MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B SINGLE VOLTAGE 3V ONLY FLASH MEMORY FEATURES GENERAL FEATURES * Byte/Word mode switchable: - 524,288 x8 / 262,144 x16 (MX29LV400C) - 1,048,576 x8 / 524,288 x16 (MX29LV800C) - 2,097,152 x8 / 1,048,576 x16 (MX29LV160C) * Sector Structure - 16K-Byte x 1, 8K-Byte x 2, 32K-Byte x 1 64K-Byte x 7 (MX29LV400C), 64K-Byte x 15 (MX29LV800C), 64K-Byte x 31 (MX29LV160C) - Provides sector protect function to prevent program or erase operation in the protected sector - Provides chip unprotect function to allow code changing - Provides temporary sector unprotect function for code changing in previously protected sector * Single Power Supply Operation - 2.7 to 3.6 volt for read, erase, and program operations * Latch-up protected to 250mA from -1V to Vcc + 1V * Low Vcc write inhibit : Vcc <= 1.4V * Compatible with JEDEC standard - Pinout and software compatible to single power supply Flash * Fully compatible with MX29LV400B/MX29LV800B/MX29LV160B device PERFORMANCE * High Performance - Fast access time: 45R (MX29LV400C and MX29LV800C only), 55R/70/90ns - Fast program time: 7us/word typical utilizing accelerate function - Fast erase time: 0.7s/sector, 15s/chip (typical, MX29LV160C) * Low Power Consumption - Low active read current: 10mA (typical) at 5MHz - Low standby current: 200nA (typical) * Minimum 100,000 erase/program cycle * 10 years data retention SOFTWARE FEATURES * Erase Suspend/ Erase Resume - Suspends sector erase operation to read data from or program data to another sector which is not being erased * Status Reply - Data# Polling & Toggle bits provide detection of program and erase operation completion * Support Common Flash Interface (CFI) HARDWARE FEATURES * Ready/Busy# (RY/BY#) Output - Provides a hardware method of detecting program and erase operation completion * Hardware Reset (RESET#) Input - Provides a hardware method to reset the internal state machine to read mode PACKAGE * 44-Pin SOP * 48-Pin TSOP * 48-Ball CSP * All Pb-free devices are RoHS Compliant P/N:PM1300 REV. 1.3, NOV. 06, 2006 1 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PIN DESCRIPTION MX29LV400C PIN CONFIGURATIONS SYMBOL A0~A17 Q0~Q14 Q15/A-1 CE# WE# BYTE# RESET# NC RY/BY# A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 MX29LV400C T/B 44 SOP(500 mil) 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC OE# RY/BY# VCC GND NC PIN NAME Address Input Data Input/Output Q15 (Word mode)/LSB addr(Byte mode) Chip Enable Input Write Enable Input Word/Byte Selection input Hardware Reset Pin/Sector Protect Unlock Output Enable Input Ready/Busy Output Power Supply Pin (2.7V~3.6V) Ground Pin Pin Not Connected Internally 48 TSOP (Standard Type) (12mm x 20mm) A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX29LV400C T/B P/N:PM1300 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 REV. 1.3, NOV. 06, 2006 2 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball CSP (Ball Pitch = 0.8 mm, Top View, Balls Facing Down, 6 x 8 mm) 6 A13 A12 A14 A15 A16 5 A9 A8 A10 A11 Q7 4 WE# RESET# NC NC Q5 BYTE# Q15/ A-1 GND Q14 Q13 Q6 Q12 VCC Q4 3 RY/ BY# NC NC NC Q2 Q10 Q11 Q3 2 A7 A17 A6 A5 Q0 Q8 Q9 Q1 1 A3 A4 A2 A1 A0 CE# OE# GND A B C D E F G H 48-Ball WFBGA (Balls Facing Down, 4 x 6 x 0.75 mm) 6 A2 A4 A6 A17 5 A1 A3 A7 NC 4 A0 A5 3 CE# 2 GND 1 A NC NC WE# NC NC A9 A11 A10 A13 A14 NC A8 A12 A15 Q8 Q10 Q4 Q11 A16 OE# Q9 NC Q5 Q6 Q7 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15 GND B C D E F G H J NC P/N:PM1300 K L REV. 1.3, NOV. 06, 2006 3 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball XFLGA (Balls Facing Down, 4 x 6 x 0.5 mm) RESET# A9 NC A10 A13 A14 NC A8 A12 A15 Q8 Q10 Q4 Q11 A16 OE# Q9 BYTE# Q5 Q6 Q7 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15/ A-1 GND B C D E F G H J 6 A2 A4 A6 A17 5 A1 A3 A7 NC 4 A0 A5 3 CE# 2 GND 1 A NC NC WE# NC P/N:PM1300 A11 K L REV. 1.3, NOV. 06, 2006 4 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV800C PIN CONFIGURATIONS PIN DESCRIPTION 44 SOP(500 mil) SYMBOL PIN NAME 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 MX29LV800CT/CB RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC A0~A18 Address Input Q0~Q14 Data Input/Output Q15/A-1 Q15(Word mode)/LSB addr(Byte mode) CE# Chip Enable Input WE# Write Enable Input BYTE# Word/Byte Selection input RESET# Hardware Reset Pin OE# Output Enable Input RY/BY# Ready/Busy Output VCC Power Supply Pin (2.7V~3.6V) GND Ground Pin NC Pin Not Connected Internally 48 TSOP (Standard Type) (12mm x 20mm) A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX29LV800CT/CB P/N:PM1300 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 REV. 1.3, NOV. 06, 2006 5 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball CSP (Ball Pitch = 0.8 mm, Top View, Balls Facing Down, 6 x 8 mm) 6 A13 A12 A14 A15 A16 5 A9 A8 A10 A11 Q7 4 WE# RESET# NC NC Q5 BYTE# Q15/ A-1 GND Q14 Q13 Q6 Q12 VCC Q4 3 RY/ BY# NC A18 NC Q2 Q10 Q11 Q3 2 A7 A17 A6 A5 Q0 Q8 Q9 Q1 1 A3 A4 A2 A1 A0 CE# OE# GND A B C D E F G H 48-Ball WFBGA (Balls Facing Down, 4 x 6 x 0.5 mm) 6 A2 A4 A6 A17 5 A1 A3 A7 NC 4 A0 A5 3 CE# 2 GND 1 A NC NC WE# NC NC A9 A11 A10 A13 A14 A18 A8 A12 A15 Q8 Q10 Q4 Q11 A16 OE# Q9 NC Q5 Q6 Q7 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15 GND B C D E F G H J NC P/N:PM1300 K L REV. 1.3, NOV. 06, 2006 6 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball XFLGA (Balls Facing Down, 4 x 6 x 0.5 mm) RESET# A9 NC A10 A13 A14 A18 A8 A12 A15 Q8 Q10 Q4 Q11 A16 OE# Q9 BYTE# Q5 Q6 Q7 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15/ A-1 GND B C D E F G H J K L 6 A2 A4 A6 A17 5 A1 A3 A7 NC 4 A0 A5 3 CE# 2 GND 1 A NC NC WE# NC P/N:PM1300 A11 REV. 1.3, NOV. 06, 2006 7 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV160C PIN CONFIGURATIONS PIN DESCRIPTION 44 SOP(500 mil) 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 MX29LV160C T/B RESET# A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 SYMBOL PIN NAME 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 WE# A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC A0~A19 Address Input Q0~Q14 Data Input/Output Q15/A-1 Q15(Word mode)/LSB addr(Byte mode) CE# Chip Enable Input WE# Write Enable Input BYTE# Word/Byte Selection input RESET# Hardware Reset Pin/Sector Protect Unlock OE# Output Enable Input RY/BY# Ready/Busy Output VCC Power Supply Pin (2.7V~3.6V) GND Ground Pin 48 TSOP (Standard Type) (12mm x 20mm) A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE# RESET# NC NC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX29LV160C T/B P/N:PM1300 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 REV. 1.3, NOV. 06, 2006 8 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball CSP (Ball Pitch = 0.8 mm, Top View, Balls Facing Down, 6 x 8 mm) BYTE# Q15/ A-1 GND Q7 Q14 Q13 Q6 A19 Q5 Q12 VCC Q4 6 A13 A12 A14 A15 A16 5 A9 A8 A10 A11 4 WE# RESET# NC 3 RY/ BY# NC A18 NC Q2 Q10 Q11 Q3 2 A7 A17 A6 A5 Q0 Q8 Q9 Q1 1 A3 A4 A2 A1 A0 CE# OE# GND B C D E F G H A 48-Ball XFLGA (Balls Facing Down, 4 x 6 x 0.5 mm) RESET# A9 NC A10 A13 A14 A18 A8 A12 A15 Q8 Q10 Q4 Q11 A16 OE# Q9 BYTE# Q5 Q6 Q7 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15/ A-1 GND B C D E F G H J 6 A2 A4 A6 A17 5 A1 A3 A7 A19 4 A0 A5 3 CE# 2 GND 1 A NC NC WE# NC P/N:PM1300 A11 K L REV. 1.3, NOV. 06, 2006 9 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B BLOCK DIAGRAM CE# OE# WE# RESET# BYTE# WRITE CONTROL STATE INPUT LOGIC HIGH VOLTAGE MACHINE (WSM) LATCH BUFFER STATE FLASH REGISTER ARRAY ARRAY Y-DECODER AND X-DECODER ADDRESS A0-AM PROGRAM/ERASE Y-PASS GATE SOURCE HV COMMAND DATA DECODER SENSE AMPLIFIER PGM DATA HV COMMAND DATA LATCH PROGRAM DATA LATCH Q0-Q15/A-1 I/O BUFFER AM: MSB address P/N:PM1300 REV. 1.3, NOV. 06, 2006 10 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Table 1. BLOCK STRUCTURE MX29LV400CT SECTOR ARCHITECTURE Sector Sector Size Byte Mode Word Mode Address range Byte Mode (x8) Word Mode (x16) Sector Address A17 A16 A15 A14 A13 A12 SA0 64Kbytes 32Kwords 00000-0FFFF 00000-07FFF 0 0 0 X X X SA1 64Kbytes 32Kwords 10000-1FFFF 08000-0FFFF 0 0 1 X X X SA2 64Kbytes 32Kwords 20000-2FFFF 10000-17FFF 0 1 0 X X X SA3 64Kbytes 32Kwords 30000-3FFFF 18000-1FFFF 0 1 1 X X X SA4 64Kbytes 32Kwords 40000-4FFFF 20000-27FFF 1 0 0 X X X SA5 64Kbytes 32Kwords 50000-5FFFF 28000-2FFFF 1 0 1 X X X SA6 64Kbytes 32Kwords 60000-6FFFF 30000-37FFF 1 1 0 X X X SA7 32Kbytes 16Kwords 70000-77FFF 38000-3BFFF 1 1 1 0 X X SA8 8Kbytes 4Kwords 78000-79FFF 3C000-3CFFF 1 1 1 1 0 0 SA9 8Kbytes 4Kwords 7A000-7BFFF 3D000-3DFFF 1 1 1 1 0 1 SA10 16Kbytes 8Kwords 7C000-7FFFF 3E000-3FFFF 1 1 1 1 1 X MX29LV400CB SECTOR ARCHITECTURE Sector Sector