Avoid extreme fluctuations in temperature during use.
• There is no specific direction in resonator mounting.
• Additional information is available separately, if required, for designing microcomputer oscillation circuits.
• CHIP type is for reflow solder, not for flow solder.
Standard
frequency (kHz)
C1/C3 series C4 series
Package
size Resonant
resistance Package
size Resonant
resistance
3,580
4,000
4,194
4,915
A
A
A
A
300 Ω max.
(00)
A
A
A
A
150 Ω max.
(01)
6,000
6,144
7,373
8,000
10,000
11,000
11,059
12,000
14,746
16.000
B
B
B
B
B
B
B
B
B
B
150 Ω max.
(01)
B
B
B
B
B
B
B
B
B
B
75 Ω max.
(02)
Frequency Package size
3 to 5.99 MHz A
6 to 16 MHz B
Frequency Standard resonant resistance
C1/C3 series C4 series
3 to 3.57 MHz — 300 Ω max.
(00)
3.58 to 5.99 MHz 300 Ω max.
(00) 150 Ω max.
(01)
6 to 16 MHz 150 Ω max.
(01) 75 Ω max.
(02)
4
FAR Family (C1, C3, C4 series)
■PART NUMBERING SYSTEM
(1) Series
(2) Package type
(3) Package size
See Table 1 in “■ Dimensions.”
(4) Frequency (kHz)
(5) Initial tolerance of frequency
See “■ Standard Frequency.”
Series Single crystal Capacitor
C1 LiTaO3—
C3 LiTaO3With built-in capacitors
C4 LiNbO3With built-in capacitors
Specification Type
CCHIP
SSIP
Specification Size
A Large
BSmall
Frequency Designation Frequency Designation Frequency Designation Frequency Designation
3,580 kHz 03580 6,000 kHz 06000 10,000 kHz 10000 14,746 kHz 14746
4,000 kHz 04000 6,144 kHz 06144 11,000 kHz 11000 16,000 kHz 16000
4,194 kHz 04194 7,373 kHz 07373 11,059 kHz 11059
4,195 kHz 04915 8,000 kHz 08000 12,000 kHz 12000
Specification Tolerance C1 series C3 series C4 series
G ±0.05% available — —
J ±0.1% available available —
K ±0.3% available available available
M ±0.5% avaialble available available
L ±1% — — available
(1)
FAR (2) (3) (4) (5) (6) (7) (8)
5
FAR Family (C1, C3, C4 series)
(6) Capacity of built-in capacitor
Note: For C1 series, only “0” is available.
(7) Resonant resistance
(8) User-specific Special Symbols
(9)Taping specification
• SIP type
•CHIP type
Specification Capacitance
0 20±8 pF
1 10±4 pF
2 30±8 pF
Specification Resonant resistance
0 300 Ω max.
1 150 Ω max.
2 75 Ω max.
Specification Description
Name No specification, no taping specification
— No specification, with taping specification
A to Z Serial number for custom design
Specification Description
–T Reel pack
–U Ammo pack
Specification Description
–R 16 mm carrier pack
6
FAR Family (C1, C3, C4 series)
■MARKING
Data code (EIAJ standard) is specified as follows in a four-year cycle.
Year Month Symbol Year Month Symbol Year Month Symbol Year Month Symbol
1977
1981
1985
1989
1993
1A
1978
1982
1986
1990
1994
1N
1979
1983
1987
1991
1995
1a
1980
1984
1988
1992
1996
1n
2B 2P 2b 2
3C 3Q 3 3
4D 4R 4d 4r
5E 5E 5e 5
6F 6T 6f 6t
7G 7U 7 7u
8H 8V 8 8
9J 9W 9j 9
10 K 10 X 10 10
11 L 11 Y 11 11
12 M 12 Z 12 12
F4000
Tkm
Fujitsu’s parts abbreviation
Frequency (kHz)
Lot No. (Date of manufacture,
conforms to EIAJ)
Initial frequency tolerance
Characteristics:
T: LiTaO3 N: LiNbO3
(SIP type)
F1200 T k m
Fujitsu’s parts abbreviation
Frequency (kHz)
Lot No. (Date of manufacture,
conforms to EIAJ)
Initial frequency tolerance
Characteristics:
T: LiTaO3 N: LiNbO3
(CHIP type)
The stamp color varies with the capacity of the capacitor.
