MT9P031I12STCES - Micron Technology, Inc.

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Preliminary‡

‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by

Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.

MT9P031 Image Sensor

Pro duct Brief

Micron’s MT9P031 is a 1/2.5-inch CMOS digital image sensor

with an active-pixel array of 2592H x 1944V. It incorporates

sophisticated camera functions such as windowing, binning,

column and row skip mode, and snapshot mode. It is program-

mable through a simple two-wire serial interface. The MT9P031

produces extraordinarily clear, sharp digital pictures, and its ability

to capture both continuous video and single frames makes it the

perfect choice for a wide range of consumer and commercial secu-

rity applications, including high resolution network cameras; pan,

tilt, and zoom cameras; and hybrid video/still cameras.

•Micron

® DigitalClarity®

imaging technology

•High frame rate

• S uperior low-light

performance

• Low dark curr ent

• Global reset release, which

starts the exposure of all rows

simultaneously

• Bulb exposure mode, for

arbitrary exposure times

• Snapshot mode to take frames

on demand

• Horizontal and vertical mirror

image

• Column and ro w skip modes to

reduce image size without

reducing field of view

• Column and row binning

modes to improve image

quality when resizing

• Simple two-wire serial

interface

• Subframe windowed readout

• Programmable con trols: g ain,

frame rate, frame size,

exposure

• Automatic black level

calibration

• On-chip PLL

• High-resolution network

cameras

• Wide field of view cameras

• High-definition surveillance

camera

• Dome cameras with electronic

pan, tilt, and zoom

• Hybrid video cameras with

high resolution stills

• Detailed feature extraction for

smart cameras

Key Parameters

Optical format 1/2.5-inch (4:3)

Active imager size 5.70mm(H) x 4.28mm(V)

7.13mm diagonal

Active pixels 2592H x 1944V

Pixel size 2.2µm x 2.2µm

Color filter array RGB Bayer pattern

Shutter type Global reset release (GRR),

snapshot only; electronic

rolling shutter (ERS)

Maximum data rate/

master clock 96 Mp/s at 96 MHz (2.8V I/O)

48 Mp/s at 48MHz (1.8V I/O)

Frame Rate

Full resolution Programmable up to 14 fps

VGA (with binning) Programmable up to 53 fps

720P (1280 X 720,

skipping mode) Programmable up to 60 fps

ADC resolution 12-bit, on-chip

Responsivity 1.4 V/lux-sec (550nm)

Pixel dynamic range 70.1dB (full resolution),

76dB (2 x 2 binning)

SNRMAX 38.1dB (full resolution),

44dB (2 x 2 binning)

Supply

voltage I/O 1.7V−3.1V

Digital 1.7V−1.9V (1.8V nominal)

Analog 2.6V−3.1V (2.8V nominal)

Power consumption 381mW at 14 fps full

resolution

Operating temp. –30°C to +70°C

Packaging 48-pin iLCC, die

Output gain 10 e-/LSB

Read noise 2.6 e-RMS at 16X

Dark current 25 e-/pix/s at 55C

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Ordering Information

General Description

The MT9P031 sensor can be oper ated in i ts defaul t mode or programmed for frame size,

exposure , gain setting, and other parameters . The default mode outputs a full-resolution

image at 14 frames per second (fps).

An on-chip analog-to-digital converter (ADC) provides 12 bits per pixel. FRAME_VALID

and LINE_VALID signals are output on dedicated pins, as is a pixel clock that is synchro-

nous with valid data.

The 5-megapixel CMOS i`mage sensor features DigitalClarity—Micron’s breakthrough

low-noise CMOS imaging technology that achieves CCD image quality (based on signal-

to-noise ratio and low-light sensitivity) while maintaining the inherent size, cost, and

integration advantages of CMOS.

Figure 1: MT9P031 Quantum Efficiency versus Wavelength

Table 1: Available Part Numbers

Part Number Description

MT9P031I12STC ES 48-Pin iLCC 7 deg

MT9P031I12STD ES Demo kit

MT9P031I12STH ES Demo kit headboard

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

General Description

Figure 2: Chief Ray Angle

CRA Des ign

0 10 20 30 40 50 60 70 80 90 100 110

Image Height (%)

CRA (deg)

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

The MT9P031 is a progressive-scan sensor that generates a stream of pixel data at a con-

stant frame rate. It uses an on-chip, phase-locked loop (PLL) to generate all internal

clocks from a single master input clock running between 6 MHz and 27 MHz. The maxi-

mum pixel rate is 96 meg api xels per second, corresponding to a clock rate of 96 MHz.

