HMC1015 v01.0814 Typical Applications Features The HMC1015 is ideal for: Passive: No DC Bias Required * Point-to-Point Radios High Input IP3: 20 dBm * Point-to-Multi-Point Radios & VSAT High LO/RF Isolation: 45 dB * Test Equipment & Sensors High 2LO/IF Isolation: 50 dB * Military End-Use Wide IF Bandwidth: 16 - 22 GHz TE Upconversion & Downconversion Applications Die Size: 1.14 x 1.1 x 0.1 mm Functional Diagram General Description LE The HMC1015 is a general purpose triple-balanced mixer chip that can be used as a frequency converter with 16 to 22 GHz at the IF port and 26 to 32 GHz at the RF port. This mixer requires no external components or matching circuitry. The HMC1015 provides excellent LO/RF, LO/IF and 2LO/IF isolation due to optimized balun structures. The mixer operates with LO drive levels from +9 dBm to +15 dBm. The HMC1015 wideband mixer exhibits consistent conversion gain and compression across its bandwidth. B SO MIXERS - TRIPLE-BALANCED - CHIP GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz Electrical Specifications, TA = +25 C, LO = 9 GHz, LO = +13 dBm [2] O Parameter Min. Typ. Max. Units RF Frequency Range 26 - 32 GHz IF Frequency Range 16- 22 GHz LO Frequency Range 7 - 11 Conversion Loss 10 LO to RF Isolation LO to IF Isolation [1] [1] 2LO to IF Isolation [1] GHz 13 dB 45 dB 31 dB 50 dB RF to IF Isolation 35 dB IP3 (Input) 22 dBm 1 dB Gain Compression (Input) 10 dBm [1] Fixed IF = 17 GHz. [2] Unless otherwise noted , all measurements performed as an upconverter with LO = 9 GHz. 1 Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz Conversion Gain vs. Temperature Upconverter, LO= 7 GHz Conversion Gain vs. Temperature Upconverter, LO= 9 GHz -10 -15 -20 -25 -10 -15 -20 -25 24 25 26 27 28 29 30 31 32 33 34 24 RF FREQUENCY (GHz) 25 26 27 +85 C -55 C Conversion Gain vs. Temperature Upconverter, LO= 11 GHz 29 +25 C 30 31 32 33 34 +85 C -55 C Conversion Gain vs. LO Power Upconverter, LO= 7 GHz 0 -5 -15 -20 -25 24 B SO -10 25 26 27 28 29 30 31 32 33 CONVERSION GAIN (dB) 0 -5 -10 -15 -20 -25 34 24 25 26 27 RF FREQUENCY (GHz) +25 C +85 C 28 29 30 31 32 33 34 RF FREQUENCY (GHz) -55 C +9 dBm +11 dBm +13 dBm +15 dBm Conversion Gain vs. LO Power Upconverter, LO= 11 GHz O Conversion Gain vs. LO Power Upconverter, LO= 9 GHz 0 CONVERSION GAIN (dB) 0 CONVERSION GAIN (dB) 28 RF FREQUENCY (GHz) LE +25 C CONVERSION GAIN (dB) -5 TE -5 MIXERS - TRIPLE-BALANCED - CHIP 0 CONVERSION GAIN (dB) CONVERSION GAIN (dB) 0 -5 -10 -15 -20 -25 -5 -10 -15 -20 -25 24 25 26 27 28 29 30 31 32 33 RF FREQUENCY (GHz) +9 dBm +11 dBm 34 24 25 26 27 28 29 30 31 32 33 34 35 RF FREQUENCY (GHz) +13 dBm +15 dBm +9 dBm +11 dBm +13 dBm +15 dBm Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com 2 HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz Input IP3 vs. Temperature Upconverter, LO= 7 GHz Input IP3 vs. Temperature Upconverter, LO= 9 GHz 30 25 IP3 (dBm) IP3 (dBm) 25 20 15 15 10 5 5 24 25 26 27 28 29 30 31 32 33 34 24 RF FREQUENCY (GHz) +25 C 25 26 -55 C 28 29 +25 C 30 31 32 33 34 +85 C -55 C Input IP3 vs. LO Power Upconverter, LO= 7 GHz LE Input IP3 vs. Temperature Upconverter, LO= 11 GHz 30 30 25 15 5 24 B SO 20 25 26 27 28 29 30 31 32 33 IP3(dBm) 25 10 20 15 10 5 34 24 25 26 RF FREQUENCY (GHz) +85 C 27 28 29 30 31 32 33 34 RF FREQUENCY (GHz) -55 C +9 dBm +11 dBm +13 dBm +15 dBm Input IP3 vs. LO Power Upconverter, LO= 11 GHz O Input IP3 vs. LO Power Upconverter, LO= 9 GHz 30 30 25 25 IP3(dBm) IP3(dBm) 27 RF FREQUENCY (GHz) +85 C +25 C 20 15 10 20 15 10 5 5 24 25 26 27 28 29 30 31 32 33 34 RF FREQUENCY (GHz) +9 dBm +11 dBm 3 20 TE 10 IP3 (dBm) MIXERS - TRIPLE-BALANCED - CHIP 30 24 25 26 27 28 29 30 31 32 33 34 RF FREQUENCY (GHz) +13 dBm +15 dBm +9 dBm +11 dBm +13 dBm +15 dBm Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz RF and IF Return Loss LO Return Loss -10 RETURN LOSS (dB) -10 -15 -20 -20 -30 -40 TE RETURN LOSS (dB) -5 -25 -30 -50 15 19 23 27 31 35 6 FREQUENCY (GHz) 8 10 12 14 FREQUENCY (GHz) IF +9 dBm +11 dBm +13 dBm +15 dBm LE RF Isolation LO/IF, LO/RF, 2LO/IF Isolation RF/IF -10 -10 -20 -50 -60 -70 -80 -90 6 B SO ISOLATION (dB) -40 7 8 9 10 11 ISOLATION (dB) -20 -30 -30 -40 -50 -60 24 12 25 26 2LO/IF 29 LO/RF O Input P1dB vs. Temperature @ LO= 9 GHz 14 12 12 10 10 6 4 31 32 33 34 Input P1dB vs. LO Power @ LO= 9 GHz 14 8 30 RF/IF P1dB (dBm) P1dB (dBm) 28 RF FREQUENCY (GHz) LO FREQUENCY (GHz) LO/IF 27 MIXERS - TRIPLE-BALANCED - CHIP 0 0 8 6 4 2 2 24 25 26 27 28 29 30 31 32 33 34 RF FREQUENCY (GHz) +25C +85C 24 25 26 27 28 29 30 31 32 33 34 RF FREQUENCY (GHz) -40C +9 dBm +11 dBm +13 dBm +15 dBm Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com 4 HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz RF / IF Input (LO = +18 dBm) 15.5 dBm LO Drive 20 dBm Maximum Junction Temperature 150 C Continuous Pdiss (Ta = 85 C) (derate 2.5 mW/C above 85 C) 79 mW Thermal Resistance (RTH) (junction to die bottom) 392 C/W Operating Temperature -55C to +85C Storage Temperature -65C to 150C TE ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS B SO LE Outline Drawing O MIXERS - TRIPLE-BALANCED - CHIP Table 1. Absolute Maximum Ratings Table 2. Die Packaging Information Standard Alternate GP-1 (Gel Pack) [2] [1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. DIE THICKNESS IS 0.004" 3. BOND PADS 1, 2 & 3 are 0.0059" [0.150] X 0.0039" [0.099]. 4. BACKSIDE METALLIZATION: GOLD. 5. BOND PAD METALLIZATION: GOLD. 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. Overall die size 0.002 [1] For more information refer to the "Packaging information" Document in the Product Support Section of our website. [2] For alternate packaging information contact Hittite Microwave Corporation. 5 Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz Table 3. Pad Descriptions Description Pad Schematic 1 RF This pad is AC coupled and matched to 50 Ohms. 2 IF This pad is AC coupled and matched to 50 Ohms. 3 LO This pad is AC coupled and Matched to 50 Ohms. Die Bottom GND Die bottom must be connected to RF/DC ground LE B SO O Assembly Diagram MIXERS - TRIPLE-BALANCED - CHIP Function TE Pad Number Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com 6 HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 0.102mm (0.004") Thick GaAs MMIC Wire Bond 0.076mm (0.003") RF Ground Plane TE 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be located as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). Handling Precautions 0.127mm (0.005") Thick Alumina Thin Film Substrate Figure 1. 0.102mm (0.004") Thick GaAs MMIC LE Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. B SO MIXERS - TRIPLE-BALANCED - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup. Wire Bond 0.076mm (0.003") RF Ground Plane 0.150mm (0.005") Thick Moly Tab 0.254mm (0.010") Thick Alumina Thin Film Substrate Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. O Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 C and a tool temperature of 265 C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 C. DO NOT expose the chip to a temperature greater than 320 C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). 7 Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com HMC1015 v01.0814 GaAs MMIC FUNDAMENTAL MIXER, 26 - 32 GHz MIXERS - TRIPLE-BALANCED - CHIP O B SO LE TE Notes: Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, delivery,Drive, and to Chelmsford, place orders: Analog Devices, Inc., Foris assumed price, bydelivery andforto place orders: Analog Devices, 2 Elizabeth MA 01824 responsibility Analog Devices its use, nor for any infringements of patents or other Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 * Fax: 978-250-3373 * Order at www.hittite.com Phone: On-line 781-329-4700 * Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks areApplication the property of theirSupport: respective owners. Phone: 978-250-3343 or apps@hittite.com 8