Ceramic transient voltage suppressors
SMD Varistors, Monolithic (CU)
Series/Type: CU4032K140G2K1
Ordering code: B72660M0141K093
Date: 2010-12-09
Version: 1
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Identification/Classification 1
(header 1 + top left header bar):
Ceramic transient voltage suppressors
Identification/Classification 2
(header 2 + bottom left header bar): SMD Varistors , Mono li th i c (CU)
Ordering code: (top right header bar) B72660M0141K093
Series/Type: (top right header bar) CU4032K140G2K1
Preliminary data (optional):
(if necessary)
Department: PPD ML PD
Date: 2010-12-09
Version: 1
Prepared by: Mrs. Koholka
Release signed by: Dr. Dernovsek
Release signed QS: Mr. Schlauer
Modifications/Remarks: New datasheet
xxxx
xxxx
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 2 of 13
Important notes at the end of this document.
Designation system
CU = chip encapsulated
4032 = 40/100’’ x 32/100’’ = 10,0 mm x 8,0 mm
K = Tolerance of Vv at 1 mA: ±10 %
140 = Max. AC voltage
G2 = Taped and reeled (1000 pcs/reel)
K1 = Sealed type
Electrical data
Max. operating voltage
RMS voltage VRMS = 140 V
DC voltage VDC = 180 V
Varistor voltage (@ 1 mA, 25 °C) VV = 198 … 242 V
Max. clamping voltage (@ 10 A, 25 °C) Vclamp = 360 V
Max. average power dissipation Pmax = 250 mW
Max. surge current (8/20 µs) Îmax = 1 x 1200 A
Max. energy absorption (2 ms) Emax = 1 x 10 J
Capacitance (@ 1 kHz, 1 V, 25 °C; typical) Ctyp = 180 pF
Response time < 0.5 ns
Operating temperature –40 ... +85 °C
Storage temperature (mounted parts) –40 ... +125 °C
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 3 of 13
Important notes at the end of this document.
V/I characteristic
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
10
4
A
i
5
500
v
6
8
10
20
40
60
80
100
200
400
V
VAR9404A
Derating
1 x
2 x
10 x
10^2 x
10^3 x
10^4 x
10^5 x
10^6 x
inf..
0,1
1
10
100
1000
10000
10 100 1000 10000
t r [µs ]
t
i
r
max.
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 4 of 13
Important notes at the end of this document.
Temperature derating
100
0
10
20
30
40
50
60
70
80
90
%
-40 °C
A
mbient temperature
Max. current, energy, operating voltage and average power
di i ti
dissipation depending on ambient temperature
70 80 90 100 110 120 130 140 150
Part dimensions
L
H
W
A
L
X
L = 10.2 +/- 0,3 mm
W = 8.0 +/- 0,3 m
m
H = 3.2 +/- 0,3 m
m
A
L = 1.2 +/- 0,3 mm
Xmax = 0,3 mm
Recommended solder pad layout
A
A
D
CB
B
A = 3.5 mm
B = 2.8 mm
C = 6.5 mm
D = 12.1 mm
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 5 of 13
Important notes at the end of this document.
Recommended soldering temperature profiles
Reflow soldering temperature profile
TPT0892-3-E
T
25
Smin
t
S
t 25 ˚C to peak
Preheat Ramp-down
Time
L
Critical zone
T
Temperature
T
L
T
p
Ramp-up
Smax
t
L
T
t
p
to T
p
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Average ramp-up rate (TSmax to Tp) 3 °C/ second max. 3 °C/ second max.
Preheat
- Temperature min (TSmin)
- Temperature max (TSmax)
- Time (tSmin to tSmax)
100 °C
150 °C
60 … 120 seconds
150 °C
200 °C
60 … 180 seconds
Time maintained above
- Temperature min (TL)
- Time (tL)
183 °C
60 … 150 seconds
217 °C
60 … 150 seconds
Peak classification temperature
(Tp)
220 °C … 240 °C 240 °C … 260 °C
Time within 5 °C of actual peak
temperature (tp)
10 … 30 seconds 20 … 40 seconds
Ramp-down rate 6 °C/ second max. 6 °C/ second max.
Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
Notes: All temperatures refer to topside of the package, measured on the package body surface.
Max. number of reflow cycles: 3
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 6 of 13
Important notes at the end of this document.
Wave soldering temperature profile
Temperature characteristic at component terminal with dual-wave soldering
˚C
300
250
200
150
100
50
Temperature
Time
KKE0144-J-E
2 K/s
approx. 200 K/s
5 K/s
1st wave 2nd wave
2 K/s
235 ˚C ... 260 ˚C
Forced
Limit curves
Normal curve
10 s
100 ˚C ... 130 ˚C
s 250200150100500
0
cooling
Soldering guidelines
The usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
The components are suitable for reflow soldering to JEDEC J-STD-020C.
Storage condition
As far as possible, the components should be employed within 24 months after delivery from
EPCOS.
They should be left in their original packings to avoid soldering problems due to oxidized
contacts.
Storage temperature: − 25 up to + 45°C.
Relative humidity: < 75 % annual average, < 95 % on max. 30 days in a year.
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 7 of 13
Important notes at the end of this document.
Taping and packaging
Tape and reel packing according to IEC 60286-3
Tape material: Blister
Dimensions and tolerances
Definition Symbol Dimension
[mm]
Tolerance
[mm]
Compartment width A0 8.6 ±0.2
Compartment length B0 10.6 ±0.2
Sprocket hole diameter D0 1.5 +0.1 /-0
Sprocket hole pitch P0 4.0
±0.1 1)
Distance center hole to center compartment P2 2.0 ±0.05
Pitch of the component compartments P1 12.0 ±0.1
Tape width W 16.0 ±0.3
Distance edge to center of hole E 1.75 ±0.1
Distance center hole to center compartment F 7.5 ±0.05
Distance compartment to edge G 0.75 min.
