Memory Module Specifications
VALUERAM0522-001.A00 09/29/06 Page 1
This document describes ValueRAM's 1GB (128M x 72-bit) PC2-5300 CL5 SDRAM (Synchronous DRAM) "fully
buffered," ECC, dual rank, Intel® Validated memory module. This module is based on eighteen 64M x 8-bit 667MHz
DDR2 FBGA components. The module also includes an AMB device (Advanced Memory Buffer). The electrical
and mechanical specifications are as follows:
Description:
KVR667D2D8F5/1GI
1GB 128M x 72-Bit PC2-5300
CL5 ECC 240-Pin FBDIMM
·FBDIMM Module: 240-pin
·JEDEC Standard: R/C B
·Memory Organization: 2 rank of x8 devices
·DDR2 DRAM Interface: SSTL_18
·DDR2 Speed Grade: 667 Mbps
·CAS Latency: 5-5-5
·Module Bandwidth: 5.3 GB/s
·DRAM: VDD = VDDQ = 1.8V
·AMB: VCC = VCCFBD = 1.5V
·EEPROM: VDDSPD = 3.3V (typical)
·Heat Spreader: Full DIMM Heat Spreader (FDHS)
·PCB Height: 30.35mm, double-side
·RoHS Compliant
Feature:
DDR2 240-pin FBDIMM Pinout:
Pin
#
Front
Side
Pin
#
Back
Side
Pin
#
Front
Side
Pin
#
Back
Side
Pin
#
Front
Side
Pin
#
Back
Side
Pin
#
Front
Side
Pin
#
Back
Side
1VDD 121 VDD 31 PN3 151 SN3 61 PN9 181 SN9 91 PS9 211 SS9
2VDD 122 VDD 32 PN3 152 SN3 62 VSS 182 VSS 92 VSS 212 VSS
3VDD 123 VDD 33 VSS 153 VSS 63 PN10 183 SN10 93 PS5 213 SS5
4VSS 124 VSS 34 PN4 154 SN4 64 PN10 184 SN10 94 PS5 214 SS5
5VDD 125 VDD 35 PN4 155 SN4 65 VSS 185 VSS 95 VSS 215 VSS
6VDD 126 VDD 36 VSS 156 VSS 66 PN11 186 SN11 96 PS6 216 SS6
7VDD 127 VDD 37 PN5 157 SN5 67 PN11 187 SN11 97 PS6 217 SS6
8VSS 128 VSS 38 PN5 158 SN5 68 VSS 188 VSS 98 VSS 218 VSS
9VCC 129 VCC 39 VSS 159 VSS KEY 99 PS7 219 SS7
10 VCC 130 VCC 40 PN13 160 SN13 69 VSS 189 VSS 100 PS7 220 SS7
11 VSS 131 VSS 41 PN13 161 SN13 70 PS0 190 SS0 101 VSS 221 VSS
12 VCC 132 VCC 42 VSS 162 VSS 71 PS0 191 SS0 102 PS8 222 SS8
13 VCC 133 VCC 43 VSS 163 VSS 72 VSS 192 VSS 103 PS8 223 SS8
14 VSS 134 VSS 44 RFU* 164 RFU* 73 PS1 193 SS1 104 VSS 224 VSS
15 VTT 135 VTT 45 RFU* 165 RFU* 74 PS1 194 SS1 105 RFU** 225 RFU**
16 VID1 136 VID0 46 VSS 166 VSS 75 VSS 195 VSS 106 RFU** 226 RFU**
17 RESET 137 DNU/M_Test 47 VSS 167 VSS 76 PS2 196 SS2 107 VSS 227 VSS
18 VSS 138 VSS 48 PN12 168 SN12 77 PS2 197 SS2 108 VDD 228 SCK
19 RFU** 139 RFU** 49 PN12 169 SN12 78 VSS 198 VSS 109 VDD 229 SCK
20 RFU** 140 RFU** 50 VSS 170 VSS 79 PS3 199 SS3 110 VSS 230 VSS
21 VSS 141 VSS 51 PN6 171 SN6 80 PS3 200 SS3 111 VDD 231 VDD
22 PN0 142 SN0 52 PN6 172 SN6 81 VSS 201 VSS 112 VDD 232 VDD
23 PN0 143 SN0 53 VSS 173 VSS 82 PS4 202 SS4 113 VDD 233 VDD
24 VSS 144 VSS 54 PN7 174 SN7 83 PS4 203 SS4 114 VSS 234 VSS
25 PN1 145 SN1 55 PN7 175 SN7 84 VSS 204 VSS 115 VDD 235 VDD
26 PN1 146 SN1 56 VSS 176 VSS 85 VSS 205 VSS 116 VDD 236 VDD
27 VSS 147 VSS 57 PN8 177 SN8 86 RFU* 206 RFU* 117 VTT 237 VTT
28 PN2 148 SN2 58 PN8 178 SN8 87 RFU* 207 RFU* 118 SA2 238 VDDSPD
29 PN2 149 SN2 59 VSS 179 VSS 88 VSS 208 VSS 119 SDA 239 SA0
30 VSS 150 VSS 60 PN9 180 SN9 89 VSS 209 VSS 120 SCL 240 SA1
90 PS9 210 SS9
RFU = Reserved Future Use.
