IPT015N10N5 MOSFET OptiMOSTM5Power-Transistor,100V HSOF Features Tab *Idealforhighfrequencyswitchingandsync.rec. *ExcellentgatechargexRDS(on)product(FOM) *Verylowon-resistanceRDS(on) *N-channel,normallevel *100%avalanchetested *Pb-freeplating;RoHScompliant *QualifiedaccordingtoJEDEC1)fortargetapplications *Halogen-freeaccordingtoIEC61249-2-21 12 34 56 78 Table1KeyPerformanceParameters Parameter Value Unit VDS 100 V RDS(on),max 1.5 m ID 300 A Qoss 213 nC QG(0V..10V) 169 nC Type/OrderingCode Package IPT015N10N5 PG-HSOF-8 1) Drain Tab Gate Pin 1 Source Pin 2-8 Marking 015N10N5 RelatedLinks - J-STD20 and JESD22 Final Data Sheet 1 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 TableofContents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Final Data Sheet 2 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 1Maximumratings atTA=25C,unlessotherwisespecified Table2Maximumratings Parameter Symbol Continuous drain current Values Unit Note/TestCondition 300 243 32 A VGS=10V,TC=25C VGS=10V,TC=100C VGS=10V,TC=25C,RthJA=40K/W1) - 1200 A TC=25C - - 775 mJ ID=150A,RGS=25 VGS -20 - 20 V - Power dissipation Ptot - - 375 W TC=25C Operating and storage temperature Tj,Tstg -55 - 175 C IEC climatic category; DIN IEC 68-1: 55/175/56 Unit Note/TestCondition Min. Typ. Max. ID - - Pulsed drain current2) ID,pulse - Avalanche energy, single pulse3) EAS Gate source voltage 2Thermalcharacteristics Table3Thermalcharacteristics Parameter Symbol Thermal resistance, junction - case Values Min. Typ. Max. RthJC - 0.2 0.4 K/W - Device on PCB, minimal footprint RthJA - - 62 K/W - Device on PCB, 6 cm cooling area1) RthJA - - 40 K/W - 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. 2) See Diagram 3 for more detailed information 3) See Diagram 13 for more detailed information Final Data Sheet 3 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 3Electricalcharacteristics Table4Staticcharacteristics Parameter Symbol Drain-source breakdown voltage Values Unit Note/TestCondition - V VGS=0V,ID=1mA 3.0 3.8 V VDS=VGS,ID=280A - 0.1 10 5 100 A VDS=100V,VGS=0V,Tj=25C VDS=100V,VGS=0V,Tj=125C IGSS - 10 100 nA VGS=20V,VDS=0V Drain-source on-state resistance RDS(on) - 1.3 1.6 1.5 2.0 m VGS=10V,ID=150A VGS=6V,ID=75A Gate resistance1) RG - 1.4 2.1 - Transconductance gfs 140 280 - S |VDS|>2|ID|RDS(on)max,ID=100A Unit Note/TestCondition Min. Typ. Max. V(BR)DSS 100 - Gate threshold voltage VGS(th) 2.2 Zero gate voltage drain current IDSS Gate-source leakage current Table5Dynamiccharacteristics1) Parameter Symbol Input capacitance Values Min. Typ. Max. Ciss - 12000 16000 pF VGS=0V,VDS=50V,f=1MHz Output capacitance Coss - 1800 2300 pF VGS=0V,VDS=50V,f=1MHz Reverse transfer capacitance Crss - 80 140 pF VGS=0V,VDS=50V,f=1MHz Turn-on delay time td(on) - 36 - ns VDD=50V,VGS=10V,ID=100A, RG,ext=1.8 Rise time tr - 30 - ns