3.3 V, 3.2 Gbps, Limiting Amplifier ADN2891 FEATURES GENERAL DESCRIPTION Input sensitivity: 4 mV p-p 80 ps rise/fall times CML outputs: 700 mV p-p differential Programmable LOS detector: 3.5 mV to 35 mV Rx signal strength indicator (RSSI) SFF-8472-compliant average power measurement Single-supply operation: 3.3 V Low power dissipation: 145 mW Available in space-saving 3 mm x 3 mm, 16-lead LFCSP Extended temperature range: -40C to +95C SFP reference design available The ADN2891 is a 3.2 Gbps limiting amplifier with integrated loss-of-signal (LOS) detection circuitry and a received signal strength indicator (RSSI). This part is optimized for SONET, Gigabit Ethernet (GbE), and Fibre Channel optoelectronic conversion applications. The ADN2891 has a differential input sensitivity of 4 mV p-p and accepts up to a 2.0 V p-p differential input overload voltage. The ADN2891 supports current mode logic (CML) outputs with controlled rise and fall times. By monitoring the bias current through a photodiode, the onchip RSSI detector measures the average power received with 2% typical linearity over the entire valid input range of the photodiode. The on-chip RSSI detector facilitates SFF-8472compliant optical transceivers by eliminating the need for external RSSI detector circuitry. APPLICATIONS SFP/SFF/GBIC optical transceivers OC-3/OC-12/OC-48, GbE, Fibre Channel (FC) receivers 10GBASE-LX4 transceivers WDM transponders Additional features include a programmable loss-of-signal (LOS) detector and output squelch. The ADN2891 is available in a 3 mm x 3 mm, 16-lead LFCSP. FUNCTIONAL BLOCK DIAGRAM AVCC AVEE DRVCC DRVEE DRVCC ADN2891 50 ADN2880 50 PIN OUTP NIN OUTN 50 +V 50 3k VREF LOS PD_VCC RSSI/LOS DETECTOR 10k RSSI_OUT ADuC7020 CAZ1 CAZ2 0.01F THRADJ SQUELCH 05244-001 PD_CATHODE Figure 1. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 (c)2005 Analog Devices, Inc. All rights reserved. ADN2891 TABLE OF CONTENTS Specifications..................................................................................... 3 Loss of Signal (LOS) Detector .................................................. 10 Absolute Maximum Ratings............................................................ 5 Received Signal Strength Indicator (RSSI) ............................. 10 Thermal Resistance ...................................................................... 5 Squelch Mode ............................................................................. 10 ESD Caution.................................................................................. 5 Applications..................................................................................... 11 Pin Configuration and Function Descriptions............................. 6 PCB Design Guidelines ............................................................. 11 Typical Performance Characteristics ............................................. 7 Outline Dimensions ....................................................................... 13 Theory of Operation ...................................................................... 10 Ordering Guide .......................................................................... 13 Limiting Amplifier ..................................................................... 10 REVISION HISTORY 7/05--Rev. 0 to Rev. A Changes to Table 1............................................................................ 3 Changes to Ordering Guide .......................................................... 