Capacitance Marking clolr
10 pF Yellow
20 pF White
30 pF Gray
7
FAR Family (C1, C3, C4 series)
■PIN ASSIGNMENT
3
•C1 series SIP type CHIP type
(Equivalent circuit)
•C3 and C4 series SIP type CHIP type
(Equivalent circuit)
12
3
12
12
12
3
12
1
2
8
FAR Family (C1, C3, C4 series)
■DIMENSIONS
Table 1 Package size
Type L L1WH a
Two terminal Three terminal
SIP type A11.0 ± 0.2
(0.433 ± 0.008) —4.3 ± 0.2
(0.169 ± 0.008) 6.3 ± 0.2
(0.248 ± 0.008)
5.08 ± 0.2
(0.200 ± 0.008) 2.54 ± 0.2
(0.100 ± 0.008)
B9.0 ± 0.2
(0.354 ± 0.008) —4.3 ± 0.2
(0.169 ± 0.008) 5.3 ± 0.2
(0.209 ± 0.008)
CHIP type A10.0 ± 0.5
(0.394 ± 0.020) 9.4 ± 0.2
(0.370 ± 0.008) 4.5 ± 0.5
(0.177 ± 0.020) 2.5 ± 0.3
(0.098 ± 0.012)
B8.0 ± 0.5
(0.315 ± 0.020) 7.4 ± 0.2
(0.291 ± 0.008) 3.2 ± 0.5
(0.126 ± 0.020) 2.5 ± 0.3
(0.098 ± 0.012)
H
WL
a
0.5 ± 0.2
(0.020 ± 0.008)
0.35 ± 0.1
(0.014 ± 0.004)
3.4 ± 0.2
(0.134 ± 0.008)
H
WL
a
0.5 ± 0.2
(0.020 ± 0.008)
0.35 ± 0.1
(0.014 ± 0.004)
3.4 ± 0.2
(0.134 ± 0.008)
a
C1 series C3 and C4 series
SIP type
L1L1L1
HHH
CHIP type
1.5
(0.059)
1.5
(0.059)
L
a0.45
(0.018) 0.95
(0.037)
W
1.5
(0.059)
L
a0.45
(0.018) 0.95
(0.037)
W
L
a
W
C1 series C3 series C4 series
aa
Unit: mm (in.)
9
FAR Family (C1, C3, C4 series)
■TAPING FORM AND DIMENSIONS
• SIP type
•CHIP type
Unit: mm (in.)
6.35 ± 1.3
(0.250 ± 0.051) 12.7 ± 1.0
(0.500 ± 0.394)
3.81 ± 0.7
(0.150 ± 0.028)
18.0 ± 0.5
(0.709 ± 0.020)
12.7 ± 0.3
(0.500 ± 0.012) φ4.0 ± 0.3 (0.157 ± 0.012)
9.0 ± 2
(0.354 ± 0.079)
3.0 max. (0.118)
12.5 min.
(0.492) 18.0 +1.0
–0.5
(0.709 )
+0.040
–0.020
Note: 1. In reel packs, the tolerance of the cumulative feed hole pitch (20 pitches) is ±1.3 (0.051) or less.
2. In ammo packs, there must be perforations every 25 pitches.
Designation Pack form Pack quantity (pcs)
Package size A Package size B
T Reel pack 1000 1000
U Ammo pack 1500 1500
4 ± 0.1
(0.157 ± 0.004) 2 ± 0.1
(0.079 ± 0.004)
±0.1 (0.004)
8 ± 0.15
(0.315 ± 0.006)
3.0 ± 0.1
(0.118 ± 0.004)
W ± 0.1
(0.004)
6.85 (0.270)
1.5 ± 0.1
(0.059 ± 0.004)
Reel form
2.0 (0.080)
φ13.0
(0.512)
φ21.0
(0.827)
1.0
(0.039)
φ330 ± 2.0
(12.992 ± 0.079) 2.0 (0.079)
18.0 (0.709)
φ75 (2.953)
7.65 ± 0.1
16 ± 0.2
(0.630 ± 0.008)
(0.301 ± 0.004)
Unit: mm (in.)
