TORX1400(F) FIBER OPTIC RECEIVING MODULE Unit : mm FIBER OPTIC RECEIVING MODULE WITH SMA RECEPTACLE For APF (All Plastic Fiber) Data Rate : 20 to 125 Mb/s. Transmission Distance: Up to 50 m. Operating Temperature : -40 to 85 3.3V PECL Interface 1. GND 2. OUTPUT () 3. OUTPUT () 4. SD(Signal Detect) 5. Vcc1 6. Vcc2 7. Case 8. Case Absolute Maximum RatingsTa=25 ITEM SYMBOL Storage Temperature Tstg Operating Temperature Topr Supply Voltage Vcc Output Current Io Soldering Temperature Tsol RATING 40 95 40 85 0.5 4.5 50 260 UNIT V mA NoteSoldering time 10 seconds.More than 1 mm apart from package 2006-05-17 1/4 TORX1400(F) Recommended Operating Conditions ITEM SYMBOL Supply Voltage Vcc Data Rate Mark Ratio Output Load RL MIN. 3.0 20 TYP. 3.3 50 50 MAX. 3.6 125 Electrical and Optical CharacteristicsTa=25Vcc=3.3V ITEM SYMBOL CONDITION MIN. Date Rate 20 Maximum Receivable Power(3) Pmax 0 (4) (2) Minimum Receivable Power Pmin Using APF 125Mb/s Current Consumption(5) Icc High Level Output Voltage VOH Vcc-1.045 Low Level Output Voltage VOL Vcc-1.84 (6) (2) SD Assert Level Using APF (7) (2) SD Deassert Level Using APF Output Voltage (SD On) Vccx0.8 Output Voltage (SD Off) Note UNIT V Mb/s % TYP. MAX. 125 - 22.5 45 55 Vcc-0.88 Vcc-1.62 - 22.5 - 23.5 Vccx0.2 UNIT Mb/s dBm dBm mA V V dBm dBm V V (2) All Plastic Fiber (NA=0.3,980/1000m). 27-1 Pattern. BER 10-9.Averaged Value. (4) 27-1 Pattern. BER 10-9. Eye Center. Averaged Value. (5) Without output current. (6) The value when SD output changes from L level to H level. (7) The value when SD output changes from H level to L level. (3) Application Circuit 0.01 1 H 10 82 130 82 130 SD OUTPUT OUTPUT () () (Bottom View) 2006-05-17 2/4 TORX1400(F) 5Precaution on Use (1) Maximum Rating The maximum ratings are the limit values which must not be exceeded when using the device. Any one of the ratings must not be exceeded. If the maximum rating is exceeded, the characteristics may not be recovered. In some extreme cases, the device may be permanently damage. (2) Soldering Optical receiving module uses semiconductor devices internally. However, in principle, optical modules are optical components. At soldering, take care that flux dose not contact the detecting surface. Also take care at flux removal after soldering. As mentioned before, optical modules are optical component. Thus, in principle, soldering where there may be flux residue or flux removal after soldering is not recommended. (3) Noise resistance It is believed that the use of optical modules improve the noise resistance. In principle, optical fiber is not affected by noise. However, especially receiving module which handle signals whose level is extremely small, are comparatively more susceptible to noise. This device improves noise resistance using a conductive case. However, the current of the signal output from the photodiode of the optic receiving module is extremely small. Thus, depending on the usage environment, shielding the case is not sufficient for noise resistance. When using this one, we recommends that you test using the actual device and check the noise resistance. Use a simple noise filter on this device's power line. If the ripple in power supply used is high, further reinforce the filter. When locating the optical module in an area susceptible to radiated noise, increase shielding by covering the optical module and the power line filter using a metallic cover. (4 ) Shielding and wiring pattern of fiber optic receiving modules To shield, connect the fixed pins (pins 7 and 8) of fiber optic receiving module TORX1400 to the GND. Where the fiber optic receiving module uses conductive resin, be careful that the case does not touch wiring (including land). To improve noise resistance, shield the optical module and the power line filter using a metallic cover. (5) Vibration and Shock This module is plastic sealed with wire fixed by resin. The structure is relatively sound against vibration or shock. In actual equipment, there are some cases where vibration, shock, or stress is applied to soldered parts or connected parts, resulting in line cut. Attention must be paid to the design of the mechanism for applications which are subject to large amounts of vibration. (6) Solvent When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour solvent in the optical connector ports. If solvent is inadvertently poured there, clean with cotton tips. (7) Supply voltage Use the supply voltage within the typical operating condition (Vcc=3.30.3V). Make sure that supply voltage does not exceed the maximum rating value of 4.5V, even instantaneously. 2006-05-17 3/4 TORX1400(F) (8) Soldering condition Solder at 260 or less within ten seconds. (9) Precaution on waste When discarding devices and packing materials, follow procedures stipulated by local regulations in order to protect the environment against contamination. (10) Precaution on use The Toshiba products listed in this document are intended for usage in general electronics applications computer, personal equipment, office equipment, domestic appliances, etc These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or malfunction or failure of which may cause loss of human life or bodily injury("Unintended Usage").Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, industrial instruments, all types of safety devices, etc. Unintended Usage of Toshiba products listed in this document shall be made at the customers' own risk. Toshiba is continually working to improve the quality and the reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent product specifications. Also, please keep in mind the precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook. RESTRICTIONS ON PRODUCT USE 030619EAC * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. * GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. 2006-05-17 4/4