October 2010 Doc ID 3082 Rev 9 1/10
10
SM6T
Transil™
Features
■Peak pulse power:
– 600 W (10/1000 µs)
– 4 kW (8/20 µs)
■Breakdown voltage range: from 6.8 V to 220 V
■Unidirectional and bidirectional types
■Low leakage current:
– 0.2 µA at 25 °C
– 1 µA at 85 °C
■Operating Tj max: 150 °C
■High power capability at Tjmax:
– 515 W (10/1000 µs)
■JEDEC registered package outline
Complies with the following standards
■IEC 61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■IEC 61000-4-5
■MIL STD 883G, method 3015-7: class 3B:
– 25 kV HBM (human body model)
■UL 497B, file number: QVGQ2.E136224
■Resin meets UL 94, V0
■MIL-STD-750, method 2026 soldererability
■EIA STD RS-481 and IEC 60286-3 packing
■IPC 7531 footprint
Description
The SM6T Transil series has been designed to
protect sensitive equipment against electrostatic
discharges according to IEC 61000-4-2 and MIL
STD 883, method 3015, and electrical overstress
according to IEC 61000-4-4 and 5. These devices
are more generally used against surges below
600 W (10/1000 µs).
Planar technology makes these devices suitable
for high-end equipment and SMPS where low
leakage current and high junction temperature are
required to provide reliability and stability over
time.
SM6T are packaged in SMB (SMB footprint in
accordance with IPC 7531 standard).
TM: Transil is a trademark of STMicroelectronics
K
A
Unidirectional Bidirectional
SMB
(JEDEC DO-214AA)
www.st.com
Characteristics SM6T
2/10 Doc ID 3082 Rev 9
1 Characteristics
Figure 1. Electrical characteristics - definitions
Figure 2. Pulse definition for electrical characteristics
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
PPP Peak pulse power dissipation(1) Tj initial = Tamb 600 W
Tstg Storage temperature range -65 to 150
°CTjOperating junction temperature range -55 to 150
TLMaximum lead temperature for soldering during 10 s. 260
1. For a surge greater than the maximum values, the diode will fail in short-circuit.
Table 2. Thermal resistance
Symbol Parameter Value Unit
Rth(j-l) Junction to leads 20 °C/W
Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 100 °C/W
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
RM
I
R
I
PP
V
RM
V
BR
V
CL
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
RM
I
R
I
PP
V
RM
V
BR
V
CL
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
V
CL
V
BR
V
RM
I
RM
I
R
I
PP
V
I
I
F
V
F
Unidirectional
Bidirectional
Symbol Parameter
V Stand-off voltage
V Breakdown voltage
V Clamping voltage
I Leakage current @ V
I Peak pulse current
T Voltage temperature coefficient
V Forward voltage drop
R Dynamic resistance
RM
BR
CL
RM RM
PP
F
D
α
Repetitive pulse current
tr= rise time (µs)
tp= pulse duration time (µs)
trtp
SM6T Characteristics
Doc ID 3082 Rev 9 3/10
Table 3. Electrical characteristics, parameter values (Tamb = 25 °C)
Order code
IRM max@VRM VBR @IR (1) VCL @IPP
10/1000 µs
RD
10/1000 µs
VCL @IPP
8/20 µs
RD
8/20 µs αT (2)
25 °C 85 °C min typ max max max max
µA V V mA V(3) A(4) ΩV(3) A(4) Ω10-4/ °C
SM6T6V8A/CA 20 50 5.8 6.45 6.8 7.14 10 10.5 57 0.059 13.4 298 0.021 5.7
SM6T7V5A/CA 20 50 6.4 7.13 7.5 7.88 10 11.3 53 0.065 14.5 276 0.024 6.1
SM6T10A/CA 20 50 8.55 9.5 10 10.5 1 14.5 41 0.098 18.6 215 0.038 7.3
SM6T12A/CA 0.2 1 10.2 11.4 12 12.6 1 16.7 36 0.114 21.7 184 0.049 7.8
SM6T15A/CA 0.2 1 12.8 14.3 15 15.8 1 21.2 28 0.193 27.2 147 0.078 8.4
SM6T18A/CA 0.2 1 15.3 17.1 18 18.9 1 25.2 24 0.263 32.5 123 0.111 8.8
SM6T22A/CA 0.2 1 18.8 20.9 22 23.1 1 30.6 20 0.375 39.3 102 0.159 9.2
SM6T24A/CA 0.2 1 20.5 22.8 24 25.2 1 33.2 18 0.444 42.8 93 0.189 9.4
SM6T27A/CA 0.2 1 23.1 25.7 27 28.4 1 37.5 16 0.569 48.3 83 0.240 9.6
SM6T30A/CA 0.2 1 25.6 28.5 30 31.5 1 41.5 14.5 0.690 53.5 75 0.293 9.7
SM6T33A/CA 0.2 1 28.2 31.4 33 34.7 1 45.7 13.1 0.840 59.0 68 0.357 9.8
SM6T36A/CA 0.2 1 30.8 34.2 36 37.8 1 49.9 12 1.01 64.3 62 0.427 9.9
SM6T39A/CA 0.2 1 33.3 37.1 39 41.0 1 53.9 11.1 1.16 69.7 57 0.504 10.0
SM6T56A/CA 0.2 1 47.6 53.2 56 58.8 1 76.6 7.8 2.28 100 40 1.030 10.0
SM6T68A/CA 0.2 1 58.1 64.6 68 71.4 1 92 6.5 3.17 121 33 1.503 10.4
SM6T75A/CA 0.2 1 64.1 71.3 75 78.8 1 103 5.8 4.17 134 30 1.84 10.5
SM6T100A/CA 0.2 1 85.5 95.0 100 105 1 137 4.4 7.27 178 22.5 3.24 10.6
SM6T150A/CA 0.2 1 128 143 150 158 1 207 2.9 16.9 265 15 7.13 10.8
SM6T200A/CA 0.2 1 171 190 200 210 1 274 2.2 29.1 353 11.3 12.7 10.8
SM6T220A/CA 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8
1. Pulse test : tp < 50 ms
2. To calculate VBR versus junction temperature, use the following formula: VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25)).