Size Byte Mode Word Mode Address range Byte Mode (x8) Word Mode (x16) Sector Address A17 A16 A15 A14 A13 A12 SA0 16Kbytes 8Kwords 00000-03FFF 00000-01FFF 0 0 0 0 0 X SA1 8Kbytes 4Kwords 04000-05FFF 02000-02FFF 0 0 0 0 1 0 SA2 8Kbytes 4Kwords 06000-07FFF 03000-03FFF 0 0 0 0 1 1 SA3 32Kbytes 16Kwords 08000-0FFFF 04000-07FFF 0 0 0 1 X X SA4 64Kbytes 32Kwords 10000-1FFFF 08000-0FFFF 0 0 1 X X X SA5 64Kbytes 32Kwords 20000-2FFFF 10000-17FFF 0 1 0 X X X SA6 64Kbytes 32Kwords 30000-3FFFF 18000-1FFFF 0 1 1 X X X SA7 64Kbytes 32Kwords 40000-4FFFF 20000-27FFF 1 0 0 X X X SA8 64Kbytes 32Kwords 50000-5FFFF 28000-2FFFF 1 0 1 X X X SA9 64Kbytes 32Kwords 60000-6FFFF 30000-37FFF 1 1 0 X X X SA10 64Kbytes 32Kwords 70000-7FFFF 38000-3FFFF 1 1 1 X X X P/N:PM1300 REV. 1.3, NOV. 06, 2006 11 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV800CT SECTOR ARCHITECTURE Sector Sector Size Byte Mode Word Mode Address range Byte Mode (x8) Word Mode (x16) Sector Address A18 A17 A16 A15 A14 A13 A12 SA0 64Kbytes 32Kwords 00000h-0FFFFh 00000h-07FFFh 0 0 0 0 X X X SA1 64Kbytes 32Kwords 10000h-1FFFFh 08000h-0FFFFh 0 0 0 1 X X X SA2 64Kbytes 32Kwords 20000h-2FFFFh 10000h-17FFFh 0 0 1 0 X X X SA3 64Kbytes 32Kwords 30000h-3FFFFh 18000h-1FFFFh 0 0 1 1 X X X SA4 64Kbytes 32Kwords 40000h-4FFFFh 20000h-27FFFh 0 1 0 0 X X X SA5 64Kbytes 32Kwords 50000h-5FFFFh 28000h-2FFFFh 0 1 0 1 X X X SA6 64Kbytes 32Kwords 60000h-6FFFFh 30000h-37FFFh 0 1 1 0 X X X SA7 64Kbytes 32Kwords 70000h-7FFFFh 38000h-3FFFFh 0 1 1 1 X X X SA8 64Kbytes 32Kwords 80000h-8FFFFh 40000h-47FFFh 1 0 0 0 X X X SA9 64Kbytes 32Kwords 90000h-9FFFFh 48000h-4FFFFh 1 0 0 1 X X X SA10 64Kbytes 32Kwords A0000h-AFFFFh 50000h-57FFFh 1 0 1 0 X X X SA11 64Kbytes 32Kwords B0000h-BFFFFh 58000h-5FFFFh 1 0 1 1 X X X SA12 64Kbytes 32Kwords C0000h-CFFFFh 60000h-67FFFh 1 1 0 0 X X X SA13 64Kbytes 32Kwords D0000h-DFFFFh 68000h-6FFFFh 1 1 0 1 X X X SA14 64Kbytes 32Kwords E0000h-EFFFFh 70000h-77FFFh 1 1 1 0 X X X SA15 32Kbytes 16Kwords F0000h-F7FFFh 78000h-7BFFFh 1 1 1 1 0 X X SA16 8Kbytes 4Kwords F8000h-F9FFFh 7C000h-7CFFFh 1 1 1 1 1 0 0 SA17 8Kbytes 4Kwords FA000h-FBFFFh 7D000h-7DFFFh 1 1 1 1 1 0 1 SA18 16Kbytes 8Kwords FC000h-FFFFFh 7E000h-7FFFFh 1 1 1 1 1 1 X P/N:PM1300 REV. 1.3, NOV. 06, 2006 12 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV800CB SECTOR ARCHITECTURE Sector Sector Size Byte Mode Word Mode Address range Byte Mode (x8) Word Mode (x16) Sector Address A18 A17 A16 A15 A14 A13 A12 SA0 16Kbytes 8Kwords 00000h-03FFFh 00000h-01FFFh 0 0 0 0 0 0 X SA1 8Kbytes 4Kwords 04000h-05FFFh 02000h-02FFFh 0 0 0 0 0 1 0 SA2 8Kbytes 4Kwords 06000h-07FFFh 03000h-03FFFh 0 0 0 0 0 1 1 SA3 32Kbytes 16Kwords 08000h-0FFFFh 04000h-07FFFh 0 0 0 0 1 X X SA4 64Kbytes 32Kwords 10000h-1FFFFh 08000h-0FFFFh 0 0 0 1 X X X SA5 64Kbytes 32Kwords 20000h-2FFFFh 10000h-17FFFh 0 0 1 0 X X X SA6 64Kbytes 32Kwords 30000h-3FFFFh 18000h-1FFFFh 0 0 1 1 X X X SA7 64Kbytes 32Kwords 40000h-4FFFFh 20000h-27FFFh 0 1 0 0 X X X SA8 64Kbytes 32Kwords 50000h-5FFFFh 28000h-2FFFFh 0 1 0 1 X X X SA9 64Kbytes 32Kwords 60000h-6FFFFh 30000h-37FFFh 0 1 1 0 X X X SA10 64Kbytes 32Kwords 70000h-7FFFFh 38000h-3FFFFh 0 1 1 1 X X X SA11 64Kbytes 32Kwords 80000h-8FFFFh 40000h-47FFFh 1 0 0 0 X X X SA12 64Kbytes 32Kwords 90000h-9FFFFh 48000h-4FFFFh 1 0 0 1 X X X SA13 64Kbytes 32Kwords A0000h-AFFFFh 50000h-57FFFh 1 0 1 0 X X X SA14 64Kbytes 32Kwords B0000h-BFFFFh 58000h-5FFFFh 1 0 1 1 X X X SA15 64Kbytes 32Kwords C0000h-CFFFFh 60000h-67FFFh 1 1 0 0 X X X SA16 64Kbytes 32Kwords D0000h-DFFFFh 68000h-6FFFFh 1 1 0 1 X X X SA17 64Kbytes 32Kwords E0000h-EFFFFh 70000h-77FFFh 1 1 1 0 X X X SA18 64Kbytes 32Kwords F0000h-FFFFFh 78000h-7FFFFh 1 1 1 1 X X X P/N:PM1300 REV. 1.3, NOV. 06, 2006 13 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV160CT SECTOR ARCHITECTURE Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 Sector Size Byte Mode Word Mode 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 32Kbytes 8Kbytes 8Kbytes 16Kbytes 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 16Kwords 4Kwords 4Kwords 8Kwords Address range Sector Address Byte Mode(x8) Word Mode(x16) A19 A18 A17 A16 A15 A14 A13 A12 000000-00FFFF 00000-07FFF 0 0 0 0 0 X X X 010000-01FFFF 08000-0FFFF 0 0 0 0 1 X X X 020000-02FFFF 10000-17FFF 0 0 0 1 0 X X X 030000-03FFFF 18000-1FFFF 0 0 0 1 1 X X X 040000-04FFFF 20000-27FFF 0 0 1 0 0 X X X 050000-05FFFF 28000-2FFFF 0 0 1 0 1 X X X 060000-06FFFF 30000-37FFF 0 0 1 1 0 X X X 070000-07FFFF 38000-3FFFF 0 0 1 1 1 X X X 080000-08FFFF 40000-47FFF 0 1 0 0 0 X X X 090000-09FFFF 48000-4FFFF 0 1 0 0 1 X X X 0A0000-0AFFFF 50000-57FFF 0 1 0 1 0 X X X 0B0000-0BFFFF 58000-5FFFF 0 1 0 1 1 X X X 0C0000-0CFFFF 60000-67FFF 0 1 1 0 0 X X X 0D0000-0DFFFF 68000-6FFFF 0 1 1 0 1 X X X 0E0000-0EFFFF 70000-77FFF 0 1 1 1 0 X X X 0F0000-0FFFFF 78000-7FFFF 0 1 1 1 1 X X X 100000-10FFFF 80000-87FFF 1 0 0 0 0 X X X 110000-11FFFF 88000-8FFFF 1 0 0 0 1 X X X 120000-12FFFF 90000-97FFF 1 0 0 1 0 X X X 130000-13FFFF 98000-9FFFF 1 0 0 1 1 X X X 140000-14FFFF A0000-A7FFF 1 0 1 0 0 X X X 150000-15FFFF A8000-AFFFF 1 0 1 0 1 X X X 160000-16FFFF B0000-B7FFF 1 0 1 1 0 X X X 170000-17FFFF B8000-BFFFF 1 0 1 1 1 X X X 180000-18FFFF C0000-C7FFF 1 1 0 0 0 X X X 190000-19FFFF 1A0000-1AFFFF 1B0000-1BFFFF 1C0000-1CFFFF 1D0000-1DFFFF 1E0000-1EFFFF 1F0000-1F7FFF 1F8000-1F9FFF 1FA000-1FBFFF 1FC000-1FFFFF C8000-CFFFF D0000-D7FFF D8000-DFFFF E0000-E7FFF E8000-EFFFF F0000-F7FFF F8000-FBFFF FC000-FCFFF FD000-FDFFF FE000-FFFFF P/N:PM1300 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 1 1 1 1 1 1 1 0 1 1 0 0 1 1 1 1 1 1 0 1 0 1 0 1 1 1 1 X X X X X X 0 1 1 1 X X X X X X X 0 0 1 X X X X X X X 0 1 X REV. 1.3, NOV. 06, 2006 14 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV160CB SECTOR ARCHITECTURE Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 SA19 SA20 SA21 SA22 SA23 SA24 SA25 SA26 SA27 SA28 SA29 SA30 SA31 SA32 SA33 SA34 Sector Size Byte Mode Word Mode 16Kbytes 8Kwords 8Kbytes 4Kwords 8Kbytes 4Kwords 32Kbytes 16Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 32Kwords 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords Address range Sector Address Byte Mode (x8) Word Mode (x16) A19 A18 A17 A16 A15 A14 A13 A12 000000-003FFF 00000-01FFF 0 0 0 0 0 0 0 X 004000-005FFF 02000-02FFF 0 0 0 0 0 0 1 0 006000-007FFF 03000-03FFF 0 0 0 0 0 0 1 1 008000-00FFFF 04000-07FFF 0 0 0 0 0 1 X X 010000-01FFFF 08000-0FFFF 0 0 0 0 1 X X X 020000-02FFFF 10000-17FFF 0 0 0 1 0 X X X 030000-03FFFF 18000-1FFFF 0 0 0 1 1 X X X 040000-04FFFF 20000-27FFF 0 0 1 0 0 X X X 050000-05FFFF 28000-2FFFF 0 0 1 0 1 X X X 060000-06FFFF 070000-07FFFF 080000-08FFFF 090000-09FFFF 0A0000-0AFFFF 0B0000-0BFFFF 0C0000-0CFFFF 0D0000-0DFFFF 0E0000-0EFFFF 0F0000-0FFFFF 100000-10FFFF 110000-11FFFF 120000-12FFFF 130000-13FFFF 140000-14FFFF 150000-15FFFF 160000-16FFFF 170000-17FFFF 180000-18FFFF 190000-19FFFF 1A0000-1AFFFF 1B0000-1BFFFF 1C0000-1CFFFF 1D0000-1DFFFF 1E0000-1EFFFF 1F0000-1FFFFF 30000-37FFF 38000-3FFFF 40000-47FFF 48000-4FFFF 50000-57FFF 58000-5FFFF 60000-67FFF 68000-6FFFF 70000-77FFF 78000-7FFFF 80000-87FFF 88000-8FFFF 90000-97FFF 98000-9FFFF A0000-A7FFF A8000-AFFFF B0000-B7FFF B8000-BFFFF C0000-C7FFF C8000-CFFFF D0000-D7FFF D8000-DFFFF E0000-E7FFF E8000-EFFFF F0000-FFFFF F8000-FFFFF P/N:PM1300 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X REV. 1.3, NOV. 06, 2006 15 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Table 2. BUS OPERATION--1 Mode Select RE- CE# WE# OE# Address SET# Data (I/O) Q0~Q7 Byte# Vil Vih Data (I/O) Q8~Q15 Device Reset L X X X X HighZ HighZ HighZ Standby Mode Vcc Vcc X X X HighZ HighZ HighZ 0.3V 0.3V H L H H X HighZ HighZ HighZ Read Mode H L H L AIN DOUT Q8-Q14= DOUT Write H L L H AIN DIN HighZ DIN Vhv X X X AIN DIN HighZ DIN Vhv L L H Sector Address, DIN, DOUT X X DIN, DOUT X X Output Disable Temporary Sector Unprotect Sector Protect A6=L, A1=H, A0=L Chip Unprotect Vhv L L H Sector Address, A6=H, A1=H, A0=L Note: 1. Q0~Q15 are input (DIN) or output (DOUT) pins according to the requests of command sequence, sector protection, or data polling algorithm. 2. In Word Mode (Byte#=Vih), the addresses are AM to A0. In Byte Mode (Byte#=Vil), the addresses are AM to A-1 (Q15). 