© 2009-2011 Microchip Technology Inc. DS22229D-page 1
MCP6401/1R/1U/2/4/6/7/9
Features
Low Quiescent Current: 45 µA (typical)
Gain Bandwidth Product: 1 MHz (typical)
Rail-to-Rail Input and Output
Supply Voltage Range: 1.8V to 6.0V
Unity Gain Stable
Extended Temperature Ranges:
- -40°C to +125°C (E temp)
- -40°C to +150°C (H temp)
No Phase Reve rsal
Applications
Port ab le Equi pm ent
Battery Powered System
Medical Instrumentation
Automo tive Elec tronics
Data Acquisition Equipment
Sensor C onditioning
Analog Active Filters
Design Aids
SPICE Ma cr o Models
•FilterLab
® Software
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
Typical Application
Description
The Microchip Technology Inc.
MCP6401/1R/1U/2/4/6/7/9 family of operational
amplifiers (op amps) has low quiescent current
(45 µA, typical) and rail-to-rail input and output
operation. This family is unity gain stable and has a
gain bandwidth product of 1 MHz (typical). These
device s ope rate with a powe r supply vo lt age of 1.8V to
6.0V. These features make the family of op amps well
suited for si ngl e-s upp ly, battery-powered appli ca tio ns .
The MC P6401/1R/1U /2/4/6/7 /9 family is design ed with
Microchip’s advanced CMOS process and offered in
single, dual and quad packages. The devices are
availa ble i n tw o ext ended tempe rature ranges (E te mp
and H temp) with different package types, which
makes them well-suited for automotiv e and industrial
applications.
VOUT
R2
D1
D2
R1
VIN
Precision Half-Wave Rectifier
MCP6401
1 MHz, 45 µA Op A mps
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 2 © 2009-2011 Microchip Technology Inc.
E Temp Package Types H Temp Package Types
5
4
1
2
3
VSS
VIN
VIN+
VDD
VOUT
SOT-23-5
5
4
1
2
3
VDD
VIN
VIN+
VSS
VOUT
SC70-5, SOT-23-5
5
4
1
2
3
VDD
VOUT
VIN
VSS
VIN+
SOT-23-5
MCP6401 MCP6401R
MCP6401U
MCP6402
SOIC
VINA+
VINA
VSS
1
2
3
4
8
7
6
5
VOUTA VDD
VOUTB
VINB
VINB+
MCP6404
VINA+
VINA
VSS
1
2
3
4
14
13
12
11
VOUTA
VDD
VOUTD
VIND
VIND+
10
9
8
5
6
7
V
OUTB
VINB
VINB+VINC+
VINC
VOUTC
SOIC, TSSOP
MCP6402
VINA+
VINA
VSS
VINB
1
2
3
4
8
7
6
5VINB+
VOUTA
EP
9
VDD
2x3 TDFN
VOUTB
* Includes Exposed Thermal Pad (EP); see Table 3-1.
E temp: -40°C to +125°C
5
4
1
2
3
VDD
VINVIN+
VSS
VOUT
SOT-23-5
MCP6401 MCP6402
SOIC
VINA+
VINA
VSS
1
2
3
4
8
7
6
5
VOUTA VDD
VOUTB
VINB
VINB+
MCP6404
VINA+
VINA
VSS
1
2
3
4
14
13
12
11
VOUTA
VDD
VOUTD
VIND
VIND+
10
9
8
5
6
7
V
OUTB
VINB
VINB+VINC+
VINC
VOUTC
SOIC
5
4
1
2
3
VDD
VIN
VIN+
VSS
VOUT
SOT-23-5
MCP6406
MCP6407
SOIC
VINA+
VINA
VSS
1
2
3
4
8
7
6
5
VOUTA VDD
VOUTB
VINB
VINB+
MCP6409
VINA+
VINA
VSS
1
2
3
4
14
13
12
11
VOUTA
VDD
VOUTD
VIND
VIND+
10
9
8
5
6
7
V
OUTB
VINB
VINB+V
INC+
VINC
VOUTC
SOIC
H temp: -40°C to +150°C
© 2009-2011 Microchip Technology Inc. DS22229D-page 3
MCP6401/1R/1U/2/4/6/7/9
1.0 ELECTRICAL
CHARACTERISTICS
1.1 Absolute Maximum Ratings †
VDD – VSS ........................................................................7.0V
Current at Input Pins.....................................................±2 mA
Analog Inputs (VIN+, VIN-)†† .......... VSS 1.0V to VDD + 1.0V
All Other Inputs and Outputs ......... VSS 0.3V to VDD + 0.3V
Difference Input Voltage ...................................... | VDDVSS|
Output Short-Circuit Current ............................. ...Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature ....................................-65°C to +150°C
Maximum Junction Temperature (TJ)..........................+155°C
ESD Protection on All Pins (HBM; MM; CDM)....≥ 4 kV; 300V ,
1500V
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional
operatio n of the devic e at those or an y other con ditions
above those indicated in the operational listings of this
specification is not implied. Exposure to maximum rat-
ing conditions for extended periods may affect device
reliability.
†† See Section 4.1.2 “Input Voltage Limits”.
1.2 MCP6401/1R/1U/2/4 Electrical Specifications
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise ind ic ated , TA= +25°C, VDD = +1.8v to +6.0v, VSS =GND,
VCM =V
DD/2, VOUT VDD/2, VL=V
DDD/2 and RL= 100 kΩ to VL (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Temp Parts
(Note 1)Conditions
Input Offset
Input Offset Voltage VOS -4.5 ±0.8 +4.5 mV E, H VCM = VSS
±1.0 mV +125°C E
±1.5 mV +150°C H
Input Offset Drift with
Temperature ΔVOS/ΔTA ±2.0 µV/°C -40°C
to
+125°C
EV
CM = VSS
±2.5 µV/°C -40°C
to
+150°C
H
Power Supply
Rejection Ratio PSRR 63 78 dB E, H VCM = VSS
75 dB +125°C E
73 dB +150°C H
Input Bias Current and Impedance
Input Bias Current IB 1 100 pA E, H
—30pA+85°CE, H
800 pA +125°C E
7 nA +150°C H
Input Offset Current IOS —1pA E, H
—5pA+85°CE, H
20 pA +125°C E
45 pA +150°C H
Note 1: E part stands for the one whose operating temperature range is from -40°C to +125°C and H part stands
for the one whose operating temperature range is from -40°C to +150°C.
2: Figure 2-14 shows how V CMR changes across temperature.
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 4 © 2009-2011 Microchip Technology Inc.
