August 2012
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1204/FPF12045 • Rev. 1.1.8
FPF1203 / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
FPF1203 / FPF1204 / FPF12045
IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Features
1.2V to 5.5V Input Voltage Operating Range
Typical RON:
45m at VIN=5.5V
55m at VIN=3.3V
90m at VIN=1.8V
185m at VIN=1.2V
Slew Rate Control with tR:
FPF1203/FPF1204: 100µs
FPF12045: 2µs
Output Discharge Function on FPF1204 / 45
Low <1.5µA Quiescent Current
ESD Protected: Above 7kV HBM, 2kV CDM
GPIO / CMOS-Compatible Enable Circuitry
4-Bump, WLCSP 0.76mm x 0.76mm, 0.4mm Pitch
Applications
Mobile Devices and Smart Phones
Portable Media Devices
Tablet PCs
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Description
The FPF1203 / 04 / 45 are ultra-small integrated
IntelliMAX™ load switches with integrated P-channel
switch and analog control features. Integrated slew-rate
control prevents inrush current and the resulting
excessive voltage drop on the power rail. The input
voltage range operates from 1.2V to 5.5V to provide
power-disconnect capability for post-regulated power
rails in portable and consumer products. The low shut-
off current of 1µA (maximum) allows power designs to
meet standby and off-power drain specifications.
The FPF1203 / 04 / 45 are controlled by an active-HIGH
logic input (ON pin) compatible with standard CMOS
GPIO circuitry found on Field Programmable Gate Array
(FPGA) embedded processors. The FPF1203 / 04 / 045
are available in 0.76mm x 0.76mm 4-bump WLCSP.
Ordering Information
Part Number Top
Mark
Switch
(Typical)
at 3.3VIN
Output
Discharge
ON Pin
Activity tR Package
FPF1203UCX QL 55m NA Active HIGH 100µs
4-Bump, Wafer-Level Chip-Scale
Package (WLCSP), 0.76mm x
0.76mm, 0.4mm Pitch
FPF1204UCX QM 55m 65 Active HIGH 100µs
FPF1204BUCX
(Backside Laminate) QM 55m 65 Active HIGH 100µs
FPF12045UCX NC 55m 65 Active HIGH 2µs
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1204 / FPF12045 • Rev. 1.1.8 10
FPF1203 / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
Physical Dimensions
Figure 24. 4-Bump, 0.76 x 0.76mm, Wafer-Level Chip-Scale Packaging
Product-Specific Dimensions
Product D E X Y
FPF1203UCX 760µm ± 30µm 760µm ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm
FPF1204UCX 760µm ± 30µm 760µm ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm
FPF1204BUCX 760µm ± 30µm 760µm ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm
FPF12045UCX 760µm ± 30µm 760µm ± 30µm 0.180mm± 0.018µm 0.180mm± 0.018µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
BOTTOM VIEW
SIDE VIEWS
TOP VIEW RECOMMENDED LAND PATTERN
BALL A1
INDEX AREA
A1
0.005 CAB
F
(NSMD PAD TYPE)
B
A
0.292±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
0.03 C
2X
0.03 C
2X
12
A
B
0.40
0.40
(X)±0.018
SEATING PLANE
C
0.06 C
0.05 C E
D
D
E
0.40
0.40 Ø0.20
Cu Pad
Ø0.30
Solder Mask
(Y)±0.018
Ø0.260±0.020
4X
0.539
0.461
F
© 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com
FPF1203 / FPF1204 / FPF12045 • Rev. 1.1.8 11
FPF1203 / FPF1204 / FPF12045 — IntelliMAX™ Ultra-Small, Slew-Rate-Controlled Load Switch
