Ericsson Internal PRODUCT TABLE OF CONTENTS SPECIFICATION E Prepared (also subject responsible if other) SEC/S Kevin Zhou EZHIXZH Approved 1 (1) (4) No. Checked PKB 4000A series Direct Converters MICRF Input 38-72 V, Output up to 30 A / 125 W 1/1301-BMR662 001 52-EN/LZT 146 Uen420 Uen Specification Technical Date Rev 2010-05-06 Reference EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB Key Features * Industry standard low profile Eighth-brick 58.4 x 22.7 x 8.50 mm (2.30 x 0.894 x 0.339 in) * High efficiency, typ. 93.3% at 5.0 Vout half load * 2250 Vdc input to output isolation * Meets isolation requirements equivalent to basic insulation according to IEC/EN/UL 60950 * More than 1.6 million hours MTBF General Characteristics * * * * * * * * * * Output over voltage protection Input under voltage shutdown Over temperature protection Monotonic startup Output short-circuit protection Remote sense Remote control Output voltage adjust function Highly automated manufacturing ensures quality ISO 9001/14001 certified supplier Safety Approvals Design for Environment Meets requirements in hightemperature lead-free soldering processes. Contents Ordering Information General Information Safety Specification Absolute Maximum Ratings ............................................................. 2 ............................................................. 2 ............................................................. 3 ............................................................. 4 Electrical Specification 3.3 V, 30 A / 99 W 5.0 V, 25 A / 125 W PKB 4910A .......................................... 5 PKB 4111A .......................................... 9 EMC Specification Operating Information Thermal Consideration Connections Mechanical Information Soldering Information Delivery Information Product Qualification Specification ........................................................... 13 ........................................................... 14 ........................................................... 15 ........................................................... 16 ........................................................... 17 ........................................................... 19 ........................................................... 20 ........................................................... 21 Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) 1/1301-BMR662 Technical Uen Specification SEC/S Kevin Zhou Approved Checked Date PKB 4000A series Direct Converters MICRF Input 38-72 V, Output up to 30 A / 125 W 2010-05-06 Product program PKB 4910A PKB 4111A Output 3.3 V, 30 A / 99 W 5.0 V, 25 A / 125 W Product number and Packaging PKB 4XXXXA n1n2n3 Options n1 Mounting n3 n2 Remote Control logic Lead length Options Description n1 PI SI Through hole * Surface mount P Negative * Positive LA LB 5.30 mm * 3.69 mm 4.57 mm n3 Rev Reference 2 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB homogeneous materials for cadmium. Ordering Information n2 2 (4) No. Example a through-hole mounted, negative logic, short pin product would be PKB 4910A PILA. * Standard variant (i.e. no option selected). General Information Reliability The Mean Time Between Failure (MTBF) is calculated at full output power and an operating ambient temperature (TA) of +40C, which is a typical condition in Information and Communication Technology (ICT) equipment. Different methods could be used to calculate the predicted MTBF and failure rate which may give different results. Ericsson Power Modules currently uses Telcordia SR332. Predicted MTBF for the series is: 1.6 million hours according to Telcordia SR332, issue 1, Black box technique. Telcordia SR332 is a commonly used standard method intended for reliability calculations in ICT equipment. The parts count procedure used in this method was originally modelled on the methods from MIL-HDBK-217F, Reliability Predictions of Electronic Equipment. It assumes that no reliability data is available on the actual units and devices for which the predictions are to be made, i.e. all predictions are based on generic reliability parameters. Exemptions in the RoHS directive utilized in Ericsson Power Modules products include: Lead in high melting temperature type solder (used to solder the die in semiconductor packages) Lead in glass of electronics components and in electronic ceramic parts (e.g. fill material in chip resistors) Lead as an alloying element in copper alloy containing up to 4% lead by weight (used in connection pins made of Brass) Quality Statement The products are designed and manufactured in an industrial environment where quality systems and methods like ISO 9000, 6 (sigma), and SPC are intensively in use to boost the continuous improvements strategy. Infant mortality or early failures in the products are screened out and they are subjected to an ATE-based final test. Conservative design rules, design reviews and product qualifications, plus the high competence of an engaged work force, contribute to the high quality of our products. Warranty Warranty period and conditions are defined in Ericsson Power Modules General Terms and Conditions of Sale. Limitation of Liability Ericsson Power Modules does not make any other warranties, expressed or implied including any warranty of merchantability or fitness for a particular purpose (including, but not limited to, use in life support applications, where malfunctions of product can cause injury to a person's