3. AM: MSB of address. P/N:PM1300 REV. 1.3, NOV. 06, 2006 16 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B BUS OPERATION--2 Item Control Input CE# WE# OE# AM A11 to to A8 A9 A12 A10 Sector Lock Status L H L SA x to A5 A6 A7 Vhv x to A1 A0 H L Q0~Q7 Q8~Q15 A2 L x Verification 01h or x 00h (Note1) Read Silicon ID L H L x x Vhv x L x L L C2H x L H L x x Vhv x L x L H B9H 22h(Word) Manufacturer Code Read Silicon ID MX29LV400CT Read Silicon ID x (Byte) L H L x x Vhv x L x L H BAH MX29LV400CB Read Silicon ID x (Byte) L H L x x Vhv x L x L H DAH MX29LV800CT Read Silicon ID L H L x x Vhv x L x L H 5BH 22h(Word) x (Byte) L H L x x Vhv x L x L H C4H MX29LV160CT Read Silicon ID 22h(Word) x (Byte) MX29LV800CB Read Silicon ID 22h(Word) 22h(Word) x (Byte) L H L x x Vhv MX29LV160CB x L x L H 49H 22h(Word) x (Byte) Notes: 1. Sector unprotected code:00h. Sector protected code:01h. 2. AM: MSB of address. P/N:PM1300 REV. 1.3, NOV. 06, 2006 17 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B WRITE COMMANDS/COMMAND SEQUENCES To write a command to the device, system must drive WE# and CE# to Vil, and OE# to Vih. In a command cycle, all address are latched at the later falling edge of CE# and WE#, and all data are latched at the earlier rising edge of CE# and WE#. Figure 1 illustrates the AC timing waveform of a write command, and Table 3 defines all the valid command sets of the device. System is not allowed to write invalid commands not defined in this datasheet. Writing an invalid command will bring the device to an undefined state. REQUIREMENTS FOR READING ARRAY DATA Read array action is to read the data stored in the array. While the memory device is in powered up or has been reset, it will automatically enter the status of read array. If the microprocessor wants to read the data stored in array, it has to drive CE# (device enable control pin) and OE# (Output control pin) as Vil, and input the address of the data to be read into address pin at the same time. After a period of read cycle (Tce or Taa), the data being read out will be displayed on output pin for microprocessor to access. If CE# or OE# is Vih, the output will be in tri-state, and there will be no data displayed on output pin at all. After the memory device completes embedded operation (automatic Erase or Program), it will automatically return to the status of read array, and the device can read the data in any address in the array. In the process of erasing, if the device receives the Erase suspend command, erase operation will be stopped temporarily after a period of time no more than Tready1 and the device will return to the status of read array. At this time, the device can read the data stored in any address except the sector being erased in the array. In the status of erase suspend, if user wants to read the data in the sectors being erased, the device will output status data onto the output. Similarly, if program command is issued after erase suspend, after program operation is completed, system can still read array data in any address except the sectors to be erased The device needs to issue reset command to enable read array operation again in order to arbitrarily read the data in the array in the following two situations: 1. In program or erase operation, the programming or erasing failure causes Q5 to go high. 2. The device is in auto select mode or CFI mode. In the two situations above, if reset command is not issued, the device is not in read array mode and system must issue reset command before reading array data. P/N:PM1300 REV. 1.3, NOV. 06, 2006 18 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B RESET# OPERATION Driving RESET# pin low for a period more than Trp will reset the device back to read mode. If the device is in program or erase operation, the reset operation will take at most a period of Tready1 for the device to return to read array mode. Before the device returns to read array mode, the RY/BY# pin remains low (busy status). When RESET# pin is held at GND0.3V, the device consumes standby current(Isb).However, device draws larger current if RESET# pin is held at Vil but not within GND0.3V. It is recommended that the system to tie its reset signal to RESET# pin of flash memory, so that the flash memory will be reset during system reset and allows system to read boot code from flash memory. SECTOR PROTECT OPERATION When a sector is protected, program or erase operation will be disabled on that protected sector. MX29LV400C/ MX29LV800C/MX29LV160C T/B provides two methods for sector protection. Once the sector is protected, the sector remains protected until next chip unprotect, or is temporarily unprotected by asserting RESET# pin at Vhv. Refer to temporary sector unprotect operation for further details. The first method is by applying Vhv on RESET# pin. Refer to Figure 12 for timing diagram and Figure 13 for the algorithm for this method. The other method is asserting Vhv on A9 and OE# pins, with A6 and CE# at Vil. The protection operation begins at the falling edge of WE# and terminates at the rising edge. Contact Macronix for details. CHIP UNPROTECT OPERATION MX29LV400C/MX29LV800C/MX29LV160C T/B provides two methods for chip unprotect. The chip unprotect operation unprotects all sectors within the device. It is recommended to protect all sectors before activating chip unprotect mode. All sectors are unprotected when shipped from the factory. The first method is by applying Vhv on RESET# pin. Refer to Figure 12 for timing diagram and Figure 13 for algorithm of the operation. The other method is asserting Vhv on A9 and OE# pins, with A6 at Vih and CE# at Vil (see Table 2). The unprotect operation begins at the falling edge of WE# and terminates at the rising edge. Contact Macronix for details. TEMPORARY SECTOR UNPROTECT OPERATION System can apply RESET# pin at Vhv to place the device in temporary unprotect mode. In this mode, previously protected sectors can be programmed or erased just as it is unprotected. The devices returns to normal operation once Vhv is removed from RESET# pin and previously protected sectors are again protected. P/N:PM1300 REV. 1.3, NOV. 06, 2006 19 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B AUTOMATIC SELECT OPERATION When the device is in Read array mode, erase-suspended read array mode or CFI mode, user can issue read silicon ID command to enter read silicon ID mode. After entering read silicon ID mode, user can query several silicon IDs continuously and does not need to issue read silicon ID mode again. When A0 is Low, device will output Macronix Manufacture ID C2. When A0 is high, device will output Device ID. In read silicon ID mode, issuing reset command will reset device back to read array mode or erase-suspended read array mode. Another way to enter read silicon ID is to apply high voltage on A9 pin with CE#, OE#, A6 and A1 at Vil. While the high voltage of A9 pin is discharged, device will automatically leave read silicon ID mode and go back to read array mode or erase-suspended read array mode. When A0 is Low, device will output Macronix Manufacture ID C2. When A0 is high, device will output Device ID. VERIFY SECTOR PROTECT STATUS OPERATION MX29LV400C/MX29LV800C/MX29LV160C T/B provides hardware sector protection against Program and Erase operation for protected sectors. The sector protect status can be read through Sector Protect Verify command. This method requires Vhv on A9 pin, Vih on WE# and A1 pins, Vil on CE#, OE#, A6 and A0 pins, and sector address on A12 to Am pins. If the read out data is 01H, the designated sector is protected. Oppositely, if the read out data is 00H, the designated sector is not protected. DATA PROTECTION To avoid accidental erasure or programming of the device, the device is automatically reset to read array mode during power up. Besides, only after successful completion of the specified command sets will the device begin its erase or program operation. Other features to protect the data from accidental alternation are described as followed. LOW VCC WRITE INHIBIT The device refuses to accept any write command when Vcc is less than 1.4V. This prevents data from spuriously altered. The device automatically resets itself when Vcc is lower than 1.4V and write cycles are ignored until Vcc is greater than 1.4V. System must provide proper signals on control pins after Vcc is larger than 1.4V to avoid unintentional program or erase operation WRITE PULSE "GLITCH" PROTECTION CE#, WE#, OE# pulses shorter than 5ns are treated as glitches and will not be regarded as an effective write cycle. LOGICAL INHIBIT A valid write cycle requires both CE# and WE# at Vil with OE# at Vih. Write cycle is ignored when either CE# at Vih, WE# a Vih, or OE# at Vil. P/N:PM1300 REV. 1.3, NOV. 06, 2006 20 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B POWER-UP SEQUENCE Upon power up, MX29LV400C/MX29LV800C/MX29LV160C T/B is placed in read array mode. Furthermore, program or erase operation will begin only after successful completion of specified command sequences. POWER-UP WRITE INHIBIT When WE#, CE# is held at