13 3/05--Revision 0: Initial Version Rev. A | Page 2 of 16 ADN2891 SPECIFICATIONS Test Conditions: VCC = 2.9 V to 3.6 V, VEE = 0 V, TA = -40C to +95C, unless otherwise noted. Table 1. Parameter QUANTIZER DC CHARACTERISTICS Input Voltage Range Input Common Mode Differential Input Range Differential Input Sensitivity Input Offset Voltage Input RMS Noise Input Resistance Input Capacitance QUANTIZER AC CHARACTERISTICS Input Data Rate Small Signal Gain S11 S22 Random Jitter Deterministic Jitter Low Frequency Cutoff Min 1.8 2.1 5.2 Electrical Hysteresis LOS Assert Time LOS De-Assert Time RSSI Input Current Range RSSI Output Linearity Gain Offset Compliance Voltage POWER SUPPLIES VCC ICC OPERATING TEMPERATURE RANGE CML OUTPUT CHARACTERISTICS Output Impedance Output Voltage Swing Output Rise and Fall Time Unit Test Conditions/Comments 2.8 2.7 2.0 V p-p V V p-p mV p-p V V rms pF At PIN or NIN, dc-coupled DC-coupled AC-coupled 3.2 Gbps, PRBS 223 - 1, BER 10-10 3200 50 -10 -10 4.0 9.0 30 1.0 45 1.9 19 2.4 2.75 Max 3.5 100 235 50 0.65 155 Power Supply Rejection Ratio LOSS OF SIGNAL DETECTOR (LOS) LOS Assert Level Typ 3.5 35 5.0 5.0 950 62 5 Mb/s dB dB dB ps rms ps p-p kHz kHz dB Differential Differential, f < 3.2 GHz Differential, f < 3.2 GHz Input 10 mV p-p, OC-48, PRBS 223 - 1 Input 10 mV p-p, OC-48, PRBS 223 - 1 CAZ = Open CAZ = 0.0 1 F f < 10 MHz 5.6 53 mV p-p mV p-p dB dB ns ns RTHRADJ = 100 k RTHRADJ = 1 k OC-3, PRBS 223 - 1 OC-48, PRBS 223 - 1 DC-coupled DC-coupled 1000 A % mA/mA nA 6.4 34 2 1.0 145 VCC - 0.9 2.9 -40 600 3.3 45 +25 50 660 80 Single-ended 5 A < IIN 1000 A IRSSI/IPD Difference between measured RSSI output and PD_CATHODE (input) current of 5 A Measured at PD_CATHODE, with I = 5 A or I = 1 mA VCC - 0.4 V 3.6 49 +95 V mA C TMIN to TMAX 850 130 mV p-p ps Single-ended Differential 20% to 80% Rev. A | Page 3 of 16 ADN2891 Parameter LOGIC INPUTS (SQUELCH) VIH, Input High Voltage VIL, Input Low Voltage Input Current LOGIC OUTPUTS (LOS) VOH, Output High Voltage VOL, Output Low Voltage Min Typ Max Unit 0.8 40 V V A IINH, VIN = 2.4 V, 100 k pull-down resistor on-chip 6 A IINL, VIN = 0.4 V, 100 k pull-down resistor on-chip V Open drain output, 4.7 k to 10 k pull-up resistor to VCC Open drain output, 4.7 k to 10 k pull-up resistor to VCC 2.0 2.4 0.4 V Rev. A | Page 4 of 16 Test Conditions/Comments ADN2891 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Power Supply Voltage Minimum Voltage (All Inputs and Outputs) Maximum Voltage (All Inputs and Outputs) Storage Temperature Operating Temperature Range Production Soldering Temperature Junction Temperature Rating 4.2 V VEE - 0.4 V VCC + 0.4 V -65C to +150C -40C to +95C J-STD-20 125C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE JA is specified for 4-layer PCB with exposed paddle soldered to GND. Table 3. Package Type 3 mm x 3 mm, 16-lead LFCSP ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 JA 28 Unit C/W ADN2891 PD_CATHODE PD_VCC RSSI_OUT SQUELCH PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 16 15 14 13 12 DRVCC AVCC 1 ADN2891 6 7 8 CAZ2 LOS 05244-002 5 CAZ1 11 OUTP TOP VIEW NIN 3 (Not to Scale) 10 OUTN AVEE 4 9 DRVEE THRADJ PIN 2 Figure 2. Pin Configuration Note that the LFCSP has an exposed pad on the bottom. To improve heat dissipation, the exposed pad must be soldered to the GND plane with filled vias. Table 4. Pin Function Descriptions Pin No. 1 2 3 4 5 6 Mnemonic AVCC PIN NIN AVEE THRADJ CAZ1 I/O Type 1 P AI AI P AO AI Descriptions Analog Power Supply. Differential Data Input, Positive Port, 50 On-Chip Termination. Differential Data Input, Negative Port, 50 On-Chip Termination. Analog Ground. LOS Threshold Adjust Resistor. If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for input offset correction. 7 CAZ2 AI If needed, one capacitor can connect between the CAZ1 and CAZ2 pin for input offset correction. 8 9 10 11 12 13 14 15 16 Exposed Pad LOS DRVEE OUTN OUTP DRVCC SQUELCH RSSI_OUT PD_VCC PD_CATHODE Pad DO P DO DO P DI AO P AO P LOS Detector Output, Open Collector. Output Buffer Ground. Differential Data Output, CML, Negative Port, 50 On-Chip Termination. Differential Data Output, CML, Positive Port, 50 On-Chip Termination. Output Buffer Power Supply. Disable Outputs, 100 k On-Chip Pull-Down Resistor. Average Current Output. Power Input for RSSI Measurement. Photodiode Bias Voltage. Connect to Ground. 