Package
size W
A4.9
(0.193) 10.4
(0.409)
B3.6
(0.142) 8.4
(0.331)
• Pack quantity
Package size Pack
quantity
A 3,000 pcs
B 3,400 pcs
10
FAR Family (C1, C3, C4 series)
■APPLICATION EXAMPLES
• C1 series
• C3, C4 series
■RELIABILITY
Parameter Test conditions Requirements
Shock MIL-STD-883B, 2002, condtion C (3000G) Frequency fluctuation:
within ±0.1%
Vibration MIL-STD-202E, 201A (1.5 mm <0.059> at 10 Hz
to 55 Hz for 2 hours) Frequency fluctuation:
within ±0.1%
Drop 5 times drop from 1 m (39.370 in.) height to
wooden board. Frequency fluctuation:
within ±0.1%
Sealing Immersion in water at 85°C No bubbles observed
Heat resistance MIL-STD-202E, 210A condition B (260°C • 5 sec.) Frequency fluctuation:
within ±0.1%
Temperature cycling MIL-STD-883B, 1010, condition A (–35 to 85°C,
10 cycle) Frequency fluctuation:
within ±0.1%
High-temperature loading test MIL-STD-883B, 1008, condition B 1000 h (100°C •
1000 hours) Frequency fluctuation:
within ±0.1%
High-temperature humidity test MIL-STD-202E, 103A, condition B (96 hours at
60°C, 90% to 95% RH, 12 VDC) Frequency fluctuation:
within ±0.1%
R
680 Ω
ICIC
1.8 kΩ
220 ΩOutput
22 pF to 47 pF
R: Resonator
IC: MB74LS04
TTL oscillation circuit
(serial resonation circuit)
1
R
2
MB8850
MB8850H series
2
13
R: Resonator
FAR Family (C1, C3, C4 series)
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU MEDIA DEVICES LIMITED
Marketing and Technical Support Dept.
SHINYOKOHAMA SQUARE BLDG
2-3-12,Shin-yokohama,
Kouhoku-ku, Yokohama-shi,
Kanagawa 222-0033, Japan
Tel: +81-45-471-0067
Fax: +81-45-471-0069
http://www.fujitsu.co.jp/hypertext/fmd/English/index.html
North and South America
FUJITSU MICROELECTRONICS, INC.
3545 North First Street,
San Jose, CA 95134-1804, U.S.A.
Tel: +1-408-922-9000
Fax: +1-408-922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: +1-800-866-8608
Fax: +1-408-922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MICROELECTR ONICS EUR OPE GmbH
Am Siebenstein 6-10,
D-63303 Dreieich-Buchschlag,
Germany
Tel: +49-6103-690-0
Fax: +49-6103-690-122
http://www.fujitsu-fme.com/
Asia Pacific
FUJITSU MICROELECTR ONICS ASIA PTE. LTD .
#05-08, 151 Lorong Chuan,
New Tech Park,
Singapore 556741
Tel: +65-281-0770
Fax: +65-281-0220
http://www.fmap.com.sg/
F9703
FUJITSU LIMITED Printed in Japan
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
The contents of this document may not be reproduced or copied
without the permission of FUJITSU LIMITED.
FUJITSU semiconductor devices are intended for use in standard
applications (computers, office automation and other office
equipments, industrial, communications, and measurement
equipments, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage, or
where extremely high levels of reliability are demanded (such as
aerospace systems, atomic energy controls, sea floor repeaters,
vehicle operating controls, medical devices for life support, etc.)
are requested to consult with FUJITSU sales representatives before
such use. The company will not be responsible for damages arising
from such use without prior approval.
Any semiconductor devices have inherently a certain rate of failure.
You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Control Law of Japan, the
prior authorization by Japanese government should be required for
export of those products from Japan.
