High SPL Microphone with
Bottom Port and Analog Output
Data Sheet ADMP411
Rev. 0 Document Feedback
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Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
4.72 mm × 3.76 mm × 1.0 mm surface mount package
131 dB SPL acoustic overload point
Sensitivity of −46 dBV
±2 dB sensitivity tolerance
Omnidirectional response
High SNR of 62 dBA
Extended frequency response from 28 Hz to 20 kHz
Low current consumption: <250 μA
Single-ended analog output
High PSR of −80 dBV
Compatible with Sn/Pb and Pb-free solder processes
RoHS/WEEE compliant
APPLICATIONS
Fire and safety radios
Safety masks
Smartphones and feature phones
Tablet computers
Teleconferencing systems
Digital still and video cameras
Studio microphones
Bluetooth headsets
Security and surveillance
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
Figure 2. Isometric Views of Microphone Package
GENERAL DESCRIPTION
The ADMP4111 is a high performance, high SPL, low noise, low
power, analog output bottom ported, omnidirectional MEMS
microphone. The ADMP411 consists of a MEMS microphone
element and an impedance converter amplifier. The ADMP411
sensitivity specification makes it an excellent choice for both
near field and far field applications. The ADMP411 is pin
compatible with the ADMP401 microphone, providing an
easy upgrade path.
The ADMP411 has a linear response up to 131 dB SPL. It offers
high SNR and extended wideband frequency response resulting
in natural sound with high intelligibility. Low current consump-
tion enables long battery life for portable applications.
The ADMP411 is available in a miniature 4.72 mm × 3.76 mm
× 1.0 mm surface-mount package. It is reflow solder compatible
with no sensitivity degradation.
1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending.
OUTPUT
AMPLIFIER
ADMP411
POWER
VDD GND
OUTPUT
10913-001
10913-002
OBSOLETE
ADMP411 Data Sheet
Rev. 0 | Page 2 of 12
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Typical Performance Characteristics ............................................. 6
Applications Information ................................................................ 7
Codec Connections .......................................................................7
Dynamic Range Considerations ..................................................7
Supporting Documents ................................................................7
Handling Instructions .......................................................................8
Pick and Place Equipment............................................................8
Reflow Solder .................................................................................8
Board Wash ....................................................................................8
PCB Land Pattern Layout .................................................................9
Outline Dimensions ....................................................................... 10
Ordering Guide .......................................................................... 10
REVISION HISTORY
4/13—Revision 0: Initial Version
OBSOLETE
Data Sheet ADMP411
Rev. 0 | Page 3 of 12
SPECIFICATIONS
TA = 25°C, VDD = 1.8 V, unless otherwise noted. All minimum and maximum specifications are guaranteed. Typical specifications are not
guaranteed.
Table 1.
Parameter Test Conditions/Comments Min Typ Max Unit
PERFORMANCE
Directionality Omni
Sensitivity 1 kHz, 94 dB SPL −48 −46 −44 dBV
Signal-to-Noise Ratio (SNR) 20 Hz to 20 kHz, A-weighted 62 dBA
Equivalent Input Noise (EIN) 20 Hz to 20 kHz, A-weighted 32 dBA SPL
Dynamic Range
Derived from EIN and maximum acoustic input
99
dB
Frequency Response1 Low frequency −3 dB point 28 Hz
High frequency −3 dB point >20 kHz
Total Harmonic Distortion (THD) 105 dB SPL 0.2 1 %
Power Supply Rejection (PSR) 217 Hz, 100 mV p-p square wave superimposed on VDD = 1.8 V −80 dBV
Power Supply Rejection Ratio (PSRR) 1 kHz, 100 mV p-p sine wave superimposed on VDD = 1.8 V −46 dB
Acoustic Overload Point 10% THD 131 dB SPL
POWER SUPPLY
Supply Voltage (VDD) 1.5 3.63 V
Supply Current (I
S
)
