To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: "Standard", "High Quality", and "Specific". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as "Specific" without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as "Specific" or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is "Standard" unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc. "Standard": 8. 9. 10. 11. 12. Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. "Specific": Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics. DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT PC2710TB 5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The PC2710TB is a silicon monolithic integrated circuit designed as PA driver for 900 MHz band cellular telephone tuners. This IC is packaged in super minimold package which is smaller than conventional minimold. This IC is manufactured using NEC's 20 GHz fT NESAT TM lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES * * * * * * * Supply voltage Circuit current Power gain Medium output power Upper limit operating frequency Port impedance High-density surface mounting : VCC = 4.5 to 5.5 V : ICC = 22 mA TYP. @VCC = 5.0 V : GP = 33 dB TYP. @ f = 500 MHz : PO(sat) = +13.5 dBm TYP. @ f = 500 MHz : fu = 1.0 GHz TYP. @ 3 dB bandwidth : input/output 50 : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm) APPLICATION * PA driver for 900 MHz band cellular telephone ORDERING INFORMATION Part Number PC2710TB-E3 Remark Package Marking 6-pin super minimold C1F Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC2710TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13443EJ3V0DS00 (3rd edition) Date Published January 2001 N CP(K) Printed in Japan The mark shows major revised points (c) 1998, 2001 PC2710TB PIN CONNECTIONS (Top View) C1F 3 2 1 (Bottom View) 4 4 3 5 5 2 6 6 1 Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC PRODUCT LINE-UP (TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Part No. PC2708T PC2708TB PC2709T PC2709TB PC2710T PC2710TB PC2776T PC2776TB fu (GHz) PO(sat) (dBm) GP (dB) NF (dB) ICC (mA) 2.9 +10.0 15 6.5 26 Package 6-pin minimold C1D 6-pin super minimold 6-pin minimold 2.3 +11.5 23 5.0 25 C1E 6-pin super minimold 6-pin minimold 1.0 +13.5 33 3.5 22 C1F 6-pin super minimold 6-pin minimold 2.7 +8.5 23 6.0 25 C2L 6-pin super minimold Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Notice The package size distinguishes between minimold and super minimold. 2 Marking Data Sheet P13443EJ3V0DS PC2710TB SYSTEM APPLICATION EXAMPLE EXAMPLE OF 900 MHz BAND DIGITAL CELLULER TELEPHONE RX DEMOD. PLL SW I Q PLL 0 I Driver TX PA PC2710TB 90 Q Data Sheet P13443EJ3V0DS 3 PC2710TB PIN EXPLANATION Pin No. Pin Name Applied Voltage (V) Pin Voltage Function and Applications 1 INPUT - 0.90 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 2 3 5 GND 0 - Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. 4 OUTPUT Voltage as same as VCC through external inductor - Signal output pin. The inductor must be attached between VCC and output pins to supply current to the internal output transistors. 6 VCC 4.5 to 5.5 - Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. Note Pin voltage is measured at VCC = 5.0 V 4 Internal Equivalent Circuit Note (V) Data Sheet P13443EJ3V0DS 6 4 1 3 2 5 PC2710TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C, pin 4 and pin 6 5.8 V Total Circuit Current ICC TA = +25C 60 mA Power Dissipation PD Mounted on double-sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB TA = +85C 270 mW Operating Ambient Temperature TA -40 to +85 C Storage Temperature Tstg -55 to +150 C Input Power Pin +10 dBm TA = +25C RECOMMENDED OPERATING RANGE Parameter Supply Voltage Symbol MIN. TYP. MAX. Unit VCC 4.5 5.0 5.5 V Remark The same voltage should be applied to pin 4 and pin 6. ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No signal 16 22 29 mA Power Gain GP f = 500 MHz 30 33 36.5 dB +11.0 +13.5 - dBm - 3.5 5.0 dB 3 dB down below flat gain at f = 0.1 GHz 0.7 1.0 - GHz Saturated Output Power Noise Figure Upper Limit Operating Frequency PO(sat) NF fu f = 500 MHz, Pin = -8 dBm f = 500 MHz Isolation ISL f = 500 MHz 34 39 - dB Input Return Loss RLin f = 500 MHz 3 6 - dB Output Return Loss RLout f = 500 MHz 9 12 - dB Gain Flatness GP f = 0.1 to 0.6 GHz - 0.8 - dB Data Sheet P13443EJ3V0DS 5 PC2710TB TEST CIRCUIT VCC 1 000 pF C3 L 6 50 C1 IN C2 4 1 1 000 pF 50 OUT 1 000 pF 2, 3, 5 COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL EXAMPLE OF ACTURAL APPLICATION COMPONENTS CHARACTERISTICS Type Value C1, C2 Bias Tee 1 000 pF C3 Capacitor 1 000 pF L Bias Tee 1 000 nH Type Value Operating Frequency C1 to C3 Chip Capacitor 1 000 pF 100 MHz or higher L Chip Inductor 300 nH 10 MHz or higher 100 nH 100 MHz or higher 10 nH 1.0 GHz or higher INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). 6 Data Sheet P13443EJ3V0DS PC2710TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD AMP-2 3 Top View C 1F 1 2 IN OUT C 6 L 5 4 C Mounting Direction VCC C COMPONENT LIST Value C 1 000 pF L 300 nH Notes 1. 30 x 30 x 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATION OF 6-PIN SUPER MINIMOLD SILICON MEDIUM-POWER HIGH-FREQUENCY AMPLIFIER MMIC (P13252E). Data Sheet P13443EJ3V0DS 7 PC2710TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25C) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 40 No signal 35 Circuit Current ICC (mA) Circuit Current ICC (mA) 35 30 25 20 15 10 30 25 20 15 10 5 5 0 No signal VCC = 5.0 V 1 2 3 4 5 0 -60 -40 6 -20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (C) Supply Voltage VCC (V) NOISE FIGURE, POWER GAIN vs. FREQUENCY POWER GAIN vs. FREQUENCY 35 35 VCC = 5.0 V VCC = 5.5 V 4 30 GP VCC = 4.5 V NF VCC = 4.5 V 3.5 3 VCC = 5.5 V Power Gain GP (dB) 4.5 Power Gain GP (dB) Noise Figure NF (dB) VCC = 5.0 V 25 0.1 0.3 1.0 25 0.1 2.0 1.0 0.3 Frequency f (GHz) ISOLATION vs. FREQUENCY INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 Input Return Loss RLin (dB) Output Return Loss RLout (dB) -10 -20 -30 -40 0.3 1.0 2.0 2.0 VCC = 5.0 V -10 -20 RLin RLout -30 -40 -50 0.1 Frequency f (GHz) 8 TA = +85C Frequency f (GHz) VCC = 5.0 V Isolation ISL (dB) 30 VCC = 5.0 V 0 -50 0.1 TA = -40C TA = +25C Data Sheet P13443EJ3V0DS 0.3 1.0 Frequency f (GHz) 2.0 PC2710TB OUTPUT POWER vs. INPUT POWER +20 VCC = 5.5 V f = 0.5 GHz +15 +15 Output Power Pout (dBm) Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER +20 +10 VCC = 5.0 V +5 VCC = 4.5 V 0 -5 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 0 VCC = 5.0 V f = 0.5 GHz +10 TA = +25C +5 TA = -40C 0 -5 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 +5 +10 Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER VCC = 5.0 V Output Power Pout (dBm) Output Power Pout (dBm) +15 VCC = 5.5 V +10 +5 0 VCC = 4.5 V -5 -10 0 f = 0.5 GHz +10 +5 f = 1.0 GHz 0 -5 -15 -40 -35 -30 -25 -20 -15 -10 -5 +5 +10 0 +5 +10 Input Power Pin (dBm) Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE +18 Pin = -8 dBm VCC = 5.5 V +16 VCC = 5.0 V +14 +12 +10 VCC = 4.5 V +8 +6 0.1 0.2 0.5 Frequency f (GHz) 1.0 2.0 3rd Order Intermodulation Distortion