1 P = power; DI = digital input; DO = digital output; AI = analog input; and AO = analog output. Rev. A | Page 6 of 16 ADN2891 05244-020 05244-015 100mV/DIV 100mV/DIV TYPICAL PERFORMANCE CHARACTERISTICS 50ps/DIV 50ps/DIV Figure 6. Eye of ADN2891 @ 95C, 3.2 Gbps, and 500 mV Input 05244-017 05244-019 100mV/DIV 100mV/DIV Figure 3. Eye of ADN2891 @ 25C, 3.2 Gbps, and 10 mV Input 1ns/DIV 50ps/DIV Figure 7. Eye of ADN2891 @ 25C, 155 Mbps, and 10 mV Input 05244-027 100mV/DIV Figure 4. Eye of ADN2891 @ 25C, 3.2 Gbps, and 500 mV Input 50ps/DIV Figure 5. Eye of ADN2891 @ 95C, 3.2 Gbps, and 10 mV Input Rev. A | Page 7 of 16 ADN2891 70 5.0 4.5 -40C 4.0 +95C 50 RANDOM JITTER (ps) +25C 40 +95C 30 +25C DEASSERTION 20 3.5 3.0 2.5 2.0 1.5 -40C 05244-011 ASSERTION 0 1k 10k RTH () 05244-010 1.0 10 0.5 0 100k 0 Figure 8. LOS Trip and Release vs. RTH at OC48 1.5 2.0 DATA RATE (Gbps) 2.5 3.0 3.5 3.0 3.5 14 OC48 DETERMINISTIC JITTER (ps) 12 OC3 4 2 0 1k 10k 10 8 6 4 2 05244-013 6 05244-012 LOS ELECTRICAL HYSTERESIS (dB) 1.0 Figure 11. Random Jitter vs. Data Rate 8 0 100k 0 RTH () 0.5 1.0 1.5 2.0 DATA RATE (Gbps) 2.5 Figure 12. Deterministic Jitter vs. Data Rate Figure 9. LOS Electrical Hysteresis vs. RTH at 25C 70 16 14 12 10 8 6 05244-022 4 2 0 6.0 6.3 6.6 6.9 7.2 7.5 7.8 8.1 8.4 ELECTRICAL HYSTERESIS (dB) 8.7 POWER SUPPLY-NOISE REJECTION (dB) 18 SAMPLE 0.5 9.0 60 50 40 30 20 10 0 100k 05244-005 LOS TRIP AND RELEASE (mV) 60 1M SUPPLY-NOISE FREQUENCY (Hz) Figure 13. PSRR vs. Supply-Noise Frequency Figure 10. Sample Lot Distribution--Worst-Case Condition: Conditions = 155 Mbps, 100 k @ 95C, 3.6 V Rev. A | Page 8 of 16 10M ADN2891 1200 900 800 5A REFERRED OFFSET (nA) RSSI OUTPUT CURRENT (A) 1000 800 600 400 700 600 500 400 300 200 0 0 05244-025 05244-018 200 100 0 -40 200 400 600 800 1000 1200 PD_CATHODE CURRENT (PHOTODIODE CURRENT) (A) -20 0 20 40 TEMPERATURE (C) 60 80 100 Figure 17. RSSI Offset is the Difference Between Measured RSSI Output and PD_CATHODE (Input) Current of 5 A Figure 14. RSSI Output vs. Average Photodiode Current 5.0 60 4.5 4.0 RSSI LINEARITY (%) RSSI OUTPUT CURRENT (A) 50 40 30 20 3.5 3.0 2.5 +100C 2.0 +30C 1.5 1.0 0 0.5 -40C 0 0 10 20 30 40 50 60 PD_CATHODE CURRENT (PHOTODIODE CURRENT) (A) 0 200 400 600 PD_CATHODE CURRENT (A) 800 1000 Figure 18. RSSI Linearity % vs. PD_CATHODE Current Figure 15. RSSI Output vs. Average Photodiode Current (Zoomed) 44.5 -0.15 -0.20 44.0 -0.25 -0.30 43.5 ICC (mA) -0.35 -0.40 -0.45 43.0 42.5 -0.50 42.0 -0.60 -0.65 -0.70 0 100 200 300 400 500 600 700 INPUT CURRENT (A) 800 900 1000 41.5 41.0 -60 05244-024 -0.55 05244-023 COMPLIANCE VOLTAGE REFERRED TO VCC (V) 05244-029 05244-028 10 -40 -20 0 20 40 60 TEMPERATURE (C) 80 Figure 19. ADN2891 ICC Current vs. Temperature Figure 16. PD_CATHODE Compliance Voltage vs. Input Current RSSI (Refer to VCC) Rev. A | Page 9 of 16 100 120 ADN2891 THEORY OF OPERATION LIMITING AMPLIFIER LOSS OF SIGNAL (LOS) DETECTOR Input Buffer The on-chip LOS circuit drives LOS to logic high when the input signal level falls below a user-programmable threshold. The threshold level can be set to anywhere from 3.5 mV p-p to 35 mV p-p, typical, and is set by a resistor connected between the THRADJ pin and VEE. See Figure 8 and Figure 9 for the LOS threshold vs. THRADJ. The ADN2891 LOS circuit has an electrical hysteresis greater than 2.5 dB to prevent chatter at the LOS signal. The LOS output is an open-collector output that must be pulled up externally with a 4.7 k to 10 k resistor. The ADN2891 limiting amplifier provides differential inputs (PIN/NIN), each