Figure3 illustrates a block diagram of the sensor.

Figure 3: MT9P031 Block Diagram

The sensor is programmed via the two-wire serial bus, which communicates with the

array control, analog signal chain, and digital signal chain. The core of the sensor is a 5-

megapixel active-pixel array. The timing and control circuitry sequences through the

rows of the array, resetting and then reading each row in turn. In the time interval

between resetting a row and reading that row, the pixels in the row integrate incident

light. The exposure is controlled by varying the time interval between reset and readout.

Once a row has been read, the data from the columns ar e sequenced through an analog

signal chain (providing offset correction and gain) and then through an ADC. The out-

put from the ADC is a 12-bit value for each pixel in the array. The ADC output passes

through a digital processing signal chain (which provides further data path corr ections

and applies digital gain). The pixel data are output at a rate of up to 96 Mp/s, in addition

to frame and line synchronization signals.

Pixel Array

2,752H x 2,004V

SCLK

SDATA

SADDR

PIXCLK

DOUT[11:0]

LINE_VALID

FRAME_VALID

STROBE

Serial

Interface

Analog Signal Chain Data Path

TRIGGER

EXTCLK

RESET#

STANDBY#

OE#

Array Control

Output

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

Figure 4: Typical Configuration (connection)

Notes: 1. Resistor value 1.5KΩ is recommended but may be greater for slower two-wire speed.

2. All power supplies should be adequately decoupled.

3. All DGND pins must be tied together, as must all AGND pins, all VDDQ pins, and all VDD pins.

Figure 5: 48-Pin iLCC 10x10mm Package Pinout Diagram (top view)

OUT

[11:0]

PIXCLK

FRAME_VALID

LINE_VALID

STROBE

ADDR

RESET#

STANDBY#

SCLK

DATA

TRIGGER

AGND

TEST

1.5KΩ

2,3

1µF

10K

RSVD

DGND

PLL

VAAPIX

2,3

OE#

Controller

From

Controller

Master

Clock

EXTCLK

12345648 47 4645 44 43

19 20 21 22 23 24 25 2627 28 29 30

FRAME_VALID

LINE_VALID

STROBE

GND

ADDR

STANDBY#

TRIGGER

RESET#

OE#

OUT

PIXCLK

EXTCLK

TEST

GND

PLL

GND

RSVD

DATA

SCLK

TEST

GND

VAAPIX

GND

OUT

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

Table 2: Pin Descriptions

Name LLCC Pin Type Description

RESET# 16 Input When LOW, the MT9P031 asynchronously resets. When driven HIGH, it

resumes normal operation with all configuration registers set to factory

defaults.

EXTCLK 31 Input External input clock.

SCLK 4 Input Serial clock: Pull to VDDQ with a 1.5KΩ resistor.

OE# 17 Input When HIGH, the PIXCLK, DOUT, FRAME_V ALID, LINE_V ALID, and STROBE

outputs enter a High-Z. When driven LOW, normal operation resumes.

STANDBY# 14 Input Standby: When LOW , the chip enters a low-power standby mode. It

resumes normal operation when the pin is driven HIGH.

TRIGGER 15 Input Snapshot trigger: Used to trigger one frame of output in snapshot

modes and to indicat e the end of exposu re in bulb expo su r e modes.

SADDR 13 Input Serial address: When HIGH, the MT9P031 responds to device ID (BA)H.

When LOW, it responds to serial device ID (90)H.

SDATA 5 I/O Serial data: Pull to VDDQ with a 1.5KΩ resistor.

PIXCLK 32 Output Pixel clock: The DOUT, FRAME_VALID, LINE_VALID, and STROBE

outputs should be captured on the falling edge of this signal.

DOUT[11:0] 33 to 45 Output Pixel data: Pixel data is 12-bit. MSB (DOUT11) through LSB (DOUT0) of

each pixel, to be captured on the falling edge of PIXCLK.

FRAME_VALID 7 Output Frame valid: Driven HIGH during active pixels and horizontal blanking

of each frame and LOW during vertical blanking.

LINE_VALID 8 Output Line valid: Driven HIGH with active pixels of each line and LOW during

blanking periods.

STROBE 9 Output Snapshot strobe: Driven HIGH when all pixels are exposing in

snapshot modes.

VDD 12, 7 Supply Digital supply voltage: Nominally 1.8V.

VDDQ11, 39Supply

IO supply voltage: Nominally 1.8V or 2.8V.

DGND 10, 26, 46 Supply Digital ground.