IM3 (dBc) Saturated Output Power PO (sat) (dBm) +15 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 +20 +5 +10 +20 VCC = 5.0 V f = 1.0 GHz 0 Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER +20 TA = +85C -60 f1 = 0.500 GHz f2 = 0.502 GHz -50 VCC = 5.0 V -40 VCC = 5.5 V -30 -20 VCC = 4.5 V -10 -10 -8 -6 -4 -2 0 +2 +4 +6 +8 +10 Output Power of Each Tone PO (each) (dBm) Data Sheet P13443EJ3V0DS 9 PC2710TB S-PARAMETERS (TA = +25C, VCC = Vout = 5.0 V) S11-FREQUENCY 0.1 GHz 3.0 GHz 2.0 GHz 1.0 GHz S22- FREQUENCY 3.0 GHz 0.1 GHz 2.0 GHz 1.0 GHz 10 Data Sheet P13443EJ3V0DS PC2710TB TYPICAL S-PARAMETER VALUES (TA = +25C) VCC = Vout = 5.0 V, ICC = 22 mA FREQUENCY MHz MAG. S11 ANG. MAG. S21 ANG. MAG. S12 ANG. MAG. ANG. 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.306 0.324 0.356 0.400 0.439 0.469 0.481 0.488 0.479 0.465 0.448 0.417 0.387 0.350 0.316 0.292 0.256 0.245 0.215 0.201 0.177 0.161 0.145 0.124 0.113 0.107 0.091 0.081 0.067 0.055 0.039 2.5 5.2 5.3 2.5 -3.3 -10.2 -17.9 -26.7 -34.5 -41.2 -49.3 -54.9 -61.2 -65.2 -70.8 -74.0 -76.9 -80.5 -82.9 -85.6 -84.4 -88.8 -88.7 -90.3 -89.8 -91.9 -92.2 -94.9 -97.4 -103.8 -95.6 43.072 43.517 44.432 45.513 45.679 45.670 44.793 43.016 40.519 37.946 35.122 32.108 29.221 26.656 23.895 21.576 19.567 17.743 16.040 14.717 13.475 12.327 11.154 10.262 9.490 8.793 8.149 7.652 7.134 6.726 6.295 -8.4 -17.1 -26.5 -36.9 -48.1 -59.7 -71.8 -84.3 -96.0 -107.3 -117.9 -128.0 -137.0 -145.8 -153.9 -161.6 -168.1 -174.4 179.6 173.5 168.8 163.1 158.7 154.4 150.4 146.4 142.4 138.9 135.1 131.5 128.4 0.012 0.010 0.010 0.012 0.012 0.013 0.014 0.014 0.013 0.016 0.016 0.015 0.015 0.015 0.013 0.016 0.015 0.018 0.017 0.021 0.020 0.021 0.022 0.023 0.025 0.028 0.030 0.031 0.031 0.039 0.039 15.2 10.7 20.2 26.9 27.0 31.3 34.9 27.9 26.6 30.8 26.6 39.5 39.7 50.2 50.8 56.6 69.0 61.7 70.0 71.2 83.0 76.7 87.9 81.4 91.9 88.7 93.4 92.1 93.0 88.3 89.6 0.156 0.164 0.185 0.225 0.255 0.283 0.301 0.312 0.316 0.311 0.307 0.282 0.270 0.248 0.236 0.215 0.200 0.196 0.180 0.175 0.166 0.171 0.159 0.164 0.158 0.166 0.175 0.183 0.191 0.200 0.203 2.7 2.1 0.3 -5.5 -15.4 -27.6 -40.2 -54.9 -67.7 -79.5 -92.2 -104.6 -115.5 -127.0 -136.2 -145.3 -155.2 -162.5 -173.4 -178.1 172.0 167.7 159.1 154.0 147.0 141.8 135.7 131.6 123.4 118.9 111.5 Data Sheet P13443EJ3V0DS S22 K 1.08 1.17 1.10 0.92 0.85 0.77 0.74 0.74 0.78 0.79 0.85 0.99 1.12 1.27 1.56 1.49 1.71 1.59 1.88 1.71 1.94 1.99 2.08 2.15 2.19 2.06 2.13 2.13 2.26 1.97 2.08 11 PC2710TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.10.1 0.2+0.1 -0.05 0.65 0.65 1.3 2.00.2 1.250.1 12 Data Sheet P13443EJ3V0DS 0.15+0.1 -0.05 0 to 0.1 0.7 0.90.1 0.1 MIN. PC2710TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. (5) The DC cut capacitor must be attached to input pin and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Count: 3, Exposure limit: NoneNote IR35-00-3 VPS Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Count: 3, Exposure limit: NoneNote VP15-00-3 Wave Soldering Soldering bath temperature: 260C or below Time: 10 seconds or less Count: 1, Exposure limit: NoneNote WS60-00-1 Partial Heating Pin temperature: 300C or below Time: 3 seconds or less (per side of device) Exposure limit: NoneNote - Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P13443EJ3V0DS 13 PC2710TB [MEMO] 14 Data Sheet P13443EJ3V0DS PC2710TB [MEMO] Data Sheet P13443EJ3V0DS 15 PC2710TB NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. * The information in this document is current as of January, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4