Vil and OE# is held at Vih during power up, the device ignores the first command on the rising edge of WE#. POWER SUPPLY DECOUPLING A 0.1uF capacitor should be connected between the Vcc and GND to reduce the noise effect. P/N:PM1300 REV. 1.3, NOV. 06, 2006 21 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B TABLE 3. MX29LV400C/MX29LV800C/MX29LV160C T/B COMMAND DEFINITIONS A utom atic S elec t Read M ode Com m and Res et M ode M anifac ture ID Hex 1s t B us Cy c S ec tor P rotec t V erify Dev ic e ID W ord B y te W ord B y te W ord B y te P rogram W ord B y te A ddr A ddr XXX 555 AAA 555 AAA 555 AAA 555 Data Data F0 AA AA AA AA AA AA AA AAA AA 2A A 555 2A A 555 2A A 555 2A A 555 2nd B us Cy c A ddr Data 55 55 55 55 55 55 55 55 3rd B us Cy c A ddr 555 AAA 555 AAA 555 AAA 555 AAA Data 90 90 90 90 90 90 A0 A0 (S ec tor) X 04 A ddr A ddr 00/01 Data Data 4th B us Cy c A ddr X 00 X 00 X 01 X 02 (S ec tor) X 02 Data C2 C2 ID ID 00/01 5th B us Cy c A ddr 6th B us Cy c A ddr Data Data Command Chip Erase Hex Word Byte 555 AAA Sector Erase Word Byte 555 AAA 1st Bus Cyc Addr Data AA AA AA AA 2nd Bus Cyc Addr 2AA 555 2AA 555 Data 55 55 55 55 3rd Bus Cyc Addr 555 AAA 555 AAA Data 80 80 80 80 4th Bus Cyc Addr 555 AAA 555 AAA Data AA AA AA AA 5th Bus Cyc Addr 2AA 555 2AA 555 Data 55 55 55 6th Bus Cyc Addr 555 Data 10 AAA Sector 10 30 CFI Read Erase Suspend Word Byte W ord/Byte XXX 55 AA 98 98 B0 Erase Resume W ord/Byte XXX 30 55 Sector 30 Notes: 1. Device ID : MX29LV400CT: 22B9; MX29LV400CB: 22BA. MX29LV800CT: 22DA; MX29LV800CB: 225B. MX29LV160CT: 22C4; MX29LV160CB: 2249. 2. For sector protect verify result, XX00H/00H means sector is not protected, XX01H/01H means sector has been protected. 3. Sector Protect command is valid during Vhv at RESET# pin, Vih at A1 pin and Vil at A0, A6 pins. The last Bus cyc is for protect verify. P/N:PM1300 REV. 1.3, NOV. 06, 2006 22 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B RESET In the following situations, executing reset command will reset device back to read array mode: * Among erase command sequence (before the full command set is completed) * Sector erase time-out period * Erase fail (while Q5 is high) * Among program command sequence (before the full command set is completed, erase-suspended program included) * Program fail (while Q5 is high, and erase-suspended program fail is included) * Read silicon ID mode * Sector protect verify * CFI mode While device is at the status of program fail or erase fail (Q5 is high), user must issue reset command to reset device back to read array mode. While the device is in read silicon ID mode, sector protect verify or CFI mode, user must issue reset command to reset device back to read array mode. When the device is in the progress of programming (not program fail) or erasing (not erase fail), device will ignore reset command. AUTOMATIC SELECT COMMAND SEQUENCE Automatic Select mode is used to access the manufacturer ID, device ID and to verify whether or not a sector is protected. The automatic select mode has four command cycles. The first two are unlock cycles, and followed by a specific command. The fourth cycle is a normal read cycle, and user can read at any address any number of times without entering another command sequence. The reset command is necessary to exit the Automatic Select mode and back to read array. The following table shows the identification code with corresponding address. Manufacturer ID Device ID Sector Protect Verify Address Data (Hex) Representation Word X00 00C2 Byte X00 C2 Word X01 ID Top/Bottom Boot Sector Byte X02 ID Top/Bottom Boot Sector Word (Sector address) X 02 00/01 Unprotected/protected Byte (Sector address) X 04 00/01 Unprotected/protected There is an alternative method to that shown in Table 2, which is intended for EPROM programmers and requires Vhv on address bit A9. P/N:PM1300 REV. 1.3, NOV. 06, 2006 23 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B AUTOMATIC PROGRAMMING The MX29LV400C/MX29LV800C/MX29LV160C T/B can provide the user program function by the form of Byte-Mode or Word-Mode. As long as the users enter the right cycle defined in the Table.3 (including 2 unlock cycles and A0H), any data user inputs will automatically be programmed into the array. Once the program function is executed, the internal write state controller will automatically execute the algorithms and timings necessary for program and verification, which includes generating suitable program pulse, verifying whether the threshold voltage of the programmed cell is high enough and repeating the program pulse if any of the cells does not pass verification. Meanwhile, the internal control will prohibit the programming to cells that pass verification while the other cells fail in verification in order to avoid over-programming. With the internal write state controller, the device requires the user to write the program command and data only. Programming will only change the bit status from "1" to "0". That is to say, it is impossible to convert the bit status from "0" to "1" by programming. Meanwhile, the internal write verification only detects the errors of the "1" that is not successfully programmed to "0". Any command written to the device during programming will be ignored except hardware reset, which will terminate the program operation after a period of time no more than Tready1. When the embedded program algorithm is complete or the program operation is terminated by hardware reset, the device will return to the reading array data mode. The typical chip program time at room temperature of the MX29LV400C/MX29LV800C/MX29LV160C T/B is less than 36 seconds. When the embedded program operation is on going, user can confirm if the embedded operation is finished or not by the following methods: Status Q7 Q6 Q5 RY/BY#*2 In progress*1 Q7# togging 0 0 Finished Q7 Stop toggling 0 1 Exceed time limit Q7# Toggling 1 0 *1: The status "in progress" means both program mode and erase-suspended program mode. *2: RY/BY# is an open drain output pin and should be weakly connected to VDD through a pull-up resistor. *3: When an attempt is made to program a protected sector, Q7 will output its complement data or Q6 continues to toggle for about 1us or less and the device returns to read array state without programing the data in the protected sector. P/N:PM1300 REV. 1.3, NOV. 06, 2006 24 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B CHIP ERASE Chip Erase is to erase all the data with "1" and "0" as all "1". It needs 6 cycles to write the action in, and the first two cycles are "unlock" cycles, the third one is a configuration cycle, the fourth and fifth are also "unlock" cycles, and the sixth cycle is the chip erase operation. During chip erasing, all the commands will not be accepted except hardware reset or the working voltage is too low that chip erase will be interrupted. After Chip Erase, the chip will return to the state of Read Array. When the embedded chip erase operation is on going, user can confirm if the embedded operation is finished or not by the following methods: Status Q7 Q6 Q5 Q2 RY/BY# In progress 0 Togging 0 Toggling 0 Finished 1 Stop toggling 0 1 1 Exceed time limit 0 Toggling 1 Toggling 0 SECTOR ERASE Sector Erase is to erase all the data in a sector with "1" and "0" as all "1". It requires six command cycles to issue. The first two cycles are "unlock cycles", the third one is a configuration cycle, the fourth and fifth are also "unlock cycles" and the sixth cycle is the sector erase command. After the sector erase command sequence is issued, there is a timeout period of 50us counted internally. During the time-out period, additional sector address and sector erase command can be written multiply. Once user enters another sector erase command, the time-out period of 50us is recounted. If user enters any command other than sector eras or erase suspend during time-out period, the erase command would be aborted and the device is reset to read array condition. The number of sectors could be from one sector to all sectors. After time-out period passing by, additional erase command is not accepted and erase embedded operation begins. During sector erasing, all commands will not be accepted except hardware reset and erase suspend and user can check the status as chip erase. When the embedded erase operation is on going, user can confirm if the embedded operation is finished or not by the following methods: Status Q7 Q6 Q5 Q3 Q2 RY/BY#*2 Time-out period 0 Togging 0 0 Toggling 0 In progress 0 Togging 0 1 Toggling 0 Finished 1 Stop toggling 0 1 1 1 Exceed time limit 0 Toggling 1 