Comm on Mo de Inpu t
Impedance ZCM —10
13||6 Ω||pF E, H
Differential Input
Impedance ZDIFF —10
13||6 Ω||pF E, H
Common Mode
Comm on Mo de Inpu t
Vo lt age Range
(Note 2)
VCMR VSS-0.20 VDD+0.20 V E, H VDD = 1.8V
VSS-0.05 VDD+0.05 V +125°C E
VSS —V
DD V +150°C H
VSS-0.30 VDD+0.30 V E, H VDD = 6.0V
VSS-0.15 VDD+0.15 V +125°C E
VSS-0.10 VDD+0.10 V +150°C H
Comm on Mo de
Rejection Ratio CMRR 56 71 dB E, H VCM = -0.2V to 2.0V,
VDD = 1.8V
68 dB +125°C E VCM = -0.05V to 1.85V,
VDD = 1.8V
65 dB +150°C H VCM = 0V to 1.8V,
VDD = 1.8V
63 78 dB E, H VCM = -0.3V to 6.3V,
VDD = 6.0V
76 dB +125°C E VCM = -0.15V to 6.15V,
VDD = 6.0V
75 dB +150°C H VCM = -0.1V to 6.1V,
VDD = 6.0V
Open-Loop Gain
DC Open-Loop Gain
(Large Signal) AOL 90 110 dB E , H VOUT = 0.3V to VDD-
0.3V,
VCM = VSS
105 dB +125°C E
100 dB +150°C H
Output
High-Level Output
Voltage VOH 1.790 1.792 V E, H VDD = 1.8V
RL = 10 kΩ
0.5V input overdrive
1.788 V +125°C E
1.785 V +150°C H
5.980 5.985 V E, H VDD = 6.0V
RL = 10 kΩ
0.5V input overdrive
5.980 V +125°C E
5.975 V +150°C H
Low-Level Output
Voltage VOL 0.008 0.010 V E, H VDD = 1.8V
RL = 10 kΩ
0.5V input overdrive
0.012 V +125°C E
0.015 V +150°C H
0.015 0.020 V E , H VDD = 6.0V
RL = 10 kΩ
0.5V input overdrive
0.020 V +125°C E
0.025 V +150°C H
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise ind ic ated , TA= +25°C, VDD = +1.8v to +6.0v, VSS =GND,
VCM =V
DD/2, VOUT VDD/2, VL=V
DDD/2 and RL= 100 kΩ to VL (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Temp Parts
(Note 1)Conditions
Note 1: E part stands for the one whose operating temperature range is from -40°C to +125°C and H part stands
for the one whose operating temperature range is from -40°C to +150°C.
2: Figure 2-14 shows how V CMR changes across temperature.
© 2009-2011 Microchip Technology Inc. DS22229D-page 5
MCP6401/1R/1U/2/4/6/7/9
Output Short -Circ uit
Current ISC —±5mA E, HV
DD = 1.8V
—±15mA E, HV
DD = 6.0V
Power Supply
Supply Voltage VDD 1.8 6.0 V E, H
Quiescent Current
per Amplifier IQ20 45 70 µA E, H I O = 0, VDD = 5.0V
VCM = 0.2VDD
55 µA +125°C E
60 µA +150°C H
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise ind ic ated , TA= +25°C, VDD = +1.8v to +6.0v, VSS =GND,
VCM =V
DD/2, VOUT VDD/2, VL=V
DDD/2 and RL= 100 kΩ to VL (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Temp Parts
(Note 1)Conditions
Note 1: E part stands for the one whose operating temperature range is from -40°C to +125°C and H part stands
for the one whose operating temperature range is from -40°C to +150°C.
2: Figure 2-14 shows how V CMR changes across temperature.
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unles s otherw ise in dicated, TA= +25°C, V DD = +1.8 to +6.0V, VSS = GND, VCM =V
DD/2,
VOUT VDD/2, VL=V
DD/2 , RL= 100 kΩ to VL and CL= 60 pF (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Parts Conditions
AC Response
Gain Bandwidth Product GBWP 1 MHz E, H
Phase Margin PM 65 ° E, H G = +1 V/V
Slew Rate SR 0 .5 V/µs E, H
Noise
Input Noise Voltage Eni 3.6 µVp-p E, H f = 0.1 Hz to 10 Hz
Input Noise Voltage Density eni —28nV/Hz E, H f = 1 kHz
Input Noise Current Density ini —0.6fA/Hz E, H f = 1 kHz
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +6.0V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operati ng Tempe ratu re Ra nge TA-40 +125 °C E temp par ts (Note 1)
TA-40 +150 °C H temp parts (Note 1)
Storage Temperature Range TA-65 +155 °C
Thermal Package Resistances
Thermal Resistance, 5L-SC70 θJA —331°C/W
Thermal Resistance, 5L-SOT-23 θJA 220.7 °C/W
Thermal Resistance, 8L-SOIC θJA 149.5 °C/W
Thermal Resistance, 8L-2x3 TDFN θJA —52.5°C/W
Thermal Resistance, 14L-SOIC θJA —95.3°C/W
Thermal Resistance, 14L-TSSOP θJA —100°C/W
Note 1: The internal junction temperature (TJ) must not exceed the absolute maximum specification of +155°C.
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 6 © 2009-2011 Microchip Technology Inc.
1.3 MCP6406/7/9 Electrical Specifications
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise ind ic ated , TA= +25°C, VDD = +1.8V to +6.0V, VSS = GND,
VCM =V
DD/2, VOUT »V
DD/2, VL=V
DD/2 and RL= 100 kΩ to VL (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Temp Parts
(Note 1)Conditions
Input Offset
Input Offset Voltage VOS -4.5 +4.5 mV E, H VCM = VSS
-5.0 ±1.0 +5.0 mV +125°C E
-5.5 ±1.5 +5.5 mV +150°C H
Input Offset Drift
with Temperature ΔVOS/DTA ±2.0 µV/°C -40°C
to
+125°C
EV
CM = VSS
±2.5 µV/°C -40°C
to
+150°C
H
Power Supply
Rejection Ratio PSRR 63 78 dB E, H VCM = VSS
60 75 dB +125°C E
58 73 dB +150°C H
Input Bias Current and Impedance
Input Bias Current IB—±1100pA E, H
30 pA +85°C E, H
800 2000 pA +125°C E
7 12 nA +150°C H
Input Offset Current IOS —1—pA E, H
5 pA +85°C E, H
20 pA +125°C E
45 pA +150°C H
Comm on Mo de
Input Impedance ZCM —10
13||6 Ω||pF E, H
Differential Input
Impedance ZDIFF —10
13||6 Ω||pF E, H
Common Mode
Comm on Mo de
Input V oltage Range
(Note 2)
VCMR VSS-0.20 VDD+0.20 V E, H VDD = 1.8V
VSS-0.05 VDD+0.05 V +125°C E
VSS —V
DD V +150°C H
VSS-0.30 VDD+0.30 V E, H VDD = 6.0V
VSS-0.15 VDD+0.15 V +125°C E
VSS-0.10 VDD+0.10 V +150°C H
Note 1: E part stands for the one whose operating temperature range is from -40°C to +125°C and H part stands
for the one whose operating temperature range is from -40°C to +150°C.
2: Figure 2-14 shows how VCMR changes across temperature.