health or life). (c) Ericsson AB 2010 The information and specifications in this technical specification is believed to be correct at the time of publication. However, no liability is accepted for inaccuracies, printing errors or for any consequences thereof. Ericsson AB reserves the right to change the contents of this technical specification at any time without prior notice. Safety Specification General information Compatibility with RoHS requirements The products are compatible with the relevant clauses and requirements of the RoHS directive 2002/95/EC and have a maximum concentration value of 0.1% by weight in homogeneous materials for lead, mercury, hexavalent chromium, PBB and PBDE and of 0.01% by weight in Ericsson Power Modules DC/DC converters and DC/DC regulators are designed in accordance with safety standards IEC/EN/UL60950, Safety of Information Technology Equipment. IEC/EN/UL60950 contains requirements to prevent injury or damage due to the following hazards: Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) SEC/S Kevin Zhou Approved Checked PKB 4000A series Direct Converters MICRF Input 38-72 V, Output up to 30 A / 125 W * * * * * * 3 (4) No. 1/1301-BMR662 Technical Uen Specification Date Rev 2010-05-06 Reference 3 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB functions: Electrical shock Energy hazards Fire Mechanical and heat hazards Radiation hazards Chemical hazards On-board DC-DC converters and DC/DC regulators are defined as component power supplies. As components they cannot fully comply with the provisions of any Safety requirements without "Conditions of Acceptability". Clearance between conductors and between conductive parts of the component power supply and conductors on the board in the final product must meet the applicable Safety requirements. Certain conditions of acceptability apply for component power supplies with limited stand-off (see Mechanical Information for further information). It is the responsibility of the installer to ensure that the final product housing these components complies with the requirements of all applicable Safety standards and Directives for the final product. Component power supplies for general use should comply with the requirements in IEC60950, EN60950 and UL60950 "Safety of information technology equipment". There are other more product related standards, e.g. IEEE802.3af "Ethernet LAN/MAN Data terminal equipment power", and ETS300132-2 "Power supply interface at the input to telecommunications equipment; part 2: DC", but all of these standards are based on IEC/EN/UL60950 with regards to safety. Ericsson Power Modules DC/DC converters and DC/DC regulators are UL60950 recognized and certified in accordance with EN60950. The flammability rating for all construction parts of the products meets requirements for V-0 class material according to IEC 60695-11-10. The products should be installed in the end-use equipment, in accordance with the requirements of the ultimate application. Normally the output of the DC/DC converter is considered as SELV (Safety Extra Low Voltage) and the input source must be isolated by minimum Double or Reinforced Insulation from the primary circuit (AC mains) in accordance with IEC/EN/UL60950. Isolated DC/DC converters It is recommended that a slow blow fuse with a rating twice the maximum input current per selected product be used at the input of each DC/DC converter. If an input filter is used in the circuit the fuse should be placed in front of the input filter. In the rare event of a component problem in the input filter or in the DC/DC converter that imposes a short circuit on the input source, this fuse will provide the following * * Isolate the faulty DC/DC converter from the input power source so as not to affect the operation of other parts of the system. Protect the distribution wiring from excessive current and power loss thus preventing hazardous overheating. The galvanic isolation is verified in an electric strength test. The test voltage (Viso) between input and output is 1500 Vdc or 2250 Vdc for 60 seconds (refer to product specification). Leakage current is less than 1 A at nominal input voltage. 24 V DC systems The input voltage to the DC/DC converter is SELV (Safety Extra Low Voltage) and the output remains SELV under normal and abnormal operating conditions. 48 and 60 V DC systems If the input voltage to the DC/DC converter is 75 Vdc or less, then the output remains SELV (Safety Extra Low Voltage) under normal and abnormal operating conditions. Single fault testing in the input power supply circuit should be performed with the DC/DC converter connected to demonstrate that the input voltage does not exceed 75 Vdc. If the input power source circuit is a DC power system, the source may be treated as a TNV2 circuit and testing has demonstrated compliance with SELV limits and isolation requirements equivalent to Basic Insulation in accordance with IEC/EN/UL60950. Non-isolated DC/DC regulators The input voltage to the DC/DC regulator is SELV (Safety Extra Low Voltage) and the output remains SELV under normal and abnormal operating conditions. E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 1 (10) No. 2/1301 BMR 662Technical Uen EAB/FJB/GMF Oscar Persson Approved Checked Date PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Rev EN/LZT 146 420 R2A May 2010 2010-05-04 Input 38-72 V, Output up to 30 A / 125 W 4 Specification Reference B (c) Ericsson AB Absolute