CMF-SDP Series - Telecom CPTC Resettable Fuses
Typical
Induction Rated Resistance Time to Trip
Voltage Rated Resistance Matching Hold Trip Imax @ @ Imax/
Model Withstand Voltage (RN) In Housing Current Current 230 VAC 230 VAC
VAC Volts Ohms Tolerance Ohms Amps @ 25 °C Amps @ 25 °C Amps Seconds
CMF-SDP05 600 230 5 ±20 % ±1 0.160 0.370 1.0 4.5
CMF-SDP07 600 230 7 ±20 % ±0.5 0.150 0.350 3.0 0.45
CMF-SDP10 600 220 10 ±20 % ±0.5 0.180 0.360 1.0 3.8
CMF-SDP10A 600 220 10 ±20 % ±0.5 0.150 0.360 1.0 3.8
CMF-SDP25 600 220 25 ±20 % ±0.5 0.130 0.260 2.5 0.2
CMF-SDP25A 600 220 25 ±20 % ±0.5 0.130 0.260 2.5 0.3
CMF-SDP35 600 220 35 +15/-20 % ±0.5 0.110 0.230 2.5 0.06
CMF-SDP35A 600 220 35 +15/-20 % ±0.5 0.110 0.230 2.5 0.0
CMF-SDP50 600 220 50 ±15 % ±0.5 0.090 0.190 2.5 0.13
CMF-SDP50A 600 220 50 ±15 % ±0.5 0.090 0.190 2.5 0.1
CMF-SDP75 600 220 75 ±20 % ±1 0.070 0.150 2.5 0.12
CMF-SDP75A 600 220 75 ±20 % ±1 0.070 0.150 2.5 0.09
Electrical Characteristics
Features
■Two resistance-matched PTCs in a
plastic housing
■Narrow resistance tolerance
■RoHS compliant*
Applications
Used as a secondary overcurrent protection
device in:
■Customer Premise Equipment (CPE)
■Central Office (CO)
■Access equipment
*RoHS COMPLIANT
Operating Temperature Range: -40°C to +125 °C
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Primary
Test Protection Test Condition Requirements
Mains Power Contact - ITU-T K.20, K.21 ....None................230 V rms, 10 ohms, 15 Min.......................................................(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21..............None................600V rms, 600 ohms, 0.2 seconds, 10 cycles, every 1 Min. ......(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 600 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 %
Power Induction - ITU-T K.20, K.21..............GDT ................600 V rms, 200 ohms, 1 second, 10 cycles, every 1 Min. ..........(Ri-Rf) / Ri < ±10 %
Lightning Surge - ITU-T K.20, K.21 ......................................10/700 µs, 25 ohms, 1.0 kV, 10 Tests, every 1 Min. ..................(Ri-Rf) / Ri < ±10 %
Lightning Surge......................................................................10/1000 µs, 25 amps, 1.5 kV, 30 Tests, every 3 Min. ................(Ri-Rf) / Ri < ±10 %
Ri = R initial
Rf = R final
Test Procedures And Requirements For Model CMF-SDP Series
How to Order
CMF - SD P 35 A -XX - 2
Product Designator
Style
SD = Surface Mount
Dual Pkg.
Housing
P = Plastic
Rated Resistance (RN)
5-75 (5-75 Ohms)
Footprint and Height Option
Blank = Standard Product
A = Reduced Footprint and Height
Resistance Tolerance Option
Blank = Standard
-XX = XX %; e.g. -10 = ±10 %
Packaging Options
- 2 = Tape & Reel
Typical Part Marking
Represents total content. Layout may vary.
35P8G
MANUFACTURER'S
TRADEMARK
PART
IDENTIFICATION:
05P = CMF-SDP05
07P = CMF-SDP07
10P = CMF-SDP10
10PA = CMF-SDP10A
25P = CMF-SDP25
25PA = CMF-SDP25A
35P = CMF-SDP35
35PA = CMF-SDP35A
50P = CMF-SDP50
50PA = CMF-SDP50A
75P = CMF-SDP75
75PA = CMF-SDP75A
YEAR CODE:
8 = 2008
BI-WEEKLY
DATE CODE:
WEEK 13-14 = G
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
Solder Reflow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (°C)
120
Preheating Soldering Cooling
Time (seconds)
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the
board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not
meet the performance specifications.
Rework
• A device should not be reworked.
CMF-SDP SERIES, REV. E, 05/09
CMF-SDP Series - Telecom CPTC Resettable Fuses
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Product Dimensions
Recommended Pad LayoutRecommended Pad Layout
Packaging options: TAPE & REEL: 350 pcs. per reel Packaging options: TAPE & REEL: 400 pcs. per reel
MM
(INCHES)
DIMENSIONS =
8.75
(.344) MAX.
MAX.
MAX.
7.2
(.283)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
CMF-SDP10A, 25A, 35A, 50A & 75A
5.0
(.197)
11.0
(.433) MAX.
9.0
(.354) MAX.
11.5
(.453)
MAX.
2.6
(.102)
CMF-SDP05, 07, 10, 25, 35, 50 & 75
7.2
(.283)
MAX.
8.75
(.344)
MAX.
3.2
(.126) 2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
9.0
(.354)
10.0
(.394)
3.2
(.126) 2.0
(.079)
2.6
(.102)
7.6
(.299)
11.0
(.433)
5.0
(.197)
CMF-SDP05-2,
CMF-SDP07-2, CMF-SDP10-2, CMF-SDP10A-2
CMF-SDP25-2, CMF-SDP-35-2, CMF-SDP25A-2, CMF-SDP35A-2,
Tape Dimensions per EIA 481-2 CMF-SDP50-2, CMF-SDP75-2 CMF-SDP50A-2, CMF-SDP75A-2
W 24.0 ±0.5 24.0 ±0.5
(0.945 ±0.020) (0.945 ±0.020)
P0 4.0 4.0
(0.157) (0.157)
P 16.0 16.0
(0.630) (0.630)
P2 2.0 2.0
(0.079) (0.079)
A0 9.1 ± 0.2 7.5 ± 0.2
(0.358 ± 0.008) (0.295 ± 0.008)
B0 11.20 ± 0.2 9.0 ± 0.2
(0.441 ± 0.008) (0.354 ± 0.008)
D 1.5 1.5
(0.059) (0.059)
F 11.5 11.5
(0.453) (0.453)
E 1.75 1.75
(0.069) (0.069)
t 0.5 ± 0.15 0.5 ± 0.15
(0.020 ± 0.006) (0.020 ± 0.006)
K0 11.7 ± 0.2 10.0 ± 0.2
(0.433 ± 0.008) (0.394 ± 0.008)
CMF-SDP Series Tape and Reel Specifi cations
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications
A0
P
P0T
K0
B0
F
E
W
P2-0.4
(-.016)
D
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
24.4
(.961) 30.4
(1.197)
MAX.
MIN.
330 -2/+0
(12.99 -.079/+0)
DIA.
DIMENSIONS: MM
(INCHES)