© 2009-2011 Microchip Technology Inc. DS22229D-page 7
MCP6401/1R/1U/2/4/6/7/9
Comm on Mo de
Rejection Ratio CMRR 56 71 dB E, H VCM = -0.2V to 2.0V,
VDD = 1.8V
53 68 dB +125°C E VCM = -0.05V to 1.85V,
VDD = 1.8V
50 65 dB +150°C H VCM = 0V to 1.8V,
VDD = 1.8V
63 78 dB E, H VCM = -0.3V to 6.3V,
VDD = 6.0V
61 76 dB +125°C E VCM = -0.15V to 6.15V,
VDD = 6.0V
60 75 dB +150°C H VCM = -0.1V to 6.1V,
VDD = 6.0V
Open-Loop Gain
DC Open-Loop Gain
(Large Signal) AOL 90 110 dB E, H VOUT = 0.3V to
VDD-0.3V, VCM = VSS
88 105 dB +125°C E
85 100 dB +150°C H
Output
High-Level Output
Voltage VOH 1.790 1.792 V E, H V DD = 1.8V
RL = 10 kΩ
0.5V input overdrive
1.785 1.788 V +125°C E
1.782 1.785 V +150°C H
5.980 5.985 V E, H VDD = 6.0V
RL = 10 kΩ
0.5V input overdrive
5.970 5.980 V +125°C E
5.965 5.975 V +150°C H
Low-Level Output
Voltage VOL 0.008 0.010 V E, H VDD = 1.8V
RL = 10 kΩ
0.5V input overdrive
0.012 0.015 V +125°C E
0.015 0.018 V +150°C H
0.015 0.020 V E, H VDD = 6.0V
RL = 10 kΩ
0.5V input overdrive
0.020 0.030 V +125°C E
0.025 0.035 V +150°C H
Output Shor t-Circuit
Current ISC —±5—mA E, HV
DD = 1.8V
—±15mA E, HV
DD = 6.0V
Power Supply
Supply Voltage VDD 1.8 6.0 V E, H
Quiescent Current
per Amplifier IQ20 45 70 µA E, H IO = 0, VDD = 5.0V
VCM = 0.2VDD
30 55 80 µA +125°C E
35 60 90 µA +150°C H
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise ind ic ated , TA= +25°C, VDD = +1.8V to +6.0V, VSS = GND,
VCM =V
DD/2, VOUT »V
DD/2, VL=V
DD/2 and RL= 100 kΩ to VL (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Temp Parts
(Note 1)Conditions
Note 1: E part stands for the one whose operating temperature range is from -40°C to +125°C and H part stands
for the one whose operating temperature range is from -40°C to +150°C.
2: Figure 2-14 shows how VCMR changes across temperature.
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 8 © 2009-2011 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
1.4 Test Circuits
The circuit used for most DC and AC tests is shown in
Figure 1-1. This circuit can independently set VCM and
VOUT; see Equation 1-1. Note that VCM is not the
circuit ’s Comm on Mode volt age ((VP+V
M)/2), and that
VOST includes VOS plus t h e e ffects ( on t he i n pu t o ffset
error, VOST) of temperature, CMRR, PSRR and AOL.
EQUATION 1-1:
FIGURE 1-1: AC and DC Test Circuit for
Most Spe cific ations.
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: U nless other wise indi cat ed, TA = +25°C, V DD = +1.8 to +6.0V, VSS = GND, VCM = V DD/2,
VOUT VDD/2, VL = VDD/2 , RL = 100 k Ω to VL and CL = 60 pF (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Part Conditions
AC Response
Gain Bandwidth Product GBWP 1 MHz E, H
Phase Margin PM 65 ° E, H G = +1 V/V
Slew Rate SR 0 .5 V/µs E, H
Noise
Input Noise Voltage Eni 3.6 µVp-p E, H f = 0.1 Hz to 10 Hz
Input Noise Voltage Density eni —28nV/Hz E, H f = 1 kHz
Input Noise Current Density ini —0.6—fA/Hz E, H f = 1 kHz
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to + 6.0V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operati ng Tempe ratu re Ra nge T A-40 +125 ° C E temp parts (Note 1)
TA-40 +150 °C H temp parts (Note 1)
Storage Temperature Range TA-65 +155 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23 θJA —220.7°C/W
Thermal Resistance, 8L-SOIC θJA —149.5°C/W
Thermal Resistance, 14L-SOIC θJA 95.3 °C/W
Note 1: The internal junction temperature (TJ) must not exceed the absolute maximum specification of +155°C.
GDM RFRG
=
VCM VPVDD 2
+()2
=
VOUT VDD 2
()VPVM
()VOST 1G
DM
+()++=
Where:
GDM = Differential Mode Gain (V/V)
VCM = Op Amp’s Common Mode
Input Voltage (V)
VOST = Op Amp’s Total Input Offset
Voltage (mV)
VOST VIN– VIN+
=
VDD
RGRF
VOUT
VM
CB2
CL
RL
VL
CB1
100 kΩ
100 kΩ
RGRF
VDD/2
VP100 kΩ
100 kΩ
60 pF
100 kΩ
F100 nF
VIN–
VIN+
CF
6.8 pF
CF
6.8 pF
MCP640x
© 2009-2011 Microchip Technology Inc. DS22229D-page 9
MCP6401/1R/1U/2/4/6/7/9
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF.
FIGURE 2-1: Input Offset V o ltage.
FIGURE 2-2: Input Offset V o ltage.
FIGURE 2-3: Input Offset V o ltage.
FIGURE 2-4: Input Offset Voltage Drift.
FIGURE 2-5: Input Offset Voltage Drift.
FIGURE 2-6: Input Offset Voltage vs.
Common Mode Input Voltage with VDD = 6.0V.
Note: The gra phs and tab les prov ided fo llow ing this note are a sta tistic al sum mary b ased on a limit ed numb er of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0%
3%
6%
9%
12%
15%
18%
21%
24%
-5-4-3-2-1012345
Input Offset Voltage (mV)
Percentage of Occurences
1760 Samples
VCM = VSS
0%
3%
6%
9%
12%
15%
18%
21%
24%
-5-4-3-2-1012345
Percentage of Occurences
Input Offset Voltage (mV)
1200 Samples
VCM = VSS
TA= +125ºC
0%
3%
6%
9%
12%
15%
18%
21%
24%
-5-4-3-2-1012345
Percentage of Occurences
Input Offset Voltage (mV)
1200 Samples
VCM = VSS
TA= +150ºC
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
-10-8-6-4-20246810
Percentage of Occurences
Input Offset Voltage Drift (μV/°C)
1760 Samples
VCM = VSS
TA= -40°C to +125°C
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
50%
-10-8-6-4-20246810
Percentage of Occurences
Input Offset Voltage Drift (μV/°C)
1200 Samples
VCM = VSS
TA= -40°C to +150°C
-1000
-800
-600
-400
-200
0
200
400
600
800
1000
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Input Offset Voltage (μV)
Common Mode Input Voltage (V)
TA= +150°C
TA= +125°C
TA= +85°C
VDD = 6.0V
Representative
Part
TA= +25°C
TA= -40°C
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 10 © 2009-2011 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF.
FIGURE 2-7: Input Offset Voltage vs.
Common Mode Input Voltage with VDD = 1.8V.
FIGURE 2-8: Input Offset Voltage vs.
Output Voltage.
FIGURE 2-9: Input Offset Voltage vs.
Power Supply Voltage.
FIGURE 2-10: Input Noise Voltage Density
vs. Frequency.