Maximum Ratings Characteristics min max Unit TP1 -40 +125 C C Operating Temperature (see Thermal Consideration section) typ TS Storage temperature -55 +110 VI Input voltage -0.5 +80 V Viso Isolation voltage (input to output test voltage) 2250 Vdc Vtr Input voltage transient (tp 100 ms) 100 V 40 V 0 40 V -0.5 2xVoi V VRC Remote Control pin voltage (see Operating Information section) Vadj Adjust pin voltage (see Operating Information section) Positive logic option 0 Negative logic option Stress in excess of Absolute Maximum Ratings may cause permanent damage. Absolute Maximum Ratings, sometimes referred to as no destruction limits, are normally tested with one parameter at a time exceeding the limits in the Electrical Specification. If exposed to stress above these limits, function and performance may degrade in an unspecified manner. Fundamental Circuit Diagram Primary Secondary + In + Out + Sense Primary Driver Secondary Driver - Sense - Out Bias supply and OTP RC - In Isolated Feedback Control and Supervision Vadj E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 2 (10) No. EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W 2/1301 BMR 662Technical Uen Date Rev EN/LZT 146 420 R2A May 2010 2010-05-04 B (c) Ericsson AB 3.3V, 30A /99W Electrical Specification PKB 4910A PI TP1 = -30 to +90C, VI = 38 to 72 V, sense pins connected to output pins unless otherwise specified under Conditions. Typical values given at: TP1 = +25C, VI= 53 VI max IO, unless otherwise specified under Conditions. Additional Cin = 33 F. See Operating Information section for selection of capacitor types. Characteristics Conditions min typ VI Input voltage range VIoff Turn-off input voltage Decreasing input voltage 30 VIon Turn-on input voltage Increasing input voltage 33 CI Internal input capacitance PO Output power Efficiency 5 Specification Reference 38 max Unit 72 V 31 32 V 34 35 V 5.7 0 F 99 50 % of max IO 92.4 max IO 91.0 50 % of max IO, VI = 48 V 92.7 max IO, VI = 48 V 91.0 W % Pd Power Dissipation max IO 9.8 Pli Input idling power IO = 0 A, VI = 53 V 1.8 PRC Input standby power VI = 53 V (turned off with RC) fs Switching frequency 0-100 % of max IO 162 180 198 kHz VOi Output voltage initial setting and accuracy TP1 = +25C, VI = 53 V, IO = 30 A 3.23 3.30 3.37 V Output adjust range See operating information 2.64 3.63 V Output voltage tolerance band 0-100 % of max IO 3.2 3.4 V Line regulation max IO 3 10 mV Load regulation VI = 53 V, 0-100 % of max IO 5 10 mV Vtr Load transient voltage deviation 200 350 mV ttr Load transient recovery time VI = 53 V, Load step 25-75-25 % of max IO, di/dt = 1 A/s See Note 1 tr Ramp-up time ts Start-up time VO tf tRC (from 10-90 % of VOi) 14 W W 0.1 W 40 s 8 ms 12 ms 0-100 % of max IO (from VI connection to 90 % of VOi) VI shut-down fall time max IO IO = 0 A 50 5 s (from VI off to 10 % of VO) RC start-up time max IO 12 ms RC shut-down fall time max IO 37 s (from RC off to 10 % of VO) IO = 0 A IO Output current Ilim Current limit threshold Isc Short circuit current TP1 = 25C, see Note 2 Cout Recommended Capacitive Load TP1 = 25C, see Note 3 VOac Output ripple & noise OVP Over voltage protection Note 1: 3000 uF; ESR value 5 m Note 2: Constant current Vo < 0.5 V Note 3: See Operating Information Section 5 0 TP1 < max TP1 See ripple & noise section, max IO, VOi TP1 = +25C, VI = 53 V, 0-100 % of max IO s s 30 40 A 45 0 3.8 A A 3000 F 60 120 mVp-p 4.3 4.8 V E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 3 (10) No. 2/1301 BMR 662Technical Uen EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W Date Rev 6 Specification Reference EN/LZT 146 420 R2A May 2010 2010-05-04 B (c) Ericsson AB 3.3V, 30A /99W Typical Characteristics PKB 4910A PI Efficiency Power Dissipation [W] 12 [%] 95 10 90 85 38 V 8 38 V 48 V 6 48 V 4 72 V 53 V 80 72 V 75 53 V 2 70 0 0 5 10 15 20 25 30 [A] 0 Efficiency vs. load current and input voltage at TP1 = +25C 5 10 15 20 25 30 [A] Dissipated power vs. load current and input voltage at TP1 = +25C Output Characteristics Current Limit Characteristics [V] [V] 3,40 3,50 3,00 3,35 38 V 48 V 3,30 3,25 2,50 38 V 2,00 53 V 1,50 72 V 1,00 48 V 53 V 72 V 0,50 0,00 3,20 0 5 10 15 20 25 Output voltage vs. load current at TP1 = +25C 30 [A] 30 35 40 45 50 [A] Output voltage vs. load current at IO > max IO , TP1 = +25C E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 4 (10) No. EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W 2/1301 BMR 662Technical Uen Date 2010-05-04 Rev Specification Reference EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB 3.3V, 30A /99W Typical Characteristics Start-up Start-up enabled by connecting VI at: TP1 = +25C, VI = 53 V, IO = 30 A resistive load. PKB 4910A PI Shut-down Top trace: output voltage (1 V/div.). Bottom trace: input voltage (50 V/div.). Time scale: (5 ms/div.). Output Ripple & Noise Output voltage ripple at: TP1 = +25C, VI = 53 V, IO = 30 A resistive load. 7 Shut-down enabled by disconnecting VI at: TP1 = +25C, VI = 53 V, IO = 30 A resistive load. Top trace: output voltage (1 V/div.). Bottom trace: input voltage (50 V/div.). Time scale: (50 us/div.). Output Load Transient Response Trace: output voltage (20 mV/div.). Time scale: (2 s/div.). Output voltage response to load current stepchange (7.5-22.5-7.5 A) at: TP1 = +25C, VI = 53V, Co = 3mF. Top trace: output voltage (200 mV/div.). Bottom trace: load current (10 A/div.). Time scale: (0.1 ms/div.). Output Voltage Adjust (see operating information) Passive adjust The resistor value for an adjusted output voltage is calculated by using the following equations: Active adjust The output voltage may be adjusted using a {current/voltage} applied to the Vadj pin. This {current/voltage} is calculated by using the following equations: Output Voltage Adjust Upwards, Increase: 5.1 x 3.30(100 + %) 510 Radj = - - 10.2 k 1 . 