having single-ended, on-chip, 50 termination. The amplifier can accept either dc-coupled or ac-coupled signals; however, an ac-coupled signal is recommended. Using a dc-coupled signal, the amplifier needs a correct input commonmode voltage and enough headroom to handle the dynamic input signal strength. Additionally, TIA output offset drifts may degrade receiver performance. The ADN2891 limiting amplifier is a high gain device. It is susceptible to dc offsets in the signal path. The pulse width distortion presented in the NRZ data or a distortion generated by the TIA may appear as dc offset or a corrupted signal to the ADN2891 inputs. An internal offset correction loop can compensate for certain levels of offset. To compensate for more offset, an external capacitor connected between the CAZ1 and CAZ2 pins maybe necessary. For GbE and FC applications, no external capacitor is necessary; however, for SONET applications, a 0.01 F capacitor helps the input signal offset compensation and provides a 3 dB cutoff frequency at 1 kHz. CML Output Buffer The ADN2891 provides differential CML outputs, OUTP and OUTN. Each output has an internal 50 termination to VCC. RECEIVED SIGNAL STRENGTH INDICATOR (RSSI) The ADN2891 has an on-chip, RSSI circuit. By monitoring the current supplied to the photodiode, the RSSI circuit provides an accurate, average power measurement. The output of the RSSI is a current that is directly proportional to the average amount of PIN photodiode current. Placing a resistor between the RSSI_OUT pin and GND converts the current to a GND referenced voltage. This function eliminates the need for external RSSI circuitry for SFF-8472-compliant optical receivers. For more information, see Figure 14 to Figure 18. SQUELCH MODE Driving the SQUELCH input to logic high disables the limiting amplifier outputs. Using LOS output to drive the SQUELCH input, the limiting amplifier outputs stop toggling anytime a signal input level to the limiting amplifier drops below the programmed LOS threshold. The SQUELCH pin has a 100 k, internal, pull-down resistor. Rev. A | Page 10 of 16 ADN2891 APPLICATIONS PCB DESIGN GUIDELINES The exposed pad should connect to the GND plane using filled vias so that solder does not leak through the vias during reflow. Using filled vias in parallel under the package greatly reduces the thermal resistance and enhances the reliability of the connectivity of the exposed pad to the GND plane during reflow. Proper RF PCB design techniques must be used to ensure optimal performance. Output Buffer Power Supply and Ground Planes Pin 9 (DRVEE) and Pin 12 (DRVCC) are the power supply and ground pins that provide current to the differential output buffer. To reduce possible series inductance, Pin 9, which is the ground return of the output buffer, should connect to ground directly. If the ground plane is an internal plane and connections to the ground plane are vias, multiple vias in parallel to ground can reduce series inductance. To reduce power noise, a 10 F electrolytic decoupling capacitor between power and ground should be close to where the 3.3 V supply enters the PCB. The other 0.1 F and 1 nF ceramic chip decoupling capacitors should be close to the VCC and VEE pins to provide better decouple filtering and a shorter current return loop. Similarly, to reduce the possible series inductance, Pin 12, which supplies power to the high speed differential OUTP/OUTN output buffer, should connect to the power plane directly. If the power plane is an internal plane and connections to the power plane are vias, multiple vias in parallel can reduce the series inductance, especially on Pin 12. See Figure 20 for the recommended connections. VCC 16 PIN C2 NIN AVEE 14 12 2 CONNECT EXPOSED PAD TO GND 11 10 4 9 6 CAZ1 5 7 C11 C12 C7 ADN2891 