V
DD
= 1.8 V
180
220
µA
VDD = 3.3 V 210 250 µA
OUTPUT CHARACTERISTICS
Output Impedance (ZOUT) 200 Ω
Output DC Offset 0.8 V
Maximum Output Voltage 131 dB SPL input 0.355 V rms
Noise Floor 20 Hz to 20 kHz, A-weighted, rms −108 dBV
1 See Figure 5 and Figure 6.
OBSOLETE
ADMP411 Data Sheet
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage −0.3 V to +3.63 V
Sound Pressure Level (SPL)
160 dB
Mechanical Shock 10,000 g
Vibration Per MIL-STD-883 Method 2007,
Test Condition B
Storage Temperature Range −40°C to +150°C
Operating Temperature Range −40°C to +85°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Figure 3. Recommended Soldering Profile Limits
Table 3. Recommended Soldering Profile Limits
Profile Feature Sn63/Pb37 Pb-Free
Average Ramp Rate (TL to TP) 1.25°C/sec maximum 1.25°C/sec maximum
Preheat
Minimum Temperature (TSMIN) 100°C 150°C
Maximum Temperature (TSMAX) 150°C 200°C
Time (TSMIN to TSMAX), tS 60 sec to 75 sec 60 sec to 75 sec
Ramp-Up Rate (TSMAX to TL) 1.25°C/sec 1.25°C/sec
Time Maintained Above Liquidous (tL) 45 sec to 75 sec ~50 sec
Liquidous Temperature (TL) 183°C 217°C
Peak Temperature (TP) 215°C + 3°C/−3°C 260°C + 0°C/−5°C
Time Within 5°C of Actual Peak Temperature (tP) 20 sec to 30 sec 20 sec to 30 sec
Ramp-Down Rate 3°C/sec maximum 3°C/sec maximum
Time 25°C to Peak Temperature 5 minute maximum 5 minute maximum
t
P
t
L
t25°C TO P E AK
t
S
PREHEAT
CRITICAL ZONE
TL TO TP
TEMPERATURE
TIME
RAMP-DOWN
RAMP-UP
TSMIN
TSMAX
TP
TL
10913-003
OBSOLETE
Data Sheet ADMP411
Rev. 0 | Page 5 of 12
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 OUTPUT Analog Output Signal
2 GND Ground
3 GND Ground
4 GND Ground
5 VDD Power Supply
6 GND Ground
BOTTOM VIEW
(No t t o Scal e)
GND
OUTPUT
GND
V
DD
GND
GND
3
12
4
5
6
10913-004
OBSOLETE
ADMP411 Data Sheet
Rev. 0 | Page 6 of 12
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 5. Frequency Response Mask
Figure 6. Typical Frequency Response (Measured)
Figure 7. Typical Power Supply Rejection Ratio vs. Frequency
Figure 8. THD + N vs. Input Level
Figure 9. Linearity
Figure 10. Clipping Characteristics
20
15
10
5
0
–10
–5
10 100 1k 10k 20k
NORM ALIZED AM P LITUDE ( dB)
FRE QUENCY ( Hz )
10913-005
15
–15
–10
–5
0
5
10
10 10k
FRE QUENCY ( Hz )
NORMALIZED FREQUENCY RESPONSE (dBV)
1k100
10913-007
–40
–50
–49
–48
–47
–46
–45
–44
–43
–42
–41
100 10k
FRE QUENCY ( Hz )
PSRR ( dB)
1k
10913-006
0.1
1
10
90 140130120110100
AMPLITUDE (dB SPL)
THD + N ( %)
10913-008
–60
–50
–40
–30
–20
–10
0
90 140130120110100
INPUT AMPLITUDE (dB SPL)
OUTPUT AMPLITUDE (dBV)
10913-009
1.2
0
0.2
0.4
0.6
0.8
1.0
01.00.80.60.40.2
TIME (ms)
OUTPUT (V)
10913-014
128dB S P L
130dB S P L
132dB S P L
134dB S P L
136dB S P L
138dB S P L
140dB S P L
OBSOLETE
Data Sheet ADMP411
Rev. 0 | Page 7 of 12
APPLICATIONS INFORMATION
CODEC CONNECTIONS
The ADMP411 output can be connected to a dedicated codec
microphone input (see Figure 11) or to a high input impedance
gain stage (see Figure 12). A 0.1 µF ceramic capacitor placed
close to the ADMP411 supply pin is used for testing and is
recommended to adequately decouple the microphone from
noise on the power supply. A dc blocking capacitor is required at
the output of the microphone. This capacitor creates a high-pass
filter with a corner frequency at
fC = 1/(2π × C × R)
where R is the input impedance of the codec.
A minimum value of 4.7 μF is recommended in Figure 11
because the ADAU1761/ADAU1361 input impedance can be
as low as 2 kΩ at its highest PGA gain setting, which results
in a high-pass filter corner frequency at 17 Hz.
Figure 12 shows the ADMP411 connected to an ADA4075-2
op amp configured as a noninverting preamplifier. The
AN-1165 Application Note describes using op amps for
microphone preamp circuits and includes a list of
recommended Analog Devices, Inc., op amps.
Figure 11. ADMP411 Connected to the Analog Devices ADAU1761 or
ADAU1361 Codec
Figure 12. ADMP411 Connected to the ADA4075-2 Op Amp
DYNAMIC RANGE CONSIDERATIONS
To fully utilize the 99 dB dynamic range of the ADMP411 in
a design, the preamp, ADC, or codec circuit following it must
be chosen carefully. For example, the ADAU1761 has a 98 dB
dynamic range with VDD = 3.3 V. To match the dynamic ranges
between the microphone and the ADC input of the codec, some
gain must be added to the ADMP411 output. For example, at
the 131 dB SPL maximum acoustic input, the ADMP411 outputs a
−13 dBV rms signal. The full-scale input voltage of the ADAU1761
ADC is 0 dBV; therefore, 13 dB of gain must be added to the
signal to match the dynamic range of the microphone with the
dynamic range of the codec.