FIGURE 2-11: Input Noise V oltage Density
vs. Common Mode Input Voltage.
FIGURE 2-12: CMRR, PSRR vs.
Frequency.
-800
-600
-400
-200
0
200
400
600
800
1000
1200
1400
-0.5
-0.3
-0.1
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
1.9
2.1
2.3
Input Offset Voltage (μV)
Common Mode Input Voltage (V)
TA= +150°C
TA= +125°C
TA= +85°C
TA= +25°C
TA= -40°C
VDD = 1.8V
Representative
Part
-1000
-750
-500
-250
0
250
500
750
1000
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Output Voltage (V)
Input Offset Voltage (µV)
VDD = 6.0V
VDD = 1.8V
Representative Part
-500
-400
-300
-200
-100
0
100
200
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Input Offset Voltage (μV)
Power Supply Voltage (V)
TA= +150°C
TA= +125°C Representative Part
TA= +85°C
TA= +25°C
TA= -40°C
10
100
1,000
0.1 1 10 100 1000 10000 100000
Frequency (Hz)
Input Noise Voltage Density
(nV/Hz)
0.1 1 10 100 1k 10k 100k
0
5
10
15
20
25
30
35
40
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Common Mode Input Voltage (V)
Input Noise Voltage Density
(nV/Hz)
f = 1 kHz
VDD = 6.0 V
20
30
40
50
60
70
80
90
100
10 100 1000 10000 100000 1000000
Frequency (Hz)
CMRR, PSRR (dB)
10 100 1k 10k 100k 1M
CMRR
PSRR+
PSRR-
Representative Part
© 2009-2011 Microchip Technology Inc. DS22229D-page 11
MCP6401/1R/1U/2/4/6/7/9
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF.
FIGURE 2-13: CMRR, PSRR vs. Ambient
Temperature.
FIGURE 2-14: Common Mode Input
Voltage Range Limits vs. Ambient Temperature.
FIGURE 2-15: Input Bias, Offset Current
vs. Ambient Temperature.
FIGURE 2-16: Input Bias Current vs.
Common Mode Input Voltage.
FIGURE 2-17: Quiescent Current vs.
Ambient Temp eratu re .
FIGURE 2-18: Quiescent Current vs.
Power Supply Voltage.
50
55
60
65
70
75
80
85
90
-50 -25 0 25 50 75 100 125 150
CMRR,PSRR (dB)
Ambient Temperature (°C)
PSRR (VDD = 1.8V to 6.0V)
CMRR (VDD = 6.0V)
CMRR (VDD = 1.8V)
-0.4
-0.3
-0.2
-0.1
0.0
0.1
0.2
0.3
0.4
-50 -25 0 25 50 75 100 125 150
Common Mode Input Voltage
Range Limits (V)
Ambient Temperature (°C)
VCMR_L -V
SS @ VDD = 1.8V
VOL -V
SS @ VDD = 6.0V
VCMR_H -V
OH @ VDD = 6.0V
@ VDD = 1.8V
1
10
100
1000
10000
25 50 75 100 125 150
Input Bias Current, Input Offset
Current (pA)
Ambient Temperature (°C)
In
p
ut Bias Current
Input Offset Current
VDD = 6.0V
1
10
100
1000
10000
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Input Bias Current (pA)
Common Mode Input Voltage (V)
VDD = 6.0V
TA= +125°C
TA= +85°C
TA= +150°C
25
30
35
40
45
50
55
60
65
-50 -25 0 25 50 75 100 125 150
Quiescent Current
(μA/Amplifier)
Ambient Temperature (°C)
VCM = 0.2VDD
VDD = 6.0V
VDD = 5.0V
VDD = 1.8V
0
10
20
30
40
50
60
70
80
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
Quiescent Current
(μA/Amplifier)
Power Supply Voltage (V)
VCM = 0.2VDD
TA= +125°C
TA= +85°C
TA= +25°C
TA= -40°C
TA= +150°C
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 12 © 2009-2011 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF.
FIGURE 2-19: Open-Loop Gain, Phase vs.
Frequency.
FIGURE 2-20: DC Open-Loop Gain vs.
Power Supply Voltage.
FIGURE 2-21: DC Open-Loop Gain vs.
Output Voltage Headroom.
FIGURE 2-22: Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature.
FIGURE 2-23: Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature.
FIGURE 2-24: Output Short Circuit Current
vs. Power Supply Voltage.
-20
0
20
40
60
80
100
120
1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+0 4 1.0E+05 1.0E+06 1.0E+07
Frequency (Hz)
Open-Loop Gain (dB)
-210
-180
-150
-120
-90
-60
-30
0
Open-Loop Phase (°)
Open-Loop Gain
Open-Loop Phase
VDD = 6.0V
0.1 1 10 100 1k 10k 100k 1M 10M
100
105
110
115
120
125
130
135
140
145
150
1.52.02.53.03.54.04.55.05.56.0
Power Supply Voltage (V)
DC Open-Loop Gain (dB)
RL = 10 k
VSS + 0.3V < VOUT < VDD - 0.3V
100
105
110
115
120
125
130
135
140
145
150
0.00 0.05 0.10 0.15 0.20 0.25
Output Voltage Headroom
VDD - VOH or VOL-VSS (V)
DC Open-Loop Gain (dB)
VDD = 6.0V
VDD = 1.8V
Large Signal AOL
45
50
55
60
65
70
75
80
85
90
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
-50 -25 0 25 50 75 100 125 150
Phase Margin (°)
Gain Bandwidth Product (MHz)
Temperature (°C)
Gain Bandwidth Product
Phase Margin
VDD = 6.0V
45
50
55
60
65
70
75
80
85
90
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
-50 -25 0 25 50 75 100 125 150
Phase Margin (°)
Gain Bandwidth Product (MHz)
Temperature (°C)
Gain Bandwidth Product
Phase Margin
VDD = 1.8V
0
5
10
15
20
25
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Output Short Circuit Current
(mA)
Power Supply Voltage (°V)
TA= -40°C
TA= +25°C
TA= +85°C
TA= +125°C
TA= +150°C
© 2009-2011 Microchip Technology Inc. DS22229D-page 13
MCP6401/1R/1U/2/4/6/7/9
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF.
FIGURE 2-25: Output Voltage Swing vs.
Frequency.
FIGURE 2-26: Output Voltage Headroom
vs. Output Current.
FIGURE 2-27: Output Voltage Headroom
vs. Ambient Temperature.
FIGURE 2-28: Slew Rate vs . Ambi en t
Temperature.
FIGURE 2-29: Small Signal Non-Inverting
Pulse Response.
FIGURE 2-30: Small Signal Inverting Pulse
Response.