VAA 23, 24 Supply Analog supply voltage: Nominally 2.8V.

VAAPIX 1, 48 Supply Pixel supply voltage: Nominally 2.8V, connected externally to VAA.

AGND 2, 22 Supply Analog ground.

VDDPLL 25 Supply PLL supply voltage: Nominally 2.8V, connected externally to VAA.

TEST 3, 20, 21 – Tie to AGND for normal device operation (factory use only).

RSVD 6 – Tie to DGND for normal de vice operation (factory use only).

NC 18, 19, 27, 28, 29,

30 –No connect.

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

Default Readout Order

By convention, the sensor core pixel array is shown with pixel (0,0) in the top right cor-

ner (see Figure 6). This reflects the actual layout of the array on the die . By default data is

first read out of the sensor at pixel (16,54).

When the sensor is imaging, the activ e surface of the se nsor face s the sce ne, as shown i n

Figure 6. When the image is read out of the sensor, it is read one row at a time, with the

rows and columns sequenced, as shown in F igur e7.

Figure 6: Imaging a Scene

Lens

Pixel (0,0)

Row

Readout

Order

Column Readout Order

Scene

Sensor (rear view)

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

Output Data Format (default mode)

The MT9P031 image data is read out in a progressive scan. Valid image data is sur-

rounded by horizontal blanking and vertical blanking, as shown in Figure 7.

LINE_VALID is HIGH in the shaded region of the figur e.

Figure 7: Spatial Illustration of Image Readout

0,0

0,1

0,2

.....................................P

0,n-1

0,n

1,0

1,1

1,2

.....................................P

1,n-1

1,n

00 00 00 .................. 00 00 00

m-1,0

m-1,1

.....................................P

m-1,n-1

m-1,n

m,0

m,1

.....................................P

m,n-1

m,n

00 00 00 .................. 00 00 00

00 00 00 ..................................... 00 00 00

VALID IMAGEHORIZONTAL

BLANKING

VERTICAL BLANKINGVERTICAL/HORIZONTAL

BLANKING

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Functional Overview

Readout Modes

Subsampling B y default, the resolution of the output image is the full width and height of the FOV as

defined above. The output resolution can be re duced by two methods: skipping and bin-

ning.

Row and column skip modes use subsampling to reduce the output resolution without

reducing field-of-view. The MT9P031 also has ro w and column binni ng modes, which

can reduce the impact of aliasing introduced by the use of skip modes. This is achieved

by the averaging of two or three adjacent rows and columns (adjacent same-color pix-

els). Both 2X and 4X binning modes are supported. Rows and columns can be binned

independently.

Skipping Skipping reduces resolution by using only selected pixels from the FOV in the output

image . In skip mode, entire rows and columns of pixels are not sampled, r esulting in a

lower-reso lution outp ut image. A skip 2X mode skips one Bayer pair of pixels for every

pair output. Skip 3X skips two pairs for each one pair output. Rows and columns are

always read out in pairs.

Binning Binning r educes r esolution b y combining adjacent, same -color imager pixels to produce

one output pixel. All of the pixels i n the FO V contribute to the output image in bin mode.

This can result in a more pleasing output image with reduced subsampling artifacts. It

also improves low-light performance. For columns, the combination step can be either

an averaging or summing operation. Depending on lighting conditions , one or the other

may be desirable. In low-light conditions, summing produces a gain roughly equivalent

to the column bin factor.

Only certain combinations of binning and skipping are allowed.

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

DC Electrical Characteristics

Table 3: DC Electrical Characteristics

Symbol Definition Conditions Min Typ Max Units

VDD Core digital vo ltage 1.7 1.8 1.9 V

VDDQ I/O digital voltage 1.7 1.8/2.8 3.1 V

VAA Analog voltage 2.6 2.8 3.1 V

VAAPIX Pixel supply voltage 2.6 2.8 3.1 V

VDDPLL PLL supply voltage 2.6 2.8 3.1 V

VIH Input high voltage VDDQ = 2.8V

VDDQ = 1.8V 2

1.3 –3.3

2.3 V

VIL Input low voltage VDDQ = 2.8V

VDDQ = 1.8V –0.3

–0.3 –+0.8

+0.5 V

IIN Input leakage current No pull-up resistor; VIN = VDDQ or

DGND –<10 – µA

VOH Output high voltage At specified IOH 1.3 – 1.82 V

VOL Output low voltage At specified IOL 0.16 – 0.35 V

IOH Output high current At specified V OH = VDDQ-400mv at

1.7V VDDQ8.9 – 22.3 mA

IOL Output low current At specified VOL = 400mv at 1.7V

VDDQ2.6 – 5.1 mA

IOZ Tri-state output leakage current VIN=VDDQ or GND –– 2µA

IDD1 Digital operating current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled –2835mA