225 x % % Example: Increase 4% =>Vout = 3.432 Vdc 5.1 x 3.30(100 + 4 ) 510 - - 10.2 k = 220 k 1.225 x 4 4 Output Voltage Adjust Downwards, Decrease: 100 Radj = 5.11x - 2 k % Vdesired - 3.30 Vadj = 1.225 + 2.45 x V 3.30 Example: Upwards => 3.50 V 3.50 - 3.30 V = 1.37 V 1.225 + 2.45 x 3.30 E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W 3.3V, 30A /99W Typical Characteristics [A] 30 3.0 m/s 25 2.0 m/s 20 1.5 m/s 15 1.0 m/s 10 0.5 m/s 5 Nat. C onv. 0 20 40 60 80 100 [C] Available load current vs. ambient air temperature and airflow at VI = 53 V. See Thermal Consideration section. 2/1301 BMR 662Technical Uen Date 2010-05-04 Rev Specification Reference 8 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB PKB 4910A PI Output Current Derating - Open frame 0 5 (10) No. E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 6 (10) No. EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W 2/1301 BMR 662Technical Uen Date Rev EN/LZT 146 420 R2A May 2010 2010-05-04 B (c) Ericsson AB 5.0V, 25A /125W Electrical Specification PKB 4111A PI TP1 = -30 to +90C, VI = 38 to 72 V, sense pins connected to output pins unless otherwise specified under Conditions. Typical values given at: TP1 = +25C, VI= 53 VI max IO, unless otherwise specified under Conditions. Additional Cin = 33 F. See Operating Information section for selection of capacitor types. Characteristics Conditions min typ VI Input voltage range VIoff Turn-off input voltage Decreasing input voltage 30 VIon Turn-on input voltage Increasing input voltage 33 CI Internal input capacitance PO Output power Efficiency 9 Specification Reference 38 max Unit 72 V 31 32 V 34 35 V 5.7 0 F 125 50 % of max IO 93.3 max IO 92.6 50 % of max IO, VI = 48 V 93.5 max IO, VI = 48 V 92.6 W % Pd Power Dissipation max IO 10.0 Pli Input idling power IO = 0 A, VI = 53 V 2.4 PRC Input standby power VI = 53 V (turned off with RC) fs Switching frequency 0-100 % of max IO 162 180 196 kHz VOi Output voltage initial setting and accuracy TP1 = +25C, VI = 53 V, IO = 25 A 4.90 5.00 5.10 V Output adjust range See operating information (see Note 1) 4.0 5.5 V Output voltage tolerance band 0-100 % of max IO 4.85 5.15 V Line regulation max IO 3 10 mV Load regulation VI = 53 V, 0-100 % of max IO 3 10 mV Vtr Load transient voltage deviation 160 250 mV ttr Load transient recovery time VI = 53 V, Load step 25-75-25 % of max IO, di/dt = 1 A/s See Note 2 tr Ramp-up time VO ts tf tRC (from 10-90 % of VOi) Start-up time (from VI off to 10 % of VO) W W 0.1 W 50 s 9 ms 13 ms 0.5 5 ms s 0-100 % of max IO (from VI connection to 90 % of VOi) VI shut-down fall time 13.5 max IO IO = 0 A RC start-up time max IO 13 ms RC shut-down fall time max IO 0.3 ms (from RC off to 10 % of VO) IO = 0 A 5 s IO Output current Ilim Current limit threshold TP1 < max TP1 32 A Isc Short circuit current TP1 = 25C, see Note 3 38 A Cout Recommended Capacitive Load TP1 = 25C, see Note 4 VOac Output ripple & noise OVP Over voltage protection 0 See ripple & noise section, max IO, VOi TP1 = +25C, VI = 53 V, 0-100 % of max IO Note 1: At trim-up, the minimum VI/Vout ratio must be kept, i.e. 5 % trim up require VI > 39.9 V Note 2: 2500uF; ESR value 10m Note 3: Constant current Vo < 0.5 V Note 4: See Operating Information Section 25 0 A 2500 F 60 120 mVp-p 6.3 7.4 V E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 7 (10) No. 2/1301 BMR 662Technical Uen EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W Date Rev 10 Specification Reference EN/LZT 146 420 R2A May 2010 2010-05-04 B (c) Ericsson AB 5.0V, 25A /125W Typical Characteristics PKB 4111A PI Efficiency Power Dissipation [%] [W] 12 95 10 90 85 38 V 8 48 V 6 53 V 80 72 V 75 38 V 48 V 53 V 4 72 V 2 70 0 5 10 15 20 0 25 [A] 0 Efficiency vs. load current and input voltage at TP1 = +25C 5 10 15 20 25 [A] Dissipated power vs. load current and input voltage at TP1 = +25C Output Characteristics Current Limit Characteristics [V] [V] 6,00 5,10 5,00 5,05 4,00 38 V 48 V 3,00 48 V 53 V 2,00 72 V 1,00 38 V 5,00 4,95 53 V 72 V 0,00 25,0 4,90 0 5 10 15 20 Output voltage vs. load current at TP1 = +25C 30,0 35,0 40,0 45,0 [A] 25 [A] Output voltage vs. load current at IO > max IO , TP1 = +25C E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) 8 (10) No. EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W 2/1301 BMR 662Technical Uen Date 2010-05-04 Rev Specification Reference EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB 5.0V, 25A /125W Typical Characteristics Start-up Start-up enabled by connecting VI at: TP1 = +25C, VI = 53 V, IO = 25 A resistive load. PKB 4111A PI Shut-down Top trace: input voltage (20 V/div.). Bottom trace: output voltage (2 V/div.). Time scale: (5 ms/div.). Output Ripple & Noise Output voltage ripple at: TP1 = +25C, VI = 53 V, IO = 25 A resistive load. 11 Shut-down enabled by disconnecting VI at: TP1 = +25C, VI = 53 V, IO = 25A resistive load. Top trace: input voltage (20 V/div.). Bottom trace: output voltage (2 V/div.). Time scale: (5 ms/div.). Output Load Transient Response Trace: output voltage (20 mV/div.). Time scale: (2 s/div.). Output voltage response to load current step- Top trace: output voltage (100 mV/div.). change (6.25-18.75-6.25 A) at: Bottom trace: load current (10 A/div.). TP1 = +25C, VI = 53V. Time scale: (0.2 ms/div.). Output Voltage Adjust (see operating information) Passive adjust The resistor value for an adjusted output voltage is calculated by using the following equations: Active adjust The output voltage may be adjusted using a {current/voltage} applied to the Vadj pin. This {current/voltage} is calculated by using the following equations: Output Voltage Adjust Upwards, Increase: 5.10 x 5.00(100 + %) 510 Radj = - - 10.2 k 1.225 x % % Vdesired - 5.00 Vadj = 1.225 + 2.45 x V 5.00 Example: Increase 4% =>Vout = 5.2 Vdc Example: Upwards => 5.30 V 5.10 x 5.00(100 + 4 ) 510 - - 10.2 k = 404 k 1.225 x 4 4 Output Voltage Adjust Downwards, Decrease: 100 Radj = 5.11x - 2 k % 5.30 - 5.00 V = 1.37 V 1.225 + 2.45 x 5.00 E Ericsson Internal PRODUCT SPECIFICATION Prepared (also subject responsible if other) EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] (MICRF) Input 38-72 V, Output up to 30 A / 125 W 5.0V, 25A / 125W Typical Characteristics [A] 25 3.0 m/s 20 2.0 m/s 15 1.5 m/s 1.0 m/s 10 0.5 m/s 5 Na t. Con v. 0 20 40 60 80 100 [C] Available load current vs. ambient air temperature and airflow at VI = 53 V. See Thermal Consideration section. 2/1301 BMR 662Technical Uen Date 2010-05-04 Rev Specification Reference 12 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB PKB 4111A PI Output Current Derating - Open frame 0 9 (10) No. Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) 1 (5) No. EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] MICJAKE Input 38-72 V, Output up to 30 A / 125 W 3/1301-BMR 662Technical 00+ Uen Specification Date 2010-04-11 Rev Reference 13 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB EMC Specification Conducted EMI measured according to EN55022, CISPR 22 and FCC part 15J (see test set-up). See Design Note 009 for further information. The fundamental switching frequency is 180 kHz for PKB 4910A PINB @ VI = 53 V, max IO. Conducted EMI Input terminal value (typ) Test set-up Layout recommendations The radiated EMI performance of the Product will depend on the PCB layout and ground layer design. It is also important to consider the stand-off of the product. If a ground layer is used, it should be connected to the output of the product and the equipment ground or chassis. EMI without filter External filter (class B) Required external input filter in order to meet class B in EN 55022, CISPR 22 and FCC part 15J. Filter components: C1,2,3 = 1 F C4,5 = 2.2 nF C6,7 = 100 F L1,L2 = 770 H A ground layer will increase the stray capacitance in the PCB and improve the high frequency EMC performance. Output ripple and noise Output ripple and noise measured according to figure below. See Design Note 022 for detailed information. Output ripple and noise test setup EMI with filter Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) EAB/FJB/GMF Oscar Persson Approved 2 (5) No. Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] MICJAKE Input 38-72 V, Output up to 30 A / 125 W Operating information Input Voltage The input voltage range 38 to 72Vdc meets the requirements of the European Telecom Standard ETS 300 132-2 for normal input voltage range in -48 and -60 Vdc systems, -40.5 to 57.0 V and -50.0 to -72 V respectively. At input voltages exceeding 72 V, the power loss will be higher than at normal input voltage and TP1 must be limited to absolute max +125C. The absolute maximum continuous input voltage is 80 Vdc. Turn-off Input Voltage The products monitor the input voltage and will turn on and turn off at predetermined levels. The minimum hysteresis between turn on and turn off input voltage is 2V. Remote Control (RC) The products are fitted with a remote control function referenced to the primary negative input connection (-In), with negative and positive logic options available. The RC function allows the product to be turned on/off by an external device like a semiconductor or mechanical switch. The RC pin has an internal pull up resistor to +In. The maximum required sink current is 1 mA. When the RC pin is left open, the voltage generated on the RC pin is 5 - 7 V or 10-13V for "P" option. The standard product is provided with "negative logic" remote control and will be off until the RC pin is connected to the -In. To turn on the product the voltage between RC pin and -In should be less than 1V. To turn off the converter the RC pin should be left open, or connected to a voltage higher than 4.5 V referenced to -In. In situations where it is desired to have the product to power up automatically without the need for control signals or a switch, the RC pin can be wired directly to -In. The second option is "positive logic" remote control, which can be ordered by adding the suffix "P" to the end of the part number. When the RC pin is left open, the product starts up automatically when the input voltage is applied. Turn off is achieved by connecting the RC pin to the -In. To ensure safe turn off the voltage difference between RC pin and the -In pin shall be less than 1V. The product will restart automatically when this connection is opened. See Design Note 021 for detailed information. Input and Output Impedance The impedance of both the input source and the load will interact with the impedance of the product. It is important that the input source has low characteristic impedance. The products are designed for stable operation