0.1
1
10
100 1000 10000 100000 1000000
Frequency (Hz)
Output Voltage Swing (VP-P)
VDD = 1.8V
VDD = 6.0V
100 1k 10k 100k 1M
0.1
1
10
100
1000
10 100 1000 10000
Output Current (mA)
Output Voltage Headroom
(mV)
0.01 0.1 1 10
VDD - VOH @ VDD = 1.8V
VOL - VSS @ VDD = 1.8V
VDD - VOH @ VDD = 6.0V
VOL - VSS @ VDD = 6.0V
RL = 10 k
0
3
6
9
12
15
18
21
24
-50 -25 0 25 50 75 100 125 150
Output Voltage Headroom
VDD -V
OH or VOL -V
SS (mV)
Ambient Temperature (°C)
VDD -V
OH @ VDD = 1.8V
VOL -V
SS @ VDD = 1.8V
VDD -V
OH @ VDD = 6.0V
VOL -V
SS@ VDD = 6.0V
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
-50 -25 0 25 50 75 100 125 150
Slew Rate (V/μs)
Temperature (°C)
Falling Edge, VDD = 6.0V
Rising Edge, VDD = 6.0V
Falling Edge, VDD = 1.8V
Rising Edge, VDD = 1.8V
Time (2 µs/div)
Output Voltage (20 mv/div)
VDD = 6.0V
G = +1 V/V
Time (2 µs/div)
Output Voltage (20 mv/div)
VDD = 6.0V
G = -1 V/V
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 14 © 2009-2011 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2,
VL = VDD/2, RL = 100 kΩ to VL and CL = 60 pF.
FIGURE 2-31: Large Signal Non-Inverting
Pulse Response.
FIGURE 2-32: Large Signal Inverting Pulse
Response.
FIGURE 2-33: The
MCP6401/1R/1U/2/4/6/7/9 Shows No Phase
Reversal.
FIGURE 2-34: Closed Loop Output
Impedance vs. Frequency.
FIGURE 2-35: Measured Input Current vs.
Input Voltage (below VSS).
FIGURE 2-36: Channel-to-Channel
Separation vs. Frequency (MCP6402/4/7/9 only).
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Time (20 µs/div)
Output Voltage (V)
VDD = 6.0V
G = +1 V/V
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Time (20 µs/div)
Output Voltage (V)
VDD = 6.0V
G = -1 V/V
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
Time (0.1 ms/div)
Input, Output Voltages (V)
VDD = 6.0V
G = +2 V/V
VOUT
VIN
1
10
100
1000
10000
1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06
Frequency (Hz)
Closed Loop Output
Impedance ()
GN:
101 V/V
11 V/V
1 V/V
10 100 1k 10k 100k 1M
1.00E-12
1.00E-11
1.00E-10
1.00E-09
1.00E-08
1.00E-07
1.00E-06
1.00E-05
1.00E-04
1.00E-03
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
-IIN (A)
VIN (V)
TA= -40°C
TA= +25°C
TA= +85°C
TA= +125°C
TA= +150°C
1m
100
μ
10
μ
1
μ
100n
10n
1n
100
p
10
p
1
p
80
90
100
110
120
130
140
150
100 1000 10000 100000
Frequency (Hz)
Channel to Channel Separation
(dB)
100 1k 10k 100k
Input Referred
© 2009-2011 Microchip Technology Inc. DS22229D-page 15
MCP6401/1R/1U/2/4/6/7/9
3.0 PIN DESCRIPTIONS
Descrip tions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE 1
MCP6401 MCP6401R MCP6401U MCP6402 MCP6404 MCP6406 MCP6407 MCP6409
Symbol Description
SC70-5,
SOT-23-5 SOT-23-5 SOT-23-5 SOIC 2x3
TDFN SOIC,
TSSOP SOT-23-5 SOIC SOIC
11 41111 11V
OUT, VOUTA Analog Output (op am p A)
44 32224 22V
IN–, VINA I nvertin g Input (op amp A)
33 13333 33V
IN+, VINA+ Non-inverting Input (op amp A)
52 58845 84V
DD Positive Power Supply
—— 555 5 5V
INB+ Non-inverting Input (op amp B)
—— 666 6 6VINBInverting Input (op am p B)
—— 777 7 7V
OUTB Analog Output (op amp B)
———8 8 V
OUTC Analog Output (op amp C)
———9 9 V
INC Inverting Input (op amp C)
—— 10 10V
INC+ Non-inverting Input (op amp C)
25 244112 411V
SS Negative Power Supply
—— 12 12V
IND+ Non-inverting Input (op amp D)
—— 13 13V
IND Inverting Input (op amp D)
—— 14 14V
OUTD Analog Output (op amp D)
9 EP Exposed Thermal Pad (EP); must be
connected to VSS.
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 16 © 2009-2011 Microchip Technology Inc.
3.1 Analog Output (VOUT)
The output pin is low-impedance voltage source.
3.2 Analog Inputs (VIN+, VIN-)
The non-inverting and inverting inputs are high-
impedance CMOS inputs with low bias currents.
3.3 Power Supply Pin (VDD, VSS)
The pos iti ve po we r s upp ly (VDD) is 1. 8V to 6. 0V h igh er
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
© 2009-2011 Microchip Technology Inc. DS22229D-page 17
MCP6401/1R/1U/2/4/6/7/9
4.0 APPLICATION INFORMATION
The MCP6401/1R/1U/2/4/6/7/9 family of op amps is
manufac tured using Mi crochip’ s st ate-of-the-art CMOS
process and is specifically designed for low-power,
high-precision applications.
4.1 Rail-to-Rail Input
4.1.1 PHASE REVERSAL
The MCP6401/1R/1U/2/4/6/7/9 op amps are designed
to prevent phase reversal when the input pins exceed
the supply voltages. Figure 2-33 shows the input
voltage exceeding the supply voltage with no phase
reversal.
4.1.2 INPUT VOLTAGE LIMITS
In order to prevent damage and/or improper operation
of these am plifi ers, the c ircuit mus t limit th e volt ages at
the input pins (see Section 1.1 “Absolute Maximum
Ratings †”).
The ESD protection on the inputs can be depicted as
shown in Figure 4-1. This structure was chosen to
protect the input transistors against many (but not all)
ove r-vol tage conditions, and to minimize the input bias
current (IB).
FIGURE 4-1: Simplified Analog Input ESD
Structures.
The input ESD diodes clamp the inputs when they try
to go more than one diode drop below VSS. They also
clamp any voltages that go well above VDD; their
breakdown voltage is high enough to allow normal
operation, but not low enough to protect against slow
over-voltage (beyond VDD) events. Very fast ESD
event s (tha t m ee t th e s pec ) a re l im ite d s o t hat dam ag e
does not occur.
In some applications, it may be necessary to prevent
excessive voltages from reaching the op amp inputs;
Figure 4-2 shows one approach to protecting these
inputs.
FIGURE 4-2: Protecting the Analog
Inputs.
A significant amount of current can flow out of the
input s when t he Common M ode volt age (VCM) is below
ground (VSS); See Figure 2-35.
4.1.3 INPUT CURRENT LIMITS
In order to prevent damage and/or improper operation
of these amplifiers, the circuit must limit the currents
into the input pins (see Section 1.1 “Absolute
Maximum Ratings †).
Figure 4-3 shows one approach to protecting these
inputs. The resistors R1 and R2 limit the possible
current s in or out of the input pin s (and the ESD dio des,
D1 and D2). The diode currents will go through either
VDD or VSS.
FIGURE 4-3: Protecting the Analog
Inputs.