1 Toggling 0 *1: The status Q3 is the time-out period indicator. When Q3=0, the device is in time-out period and is acceptible to another sector address to be erased. When Q3=1, the device is in erase operation and only erase suspend is valid. *2: RY/BY# is open drain output pin and should be weakly connected to VDD through a pull-up resistor. *3: When an attempt is made to erase a protected sector, Q7 will output its complement data or Q6 continues to toggle for 100us or less and the device returned to read array status without erasing the data in the protected sector. P/N:PM1300 REV. 1.3, NOV. 06, 2006 25 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B SECTOR ERASE SUSPEND During sector erasure, sector erase suspend is the only valid command. If user issue erase suspend command in the time-out period of sector erasure, device time-out period will be over immediately and the device will go back to erasesuspended read array mode. If user issue erase suspend command during the sector erase is being operated, device will suspend the ongoing erase operation, and after the Tready1 (<=20us) suspend finishes and the device will enter erase-suspended read array mode. User can judge if the device has finished erase suspend through Q6, Q7, and RY/ BY#. After device has entered erase-suspended read array mode, user can read other sectors not at erase suspend by the speed of Taa; while reading the sector in erase-suspend mode, device will output its status. User can use Q6 and Q2 to judge the sector is erasing or the erase is suspended. Status Q7 Q6 Q5 Q3 Q2 RY/BY# 1 No toggle 0 N/A toggle 1 Erase suspend read in non-erase suspended sector Data Data Data Data Data 1 Erase suspend program in non-erase suspended sector Q7# Toggle 0 N/A N/A 0 Erase suspend read in erase suspended sector When the device has suspended erasing, user can execute the command sets except sector erase and chip erase, such as read silicon ID, sector protect verify, program, CFI query and erase resume. SECTOR ERASE RESUME Sector erase resume command is valid only when the device is in erase suspend state. After erase resume, user can issue another erase suspend command, but there should be a 400uS interval between erase resume and the next erase suspend. If user issue infinite suspend-resume loop, or suspend-resume exceeds 1024 times, the time for erasing will increase. P/N:PM1300 REV. 1.3, NOV. 06, 2006 26 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B QUERY COMMAND AND COMMON FLASH INTERFACE (CFI) MODE MX29LV400C/MX29LV800C/MX29LV160C T/B features CFI mode. Host system can retrieve the operating characteristics, structure and vendor-specified information such as identifying information, memory size, byte/word configuration, operating voltages and timing information of this device by CFI mode. The device enters the CFI Query mode when the system writes the CFI Query command, 98H, to address 55H/AAH (depending on Word/Byte mode) any time the device is ready to read array data. The system can read CFI information at the addresses given in Table 4. A reset command is required to exit CFI mode and go back to ready array mode or erase suspend mode. The system can write the CFI Query command only when the device is in read mode, erase suspend, standby mode or automatic select mode. Table 4-1. CFI mode: Identification Data Values (All values in these tables are in hexadecimal) Description Query-unique ASCII string "QRY" Primary vendor command set and control interface ID code Address for primary algorithm extended query table Alternate vendor command set and control interface ID code Address for alternate algorithm extended query table Address (h) (Word Mode) 10 11 12 13 14 15 16 17 18 19 1A Address (h) (Byte Mode) 20 22 24 26 28 2A 2C 2E 30 32 34 Data (h) Address (h) (Word Mode) 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 Address (h) (Byte Mode) 36 38 3A 3C 3E 40 42 44 46 48 4A 4C Data (h) 0051 0052 0059 0002 0000 0040 0000 0000 0000 0000 0000 Table 4-2. CFI Mode: System Interface Data Values Description Vcc supply minimum program/erase voltage Vcc supply maximum program/erase voltage VPP supply minimum program/erase voltage VPP supply maximum program/erase voltage Typical timeout per single word/byte write, 2n uS Typical timeout for maximum-size buffer write, 2n uS Typical timeout per individual block erase, 2n mS Typical timeout for full chip erase, 2n mS Maximum timeout for word/byte write, 2n times typical Maximum timeout for buffer write, 2n times typical Maximum timeout per individual block erase, 2n times typical Maximum timeout for chip erase, 2n times typical P/N:PM1300 0027 0036 0000 0000 0004 0000 000A 0000 0005 0000 0004 0000 REV. 1.3, NOV. 06, 2006 27 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Table 4-3. CFI Mode: Device Geometry Data Values Description Address (h) Address (h) Data (h) (Word Mode) (Byte Mode) n 27 4E 0013 n 27 4E 0014 n Device size = 2 in number of bytes (MX29LV160C) 27 4E 0015 Flash device interface description (02=asynchronous x8/x16) 28 50 0002 29 52 0000 2A 54 0000 2B 56 0000 Number of erase regions within device 2C 58 0004 Index for Erase Bank Area 1 2D 5A 0000 [2E,2D] = # of same-size sectors in region 1-1 2E 5C 0000 [30, 2F] = sector size in multiples of 256-bytes 2F 5E 0040 30 60 0000 31 62 0001 32 64 0000 33 66 0020 34 68 0000 35 6A 0000 36 6C 0000 37 6E 0080 38 70 0000 Index for Erase Bank Area 4 (for MX29LV400C) 39 72 0006 Index for Erase Bank Area 4 (for MX29LV800C) 39 72 000E Index for Erase Bank Area 4 (for MX29LV160C) 39 72 001E 3A 74 0000 3B 76 0000 3C 78 0001 Device size = 2 in number of bytes (MX29LV400C) Device size = 2 in number of bytes (MX29LV800C) n Maximum number of bytes in buffer write = 2 (not support) Index for Erase Bank Area 2 Index for Erase Bank Area 3 P/N:PM1300 REV. 1.3, NOV. 06, 2006 28 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Table 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values Description Address (h) Address (h) (Word Mode) (Byte Mode) 40 80 0050 41 82 0052 42 84 0049 Major version number, ASCII 43 86 0031 Minor version number, ASCII 44 88 0030 Unlock recognizes address (0= recognize, 1= don't recognize) 45 8A 0000 Erase suspend (2= to both read and program) 46 8C 0002 Sector protect (N= # of sectors/group) 47 8E 0001 Temporary sector unprotect (1=supported) 48 90 0001 Sector protect/Chip unprotect scheme 49 92 0004 Simultaneous R/W operation (0=not supported) 4A 94 0000 Burst mode (0=not supported) 4B 96 0000 Page mode (0=not supported) 4C 98 0000 Query - Primary extended table, unique ASCII string, PRI P/N:PM1300 Data (h) REV. 1.3, NOV. 06, 2006 29 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B ABSOLUTE MAXIMUM STRESS RATINGS Surrounding Temperature with Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65oC to +125oC Storage Temperature . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65oC to +150oC Voltage Range Vcc . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V RESET#, A9 and OE# . .. . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +12.5 V The other pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5 V to Vcc +0.5 V Output Short Circuit Current (less than one second) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200 mA OPERATING TEMPERATURE AND VOLTAGE Commercial (C) Grade Surrounding Temperature (TA ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to +70C Industrial (I) Grade Surrounding Temperature (TA ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to +85C VCC Supply Voltages VCC range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.7 V to 3.6 V P/N:PM1300 REV. 1.3, NOV. 06, 2006 30 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B DC CHARACTERISTICS Symbol Description Iilk Input Leak Iilk9 A9 Leak Iolk Output Leak Icr1 Read Current(5MHz) Min Typ Max Remark 1.0uA 35uA A9=12.5V 1.0uA 7mA 12mA CE#=Vil, OE#=Vih Icr2 Read Current(1MHz) 2mA 4mA CE#=Vil, OE#=Vih Icw Write Current 15mA 30mA CE#=Vil, OE#=Vih, WE#=Vil Isb Standby Current 0.2uA 5uA Vcc=Vcc max, other pin disable Isbr Reset Current 0.2uA 5uA Vcc=Vccmax, Reset# enable, other pin disable Isbs Sleep Mode Current 0.2uA 5uA Vil Input Low Voltage -0.5V 0.8V Vih Input High Voltage 0.7xVcc Vcc+0.3V Vhv Very High Voltage for hardware 11.5V 12.5V Protect/Unprotect/Accelerated Program/Auto Select/Temporary Unprotect Vol Output Low Voltage 0.45V Voh1 Ouput High Voltage 0.85xVcc Ioh1=-2mA Voh2 Ouput High Voltage Vcc-0.4V Ioh2=-100uA P/N:PM1300 Iol=4.0mA REV. 1.3, NOV. 06, 2006 31 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B SWITCHING TEST CIRCUITS Vcc R2 TESTED DEVICE 0.1uF +3.3V