without external 3/1301-BMR 662Technical 00+ Uen Specification Date 2010-04-11 Rev Reference 14 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB capacitors connected to the input or output. The performance in some applications can be enhanced by addition of external capacitance as described under External Decoupling Capacitors. If the input voltage source contains significant inductance, the addition of a 100 F capacitor across the input of the product will ensure stable operation. The capacitor is not required when powering the product from an input source with an inductance below 10 H. The minimum required capacitance value depends on the output power and the input voltage. The higher output power the higher input capacitance is needed. External Decoupling Capacitors When powering loads with significant dynamic current requirements, the voltage regulation at the point of load can be improved by addition decupling capacitors at the load with >10% of the maximum recommended value found in the electrical specification. The most effective technique is to locate low ESR ceramic and electrolytic capacitors as close to the load as possible, using several parallel capacitors to lower the effective ESR. The ceramic capacitors will handle high-frequency dynamic load changes while the electrolytic capacitors are used to handle low frequency dynamic load changes. It is equally important to use low resistance and low inductance PCB layouts and cabling. External decoupling capacitors will become part of the product's control loop. The control loop is optimized for a wide range of external capacitance and the maximum recommended value that could be used without any additional analysis is found in the Electrical specification. The ESR of the capacitors is a very important parameter. Stable operation is guaranteed with a verified ESR value of >10 m across the output connections. For further information please contact your local Ericsson Power Modules representative. Output Voltage Adjust (Vadj) The products have an Output Voltage Adjust pin (Vadj). This pin can be used to adjust the output voltage above or below Output voltage initial setting. When increasing the output voltage, the voltage at the output pins (including any remote sense compensation ) must be kept below the threshold of the over voltage protection, (OVP) to prevent the product from shutting down. At increased output voltages the maximum power rating of the product remains the same, and the max output current must be decreased correspondingly. To increase the voltage the resistor should be connected between the Vadj pin and +Sense pin. The resistor value of the Output voltage adjust function is according to information given under the Output section for the respective product. To decrease the output voltage, the resistor should be connected between the Vadj pin and -Sense pin. Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) EAB/FJB/GMF Oscar Persson Approved 3 (5) No. Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] MICJAKE Input 38-72 V, Output up to 30 A / 125 W 3/1301-BMR 662Technical 00+ Uen Specification Date 2010-04-11 Rev Reference 15 EN/LZT 146 420 R2A May 2010 B (c) Ericsson AB Pre-bias Start-up The products do not support pre-biased start up with zero reverse current. Thermal Consideration General The products are designed to operate in different thermal environments and sufficient cooling must be provided to ensure reliable operation. Parallel Operation Two products may be paralleled for redundancy if the total power is equal or less than PO max. It is not recommended to parallel the products without using external current sharing circuits. See Design Note 006 for detailed information. Remote Sense The products have remote sense that can be used to compensate for voltage drops between the output and the point of load. The sense traces should be located close to the PCB ground layer to reduce noise susceptibility. The remote sense circuitry will compensate for up to 10% voltage drop between output pins and the point of load. If the remote sense is not needed +Sense should be connected to +Out and -Sense should be connected to -Out. Over Temperature Protection (OTP) The products are protected from thermal overload by an internal over temperature shutdown circuit. When TP1 as defined in thermal consideration section exceeds 140C the product will shut down. The product will make continuous attempts to start up (non-latching mode) and resume normal operation automatically when the temperature has dropped >15C below the temperature threshold. Over Voltage Protection (OVP) The products have output over voltage protection that will shut down the product in over voltage conditions. The product will make continuous attempts to start up (non-latching mode) and resume normal operation automatically after removal of the over voltage condition. Over Current Protection (OCP) The products include current limiting circuitry for protection at continuous overload. The output voltage will decrease towards zero for output currents in excess of max output current (max IO). The product will resume normal operation after removal of the overload. The load distribution should be designed for the maximum output short circuit current specified. Cooling is achieved mainly by conduction, from the pins to the host board, and convection, which is dependant on the airflow across the product. Increased airflow enhances the cooling of the