$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
Multilayer Chip NTC Thermistors
ERTJ
n
l
l
l
l
n
l
l
l
l
n
E R T
Product Code Shape
Size Type
(EIA)
Packaging Styles Resistance Tolerance
Resistance R25 ( )
Center of B Value (K)
Special
Specification
)
*
+
,
-
n
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
n
n
l
l
l
B B
l
B
B
nr
l
]9
] 9
]
] 9
]]
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
k
k
]
]]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
]
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
l
n
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
] ]
l
]
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
Multilayer Chip NTC Thermistors
Handling Precautions
afety Precautions
through b
flaming o
mechanical sses.
s using Thermiss,ould
ould
b an l run away may
result.
ould
In app using the Thermistor for
uen
unt
ould
ould
the f :
Eed
Eed
c)Coni
Con s
Sev
ra
the '
the df the therann coefficients
ould
used
]
ol
]]
××
en
The following Safety Precautions Ó and ÒApplication Notes" should be studied carefully by you. If
you have a questionabout the Handling Precautions, please contact our engineering section or factory.
Ò
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
nne
'
with
ould taking into consideration the position-
ing tolerances o
dimensional t
on
is
Assembly P
l n
should b
off on t
l
l should
l ould
get
l
, t he ould
a
them should be kept to a minimum to
comick
should
ould
ould
ould
×
×
×
×
Boards.
Cracked SMCs may result
when located at an easily
warped location on PC
Board
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
Reflow Soldering
The te conditionssolderingconsists
urforthe p
oulddually
as cracking.
ould nf
exceed 100dC.
repeatfl
ould,
inging.
lshould
l
the c
in
f
ct
to t
ould
according t
conditions an
ould
ould
in
ould
ould
ould
er
cooling of the part. If rapid heat is added to thermistors,
distortion occurs due to the large internal temperature
difference of the thermistor and it will cause thermal cracks.
Please pay careful attention to the temperature difference.
Preheating parts is necessary to avoidtombstoning (chip
standing). Please pay careful attention to temperature
control.
ture increase of the part, main heating of the part and
$ESIGNANDSPECIlCATIONSARESUBJECTTOCHANGEWITHOUTNOTICE!SKFACTORYFORTECHNICALSPECIlCATIONSBEFOREPURCHASEANDORUSE
7HENEVERADOUBTABOUTSAFETYARISESFROMTHISPRODUCTPLEASECONTACTUSIMMEDIATELYFORTECHNICALCONSULTATION
In hand soldering of the Thermistors, a large
the p
ck breaking.
ould
the pt to a
w the f ng recommended conditions
B ecti
]
]
ould
eter.
ould
ould
ly ence
. Itould
ould
ould
i used on t
the
to
es
rm
ould d to the PC
f
to
ould be supported by
to bending.
ould e measuring pins
ve
shouldbe
t c
that are
ould
should
in order to prevent
ck to
should
to a m
ould
ould