CL R1 DIODES=IN3064 OR EQUIVALENT R1=6.2K ohm R2=1.6K ohm Test Condition Output Load : 1 TTL gate Output Load Capacitance,CL : 30pF(70nS)/100pF(90nS) Rise/Fall Times : 5nS In/Out reference levels :1.5V SWITCHING TEST WAVEFORMS 3.0V 1.5V 1.5V Test Points 0.0V INPUT OUTPUT P/N:PM1300 REV. 1.3, NOV. 06, 2006 32 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B AC CHARACTERISTICS Symbol Taa Description Min Typ Valid data output after address Max 45/55 Unit (1) nS 70/90 Tce 45/55 (1) Valid data output after CE# low nS 70/90 Toe Valid data output after OE# low 30 nS Tdf Data output floating after OE# high 25 nS Toh Output hold time from the earliest rising edge of address, 0 nS 45/55 (1) nS CE#, OE# Trc Read period time 70/90 Twc Write period time 70/90 nS Tcwc Command write period time 70/90 nS Tas Address setup time 0 nS Tah Address hold time 45 nS Tds Data setup time 35 nS Tdh Data hold time 0 nS Tvcs Vcc setup time 50 uS Tcs Chip enable Setup time 0 nS Tch Chip enable hold time 0 nS Toes Output enable setup time 0 nS Read 0 nS Toggle & 10 nS Toeh Toeh Output enable hold time Data# Polling Tws WE# setup time 0 nS Twh WE# hold time 0 nS Tcep CE# pulse width 35 nS Tceph CE# pulse width high 30 nS Twp WE# pulse width 35 nS Twph WE# pulse width high 30 nS Tbusy Program/Erase active time by RY/BY# Tghwl Read recover time before write 0 nS Tghel Read recover time before write 0 nS Twhwh1 Program operation Byte 9 uS Twhwh1 Program operation Word 11 uS Twhwh2 Sector Erase Operation 0.7 sec Tbal Sector Add hold time 90 50 nS uS Notes: (1) 45nS only for MX29LV800C-45 P/N:PM1300 REV. 1.3, NOV. 06, 2006 33 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 1. COMMAND WRITE OPERATION Tcwc CE# Vih Vil Tch Tcs WE# Vih Vil Toes OE# Twph Twp Vih Vil Addresses Vih VA Vil Tah Tas Tdh Tds Vih Data Vil DIN VA: Valid Address P/N:PM1300 REV. 1.3, NOV. 06, 2006 34 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B READ/RESET OPERATION Figure 2. READ TIMING WAVEFORMS Tce Vih CE# Vil Vih WE# Vil Toeh Tdf Toe Vih OE# Vil Toh Taa Trc Vih ADD Valid Addresses Vil Outputs Voh HIGH Z DATA Valid HIGH Z Vol P/N:PM1300 REV. 1.3, NOV. 06, 2006 35 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B AC CHARACTERISTICS Item Description Setup Speed Unit Trp1 RESET# Pulse Width (During Automatic Algorithms) MIN 500 nS Trp2 RESET# Pulse Width (NOT During Automatic Algorithms) MIN 500 nS Trh RESET# High Time Before Read MIN 50 nS Trb1 RY/BY# Recovery Time (to CE#, OE# go low) MIN 0 nS Trb2 RY/BY# Recovery Time (to WE# go low) MIN 50 nS Tready1 RESET# PIN Low (During Automatic Algorithms) MAX 20 uS MAX 500 nS to Read or Write Tready2 RESET# PIN Low (NOT During Automatic Algorithms) to Read or Write Figure 3. RESET# TIMING WAVEFORM Trb1 CE#, OE# Trb2 WE# Tready1 RY/BY# RESET# Trp1 Reset Timing during Automatic Algorithms CE#, OE# Trh RY/BY# RESET# Trp2 Tready2 Reset Timing NOT during Automatic Algorithms P/N:PM1300 REV. 1.3, NOV. 06, 2006 36 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B ERASE/PROGRAM OPERATION Figure 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM CE# Tch Twp WE# Twph Tcs Tghwl OE# Last 2 Erase Command Cycle Twc Address Read Status Tah Tas 2AAh VA SA Tds Tdh 55h VA In Progress Complete 10h Data Tbusy Trb RY/BY# SA: 555h for chip erase P/N:PM1300 REV. 1.3, NOV. 06, 2006 37 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 80H Address 555H Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 10H Address 555H Data# Polling Algorithm or Toggle Bit Algorithm NO Data=FFh ? YES Auto Chip Erase Completed P/N:PM1300 REV. 1.3, NOV. 06, 2006 38 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM Read Status CE# Tch Twhwh2 Twp WE# Twph Tcs Tghwl OE# Tbal Last 2 Erase Command Cycle Twc Address Tas Sector Address 0 2AAh Tds Tdh 55h Sector Address 1 Sector Address n Tah VA VA In Progress Complete 30h 30h 30h Data Tbusy Trb RY/BY# P/N:PM1300 REV. 1.3, NOV. 06, 2006 39 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 80H Address 555H Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 30H Sector Address Last Sector to Erase NO YES Data# Polling Algorithm or Toggle Bit Algorithm Data=FFh NO YES Auto Sector Erase Completed P/N:PM1300 REV. 1.3, NOV. 06, 2006 40 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 8. ERASE SUSPEND/RESUME FLOWCHART START Write Data B0H NO ERASE SUSPEND Toggle Bit checking Q6 not toggled YES Read Array or Program Reading or Programming End NO YES Write Data 30H ERASE RESUME Continue Erase Another Erase Suspend ? NO YES P/N:PM1300 REV. 1.3, NOV. 06, 2006 41 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 9. AUTOMATIC PROGRAM TIMING WAVEFORMS CE# Tch Twhwh1 Twp WE# Tcs Twph Tghwl OE# Last 2 Program Command Cycle Address 555h Last 2 Read Status Cycle Tah Tas VA PA Tds VA Tdh A0h Status PD DOUT Data Tbusy Trb RY/BY# P/N:PM1300 REV. 1.3, NOV. 06, 2006 42 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 10. CE# CONTROLLED WRITE TIMING WAVEFORM WE# Twhwh1 or Twhwh2 Tcep CE# Tceph Tghwl OE# Tah Tas Address 555h VA PA Tds VA Tdh A0h Status PD DOUT Data Tbusy Trb RY/BY# P/N:PM1300 REV. 1.3, NOV. 06, 2006 43 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 11. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data A0H Address 555H Write Program Data/Address Data# Polling Algorithm or Toggle Bit Algorithm next address Read Again Data: Program Data? No YES No Last Word to be Programed YES Auto Program Completed P/N:PM1300 REV. 1.3, NOV. 06, 2006 44 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B SECTOR PROTECT/CHIP UNPROTECT Figure 12. Sector Protect/Chip Unprotect Waveform (RESET# Control) 150uS: Sector Protect 15mS: Chip Unprotect 1us CE# WE# OE# Verification Data 60h SA, A6 A1, A0 60h 40h VA VA Status VA Vhv Vih RESET# VA: valid address P/N:PM1300 REV. 1.3, NOV. 06, 2006 45 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 13-1. IN-SYSTEM SECTOR PROTECT WITH RESET#=Vhv START Retry count=0 RESET#=Vhv Wait 1us Temporary Unprotect Mode No First CMD=60h? Yes Write Sector Address with [A6,A1,A0]:[0,1,0] data: 60h Wait 150us Reset PLSCNT=1 Write Sector Address with [A6,A1,A0]:[0,1,0] data: 40h Retry Count +1 Read at Sector Address with [A6,A1,A0]:[0,1,0] No No Retry Count=25? Data=01h? Yes Yes Device fail Protect another sector? Yes No Temporary Unprotect Mode RESET#=Vih Write RESET CMD Sector Protect Done P/N:PM1300 REV. 1.3, NOV. 06, 2006 46 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 13-2. CHIP UNPROTECT ALGORITHMS WITH RESET#=Vhv START Retry count=0 RESET#=Vhv Wait 1us Temporary Unprotect No First CMD=60h? Yes All sectors protected? No Protect All Sectors Yes Write [A6,A1,A0]:[1,1,0] data: 60h Wait 15ms Write [A6,A1,A0]:[1,1,0] data: 40h Retry Count +1 Read [A6,A1,A0]:[1,1,0] No No Retry Count=1000? Data=00h? Yes Device fail Yes Temporary Unprotect Write reset CMD Chip Unprotect Done P/N:PM1300 REV. 1.3, NOV. 06, 2006 47 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Table 5. TEMPORARY SECTOR UNPROTECT Parameter Alt Description Condition Speed Unit Trpvhh Tvidr RESET# Rise Time to Vhv and Vhv Fall Time to RESET# MIN 500 nS Tvhhwl Trsp RESET# Vhv to WE# Low MIN 4 uS Figure 14. TEMPORARY SECTOR UNPROTECT WAVEFORMS Program or Erase Command Sequence CE# WE# Tvhhwl RY/BY# Vhv 12V RESET# 0 or Vih Vil or Vih Trpvhh Trpvhh P/N:PM1300 REV. 1.3, NOV. 06, 2006 48 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 15. TEMPORARY SECTOR UNPROTECT FLOWCHART Start Apply Reset# pin Vhv Volt Enter Program or Erase Mode Mode Operation Completed (1) Remove Vhv Volt from Reset# (2) RESET# = Vih Completed Temporary Sector Unprotected Mode Notes: 1. Temporary unprotect all protected sectors Vhv=11.5~12.5V. 2. After leaving temporary unprotect mode, the previously protected sectors are again protected. P/N:PM1300 REV. 1.3, NOV. 06, 2006 49 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 16. SILICON ID READ TIMING WAVEFORM Vih CE# Vil Tce Vih WE# Vil Toe Vih OE# Tdf Vil Toh Toh Vhv Vih A9 Vil Vih A0 Vil Taa A1 Taa Vih Vil Vih ADD Vil DATA Q0-Q7 Vih DATA OUT DATA OUT C2H A7H (TOP boot) A8H (Bottom boot) Vil P/N:PM1300 REV. 1.3, NOV. 06, 2006 50 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B WRITE OPERATION STATUS Figure 17. DATA# POLLING TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS) Tce CE# Tch WE# Toe OE# Toeh Tdf Trc Address VA VA Taa Toh Q7 Status Data Complement True Valid Data Q0-Q6 Status Data Status Data True Valid Data High Z High Z Tbusy RY/BY# P/N:PM1300 REV. 1.3, NOV. 06, 2006 51 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 18. Data# Polling Algorithm Start Read Q7~Q0 at valid address (Note 1) No Q7 = Data# ? Yes No Q5 = 1 ? Yes Read Q7~Q0 at valid address Q7 = Data# ? (Note 2) No Yes FAIL Pass Notes: 1. For programming, valid address meas program address. For erasing, valid address meas erase sectors address. 