product. The Output Current Derating graph found in the Output section for each model provides the available output current vs. ambient air temperature and air velocity at VI = 53 V. The product is tested on a 254 x 254 mm, 35 m (1 oz), 16-layer test board mounted vertically in a wind tunnel with a cross-section of 608 x 203 mm. Ericsson Internal PRODUCT SPECIFICATION E Prepared (also subject responsible if other) EAB/FJB/GMF Oscar Persson Approved Checked PKB 4000A series Direct Converters EAB/FJB/GMF [Natalie Johansson] MICJAKE Input 38-72 V, Output up to 30 A / 125 W Definition of product operating temperature The product operating temperatures is used to monitor the temperature of the product, and proper thermal conditions can be verified by measuring the temperature at positions P1, P2 and P2. The temperature at these positions (TP1, TP2 , TP3) should not exceed the maximum temperatures in the table below. The number of measurement points may vary with different thermal design and topology. Temperatures above maximum TP1, measured at the reference point P1 are not allowed and may cause permanent damage. Position Description Max Temp. P1 Mosfet pin TP1=130 C P2 Opto coupler (case) TP2=110 C P3 Transformer TP3=130 C Open frame 4 (5) No. 3/1301-BMR 662Technical 00+ Uen Specification Date Rev Reference EN/LZT 146 420 R2A May 2010 2010-04-11 B (c) Ericsson AB Connections Pin 1 Designation +In Function Positive input 2 RC Remote control 3 -In Negative input 4 -Out Negative output 5 -Sen Negative remote sense 6 Vadj Output voltage adjust 7 +Sen Positive remote sense 8 +Out Positive output 16 E Prepared (also subject responsible if other) 1 (3) 4/1301 - BMR 662 Uen Technical Specification 17 No. EPETSCH Approved Ericsson Internal PRODUCT SPEC. MECHANICAL Checked PKB 4000A[Natalie seriesJ]Direct Converters EAB/FJB/GM See 1 Input 38-72 V, Output up to 30 A / 125 W Date 2010-01-18 Rev Reference EN/LZT 146 420 R2A May 2010 A (c) Ericsson AB Mechanical Information - SMD, Open Frame Version All component placements - whether shown as physical components or symbolical outline - are for reference only and are subject to change throughout the product's life cycle, unless explicitly described and dimensioned in this drawing. E Prepared (also subject responsible if other) 2 (3) 4/1301 - BMR 662 Uen Technical Specification 18 No. EPETSCH Approved Ericsson Internal PRODUCT SPEC. MECHANICAL Checked PKB 4000A[Natalie seriesJ]Direct Converters EAB/FJB/GM See 1 Input 38-72 V, Output up to 30 A / 125 W Date 2010-01-18 Rev Reference EN/LZT 146 420 R2A May 2010 A (c) Ericsson AB Mechanical Information- Hole Mount, Open Frame Version All component placements - whether shown as physical components or symbolical outline - are for reference only and are subject to change throughout the product's life cycle, unless explicitly described and dimensioned in this drawing. E Prepared (also subject responsible if other) 1 (4) 5/1301-BMR 662Technical Uen Specification 19 No. EPETSCH Approved Ericsson Internal PROD. SPECIFICATION MECHANICAL Checked PKB 4000A[Natalie seriesJ]Direct Converters EAB/FJB/GM See 1 Input 38-72 V, Output up to 30 A / 125 W Date 2010-01-18 Rev Reference EN/LZT 146 420 R2A May 2010 A (c) Ericsson AB Soldering Information - Surface Mounting The surface mount version of the product is intended for convection or vapor phase reflow SnPb and Pb-free processes. To achieve a good and reliable soldering result, make sure to follow the recommendations from the solder paste supplier, to use state-of-the-art reflow equipment and reflow profiling techniques as well as the following guidelines. A no-clean flux is recommended to avoid entrapment of cleaning fluids in cavities inside the product or between the product and the host board. The cleaning residues may affect long time reliability and isolation voltage. Minimum Pin Temperature Recommendations Pin number 4 is chosen as reference location for the minimum pin temperature recommendations since this will likely be the coolest solder joint during the reflow process. Pin 2 for measurement of maximum Peak product reflow temperature, TPIN Peak Product Temperature Requirements Pin number 2 is chosen as reference location for the maximum (peak) allowed product temperature (TP) since this will likely be the warmest part of the product during the reflow process. To avoid damage or performance degradation of the product, the reflow profile should be optimized to avoid excessive heating. A sufficiently extended preheat time is recommended to ensure an even temperature across the host PCB, for both small and large devices. To reduce the risk of excessive heating is also recommended to reduce the time in the reflow zone as much as possible. SnPb solder processes For SnPb solder processes, the product is qualified for MSL 1 according to IPC/JEDEC standard J-STD-020C. During reflow, TP must not exceed +225C at any time. Lead-free (Pb-free) solder processes For Pb-free solder processes, the product is qualified for MSL 3 according to IPC/JEDEC standard J-STD-020C. During reflow, TP must not exceed +260C at any time. Temperature Pin 4 for measurement of minimum Solder joint temperature, TPIN Ramp-up TP Ramp-down (cooling) TL SnPb solder processes For SnPb solder processes, a pin temperature (TPIN) in excess of the solder melting temperature, (TL, +183C for Sn63/Pb37) for more than 30 seconds, and a peak temperature of +210C is recommended to ensure a reliable solder