* These pin positions are reserved for forwarded clocks to be used in future module implementations
** These pin positions are reserved for future architecture flexibility
1) The following signals are CRC bits and thus appear out of the normal sequence: PN12/PN12, SN12/SN12, PN13/PN13, SN13/SN13,
PS9/PS9, SS9/SS9
VALUERAM0522-001.A00 Page 2
TECHNOLOGY
DIMM Connector Pin Description:
Pin Name Pin Description Count
SCK System Clock Input, positive line11
SCK System Clock Input, negative line11
PN[13:0] Primary Northbound Data, positive lines 14
PN[13:0] Primary Northbound Data, negative lines 14
PS[9:0] Primary Southbound Data, positive lines 10
PS[9:0] Primary Southbound Data, negative lines 10
SN[13:0] Secondary Northbound Data, positive lines 14
SN[13:0] Secondary Northbound Data, negative lines 14
SS[9:0] Secondary Southbound Data, positive lines 10
SS[9:0] Secondary Southbound Data, negative lines 10
SCL Serial Presence Detect (SPD) Clock Input 1
SDA SPD Data Input / Output 1
SA[2:0] SPD Address Inputs, also used to select the DIMM number in the AMB 3
VID[1:0] Voltage ID: These pins must be unconnected for DDR2-based Fully Buffered DIMMs
VID[0] is VDD value: OPEN = 1.8 V, GND = 1.5 V; VID[1] is V CC value: OPEN = 1.5 V, GND = 1.2 V 2
RESET AMB reset signal 1
RFU Reserved for Future Use216
VCC AMB Core Power and AMB Channel Interface Power (1.5 Volt) 8
VDD DRAM Power and AMB DRAM I/O Power (1.8 Volt) 24
VTT DRAM Address/Command/Clock Termination Power (V DD/2) 4
VDDSPD SPD Power 1
VSS Ground 80
DNU/M_Test
The DNU/M_Test pin provides an exter nal connection on R/Cs A-D for testing
the margin of Vref which is produced by a voltage divider on the module. It
is not intended to be used in normal system operation and must not be
connected (DNU) in a system. This test pin may have other features on future card designs
and if it does, will be included in this specification at that time.
1
1
Total 240
1. System Clock Signals SCK and SCK switch at one half the DRAM CK/CK frequency
2. Eight pins reserved for forwarded clocks, eight pins reserved for future architecture flexibility
VALUERAM0522-001.A00 Page 3
TECHNOLOGY
Absolute Maximum Ratings
095°C
AMB device operating temperature (Ambient) 0110°C
Symbol Parameter MIN MAX Units
V
IN, VOUT
Voltage on any pin relative to V
SS
-0.3 1.75 V
V
CC
Voltage on V
CC
pin relative to V
SS
-0.3 1.75 V
V
DD
Voltage V
DD
pin relative to Vss -0.5 2.3 V
V
TT
Voltage on V
TT
pin relative to V
SS
-0.5 2.3 V
T
STG
Storage temperature -55 100 °C
T
CASE
DDR2 SDRAM device operating temperature (Ambient)
Note: (1) Above 85°C DRAM case temperature the Auto-Refresh command interval has to be reduced to tREFI = 3.9 µs.