2. Q7 should be rechecked even Q5="1" because Q7 may change simultaneously with Q5. P/N:PM1300 REV. 1.3, NOV. 06, 2006 52 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 19. TOGGLE BIT TIMING WAVEFORMS (DURING AUTOMATIC ALGORITHMS) Tce CE# Tch WE# Toe OE# Toeh Tdf Trc Address VA VA VA VA Taa Toh Q6/Q2 Valid Status (first read) Valid Status Valid Data (second read) (stops toggling) Valid Data Tbusy RY/BY# VA : Valid Address P/N:PM1300 REV. 1.3, NOV. 06, 2006 53 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Figure 20. Toggle Bit Algorithm Start Read Q7-Q0 Twice (Note 1) NO Q6 Toggle ? YES NO Q5 = 1? YES Read Q7~Q0 Twice NO Q6 Toggle ? YES PGM/ERS fail Write Reset CMD PGM/ERS Complete Notes: 1. Read toggle bit twice to determine whether or not it is toggling. 2. Recheck toggle bit because it may stop toggling as Q5 changes to "1". P/N:PM1300 REV. 1.3, NOV. 06, 2006 54 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B AC CHARACTERISTICS WORD/BYTE CONFIGURATION (BYTE#) Parameter Description Speed Options -70 -90 Unit Telfl/Telfh CE# to BYTE# from L/H MAX 5 5 nS Tflqz BYTE# from L to Output Hiz MAX 25 30 nS Tfhqv BYTE# from H to Output Active MIN 70 90 nS Figure 21. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to word mode) CE# OE# Telfh BYTE# Q0~Q14 DOUT (Q0-Q7) Q15/A-1 VA DOUT (Q0-Q14) DOUT (Q15) Tfhqv P/N:PM1300 REV. 1.3, NOV. 06, 2006 55 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B RECOMMENDED OPERATING CONDITIONS At Device Power-Up AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate correctly. Vcc(min) Vcc GND Tvr Tvcs Tf Tce Tr Vih CE# Vil Vih WE# Vil Tf Toe Tr Vih OE# Vil Tr or Tf Vih ADDRESS Tr or Tf Valid Address Vil Voh DATA Taa High Z Valid Ouput Vol Vih WP#/ACC Vil Figure A. AC Timing at Device Power-Up Symbol Parameter Min. Max. Unit Tvr Vcc Rise Time 20 500000 uS/V Tr Input Signal Rise Time 20 uS/V Tf Input Signal Fall Time 20 uS/V P/N:PM1300 REV. 1.3, NOV. 06, 2006 56 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B ERASE AND PROGRAMMING PERFORMANCE LIMITS PARAMETER MIN. Chip Erase Time TYP. MAX. UNITS MX29LV400C 4 32 sec MX29LV800C 8 32 sec MX29LV160C 15 32 sec 0.7 15 sec Sector Erase Time Erase/Program Cycles 100,000 Chip Programming Time MX29LV400C Cycles Byte Mode 4.5 13.5 sec Word Mode 3 9 sec Byte Mode 9 27 sec Word Mode 5.8 17 sec Byte Mode 18 54 sec Word Mode 12 36 sec Accelerated Byte/Word Program Time 7 210 uS Word Program Time 11 360 uS Byte Programming Time 9 300 uS MX29LV800C MX29LV160C LATCH-UP CHARACTERISTICS MIN. MAX. Input Voltage voltage difference with GND on all pins except I/O pins -1.0V 12.5V Input Voltage voltage difference with GND on all I/O pins -1.0V Vcc + 1.0V -100mA +100mA Vcc Current All pins included except Vcc. Test conditions: Vcc = 3.0V, one pin per testing TSOP PIN CAPACITANCE Parameter Symbol Parameter Description Test Set TYP MAX UNIT CIN2 Control Pin Capacitance VIN=0 7.5 9 pF COUT Output Capacitance VOUT=0 8.5 12 pF CIN Input Capacitance VIN=0 6 7.5 pF P/N:PM1300 REV. 1.3, NOV. 06, 2006 57 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B ORDERING INFORMATION MX29LV400C T/B PART NO. MX29LV400CTMC-55R MX29LV400CBMC-55R MX29LV400CTMC-70 MX29LV400CBMC-70 MX29LV400CTMC-90 MX29LV400CBMC-90 MX29LV400CTTC-55R ACCESS TIME (ns) 55 55 70 70 90 90 55 OPERATING CURRENT STANDBY CURRENT MAX.(mA) MAX.(uA) 30 5 30 5 30 5 30 5 30 5 30 5 30 5 MX29LV400CBTC-55R 55 30 5 MX29LV400CTTC-70 70 30 5 MX29LV400CBTC-70 70 30 5 MX29LV400CTTC-90 90 30 5 MX29LV400CBTC-90 90 30 5 MX29LV400CTXBC-55R 55 30 5 MX29LV400CBXBC-55R 55 30 5 MX29LV400CTXBC-70 70 30 5 MX29LV400CBXBC-70 70 30 5 MX29LV400CTXBC-90 90 30 5 MX29LV400CBXBC-90 90 30 5 MX29LV400CTXEC-55R 55 30 5 MX29LV400CBXEC-55R 55 30 5 MX29LV400CTXEC-70 70 30 5 MX29LV400CBXEC-70 70 30 5 P/N:PM1300 PACKAGE 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) REV. 1.3, NOV. 06, 2006 58 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. MX29LV400CTXEC-90 ACCESS TIME (ns) 90 OPERATING CURRENT STANDBY CURRENT PACKAGE MAX.(mA) MAX.(uA) 30 5 48 Ball CSP (ball size=0.4mm) 30 5 48 Ball CSP (ball size=0.4mm) 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP 30 5 44 Pin SOP MX29LV400CBXEC-90 90 MX29LV400CTMI-55R MX29LV400CBMI-55R MX29LV400CTMI-70 MX29LV400CBMI-70 MX29LV400CTMI-90 55 55 70 70 90 MX29LV400CBMI-90 MX29LV400CTTI-55R 90 55 30 30 5 5 MX29LV400CBTI-55R 55 30 5 MX29LV400CTTI-70 70 30 5 MX29LV400CBTI-70 70 30 5 MX29LV400CTTI-90 90 30 5 MX29LV400CBTI-90 90 30 5 MX29LV400CTXBI-55R 55 30 5 MX29LV400CBXBI-55R 55 30 5 MX29LV400CTXBI-70 70 30 5 MX29LV400CBXBI-70 70 30 5 MX29LV400CTXBI-90 90 30 5 MX29LV400CBXBI-90 90 30 5 MX29LV400CTXEI-55R 55 30 5 MX29LV400CBXEI-55R 55 30 5 P/N:PM1300 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) REV. 1.3, NOV. 06, 2006 59 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. MX29LV400CTXEI-70 ACCESS TIME (ns) 70 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV400CBXEI-70 70 30 5 MX29LV400CTXEI-90 90 30 5 MX29LV400CBXEI-90 90 30 5 MX29LV400CTMC-55Q 55 30 5 MX29LV400CBMC-55Q MX29LV400CTMC-70G MX29LV400CBMC-70G MX29LV400CTMC-90G MX29LV400CBMC-90G MX29LV400CTTC-55Q 55 70 70 90 90 55 30 30 30 30 30 30 5 5 5 5 5 5 MX29LV400CBTC-55Q 55 30 5 MX29LV400CTTC-70G 70 30 5 MX29LV400CBTC-70G 70 30 5 MX29LV400CTTC-90G 90 30 5 MX29LV400CBTC-90G 90 30 5 MX29LV400CTXBC-55Q 55 30 5 MX29LV400CBXBC-55Q 55 30 5 MX29LV400CTXBC-70G 70 30 5 MX29LV400CBXBC-70G 70 30 5 MX29LV400CTXBC-90G 90 30 5 MX29LV400CBXBC-90G 90 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 44 Pin SOP PB free 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 60 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV400CTXEC-55Q 55 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV400CBXEC-55Q 55 30 5 MX29LV400CTXEC-70G 70 30 5 MX29LV400CBXEC-70G 70 30 5 MX29LV400CTXEC-90G 90 30 5 MX29LV400CBXEC-90G 90 30 5 MX29LV400CTMI-55Q MX29LV400CBMI-55Q MX29LV400CTMI-70G MX29LV400CBMI-70G MX29LV400CTMI-90G MX29LV400CBMI-90G MX29LV400CTTI-55Q 55 55 70 70 90 90 55 30 30 30 30 30 30 30 5 5 5 5 5 5 5 MX29LV400CBTI-55Q 55 30 5 MX29LV400CTTI-70G 70 30 5 MX29LV400CBTI-70G 70 30 5 MX29LV400CTTI-90G 90 30 5 MX29LV400CBTI-90G 90 30 5 MX29LV400CTXBI-55Q 55 30 5 MX29LV400CBXBI-55Q 55 30 5 MX29LV400CTXBI-70G 70 30 5 MX29LV400CBXBI-70G 70 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 61 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV400CTXBI-90G 90 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV400CBXBI-90G 90 30 5 MX29LV400CTXEI-55Q 55 30 5 MX29LV400CBXEI-55Q 55 30 5 MX29LV400CTXEI-70G 70 30 5 MX29LV400CBXEI-70G 70 30 5 MX29LV400CTXEI-90G 90 30 5 MX29LV400CBXEI-90G 90 30 5 MX29LV400CTXHI-55Q 55 30 5 MX29LV400CBXHI-55Q 55 30 5 MX29LV400CTXHI-70G 70 30 5 MX29LV400CBXHI-70G 70 30 5 MX29LV400CTGBI-70G 70 30 5 MX29LV400CBGBI-70G 70 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.3mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (ball size=0.4mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball XFLGA (4 x 6 x 0.5mm) 48 Ball XFLGA (4 x 6 x 0.5mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 62 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV800C T/B PART NO. ACCESS TIME (ns) MX29LV800CTMC-55R 55 MX29LV800CBMC-55R 55 MX29LV800CTMC-70 70 MX29LV800CBMC-70 70 MX29LV800CTMC-90 90 MX29LV800CBMC-90 90 MX29LV800CTTC-55R 55 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 MX29LV800CBTC-55R 55 30 5 MX29LV800CTTC-70 70 30 5 MX29LV800CBTC-70 70 30 5 MX29LV800CTTC-90 90 30 5 MX29LV800CBTC-90 90 30 5 MX29LV800CTXBC-55R 55 30 5 MX29LV800CBXBC-55R 55 30 5 MX29LV800CTXBC-70 70 30 5 MX29LV800CBXBC-70 70 30 5 MX29LV800CTXBC-90 90 30 5 MX29LV800CBXBC-90 90 30 5 MX29LV800CTMI-55R MX29LV800CBMI-55R MX29LV800CTMI-70 MX29LV800CBMI-70 MX29LV800CTMI-90 MX29LV800CBMI-90 MX29LV800CTTI-55R 55 55 70 70 90 90 55 30 30 30 30 30 30 30 5 5 5 5 5 5 5 MX29LV800CBTI-55R 55 30 5 MX29LV800CTTI-70 70 30 5 MX29LV800CBTI-70 70 30 5 P/N:PM1300 PACKAGE Remark 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) REV. 1.3, NOV. 06, 2006 63 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. MX29LV800CTTI-90 ACCESS TIME (ns) 90 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV800CBTI-90 90 30 5 MX29LV800CTXBI-55R 55 30 5 MX29LV800CBXBI-55R 55 30 5 MX29LV800CTXBI-70 70 30 5 MX29LV800CBXBI-70 70 30 5 MX29LV800CTXBI-90 90 30 5 MX29LV800CBXBI-90 90 30 5 MX29LV800CTXEC-55R 55 30 5 MX29LV800CBXEC-55R 55 30 5 MX29LV800CTXEC-70 70 30 5 MX29LV800CBXEC-70 70 