Overall thickness T2 5.5 max.
Thickness tape T 0.3 max.
1) ± 0.2 mm over any 10 pitches
Package: 16-mm tape
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 8 of 13
Important notes at the end of this document.
Packing
Packing material: Plastic
Reel dimensions:
Dinition Symbol Dimension
[mm]
Tolerance
[mm]
Reel diameter A 330 +0 / -2
Reel width (inside) W1 16.4 +1.5 /-0
Reel width (outside) W2 22.4 max.
Packing unit: 1000pcs
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 9 of 13
Important notes at the end of this document.
Cautions and warnings
General
Some parts of this publication contain statements about the suitability of our ceramic transient voltage
suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk
varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for certain areas of
application, including recommendations about incorporation/design-in of these products into customer
applications. The statements are based on our knowledge of typical requirements often made of our
CTVS devices in the particular areas. We nevertheless expressly point out that such statements
cannot be regarded as binding statements about the suitability of our CTVS components for a
particular customer application. As a rule, EPCOS is either unfamiliar with individual customer
applications or less familiar with them than the customers themselves. For these reasons, it is always
incumbent on the customer to check and decide whether the CTVS devices with the properties
described in the product specification are suitable for use in a particular customer application.
Do not use EPCOS CTVS components for purposes not identified in our specifications,
application notes and data books.
Ensure the suitability of a CTVS in particular by testing it for reliability during design-in.
Always evaluate a CTVS component under worst-case conditions.
Pay special attention to the reliability of CTVS devices intended for use in safety-critical
applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant).
Design notes
Always connect a CTVS in parallel with the electronic circuit to be protected.
Consider maximum rated power dissipation if a CTVS has insufficient time to cool down
between a number of pulses occurring within a specified isolated time period. Ensure that
electrical characteristics do not degrade.
Consider derating at higher operating temperatures. Choose the highest voltage class
compatible with derating at higher temperatures.
Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will
burst.
If steep surge current edges are to be expected, make sure your design is as low-inductance
as possible.
In some cases the malfunctioning of passive electronic components or failure before the end
of their service life cannot be completely ruled out in the current state of the art, even if they
are operated as specified. In applications requiring a very high level of operational safety and
especially when the malfunction or failure of a passive electronic component could endanger
human life or health (e.g. in accident prevention, life-saving systems, or automotive battery
line applications such as clamp 30), ensure by suitable design of the application or other
measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is
sustained by third parties in the event of such a malfunction or failure. Only use CTVS
components from the AUTO series in safety-relevant applications.
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 10 of 13
Important notes at the end of this document.
Specified values only apply to CTVS components that have not been subject to prior electrical,
mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
therefore not advisable, and it is only allowed together with safety countermeasures like
thermal fuses.
Storage
Only store CTVS in their original packaging. Do not open the package before storage.
Storage conditions in original packaging: temperature −25 to +45°C, relative humidity ≤75%
annual average, maximum 95%, dew precipitation is inadmissible.
Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the
packaging material may be deformed or CTVS may stick together, causing problems during
mounting.
Avoid contamination of the CTVS surface during storage, handling and processing.
Avoid storing CTVS devices in harmful environments where they are exposed to corrosive
gases for example (SOx, Cl).
Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.
Solder CTVS components after shipment from EPCOS within the time specified:
o CTVS with Ni barrier termination, 12 months
o CTVS with AgPd termination, 6 months
o SHCV and CU series, 24 months
Handling
Do not drop CTVS components and allow them to be chipped.
Do not touch CTVS with your bare hands - gloves are recommended.
Avoid contamination of the CTVS surface during handling.
Mounting
When CTVS devices are encapsulated with sealing material or overmolded with plastic
material, be sure to observe the precautions in “Mounting instructions”, “Sealing, potting and
overmolding”.
Make sure an electrode is not scratched before, during or after the mounting process.
Make sure contacts and housings used for assembly with CTVS components are clean before
mounting.
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 11 of 13
Important notes at the end of this document.
The surface temperature of an operating CTVS can be higher. Ensure that adjacent
components are placed at a sufficient distance from a CTVS to allow proper cooling.
Avoid contamination of the CTVS surface during processing.
Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.
Soldering
Complete removal of flux is recommended to avoid surface contamination that can result in an
instable and/or high leakage current.
Use resin-type or non-activated flux.
Bear in mind that insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
Conductive adhesive gluing
Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive
adhesive gluing.
Operation
Use CTVS only within the specified operating temperature range.
Use CTVS only within specified voltage and current ranges.
Environmental conditions must not harm a CTVS. Only use them in normal atmospheric
conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited.
Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS
(e.g. through plug terminals).
Avoid dewing and condensation.
EPCOS CTVS components are mainly designed for encased applications. Under all
circumstances avoid exposure to:
o direct sunlight
o rain or condensation
o steam, saline spray
o corrosive gases
o atmosphere with reduced oxygen content
Ceramic transient voltage supp ressors B72660M0141K 093
SMD Varistors, Monolithic (CU) CU4032K140G2K1
PPD ML PD 2010-12-09
Please read Cautions and warnings and Page 12 of 13
Important notes at the end of this document.
EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where
static power dissipation is required.
Multilayer varistors (MLVs) are designed for ESD protection and transient suppression.
CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and
EMI protection only.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Important notes
Page 13 of 13
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in th e current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed
questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic,
DSSP, FormFit, MiniBlue, MiniCell, MKD, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube,
PhaseMod, PhiCap, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer,
SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe
and in other countries. Further information will be found on the Internet at
www.epcos.com/trademarks.