VDD=50V,VGS=10V,ID=100A, RG,ext=1.8 Turn-off delay time td(off) - 85 - ns VDD=50V,VGS=10V,ID=100A, RG,ext=1.8 Fall time tf - 30 - ns VDD=50V,VGS=10V,ID=100A, RG,ext=1.8 Unit Note/TestCondition Table6Gatechargecharacteristics2) Parameter Symbol Gate to source charge Gate charge at threshold Values Min. Typ. Max. Qgs - 53 - nC VDD=50V,ID=100A,VGS=0to10V Qg(th) - 36 - nC VDD=50V,ID=100A,VGS=0to10V Gate to drain charge Qgd - 34 51 nC VDD=50V,ID=100A,VGS=0to10V Switching charge Qsw - 51 - nC VDD=50V,ID=100A,VGS=0to10V Gate charge total Qg - 169 211 nC VDD=50V,ID=100A,VGS=0to10V Gate plateau voltage Vplateau - 4.4 - V VDD=50V,ID=100A,VGS=0to10V Gate charge total, sync. FET Qg(sync) - 146 - nC VDS=0.1V,VGS=0to10V Qoss - 213 284 nC VDD=50V,VGS=0V 1) 1) 1) Output charge 1) 2) Defined by design. Not subject to production test. See Gate charge waveforms for parameter definition Final Data Sheet 4 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 Table7Reversediode Parameter Symbol Diode continuous forward current Diode pulse current Diode forward voltage 1) Reverse recovery time 1) Reverse recovery charge 1) Values Unit Note/TestCondition 300 A TC=25C - 1200 A TC=25C - 0.9 1.2 V VGS=0V,IF=100A,Tj=25C trr - 103 206 ns VR=50V,IF=100A,diF/dt=100A/s Qrr - 316 632 nC VR=50V,IF=100A,diF/dt=100A/s Min. Typ. Max. IS - - IS,pulse - VSD Defined by design. Not subject to production test. Final Data Sheet 5 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 4Electricalcharacteristicsdiagrams Diagram1:Powerdissipation Diagram2:Draincurrent 400 350 350 300 300 250 200 ID[A] Ptot[W] 250 200 150 150 100 100 50 50 0 0 25 50 75 100 125 150 0 175 0 25 50 75 TC[C] 100 125 150 175 200 TC[C] Ptot=f(TC) ID=f(TC);VGS10V Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance 4 100 10 1 s 103 0.5 10 s 10-1 102 ZthJC[K/W] ID[A] 100 s 0.2 1 ms 1 10 0.1 0.05 0.02 10 10 ms DC -2 0.01 100 single pulse 10-1 10-1 100 101 102 103 10-3 10-6 10-5 10-4 VDS[V] 10-2 10-1 100 tp[s] ID=f(VDS);TC=25C;D=0;parameter:tp Final Data Sheet 10-3 ZthJC=f(tp);parameter:D=tp/T 6 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 Diagram5:Typ.outputcharacteristics Diagram6:Typ.drain-sourceonresistance 800 3.0 10 V 6V 7V 700 5V 2.5 5.5 V 600 5.5 V RDS(on)[m] ID[A] 500 400 300 5V 2.0 6V 1.5 7V 10 V 1.0 200 0.5 100 0 0.0 0.5 1.0 1.5 2.0 2.5 0.0 3.0 0 100 200 VDS[V] 300 400 500 600 700 800 ID[A] ID=f(VDS);Tj=25C;parameter:VGS RDS(on)=f(ID);Tj=25C;parameter:VGS Diagram7:Typ.transfercharacteristics Diagram8:Typ.forwardtransconductance 700 360 320 600 280 500 240 ID[A] gfs[S] 400 300 200 160 120 200 80 100 175 C 40 25 C 0 0 1 2 3 4 5 6 7 0 0 VGS[V] 80 120 160 ID[A] ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj Final Data Sheet 40 gfs=f(ID);Tj=25C 7 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 Diagram9:Drain-sourceon-stateresistance