joint. Reflow Preheat 25 C Time 25 C to peak Time Lead-free (Pb-free) solder processes For Pb-free solder processes, a pin temperature (TPIN) in excess of the solder melting temperature (TL, +217 to +221C for Sn/Ag/Cu solder alloys) for more than 30 seconds, and a peak temperature of +235C on all solder joints is recommended to ensure a reliable solder joint. Reflow process specifications Sn/Pb eutectic Pb-free Average ramp-up rate 3C/s max 3C/s max +183C +221C 30 s 30 s +210C +235C Peak product temperature TP +225C +260C Average ramp-down rate 6C/s max 6C/s max Time 25C to peak 6 minutes max 8 minutes max Solder melting temperature (typical) TL Minimum time above TL Minimum pin temperature TPIN E Prepared (also subject responsible if other) 2 (4) 5/1301-BMR 662Technical Uen Specification 20 No. EPETSCH Approved Ericsson Internal PROD. SPECIFICATION MECHANICAL Checked PKB 4000A[Natalie seriesJ]Direct Converters EAB/FJB/GM See 1 Input 38-72 V, Output up to 30 A / 125 W Soldering Information -- Through Hole Mounting The through hole mount version of the product is intended for manual or wave soldering. When wave soldering is used, the temperature on the pins is specified to maximum 270C for maximum 10 seconds. A maximum preheat rate of 4C/s and a temperature of max +150C is suggested. When soldering by hand, care should be taken to avoid direct contact between the hot soldering iron tip and the pins for more than a few seconds in order to prevent overheating. A no-clean flux is recommended to avoid entrapment of cleaning fluids in cavities inside the product or between the product and the host board. The cleaning residues may affect long time reliability and isolation voltage. Date 2010-01-18 Rev Reference EN/LZT 146 420 R2A May 2010 A (c) Ericsson AB Delivery Package Information, Through Hole Mounting Version The products are delivered in antistatic clamshell. Clamshell Specifications Material PET with antistatic coated Surface resistance 106 < Ohm/square < 1012 Bake ability The clamshells are not bake-able. Clamshell capacity 20 products/clamshell Clamshell thickness 20 mm [0.787 inch] Box capacity 100 products (5 full trays/box) Clamshell weight 130 g empty, 530 g full tray Delivery Package Information, Surface Mount Version The surface mount versions of the products are delivered in antistatic injection molded trays (Jedec design guide 4.10D standard. Tray Specifications Material PPE, Antistatic Surface resistance Tray capacity 105 < Ohm/square < 1012 The trays can be baked at maximum 125C for 48 hours 20 products/tray Tray thickness 13.4 mm [0.528 inch] Box capacity 100 products (5 full trays/box) Tray weight 110 g empty, 530 g full tray Bakability Non-Dry Pack Information The through hole mount version of product is delivered in non-dry packing clamshells. Dry Pack Information The surface mount versions of the products are delivered in trays These inner shipment containers are dry packed in standard moisture barrier bags according to IPC/JEDEC standard J-STD-033 (Handling, packing, shipping and use of moisture/reflow sensitivity surface mount devices). Using products in high temperature Pb-free soldering processes requires dry pack storage and handling. In case the products have been stored in an uncontrolled environment and no longer can be considered dry, the modules must be baked according to J-STD-033. E Prepared (also subject responsible if other) Ericsson Internal PROD. SPECIFICATION MECHANICAL 3 (4) 5/1301-BMR 662Technical Uen Specification 21 No. EPETSCH Approved Checked PKB 4000A[Natalie seriesJ]Direct Converters EAB/FJB/GM See 1 Input 38-72 V, Output up to 30 A / 125 W Date 2010-01-18 Rev Reference EN/LZT 146 420 R2A May 2010 A (c) Ericsson AB Product Qualification Specification Characteristics External visual inspection IPC-A-610 Change of temperature (Temperature cycling) IEC 60068-2-14 Na Temperature range Number of cycles Dwell/transfer time -40 to +100C 1000 15 min/0-1 min Cold (in operation) IEC 60068-2-1 Ad Temperature TA Duration -45C 72 h Damp heat IEC 60068-2-67 Cy Temperature Humidity Duration +85C 85 % RH 1000 hours Dry heat IEC 60068-2-2 Bd Temperature Duration +125C 1000 h Electrostatic discharge susceptibility IEC 61340-3-1, JESD 22-A114 IEC 61340-3-2, JESD 22-A115 Human body model (HBM) Machine Model (MM) Class 2, 2000 V Class 3, 200 V Immersion in cleaning solvents IEC 60068-2-45 XA Method 2 Water Glycol ether Isopropyl alcohol +55C +35C +35C Mechanical shock IEC 60068-2-27 Ea Peak acceleration Duration 100 g 6 ms Moisture reflow sensitivity 1 J-STD-020C Level 1 (SnPb-eutectic) Level 3 (Pb Free) 225C 260C Operational life test MIL-STD-202G method 108A Duration 1000 h Resistance to soldering heat 2 IEC 60068-2-20 Tb Method 1A Solder temperature Duration 270C 10-13 s Robustness of terminations IEC 60068-2-21 Test Ua1 IEC 60068-2-21 Test Ue1 Through hole mount products Surface mount products All leads All leads Solderability IEC 60068-2-58 test Td 1 Preconditioning Temperature, SnPb Eutectic Temperature, Pb-free 150C dry bake 16 h 215C 235C IEC 60068-2-20 test Ta 2 Preconditioning Temperature, SnPb Eutectic Temperature, Pb-free Steam ageing 235C 245C IEC 60068-2-64 Fh, method 1 Frequency Spectral density Duration 10 to 500 Hz 0.07 g2/Hz 10 min in each perpendicular direction Vibration, broad band random Note 1: Only for products intended for reflow soldering (surface mount products) Note 2: Only for products intended for wave soldering (plated through hole products)