For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
1
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
RF Frequency Range 37 - 40 40 - 43 43 - 46.5 GHz
LO Frequency Range 8.5 - 11 GHz
IF Frequency Range DC - 7.5 GHz
Conversion Loss 14 16 11 13 911 dB
4LO to RF Isolation 22 15 15 dB
4LO to IF Isolation 16 18 25 dB
Input Third Order Intercept (IP3) 30 26 21 dB
Input Power for 1 dB Compression [2] 20 18 16 dBm
Idd 140 160 210 140 160 210 140 160 210 mA
Functional Diagram
Features
Typical Applications
General Description
The HMC1093 is ideal for:
• 38 GHz Microwave Radio
• 42 GHz Microwave Radio
• Military End-Use
Electrical Specications, TA = +25° C, Vdd = +3V, USB [1]
Sub-Harmonically Pumped (x4) LO
Low LO Power: -1 dBm
High 4LO/RF Isolation: 20 dB
Wide IF Bandwidth: DC to 7.5 GHz
Downconversion Applications
Die Size: 1.45 X 3.85 X 0.1 mm
The HMC1093 chip is a sub-harmonically pumped
(x4) MMIC mixer with an integrated LO amplier. The
HMC1093 chip is ideal for use as a downconverter
with 37 to 46.5 GHz at the RF port and DC to 7.5 GHz
at the IF port. The HMC1093 utilizes a GaAs PHEMT
technology and delivers excellent 4LO to RF isolation
of 20 dB, which eliminates the need for additional
ltering. The LO amplier is a single bias (+3V) two-
stage design requiring only -1 dBm of LO power.
The RF and LO ports are DC blocked and matched
to 50 Ohms for ease of use. All data shown herein
is measured with the chip in a 50 Ohm test xture
connected via 0.025mm (1 mil) wire bonds of minimal
length <0.31 mm (<12 mils).
[1] Unless otherwise noted , all measurements performed as a downconverter with LO = -1 dBm.
[2] Data taken at IF = 7.5 GHz, USB.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
2
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
-5 dBm -1 dBm +3 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
Conversion Loss vs. Temperature Conversion Loss vs. LO Drive
RF Return Loss LO Return Loss vs. Temperature
IF Return Loss 4LO Isolation
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-20
-15
-10
-5
0
5
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
RETURN LOSS (dB)
FREQUENCY (GHz)
-25
-20
-15
-10
-5
7 8 9 10 11 12 13
+25 C +85 C -55 C
RETURN LOSS (dB)
FREQUENCY (GHz)
-25
-20
-15
-10
-5
0
012345678910
25 C 85 C -55 C
RETURN LOSS (dB)
IF FREQUENCY (GHz)
-40
-35
-30
-25
-20
-15
-10
-5
0
8 9 10 11 12
4LO/RF 4LO/IF
ISOLATION (dB)
LO FREQUENCY (GHz)
Data taken at IF = 1 GHz, USB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
3
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Input IP3 vs. Temperature Output IP3 vs. Temperature
10
14
18
22
26
30
34
38
42
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
2
6
10
14
18
22
26
30
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
Input IP3 vs. LO Power Output IP3 vs. LO Power
10
14
18
22
26
30
34
38
42
37 38 39 40 41 42 43 44 45 46 47
-5 dBm -1 dBm +3 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
2
6
10
14
18
22
26
30
37 38 39 40 41 42 43 44 45 46 47
-5 dBm -1 dBm +3 dBm
IP3 (dBm)
RF FREQUENCY (GHz)
Data taken at IF = 1 GHz, USB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
4
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Conversion Loss vs. Temperature Conversion Loss vs. LO Drive
Input IP3 vs. Temperature Output IP3 vs. Temperature
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
-5 dBm -1 dBm +3 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
10
14
18
22
26
30
34
38
42
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
2
6
10
14
18
22
26
30
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
Data taken at IF = 2 GHz, USB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
5
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Conversion Loss vs. Temperature Conversion Loss vs. LO Drive
Input IP3 vs. Temperature Output IP3 vs. Temperature
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
-5 dBm -1 dBm +3 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
10
14
18
22
26
30
34
38
42
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
-6
-2
2
6
10
14
18
22
26
30
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
Data taken at IF = 3.5 GHz, USB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
6
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Conversion Loss vs. Temperature Conversion Loss vs. LO Drive
Input IP3 vs. Temperature Output IP3 vs. Temperature
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
-30
-26
-22
-18
-14
-10
-6
-2
2
37 38 39 40 41 42 43 44 45 46 47
-5 dBm -1 dBm +3 dBm
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
2
6
10
14
18
22
26
30
34
38
42
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
-10
-6
-2
2
6
10
14
18
22
26
30
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
IP3 (dBm)
RF FREQUENCY (GHz)
Input P1dB vs. Temperature [1] Output P1dB vs. Temperature [1]
-4
-2
0
2
4
6
8
10
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55 C
P1dB (dBm)
RF FREQUENCY (GHz)
10
12
14
16
18
20
22
24
37 38 39 40 41 42 43 44 45 46 47
+25 C +85 C -55C
P1dB (dBm)
RF FREQUENCY (GHz)
Data taken at IF = 7 GHz, USB
[1] Data taken at IF = 7.5 GHz, USB
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
7
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS 0.0026” [0.066] SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. OVERALL DIE SIZE ± .002
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Absolute Maximum Ratings
Bias Voltage +3.5V
RF Input Power +18dBm
LO Input Power +5dBm
Channel Temperature 175 °C
Continuous Pdiss (T = 85 °C)
(derate 15mW/ °C above 85 °C) 1.6
Thermal Resistance (RTH)
(channel to die bottom) 66.7 °C/W
Operating Temperature -55°C to +85°C
Storage Temperature -65°C to 125°C
ESD Sensitivity (HBM) Class 0, Passed 150V
Die Packaging Information [1]
Standard Alternate
GP-2 (Gel Pack) [2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
8
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Pad Descriptions
Pad Number Function Description Pad Schematic
1RF This pad is AC coupled and matched to 50 Ohms.
2IF This pad is DC coupled
and matched to 50 Ohms.
3LO This pad is AC coupled
and matched to 50 Ohms.
4, 5, 6 Vdd1, Vdd2, Vdd3
Power Supply Voltage for the LO Amplier. External
bypass capacitors 100pF, 0.01uF, and 4.7uF are
required.
Die Bottom Ground Die bottom must be connected to RF/DC ground.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
9
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Assembly Diagram
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
MIXERS - SUB HARMONIC - CHIP
10
HMC1093
v00.0613
GaAs MMIC SUB HARMONIC
MIXER, 37 - 46.5 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin lm substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin lm substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accom-
plish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
Microstrip substrates should be located as close to the die as possible
in order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD pro-
tective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V
ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet
or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched
with vacuum collet, tweezers, or ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and at.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy llet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage
temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is rec-
ommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started
on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 1.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
RF Ground Plane
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
0.076mm
(0.003”)
Figure 2.
0.150mm (0.005”) Thick
Moly Tab
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Analog Devices Inc.:
HMC1093 HMC1093-SX