3. To calculate maximum clamping voltage at other surge level, use the following formula: VCL = RD x IPP + VBRmax.
4. Surge capability given for both directions for unidirectional and bidirectional types.
Characteristics SM6T
4/10 Doc ID 3082 Rev 9
Figure 5. Clamping voltage versus peak pulse current (maximum values)
Figure 3. Peak power dissipation versus
initial junction temperature
Figure 4. Peak pulse power versus
exponential pulse duration
0
100
200
300
400
500
600
700
0 25 50 75 100 125 150 175
P
pp
(W)
Tj(°C)
0.1
1.0
10.0
100.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
P
PP
(kW)
T
j
initial = 25 °C
t
P
(ms)
0.1
1.0
10.0
100.0
1000.0
1 10 100 1000
IPP(A)
10/1000 µs
Tjinitial=25 °C
8/20 µs
10 ms
SM6T6V8A
SM6T220A
SM6T15A
SM6T30A
SM6T68A
SM6T100A
VCL
(V)
SM6T Characteristics
Doc ID 3082 Rev 9 5/10
Figure 6. Capacitance versus reverse
applied voltage for unidirectional
types (typical values)
Figure 7. Capacitance versus reverse applied
voltage for bidirectional types
(typical values)
C (pF)
10
100
1000
10000
1 10 100 1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8A
SM6T15A
SM6T30A
SM6T68A
SM6T100A
SM6T220A
V(V)
R
C (pF)
10
100
1000
10000
1 10 100 1000
F=1 MHz
Vosc=30 mVRMS
Tj=25 °C
SM6T6V8CA
SM6T15CA
SM6T30CA
SM6T68CA
SM6T100CA
SM6T220CA
V(V)
R
Figure 8. Peak forward voltage drop versus
peak forward current
(typical values)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
I
FM
(A)
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
Zth (j-a)/Rth (j-a)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
s
tp
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 11. Leakage current versus junction
temperature (typical values)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
(printed circuit board FR4,
copper thickness = 35 µm)
SCu(cm²)
I
R
(nA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150
VR=VRM
VRM ≥10 V
VR=VRM
VRM < 10 V
T (° C)
j
Ordering information scheme SM6T
6/10 Doc ID 3082 Rev 9
2 Ordering information scheme
Figure 12. Ordering information scheme
SM 6 T 100 CA
Surface mount
Peak pulse power
Breakdown voltage
Types
6 = 600 W Transil in SMB
100 = 100 V
CA = Bidirectional
A = Unidirectional
SM6T Packaging information
Doc ID 3082 Rev 9 7/10
3 Packaging information
●Case: JEDEC DO-214AA molded plastic over planar junction
●Terminals: solder plated, solderable as per MIL-STD-750, Method 2026
●Polarity: for unidirectional types the band indicates cathode
●Flammability: epoxy meets UL 94, V0
●RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 4. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
L 0.75 1.50 0.030 0.059
Figure 13. SMB footprint dimensions in
mm (inches)
Figure 14. Marking layout(1)
1. Marking layout can vary according to assembly location.
E
CL
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.23)
(0.064)
(0.086)
y w w
e
z
x x x
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: Week
Cathode bar (unidirectional devices only )
Packaging information SM6T
8/10 Doc ID 3082 Rev 9
Table 5. Marking
Order code Marking Order code Marking
SM6T6V8A DE SM6T6V8CA LE
SM6T7V5A DG SM6T7V5CA LG
SM6T10A DP SM6T10CA LP
SM6T12A DT SM6T12CA LT
SM6T15A DX SM6T15CA LX
SM6T18A EE SM6T18CA ME
SM6T22A EK SM6T22CA MK
SM6T24A EM SM6T24CA MM
SM6T27A EP SM6T27CA MP
SM6T30A ER SM6T30CA MR
SM6T33A ET SM6T33CA MT
SM6T36A EV SM6T36CA MV
SM6T39A EX SM6T39CA MX
SM6T56A FL SM6T56CA NL
SM6T68A FQ SM6T68CA NQ
SM6T75A FS SM6T75CA NS
SM6T100A FY SM6T100CA NY
SM6T150A GL SM6T150CA OL
SM6T200A GU SM6T200CA OU
SM6T220A GW SM6T220CA OW
SM6T Ordering information
Doc ID 3082 Rev 9 9/10
4 Ordering information
5 Revision history
Table 6. Ordering information
Order code Marking Package Weight Base qty Delivery mode
SM6TxxxA/CA(1)
1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See
Table 3 for list of available devices and their order codes
See Table 5 on page 8 SMB 0.11 g 2500 Tape and reel
Table 7. Document revision history
Date Revision Changes
August-2001 4A Previous update.
15-Sep-2004 5 1. Types table parameters on page 2: IRM @ Tj = 85 °C condition added
2. IRM max values changed
26-Mar-2008 6
Reformatted to current standard. SMB dimensions and footprint updated.
Maximum junction temperature replaced with operating junction
temperature range in Ta bl e 1 .
25-May-2009 7
Reformatted to current standard. Added standards compliance
information on page 1. Added device SM6T56 to Ta bl e 3 . Updated all
characteristic curves.
17-Sep-2009 8 Document updated for low leakage current.
20-Oct-2010 9 Updated Figure 13.
SM6T
10/10 Doc ID 3082 Rev 9
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