4.1.4 NORMAL OPERATION
The input stage of the MCP6401/1R/1U/2/4/6/7/9 op
amps use two differential input stages in parallel. One
operates at a low Common Mode input voltage (VCM),
while the other operates at a high VCM. With this
topology, the devic e opera tes wit h a VCM up to 300 mV
above VDD and 300 mV below VSS (see Figure 2-14).
The input offset voltage is measured at VCM = VSS
0.3V and VDD + 0.3V to ensure proper operation.
The transition between the input stages occurs when
VCM is near VDD 1.1V (see Figures 2-6 and 2-7). For
the best distortion performance and gain linearity, with
non-inverting gains, avoid this region of operation.
Bond
Pad
Bond
Pad
Bond
Pad
VDD
VIN+
VSS
Input
Stage Bond
Pad VIN
V1
VDD
D1
V2
D2
MCP640x
VOUT
U1
V1R1
VDD
D1
min(R1,R2)> VSS –min(V
1, V2)
2mA
V2R2
D2
MCP640x
VOUT
U1
min(R1,R2)> max(V1,V2)–V
DD
2mA
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 18 © 2009-2011 Microchip Technology Inc.
4.2 Rail-to-Rail Output
The output voltage range of the
MCP6401/1R/1U/2/4/6/7/9 op amps is VSS +20mV
(minimum) and VDD – 20 mV (maximum) when
RL=10kΩ is connected to VDD/2 and VDD =6.0V.
Refer to Figures 2-26 and 2-27 for more information.
4.3 Capacitive Loads
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. While a unity-gain buffer (G = +1 V/V) is the
most sensitive to capacitive loads, all gains show the
same general behavior.
When driving large capacitive loads with these op
amp s (e .g., > 100 pF when G = +1 V/V), a small se rie s
resistor at the output ( RISO in Figure 4-4) improv es the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The
bandwidth will be generally lower than the bandwidth
with no capacitance lo ad.
FIGURE 4-4: Output Resistor, RISO
Stabilizes Large Capacitive Loads.
Figure 4-5 gives recommended RISO values for
different capacitive loads and gains. The x-axis is the
norma l iz ed lo ad ca paci tan c e (C L/GN), where GN is the
circuit 's noise gain. For non-inverti ng gains, GN a nd the
Signal Gain are equal. For inverting gains, GN is
1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V).
FIGURE 4-5: Recommended RISO Values
for Capacitive Loads.
After selecting RISO for your circuit, double-check the
resulting frequency response peaking and step
response overshoot. Modify RISOs value until the
response is reasonable. Bench evaluation and
simulations with the MCP6401/1R/1U/2/4/6/7/9 SPICE
macro model are very helpful.
4.4 Supply Bypass
With this family of operational amplifiers, the power
supply pin (VDD for single-supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good hi gh freque ncy p erfor mance. It can use a bulk
capa citor (i.e., 1 µF or larger) withi n 100 mm to provid e
large, s low curr ents. This bulk c ap a ci tor can be s hare d
with oth er analog parts.
4.5 Unused Op Amps
An unused op amp in quad packages (MCP6404 or
MCP640 9) shou ld be con figured as shown in Figure 4-
6. These circuits prevent the output from toggling and
causing crosstalk. Circuit A sets the op amp at its
minimu m noi se gain. The re sisto r di vider produc es an y
desired reference voltage within the output voltage
range of the op amp, which buffers that reference
voltage. Circuit B uses the minimum number of
components and operates as a comparator, but it may
draw more current.
FIGURE 4-6: Unused Op Amps.
VIN
RISO VOUT
CL
+
MCP640x
1
10
100
1000
10000
1.E-11 1.E-10 1.E-09 1.E-08 1.E-07 1.E-06
Normalized Load Capacitance; CL/GN (F)
Recommended R ISO ()
GN:
1 V/V
2 V/V
5 V/V
VDD = 6.0 V
RL = 10 k
10p 100p 1n 10n 0.
VDD
VDD
R1
R2
VDD
VREF
VREF VDD R2
R1R2
+
-------------------
×
=
¼ MCP6404 (A) ¼ MCP6404 (B)
© 2009-2011 Microchip Technology Inc. DS22229D-page 19
MCP6401/1R/1U/2/4/6/7/9
4.6 PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
betwee n nearby traces is 1012Ω. A 5V dif ference would
cause 5 pA of current to flow; wh ic h is greater than the
MCP6401/1R/1U/2/4/6/7/9 family’s bias current at
+25°C (±1.0 pA, typical).
The easiest way to reduce surfac e leakage is to use a
guard ring around sensitive p ins (or t r ac es) . The gua rd
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-7.
FIGURE 4-7: Example Guard Ring Layout
for Inverting Gain.
1. Non-inverting Gain and Unity-Gain Buffer:
a) Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b) Connect the guard ring to the inverting input
pin (VIN–). This b iases th e g uard ri ng to the
Common Mode input voltage.
2. Inverting Gain and Transimpedance Gain
Amplifiers (convert current to voltage, such as
photo detectors):
a) Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
b) Connect the inverting pin (VIN–) to the inp ut
with a wire that does not touch the PCB
surface.
4.7 Application Circuits
4.7.1 PRECISION HALF-WAVE
RECTIFIER
The precision half-wave rectifier, which is also known
as a super diode, is a configuration obtained with an
operational amplifier in order to have a circuit behave
like an i deal diode and rec tifier . It effec tively cancels the
forward vol t ag e drop of the diod e s o t hat very low le ve l
signal s can st ill be rectifi ed with mi nimal error. This can
be useful for high-precision signal processing. The
MCP6401/1R/1U/2/4/6/7/9 op amps have high input
impedance, low input bias current and rail-to-rail
input/output, which makes this device suitable for
preci sion rec tifi er appl ic ati ons .
Figure 4-8 shows a precision half-wave rectifi er an d its
transfer characteristic. The rectifier’s input impedance
is determ ined by the inp ut resistor R1. To avoid loadin g
effect, it must be driven from a low-impedance source.
When VIN is greater than zero, D1 is OFF , D2 is ON, and
VOUT is zero. When VIN is less than zero, D1 is ON, D 2
is OFF, and VOUT is the VIN with an amplification of
-R2/R1.
The rectifi er circui t sho wn in Figure 4-8 has the benef it
that the op amp never goes in saturation, so the only
thing affecting its frequency response is the
amplification and the gain bandwidth product.
.
FIGURE 4-8: Prec i sion Half -Wave
Rectifier.
Guard Ring VIN–V
IN+ VSS
VOUT
R2
D1
D2
R1
VIN
VOUT
VIN
-R2/R1
Transfer Characteristic
Precision Half-Wave Rectifier
MCP6401
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 20 © 2009-2011 Microchip Technology Inc.
4.7.2 BATTERY CURRENT SENSING
The MCP6401/1R/1U/2/4/6/7/9 op amps’ Common
Mode Input Range, which goes 0.3V beyond both
supply rails, supports their use in high-side and low-
side battery current sensing applications. The low
quiesc ent current (45 µA, typical) help s prolo ng battery
life, and the rail-to-rail output supports detection of low
currents.