30 5 MX29LV800CTXEC-90 90 30 5 MX29LV800CBXEC-90 90 30 5 MX29LV800CTXEI-55R 55 30 5 MX29LV800CBXEI-55R 55 30 5 MX29LV800CTXEI-70 70 30 5 MX29LV800CBXEI-70 70 30 5 MX29LV800CTXEI-90 90 30 5 MX29LV800CBXEI-90 90 30 5 MX29LV800CTMC-55Q MX29LV800CBMC-55Q MX29LV800CTMC-70G MX29LV800CBMC-70G 55 55 70 70 30 30 30 30 5 5 5 5 P/N:PM1300 PACKAGE Remark 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 64 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV800CTMC-90G 90 MX29LV800CBMC-90G 90 MX29LV800CTTC-55Q 55 OPERATING Current MAX. (mA) 30 30 30 STANDBY Current MAX. (uA) 5 5 5 MX29LV800CBTC-55Q 55 30 5 MX29LV800CTTC-70G 70 30 5 MX29LV800CBTC-70G 70 30 5 MX29LV800CTTC-90G 90 30 5 MX29LV800CBTC-90G 90 30 5 MX29LV800CTXBC-55Q 55 30 5 MX29LV800CBXBC-55Q 55 30 5 MX29LV800CTXBC-70G 70 30 5 MX29LV800CBXBC-70G 70 30 5 MX29LV800CTXBC-90G 90 30 5 MX29LV800CBXBC-90G 90 30 5 MX29LV800CTMI-55Q MX29LV800CBMI-55Q MX29LV800CTMI-70G MX29LV800CBMI-70G MX29LV800CTMI-90G MX29LV800CBMI-90G MX29LV800CTTI-55Q 55 55 70 70 90 90 55 30 30 30 30 30 30 30 5 5 5 5 5 5 5 MX29LV800CBTI-55Q 55 30 5 MX29LV800CTTI-70G 70 30 5 MX29LV800CBTI-70G 70 30 5 MX29LV800CTTI-90G 90 30 5 MX29LV800CBTI-90G 90 30 5 MX29LV800CTXBI-55Q 55 30 5 P/N:PM1300 PACKAGE Remark 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 65 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV800CBXBI-55Q 55 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV800CTXBI-70G 70 30 5 MX29LV800CBXBI-70G 70 30 5 MX29LV800CTXBI-90G 90 30 5 MX29LV800CBXBI-90G 90 30 5 MX29LV800CTXEC-55Q 55 30 5 MX29LV800CBXEC-55Q 55 30 5 MX29LV800CTXEC-70G 70 30 5 MX29LV800CBXEC-70G 70 30 5 MX29LV800CTXEC-90G 90 30 5 MX29LV800CBXEC-90G 90 30 5 MX29LV800CTXEI-55Q 55 30 5 MX29LV800CBXEI-55Q 55 30 5 MX29LV800CTXEI-70G 70 30 5 MX29LV800CBXEI-70G 70 30 5 MX29LV800CTXEI-90G 90 30 5 MX29LV800CBXEI-90G 90 30 5 MX29LV800CTTI-45Q 45 30 5 MX29LV800CBTI-45Q 45 30 5 MX29LV800CTXBI-45Q 45 30 5 MX29LV800CBXBI-45Q 45 30 5 MX29LV800CTXEI-45Q 45 30 5 MX29LV800CBXEI-45Q 45 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 66 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV800CTXHI-55R 55 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV800CBXHI-55R 55 30 5 MX29LV800CTXHI-70G 70 30 5 MX29LV800CBXHI-70G 70 30 5 MX29LV800CTGBI-70G 70 30 5 MX29LV800CBGBI-70G 70 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball XFLGA (4 x 6 x 0.5mm) 48 Ball XFLGA (4 x 6 x 0.5mm) PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 67 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV160CTMC-55R 55 MX29LV160CBMC-55R 55 MX29LV160CTMC-70 70 MX29LV160CBMC-70 70 MX29LV160CTMC-90 90 MX29LV160CBMC-90 90 MX29LV160CTMI-55R 55 MX29LV160CBMI-55R 55 MX29LV160CTMI-70 70 MX29LV160CBMI-70 70 MX29LV160CTMI-90 90 MX29LV160CBMI-90 90 MX29LV160CTTC-55R 55 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 MX29LV160CBTC-55R 55 30 5 MX29LV160CTTC-70 70 30 5 MX29LV160CBTC-70 70 30 5 MX29LV160CTTC-90 90 30 5 MX29LV160CBTC-90 90 30 5 MX29LV160CTTI-55R 55 30 5 MX29LV160CBTI-55R 55 30 5 MX29LV160CTTI-70 70 30 5 MX29LV160CBTI-70 70 30 5 MX29LV160CTTI-90 90 30 5 MX29LV160CBTI-90 90 30 5 MX29LV160CTXBC-55R 55 30 5 MX29LV160CBXBC-55R 55 30 5 MX29LV160CTXBC-70 70 30 5 P/N:PM1300 PACKAGE Remark 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) REV. 1.3, NOV. 06, 2006 68 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV160CBXBC-70 70 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV160CTXBC-90 90 30 5 MX29LV160CBXBC-90 90 30 5 MX29LV160CTXBI-55R 55 30 5 MX29LV160CBXBI-55R 55 30 5 MX29LV160CTXBI-70 70 30 5 MX29LV160CBXBI-70 70 30 5 MX29LV160CTXBI-90 90 30 5 MX29LV160CBXBI-90 90 30 5 MX29LV160CTXEC-55R 55 30 5 MX29LV160CBXEC-55R 55 30 5 MX29LV160CTXEC-70 70 30 5 MX29LV160CBXEC-70 70 30 5 MX29LV160CTXEC-90 90 30 5 MX29LV160CBXEC-90 90 30 5 MX29LV160CTXEI-55R 55 30 5 MX29LV160CBXEI-55R 55 30 5 MX29LV160CTXEI-70 70 30 5 MX29LV160CBXEI-70 70 30 5 MX29LV160CTXEI-90 90 30 5 MX29LV160CBXEI-90 90 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) REV. 1.3, NOV. 06, 2006 69 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. MX29LV160CTMC-55Q MX29LV160CBMC-55Q MX29LV160CTMC-70G MX29LV160CBMC-70G MX29LV160CTMC-90G MX29LV160CBMC-90G MX29LV160CTMI-55Q MX29LV160CBMI-55Q MX29LV160CTMI-70G MX29LV160CBMI-70G MX29LV160CTMI-90G MX29LV160CBMI-90G MX29LV160CTTC-55Q ACCESS TIME (ns) 55 55 70 70 90 90 55 55 70 70 90 90 55 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 MX29LV160CBTC-55Q 55 30 5 MX29LV160CTTC-70G 70 30 5 MX29LV160CBTC-70G 70 30 5 MX29LV160CTTC-90G 90 30 5 MX29LV160CBTC-90G 90 30 5 MX29LV160CTTI-55Q 55 30 5 MX29LV160CBTI-55Q 55 30 5 MX29LV160CTTI-70G 70 30 5 MX29LV160CBTI-70G 70 30 5 MX29LV160CTTI-90G 90 30 5 MX29LV160CBTI-90G 90 30 5 MX29LV160CTXBC-55Q 55 30 5 MX29LV160CBXBC-55Q 55 30 5 MX29LV160CTXBC-70G 70 30 5 MX29LV160CBXBC-70G 70 30 5 P/N:PM1300 PACKAGE Remark 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 70 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NO. ACCESS TIME (ns) MX29LV160CTXBC-90G 90 OPERATING Current MAX. (mA) 30 STANDBY Current MAX. (uA) 5 MX29LV160CBXBC-90G 90 30 5 MX29LV160CTXBI-55Q 55 30 5 MX29LV160CBXBI-55Q 55 30 5 MX29LV160CTXBI-70G 70 30 5 MX29LV160CBXBI-70G 70 30 5 MX29LV160CTXBI-90G 90 30 5 MX29LV160CBXBI-90G 90 30 5 MX29LV160CTXEC-55Q 55 30 5 MX29LV160CBXEC-55Q 55 30 5 MX29LV160CTXEC-70G 70 30 5 MX29LV160CBXEC-70G 70 30 5 MX29LV160CTXEC-90G 90 30 5 MX29LV160CBXEC-90G 90 30 5 MX29LV160CTXEI-55Q 55 30 5 MX29LV160CBXEI-55Q 55 30 5 MX29LV160CTXEI-70G 70 30 5 MX29LV160CBXEI-70G 70 30 5 MX29LV160CTXEI-90G 90 30 5 MX29LV160CBXEI-90G 90 30 5 MX29LV160CTGBI-70G 70 30 5 MX29LV160CBGBI-70G 70 30 5 P/N:PM1300 PACKAGE Remark 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.3mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball CSP (ball size:0.4mm) 48 Ball XFLGA (4 x 6 x 0.5mm) 48 Ball XFLGA (4 x 6 x 0.5mm) PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free REV. 1.3, NOV. 06, 2006 71 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PART NAME DESCRIPTION MX 29 LV 160 C T T C 70 G OPTION: G: Lead-free package R: Restricted Vcc (3.0V~3.6V) Q: Restricted Vcc (3.0V~3.6V) with Lead-free package blank: normal SPEED: 55: 55nS 70: 70nS 90: 90nS TEMPERATURE RANGE: C: Commercial (0C to 70C) I: Industrial (-40C to 85C) PACKAGE: M: SOP T: TSOP X: FBGA (CSP) XB - 6 x 8 x 1.2mm, Pitch 0.8mm, 0.3mm Ball XE - 6 x 8 x 1.3mm, Pitch 0.8mm, 0.4mm Ball XH: WFBGA - 4 x 6 x 0.75mm, Pitch 0.5mm, 0.3mm Ball GB: XFLGA - 4 x 6 x 0.5mm, Pitch 0.5mm, 0.25mm Ball BOOT BLOCK TYPE: T: Top Boot B: Bottom Boot REVISION: C DENSITY & MODE: 160: 16Mb, x8/x16 Boot Block 800: 8Mb, x8/x16 Boot Block 400: 4Mb, x8/x16 Boot Block TYPE: LV: 3V DEVICE: 29:Flash P/N:PM1300 REV. 1.3, NOV. 06, 2006 72 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B PACKAGE INFORMATION P/N:PM1300 REV. 1.3, NOV. 06, 2006 73 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B P/N:PM1300 REV. 1.3, NOV. 06, 2006 74 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball CSP (for MX29LV400C/MX29LV800C/MX29LV160C TXBC/ TXBI/BXBC/BXBI) P/N:PM1300 REV. 1.3, NOV. 06, 2006 75 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball CSP (for MX29LV400C/MX29LV800C/MX29LV160C TXEC/ TXEI/BXEC/BXEI) P/N:PM1300 REV. 1.3, NOV. 06, 2006 76 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball CSP (for MX29LV400C/MX29LV800C TXHC/ TXHI/BXHC/BXHI) P/N:PM1300 REV. 1.3, NOV. 06, 2006 77 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B 48-Ball XFLGA (for MX29LV400C/MX29LV800C/MX29LV160C TGBI/BGBI) P/N:PM1300 REV. 1.3, NOV. 06, 2006 78 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B REVISION HISTORY Revision No. Description 1.1 1. Data modification 1.2 1. Added 48-ball XFLGA package information 1.3 1. Added statement P/N:PM1300 Page All P4,7,9,62 P67,71,72,78 P80 Date AUG/17/2006 SEP/19/2006 NOV/06/2006 REV. 1.3, NOV. 06, 2006 79 MX29LV400C T/B MX29LV800C T/B MX29LV160C T/B Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substantial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. Macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications. MACRONIX INTERNATIONAL CO., LTD. Headquarters: TEL:+886-3-578-6688 FAX:+886-3-563-2888 Europe Office : TEL:+32-2-456-8020 FAX:+32-2-456-8021 Hong Kong Office : TEL:+86-512-6258-0888 FAX:+86-512-6258-6799 Japan Office : Kawasaki Office : TEL:+81-44-246-9100 FAX:+81-44-246-9105 Technical Support Center : TEL:+81-44-246-9875 FAX:+81-44-246-9951 Singapore Office : TEL:+65-6346-5505 FAX:+65-6348-8096 Taipei Office : TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-262-8887 FAX:+1-408-262-8810 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 80