95
(1)
VALUERAM0522-001.A00 Page 4
TECHNOLOGY
Functional Block Diagram:
DQ4
DQ5
DQ6
DQ7
DQ0
DQ1
DQ2
DQ3
DM/
D0
S0
CS
DQS0
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
A0
Serial PD
A1 A2
SA0 SA1 SA2
SDA
SCL
WP
DQS
S1
RDQS NU/ DM/
D9
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS0
RDQS RDQS
DQ12
DQ13
DQ14
DQ15
DQ8
DQ9
DQ10
DQ11
DM/
D1
CS
DQS1
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D10
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS1
RDQS RDQS
DQ20
DQ21
DQ22
DQ23
DQ16
DQ17
DQ18
DQ19
DM/
D2
CS
DQS2
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D11
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS2
RDQS RDQS
DQ28
DQ29
DQ30
DQ31
DQ24
DQ25
DQ26
DQ27
DM/
D3
CS
DQS3
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D12
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS3
RDQS RDQS
CB4
CB5
CB6
CB7
CB0
CB1
CB2
CB3
DM/
D8
CS
DQS8
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D17
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS8
RDQS RDQS
DQ36
DQ37
DQ38
DQ39
DQ32
DQ33
DQ34
DQ35
DM/
D4
CS
DQS4
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D13
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS4
RDQS RDQS
DQ44
DQ45
DQ46
DQ47
DQ40
DQ41
DQ42
DQ43
DM/
D5
CS
DQS5
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D14
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS5
RDQS RDQS
DQ52
DQ53
DQ54
DQ55
DQ48
DQ49
DQ50
DQ51
DM/
D6
CS
DQS6
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D15
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS6
RDQS RDQS
DQ60
DQ61
DQ62
DQ63
DQ56
DQ57
DQ58
DQ59
DM/
D7
CS
DQS7
DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/ DM/
D16
CS DQS
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
RDQS NU/
DQS7
RDQS RDQS
Notes:
1. DQ-to-I/O wiring may be changed within a byte.
2. There are two physical copies of each
address/command/control/clock
VSS
D0-D17, AMB
D0-D17, SPD, AMB
D0-D17VREF
SPD, AMB
VDD
VDDSPD
AMB
VCC
VTT
All address/command/control/clock
VTT Terminators
DQS9
DQS10
DQS11
DQS12
DQS13
DQS14
DQS15
DQS16
DQS17
A
M
B
PN0-PN13
PN0-PN13
PS0-PS9
PS0-PS9
SS0-SS9
SS0-SS9
WE (all SDRAMs)
CK/CK (all SDRAMs)
BA0-BA2 (all SDRAMs)
A0-A15 (all SDRAMs)
RAS (all SDRAMs)
CAS (all SDRAMs)
SCL
SDA
SA1-SA2
ODT -> ODT (all SDRAMs)
RESET
SN0-SN13
SN0-SN13
CKE0 -> CKE (D0-D8)
S0 -> CS (D0-D8)
CKE1 -> CKE (D9-D17)
S1 -> CS (D9-D17)
SCK/SCK
SA0
825 22
VALUERAM0522-001.A00 Page 5
TECHNOLOGY
Architecture:
Advanced Memory Buffer Pin Description:
Pin Name Pin Description Count
FB-DIMM Channel Signals 99
SCK System Clock Input, positive line 1
SCK System Clock Input, negative line 1
PN[13:0] Primary Northbound Data, positive lines 14
PN[13:0] Primary Northbound Data, negative lines 14
PS[9:0] Primary Southbound Data, positive lines 10
PS[9:0] Primary Southbound Data, negative lines 10
SN[13:0] Secondary Northbound Data, positive lines 14
SN[13:0] Secondary Northbound Data, negative lines 14
SS[9:0] Secondary Southbound Data, positive lines 10
SS[9:0] Secondary Southbound Data, negative lines 10