Figure 4-9 shows a high-side battery current sensor
circuit. The 10Ω resistor is sized to minimize power
losses. The battery current (IDD) through the 10Ω
resistor causes its top terminal to be more negative
than the bottom terminal. This keeps the Common
Mode input voltage of the op amp below VDD, which is
within its allowed range. The output of the op amp will
also b e bel ow VDD, which is within its Max imum Output
Volta ge Sw ing spec ifi cat ion .
FIGURE 4-9: Suppl y Curre nt Sen si ng.
4.7.3 INSTRUMENTATION AMPLIFIER
The MCP6401/1R/1U/2/4/6/7/9 op amps are well
suited for conditioning sensor signals in battery-
powered application s. Figure 4-10 shows a two op amp
instrumentation amplifier, using the MCP6402, that
works well for applications requiring rejection of
Common Mode noise at higher gains. The reference
voltage (VREF) is supplied by a low impeda nc e so urc e.
In single supply applications, VREF is typically VDD/2.
FIGURE 4-10: Two Op Amp
Instrumentation Amplifier.
VDD
IDD
100 kΩ
1MΩ
1.8V VOUT
10Ω
to
6.0V
IDD VDD VOUT
10 V/V()10
Ω
()
------------------------------------------=
To load
MCP6401
VOUT V1V2
()1R1
R2
------2R1
RG
---------++
⎝⎠
⎛⎞
VREF
+=
VREF R1R2R2R1VOUT
RG
V2
V1
½ MCP6402 ½ MCP6402
© 2009-2011 Microchip Technology Inc. DS22229D-page 21
MCP6401/1R/1U/2/4/6/7/9
5.0 DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6401/1R/1U/2/4/6/7/9 family of op amps.
5.1 SPICE Macro Model
The latest SPICE macro model for the
MCP6401/1R/1U/2/4/6/7/9 op amp is available on the
Microchip web site at www.microchip.com. The model
was written and tested in official Orcad (Cadence)
owned PSPICE. For other simulators, translation may
be required.
The model covers a wide aspect of the op amp's
electric al speci fication s. Not onl y does the mod el cover
voltage, current, and resistance of the op amp, but it
also covers the temperature and noise effects on the
behavior of the op amp. The model has not been
verified outside of the specification range listed in the
op amp data sheet. The model behaviors under these
conditions cannot be guaranteed to match the actual
op amp performance.
Moreover, the model is intended to be an initial design
tool. Bench testing is a very important part of any
design and cannot be replaced with simulations. Also,
simulation results using this macro model need to be
validated by comparing them to the data sheet
specifications and characteristic curves.
5.2 FilterLab® Software
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from the
Micro chi p web s ite at www.microchip.com/filterlab, the
FilterLab design tool provides full schematic diagrams
of the filter circuit with component values. It also
outputs the filter circuit in SPICE format, which can be
used with the macro model to simulate actual filter
performance.
5.3 Microchip Advanced Part Selector
(MAPS)
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip website at
www.microchip.com/maps, the MAPS is an overall
selection tool for Microchip’s product portfolio that
includes Analog, Memory , MCUs and DSCs. Using this
tool, you can define a filter to sort features for a
parametric search of devices and export side-by-side
technical comparison reports. Helpful links are also
provided for Datasheets, Purchase, and Sampling of
Microchip parts.
5.4 Analog Demonstration and
Evaluation Boards
Microchip offers a broad spectrum of Analog
Demonstration and Evaluation Boards that are
designe d to h elp you a chieve f aster tim e to market. F or
a complete listing of these boards and their
correspo nding user’s guides and tech nical info rmatio n,
visit www.microchip.com/analogtools, the Microchip
web site.
Some boards that are especially useful are:
MCP6XXX Amplifier Evaluation Board 1
MCP6XXX Amplifier Evaluation Board 2
MCP6XXX Amplifier Evaluation Board 3
MCP6XXX Amplifier Evaluation Board 4
Active Filter Demo Board Kit
5/6-Pin SOT-23 Evaluation Board, P/N VSUPEV2
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board,
P/N SOIC8EV
14-Pin SOIC/TSSOP/DIP Evaluation Board, P/N
SOIC14EV
5.5 Application Notes
The following Microchip Analog Design Note and
Application Notes are available on the Microchip web
site at www.microchip.com/appnotes and are
recomm end ed as suppl em ental reference resourc es .
ADN003: “Select the Right Operational Amplifier
for your Filtering Circuits”, DS21821
AN722: “Operational Amplifier T opologies and DC
Specifications”, DS00722
AN723: “Operational Amplifier AC Specifications
and Applications”, DS00723
AN884: “Driving Capacitive Loads With Op
Amps”, DS00884
AN990: “Analog Sensor Conditioning Circuits
An Overview”, DS00990
AN1177: “Op Amp Precision Design: DC Errors”,
DS01177
AN1228: “Op Amp Precision Design: Random
Noise”, DS01228
AN1297: “Microchip’s Op Amp SPICE Macro
Models”, DS01297
AN1332: “Current Sensing Circuit Concepts and
Fundamentals”, DS01332
These application notes and others are listed in the
design guide:
“Signal Chain Design Guide”, DS21825
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 22 © 2009-2011 Microchip Technology Inc.
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
5-Lead SC70 (MCP6401 only) Example:
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the ful l Micro chip p art num ber can not be ma rked on one line , it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Example:
5-Lead SOT-23 Part Number Code
MCP6401T-E/OT NLNN
MCP6401T-H/OT U8NN
MCP6401RT-E/OT NMNN
MCP6401RT-H/OT U9NN
MCP6401UT-E/OT NPNN
MCP6401UT-H/OT V8NN
MCP6406T-E/OT ZXNN
MCP6406T-H/OT ZYNN
8-Lead TDFN (2 x 3) (MCP6402 only) Example:
8-Lead SOIC (150 mil) (MCP6401, MCP6402, MCP6407) Example:
(MCP6401/1R/1U, MCP6406)
Part Number Code
MCP6402T-E/MNY AAW
BL25
NL25
AAW
129
25
NNN
MCP6402E
SN ^^1129
256
3
e
© 2009-2011 Microchip Technology Inc. DS22229D-page 23
MCP6401/1R/1U/2/4/6/7/9
Package Marking Information (Continued)
14-Lead TSSOP (MCP6404 only)Example:
14-Lead SOIC (150 mil) (MCP6404, MCP6409)Example:
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanume ric trac ea bil ity code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the even t the full M icroc hip p art numb er cann ot be mark ed on one line, it wil l
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
and
MCP6404
H/SL ^^
1129256
3
e
YYWW
NNN
XXXXXXXX
6404E/ST
1129
256
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 24 © 2009-2011 Microchip Technology Inc.


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 
 
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 
   

 
  
   
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    
   
   
  
  
D
b
1
23
E1
E
45
ee
c
L
A1
AA2
   
© 2009-2011 Microchip Technology Inc. DS22229D-page 25
MCP6401/1R/1U/2/4/6/7/9
 

MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 26 © 2009-2011 Microchip Technology Inc.
 !