Diagram10:Typ.gatethresholdvoltage 3.5 4 3.0 2800 A 3 2.5 280 A 1.5 VGS(th)[V] RDS(on)[m] max 2.0 typ 1.0 2 1 0.5 0.0 -60 -20 20 60 100 140 0 -60 180 -20 20 60 Tj[C] 100 140 180 Tj[C] RDS(on)=f(Tj);ID=150A;VGS=10V VGS(th)=f(Tj);VGS=VDS Diagram11:Typ.capacitances Diagram12:Forwardcharacteristicsofreversediode 5 104 10 25 C 175 C 175C max 25C max 104 103 Ciss IF[A] C[pF] Coss 103 102 101 101 Crss 0 20 102 40 60 80 100 100 0.0 0.5 VDS[V] 1.5 2.0 2.5 VSD[V] C=f(VDS);VGS=0V;f=1MHz Final Data Sheet 1.0 IF=f(VSD);parameter:Tj 8 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 Diagram13:Avalanchecharacteristics Diagram14:Typ.gatecharge 3 10 10 9 50 V 8 7 25 C 102 20 V 6 VGS[V] IAV[A] 100 C 80 V 5 4 125 C 1 10 3 2 1 100 100 101 102 103 0 0 tAV[s] 50 100 150 200 Qgate[nC] IAS=f(tAV);RGS=25;parameter:Tj(start) VGS=f(Qgate);ID=100Apulsed;parameter:VDD Diagram15:Drain-sourcebreakdownvoltage Gate charge waveforms 110 108 106 VBR(DSS)[V] 104 102 100 98 96 94 -60 -20 20 60 100 140 180 Tj[C] VBR(DSS)=f(Tj);ID=1mA Final Data Sheet 9 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 5PackageOutlines 1) partially covered with Mold Flash DIM A b b1 b2 c D D2 E E1 E4 E5 e H H1 H2 H3 H4 N K1 L L1 L2 L4 MILLIMETERS MIN MAX 2.20 2.40 0.70 0.90 9.70 9.90 0.42 0.50 0.40 0.60 10.28 10.58 3.30 9.70 10.10 7.50 8.50 9.46 1.20 (BSC) 11.48 6.55 11.88 6.75 INCHES MIN 0.087 0.028 0.382 0.017 0.016 0.405 0.295 0.335 0.372 0.047 (BSC) 0.452 0.258 2 0 2 4mm EUROPEAN PROJECTION 0.083 ISSUE DATE 20-02-2014 0.051 REVISION 02 0.028 0.024 1.30 0 SCALE 0.468 0.266 0.063 0.70 0.60 1.00 0.398 0.281 0.141 0.128 8 0.165 2.10 DOCUMENT NO. Z8B00169619 0.130 0.382 7.15 3.59 3.26 8 4.18 1.60 MAX 0.094 0.035 0.390 0.020 0.024 0.416 0.039 Figure1OutlinePG-HSOF-8 Final Data Sheet 10 Rev.2.2,2016-10-13 OptiMOSTM5Power-Transistor,100V IPT015N10N5 RevisionHistory IPT015N10N5 Revision:2016-10-13,Rev.2.2 Previous Revision Revision Date Subjects (major changes since last revision) 2.0 2014-12-17 Release of final version 2.1 2015-02-23 Correction of SOA area with Ipulse = 1200A 2.2 2016-10-13 Update Avalanche Energy TrademarksofInfineonTechnologiesAG AURIXTM,C166TM,CanPAKTM,CIPOSTM,CoolGaNTM,CoolMOSTM,CoolSETTM,CoolSiCTM,CORECONTROLTM,CROSSAVETM,DAVETM,DI-POLTM,DrBladeTM, EasyPIMTM,EconoBRIDGETM,EconoDUALTM,EconoPACKTM,EconoPIMTM,EiceDRIVERTM,eupecTM,FCOSTM,HITFETTM,HybridPACKTM,InfineonTM, ISOFACETM,IsoPACKTM,i-WaferTM,MIPAQTM,ModSTACKTM,my-dTM,NovalithICTM,OmniTuneTM,OPTIGATM,OptiMOSTM,ORIGATM,POWERCODETM, PRIMARIONTM,PrimePACKTM,PrimeSTACKTM,PROFETTM,PRO-SILTM,RASICTM,REAL3TM,ReverSaveTM,SatRICTM,SIEGETTM,SIPMOSTM,SmartLEWISTM, SOLIDFLASHTM,SPOCTM,TEMPFETTM,thinQTM,TRENCHSTOPTM,TriCoreTM. 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TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. Final Data Sheet 11 Rev.2.2,2016-10-13