3 R2 RSSI MEASUREMENT TO ADC 13 1 THRADJ ADN2880 C1 15 C10 VCC C8 DRVCC OUTP C3 OUTN C4 TO HOST BOARD DRVEE 8 LOS AVCC R1 C1-C4, C11: 0.01F X5R/X7R DIELECTRIC, 0201 CASE C5, C7, C9, C10, C12: 0.1F X5R/X7R DIELECTRIC, 0402 CASE C6, C8: 1nF X5R/X7R DIELECTRIC, 0201 CASE R3 4.7k TO 10k ON HOST BOARD VCC Figure 20. Typical Applications Circuit (Example of Using PIN PD and On-Chip RSSI Detector) Rev. A | Page 11 of 16 05244-008 C6 CAZ2 C5 SQUELCH VCC PD_VCC PD_CATHODE 0.1F RSSI_OUT C9 VCC ADN2891 PCB Layout As with any high speed, mixed-signal design, keep all high speed digital traces away from sensitive analog nodes. Figure 21 shows the recommended PCB layout. The 50 transmission lines are the traces that bring the high frequency input and output signals (PIN, NIN, OUTP, and OUTN) to the SMA connectors with minimum reflection. To avoid a signal skew between the differential traces, each differential PIN/NIN and OUTP/OUTN pair should have matched trace lengths from the signal pins to the corresponding SMA connectors. C1, C2, C3, and C4 are ac coupling capacitors in series with the high speed, signal input/output paths. To minimize the possible mismatch, the ac coupling capacitor pads should be the same width as the 50 transmission line trace width. To reduce supply noise, a 1 nF decoupling capacitor should be placed on the same layer as close as possible to the VCC pins. A 0.1 F decoupling capacitor can be placed on the bottom of the PCB directly underneath the 1 nF capacitor. All high speed, CML outputs have internal 50 resistor termination between the output pin and VCC. The high speed inputs, PIN and NIN, also have the internal 50 termination to an internal reference voltage. Soldering Guidelines for the LFCSP The lands on the 16-lead LFCSP are rectangular. The PCB pad for these should be 0.1 mm longer than the package land length and 0.05 mm wider than the package land width. The land should be centered on the pad. This ensures that the solder joint size is maximized. The bottom of the LFCSP has a central exposed pad. The pad on the printed circuit board should be at least as large as the exposed pad. Users must connect the exposed pad to VEE using filled vias so that solder does not leak through the vias during reflow. This ensures a solid connection from the exposed pad to VEE. R1, C9, C10 ON BOTTOM TO ROSA DOUBLE-VIAS TO REDUCE INDUCTANCE TO SUPPLY AND GND PLACE C5 ON BOTTOM OF BOARD UNDERNEATH C6 C1 1 PLACE C7 ON BOTTOM OF BOARD UNDERNEATH C8 EXPOSED PAD C6 C8 C3 PIN OUTN NIN C2 C4 DOUBLE-VIA TO GND TO REDUCE INDUCTANCE VIA TO C12, R2 ON BOTTOM C11 VIA TO BOTTOM Figure 21. Recommended PCB Layout (Top View) Rev. A | Page 12 of 16 05244-009 4mm OUTP VIAS TO GND ADN2891 OUTLINE DIMENSIONS 3.00 BSC SQ 0.60 MAX 13 12 0.45 PIN 1 INDICATOR TOP VIEW 2.75 BSC SQ 0.80 MAX 0.65 TYP 12 MAX SEATING PLANE 16 1 PIN 1 INDICATOR *1.65 1.50 SQ 1.35 EXPOSED PAD 0.50 BSC 0.90 0.85 0.80 0.50 0.40 0.30 9 (BOTTOM VIEW) 4 8 5 0.25 MIN 1.50 REF 0.05 MAX 0.02 NOM 0.30 0.23 0.18 0.20 REF *COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2 EXCEPT FOR EXPOSED PAD DIMENSION. Figure 22. 16-Lead Lead Frame Chip Scale Package [VQ_LFCSP] 3 mm x 3 mm Body, Very Thin Quad (CP-16-3) Dimensions shown in millimeters ORDERING GUIDE Model ADN2891ACPZ-500RL7 1 ADN2891ACPZ-RL71 ADN2891ACPZ-RL1 EVAL-ADN2891EB 1 Temperature Range -40C to +95C -40C to +95C -40C to +95C Package Description 16-Lead VQ_LFCSP, 500 pieces 16-Lead VQ_LFCSP, 1,500 pieces 16-Lead VQ_LFCSP, 5,000 pieces Evaluation Board Z = Pb-free part. Rev. A | Page 13 of 16 Package Option CP-16-3 CP-16-3 CP-16-3 Branding F04 F04 F04 ADN2891 NOTES Rev. A | Page 14 of 16 ADN2891 NOTES Rev. A | Page 15 of 16 ADN2891 NOTES (c) 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05244-0-7/05(A) Rev. A | Page 16 of 16