SUPPORTING DOCUMENTS
Evaluation Board User Guide
UG-445, EVAL-ADMP411Z-FLEX: Bottom-Ported Analog
Output MEMS Microphone Evaluation Board
Application Notes
AN-1003, Recommendations for Mounting and Connecting
Analog Devices, Inc., Bottom-Ported MEMS Microphones
AN-1068, Reflow Soldering of the MEMS Microphone
AN-1112, Microphone Specifications Explained
AN-1124, Recommendations for Sealing Analog Devices, Inc.,
Bottom-Port MEMS Microphones from Dust and Liquid
Ingress
AN-1140, Microphone Array Beamforming
AN-1165, Op Amps for MEMS Microphone Preamp Circuits
AN-1181, Using a MEMS Microphone in a 2-Wire Microphone
Circuit
ADAU1761
OR
ADAU1361
ADMP411
V
DD
GND
OUTPUT LINN
LINP
MICBIAS
CM
4.7µF
MINIMUM
0.1µF
10913-010
GAIN = (R1 + R2) /R1
ADMP411
GND
OUTPUT
1µF
MINIMUM
0.1µF
10kΩ
R1 R2
V
DD
V
REF
V
OUT
V
REF
ADA4075-2
1.8V TO 3.3V
10913-011
OBSOLETE
ADMP411 Data Sheet
Rev. 0 | Page 8 of 12
HANDLING INSTRUCTIONS
PICK AND PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick
and place and chip shooting equipment. Take care to avoid
damage to the MEMS microphone structure as follows:
• Use a standard pickup tool to handle the microphone.
Because the microphone hole is on the bottom of the
package, the pickup tool can make contact with any part
of the lid surface.
• Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
• Do not pull air out or blow air into the microphone port.
• Do not use excessive force to place the microphone
on the PCB.
REFLOW SOLDER
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 3 and Table 3. For more detailed
recommendations, see the AN-1068 Application Note, Reflow
Soldering of the MEMS Microphone.
BOARD WASH
When washing the PCB, ensure that water does not make
contact with the microphone port. Blowoff procedures and
ultrasonic cleaning must not be used.
OBSOLETE
Data Sheet ADMP411
Rev. 0 | Page 9 of 12
PCB LAND PATTERN LAYOUT
The recommended PCB land pattern for the ADMP411 is laid
out to a 1:1 ratio to the solder pads on the microphone package,
as shown in Figure 13. Take care to avoid applying solder paste
to the sound hole in the PCB. A suggested solder paste stencil
pattern layout is shown in Figure 14. The diameter of the sound
hole in the PCB should be larger than the diameter of the sound
port of the microphone. A minimum diameter of 0.5 mm is
recommended.
Figure 13. PCB Land Pattern Layout (Dimensions Shown in Millimeters)
Figure 14. Suggested Solder Paste Stencil Pattern Layout
2.62
ø1.10
ø1.68
ø0.70 (2×)
ø0.90 (3×)
2.40
1.20
2.54
0.79
1.27
10913-012
1.27mm
1.2mm
2.54mm
2.62mm
3.41mm
2.4mm
0.85mm DIA. ( 3× ) 1.8mm/1.3mm DIA. 0.2032 CUT WIDTH (4× ) 0.649mm DI A. (2×)
10913-013
OBSOLETE
ADMP411 Data Sheet
Rev. 0 | Page 10 of 12
OUTLINE DIMENSIONS
Figure 15. 6-Terminal Chip Array Small Outline No Lead Cavity [LGA_CAV]
4.72 mm × 3.76 mm Body
(CE-6-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option Ordering Quantity
ADMP411ACEZ-RL −40°C to +85°C 6-Terminal LGA_CAV, 13” Tape and Reel CE-6-1 4,500
ADMP411ACEZ-RL7 −40°C to +85°C 6-Terminal LGA_CAV, 7” Tape and Reel CE-6-1 1,000
EVAL-ADMP411Z-FLEX Flex Evaluation Board
1 Z = RoHS Compliant Part.
3.86
3.76
3.66
4.82
4.72
4.62
BOTTOM VIEW
TOP VI EW
SIDE VIEW
0.90 DIA.
(PINS 1, 5, 6)
1
3
2
4
5
6
2.62 BS C
3.30 RE F
1.10 DIA.
1.68 DIA.
0.25 DIA.
(T HRU HOLE )
0.79 BS C
2.54
BSC
1.27 BS C
1.10
1.00
0.90
0.24 RE F
0.73 RE F
1.20 BS C
2.40 BS C
0.68 RE F 0.61 RE F
0.70 DIA.
(PINS 2, 4)
12-12-2011-C
3.14
REF
4.10 RE F
REFERENCE
CORNER
PI N 1
OBSOLETE
Data Sheet ADMP411
Rev. 0 | Page 11 of 12
NOTES
OBSOLETE
ADMP411 Data Sheet
Rev. 0 | Page 12 of 12
NOTES
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10913-0-4/13(0)
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10913-0-4/13(0)
OBSOLETE