IDDQ1 I/O digital operating curre nt Parallel mode 96 MHz full frame

nominal voltage, PLL enabled –38.650 mA

IAA1 Analog operating current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled –7295mA

IAAPIX1 Pixel supply current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled –2.4 6 mA

IDDPLL1 PLL supply current Parallel mode 96 MHz full frame

nominal voltage, PLL enabled –5 6mA

IDD2 Digital operating current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled –1535mA

IDDQ2 I/O digital operating current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled –6.450mA

IAA2 Analog operating current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled –6995mA

IAAPIX2 Pixel supply current Parallel mode 96 MHz 4X binning

nominal voltage, PLL Enabled –3.4 6 mA

IDDPLL2 PLL supply current Parallel mode 96 MHz 4X binning

nominal voltage, PLL enabled –5 6mA

ISTBY1 Hard standby current PLL

enabled EXTCLK enabled –<500 – µA

ISTBY2 Hard standby current PLL

disabled EXTCLK disabled –<50 – µA

ISTBY3 Soft standby current PLL enabled EXTCLK enabled (PLL enabled) –<500 – µA

ISTBY4 Soft stand by current PLL

disabled EXTCLK enabled (PLL disabled) –<500 – µA

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MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

DC Electrical Characteristics

Notes: 1. Stresses greater than those listed may cause permanent damage to the device. This is a

stress rating only, and functional operation of the device at these or any other conditions

above those indicated in the operational sections of this specification is not implied. Expo-

sure to absolute maximum rating conditions for extended periods may affect reliability.

2. In order to keep dark current and shot noise artifacts from impacting image quality, care

should be taken to keep TOP at a minimum.

3. Measure at junction.

Table 4: Power Consumption

Mode Full Resolution (14 fps) 4X Binning Units

Streaming 381 262 mW

Table 5: Absolute Maximum Ratings

Symbol Definition Min Max Units

VDD_MAX Core digital voltage –0.3 1.9 V

VDDQ_MAX I/O digital voltage –0.3 3.1 V

VAA_MAX Analog voltage –0.3 3.1 V

VAAPIX_MAX Pixel supply voltage –0.3 3.1 V

VDDPLL_MAX PLL supply voltage –0.3 3.1 V

VIN_MAX Input voltage –0.3 VDDQ + 0.3 V

IDD_MAX Digital operating current –35mA

IDDQ_MAX I/O digital operating current –100mA

IAA_MAX Analog operating current –95mA

IAAPIX_MAX Pixel supply current –6mA

IDDPLL_MAX PLL supply current –6mA

TOP 2, 3 Operating te mperature –30 70 °C

TST Storage temperature –40 125 °C

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prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-49 92

Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.

All other trademarks are the property of their respective owners.

MT9P031: 1/2.5-Inch 5-Mp Digital Image Sensor

Package Dimensions

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Package Dimensions

Figure 8: 48-Pin iLCC Package Outline

Notes: 1. All dimensions are in millimeters.

4.50

10.000 ±0.075

3.85

7.70

3.85

0.70

TYP

0.70

TYP

7.70

48 1

1.40

47X 0.80

48X 0.40

4.50

10.000 ±0.075

7.57

1.455

5.702

CTR

7.02

4.277

CTR

1.45

L LEAD FINISH:

GOLD PLATING,

0.50 MICRONS

MINIMUM THICKNESS

4.20

5.000 ±0.075

OPTICAL CENTER

OPTICAL

AREA

MAXIMUM ROTATION OF OPTICAL AREA

RELATIVE TO PACKAGE EDGES B AND C : 1º

MAXIMUM TILT OF OPTICAL AREA

RELATIVE TO SEATING PLANE A : 25 MICRONS

RELATIVE TO TOP OF COVER GLASS D : 50 MICRONS

5.000 ±0.075

OPTICAL CENTER

FIRST

CLEAR

PIXEL

SEATING

PLANE

MOLD COMPOUND: EPOXY NOVOLAC

IMAGE SENSOR DIE

LID MATERIAL: BOROSILICATE GLASS 0.40 THICKNESS

1.250 ±0.125

0.725 ±0.075

0.525 ±0.050

0.125

(FOR REFERENCE ONLY)

SUBSTRATE MATERIAL: PLASTIC LAMINATE