FBDRES To an external precision calibration resistor connected to Vcc 1
DDR2 Interface Signals 175
DQS[8:0] Data Strobes, positive lines 9
DQS[8:0] Data Strobes, negative lines 9
DQS[17:9]/DM[8:0] Data Strobes (x4 DRAM only), positive lines. These signals are driven low to x8 DRAM on writes. 9
DQS[17:9] Data Strobes (x4 DRAM only), negative lines 9
DQ[63:0] Data 64
CB[7:0] Checkbits 8
A[15:0]A, A[15:0]B Addresses. A10 is part of the pre-charge command 32
BA[2:0]A, BA[2:0]B Bank Addresses 6
RASA, RASB Part of command, with CAS, WE, and CS[1:0]. 2
CASA, CASB Part of command, with RAS, WE, and CS[1:0]. 2
WEA, WEB Part of command, with RAS, CAS, and CS[1:0]. 2
ODTA, ODTB On-die Termination Enable 2
CKE[1:0]A, CKE[1:0]B Clock Enable (one per rank) 4
CS[1:0]A, CS[1:0]B Chip Select (one per rank) 4
CLK[3:0] CLK[1:0] used on 9 and 18 device DIMMs, CLK[3:0] used on 36 device DIMMs. CLK[3:2] should be out-
put disabled when not in use. 4
CLK[3:0] Negative lines for CLK[3:0] 4
DDRC_C14 DDR Compensation: Common return pin for DDRC_B18 and DDRC_C18. 1
DDRC_B18 DDR Compensation: Resistor connected to common return pin DDRC_C14 1
DDRC_C18 DDR Compensation: Resistor connected to common return pin DDRC_C14 1
DDRC_B12 DDR Compensation: Resistor connected to VSS 1
DDRC_C12 DDR Compensation: Resistor connected to VDD 1
VALUERAM0522-001.A00 Page 6
TECHNOLOGY
SPD Bus Interface Signals 5
SCL Serial Presence Detect (SPD) Clock Input 1
SDA SPD Data Input / Output 1
SA[2:0] SPD Address Inputs, also used to select the DIMM number in the AMB 3
Miscellaneous Signals 163
PLLTSTO PLL Clock Observability Output 1
VCCAPLL Analog VCC for the PLL. Tied with low pass filter to VCC. 1
VSSAPLL Analog VSS for the PLL. Tied to ground on the AMB die. Do not tie to ground on the DIMM. 1
TEST_pin# Leave floating on the DIMM 6
TESTLO_pin# Tie to ground on the DIMM25
BFUNC Tie to ground to set functionality as buffer on DIMM. 1
RESET AMB reset signal 1
NC No connect. Many NC are connected to VDD on the DIMM, to lower the impedance of the VDD power
islands. 129
RFU Reserved for Future Use 18
Power/Ground Signals 213
VCC AMB Core Power (1.5 Volt) 24
VCCFBD AMB Channel I/O Power (1.5 Volt) 8
VDD AMB DRAM I/O Power (1.8 Volt) 24
VDDSPD SPD Power (3.3 Volt) 1
VSS Ground 156
Total 655
1. System Clock Signals SCK and SCK switch at one half the DRAM CK/CK frequency.
2. TESTLO_AB20 and TESTLO_AC20 should be configured for debug purposes on prototype DIMMs: each pin should have a zero
ohm resistor pulldown to ground, and an unpopulated resistor pullup to VCC. These resistors can be replaced on production
DIMMs with a direct connection to ground.
Advanced Memory Buffer Pin Description:
VALUERAM0522-001.A00 Page 7
TECHNOLOGY
Package Dimensions:
TECHNOLOGY
AMB
Advanced Memory Buffer
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
FBGA DDR2
SDRAM
(Units = millimeters)
Units: inches (millimeters)
0.054 (1.37)
0.046 (1.17)
0.346 (8.8)
MAX with heat sink
Detail A
0.047 (1.19)
0.042 (1.06)
0.042 (1.06)
45°x 0.0071(0.18)