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  
   
  
  
  
φ
N
b
E
E1
D
123
e
e1
A
A1
A2 c
L
L1
   
© 2009-2011 Microchip Technology Inc. DS22229D-page 27
MCP6401/1R/1U/2/4/6/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 28 © 2009-2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009-2011 Microchip Technology Inc. DS22229D-page 29
MCP6401/1R/1U/2/4/6/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 30 © 2009-2011 Microchip Technology Inc.
"#$%!&'()*
 

© 2009-2011 Microchip Technology Inc. DS22229D-page 31
MCP6401/1R/1U/2/4/6/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 32 © 2009-2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009-2011 Microchip Technology Inc. DS22229D-page 33
MCP6401/1R/1U/2/4/6/7/9
"+,%-./# 0!0&()+,
 

MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 34 © 2009-2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009-2011 Microchip Technology Inc. DS22229D-page 35
MCP6401/1R/1U/2/4/6/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 36 © 2009-2011 Microchip Technology Inc.
 

© 2009-2011 Microchip Technology Inc. DS22229D-page 37
MCP6401/1R/1U/2/4/6/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 38 © 2009-2011 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009-2011 Microchip Technology Inc. DS22229D-page 39
MCP6401/1R/1U/2/4/6/7/9
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 40 © 2009-2011 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision D (September 2011)
The following is the list of modifications:
1. Section 1.0 “Electrical Characteristics”:
Updated minor typographical corrections in
both “DC Electrical Specifications” tables to
show the corr ect unit for RL (kΩ inst ead o f k W).
Revision C (August 2011)
The following is the list of modifications:
1. Added new MCP6406, MCP6407 and
MCP6409 devices and the related information
throughout the document.
2. Created two package type drawings based on
the temperature characterization (see E Temp
Package Types and H Temp Package Types).
3. Added MCP6406/7/9 specification tables in
Section 1.3 “MCP6406/7/9 Electrical Specifi-
cations”.
4. Updated characterization graphics in
Section 2.0 “Typical Performance Curves”.
5. Updated Table 3-1 in Section 3.0 “Pin
Descriptions” to show all the devices.
6. Updated markings examples in Section 6.1
“Package Marking Information”.
7. Updated the package markings information to
show all drawings available for each type of
package.
8. Updated the Product Identification System
page with the new devices and temperature
specifications.
Revision B (June 2010)
The following is the list of modifications:
1. Added the MCP6402 and MCP6404 package
information.
2. Updated the ESD protection value on all pins in
Section 1.1 “Absolute Maximum Ratings †”.
3. Added Figure 2-36.
4. Updated Table 3-1.
5. Updated Section 4.1.2 “Input Voltage Limits”.
6. Added Section 4.1.3 “Input Current Limits”.
7. Added Section 4.5 “Unused Op Amps”.
8. Updated Section 5.4 “Analog Demonstration
and Evaluation Boards”.
9. Updated the package markings information and
drawings.
10. Updated the Product Identification System
page.
Revision A (December 2009)
Original data sheet for the MCP6401/1R/1U/2/4/6/7/9
family of devices.
© 2009-2011 Microchip Technology Inc. DS22229D-page 41
MCP6401/1R/1U/2/4/6/7/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP6401T: Single Op Amp (Tape and Reel)
(SC 70, SOT-23)
MCP6401RT: Single Op Amp (Tape and Reel)
(SOT-23)
MCP6401UT: Single Op Amp (Tape and Reel)
(SOT-23)
MCP6402: Dual Op Amp
MCP6402T: Dual Op Amp (Tape and Reel)
(SOIC, 2x3 TDFN)
MCP6404 : Qua d Op Amp
MCP6404T: Quad Op Amp (Tape and Reel)
(SOIC, TSSOP)
MCP6406T: Single Op Amp (Tape and Reel)
(SOT-23)
MCP6407: Dual Op Amp
MCP6407T: Dual Op Amp (Tape and Reel)
(SOIC)
MCP6409 : Qua d Op Amp
MCP6409T: Quad Op Amp (Tape and Reel)
(SOIC)
Temperature Range: E = -40°C to +125°C (Extended Temperature)
H = -40°C to +150°C (High Temperature)
Package: LT = Plastic Package (SC70), 5-lead
OT = Plastic Small Outline Transistor (SOT-23), 5-lead
SN = Plastic SOIC, (3.90 mm body), 8-lead
MNY* = Plastic Dual Flat, No Lead, (2x3 TDFN), 8-lead
SL = Plastic SOIC (3.90 mm body), 14-lead
ST = Plastic TSSOP (4.4mm body), 14-lead
* Y = Nickel palladium gold manufacturing designator.
Only available on the TDFN package.
PART NO. -X /XX
PackageTemperature
Range
Device
Examples:
a) MCP6401T-E/LT: Tape and Reel,
Extended Temperature,
5LD SC70 pkg
b) MCP6401T-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 pkg
c) MCP6401RT-E/OT: Tape and Reel,
5LD SOT-23 pkg
d) MCP6401UT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 pkg
e) MCP6402-E/SN: Extended Temperature,
8LD SOIC pkg
f) MCP6402T-E/SN: Tape and Reel,
Extended Temperature,
8LD SOIC pkg
g) MCP6402T-E/MNY: Tape and Reel,
Extended Temperature,
8LD 2x3 TDFN pkg
h) MCP6404-E/SL: Extended Temperature,
14LD SOIC pkg
i) MCP 64 04T-E/SL: Tape and Ree l,
Extended Temperature,
14LD SOIC pkg
j) MCP6404-E/ST: Extended Temperature,
14LD TSSOP pkg
k) MCP6404T-E/ST: Tape and Reel,
Extended Temperature,
14LD TSSOP pkg.
a) MCP6401T-H/OT: Tape and Reel,
High Temperature,
5LD SOT-23 pkg
b) MCP6402-H /SN: High Temperature,
8LD SOIC pkg
c) MCP6402T -H/SN: Tape and Reel,
High Temperature,
8LD SOIC pkg
d) MCP6404-H/SL: High Temperature,
14LD SOIC pkg
e) MCP6404T-H/SL: Tape and Reel,
High Tem per atu re,
14LD SOIC pkg
f) MCP6406T-H/OT: Tape and Reel,
High Temperature,
5LD SOT-23 pkg
g) MCP6407-H/SN : High Temperature,
8LD SOIC pkg
h) M CP 64 07T-H/SN: Ta pe and Reel ,
High Temperature,
8LD SOIC pkg
i) MCP6409-H/SL: High Temperature,
14LD SOIC pkg
j) MCP6409T-H/SL: Tape and Reel,
High Temperature,
14LD SOIC pkg
MCP6401/1R/1U/2/4/6/7/9
DS22229D-page 42 © 2009-2011 Microchip Technology Inc.
NOTES:
© 2009-2011 Microchip Technology Inc. DS22229D-page 43
Information contained in this publication regarding device
applications a nd the lik e is provided only f or yo ur convenience
and may be supers ed ed by u pda t es . It is y our responsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PI C START,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Em bedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009-2011, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-616-7
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of t he most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS22229D-page 44 © 2009-2011 Microchip Technology Inc.
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