PT481FE0000F - Sharp Microelectronics of the Americas

1Sheet No.: D1-A01401EN

Date: November 30, 2007

©SHARP Corporation

PT481FE0000F

PT481FE0000F Opaque Resin, Narrow Directivity Angle,

Darlington Phototransistor

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

■Features

1. Side view detection package with long terminal

2. Plastic mold with opaque resin lens

3. Peak sensitivity wavelength: 860 nm (TYP.)

4. High sensitivity (IC: 10.0 mA TYP.)

5. Narrow acceptance angle (Δθ ±13° TYP.)

6. Lead free and RoHS directive compliant

■Agency Approvals/Compliance

1. Compliant with RoHS directive (2002/95/EC)

2. Content information about the six substances

specified in “Management Methods for Control of

Pollution Caused by Electronic Information Prod-

ucts Regulation” (popular name: China RoHS)

(Chinese: );

refer to page 7.

■Applications

1. Optoelectronic switches

2. Automatic stroboscopes

3. Mechanical Systems

4. Office automation equipment

5. Audio visual equipment

Sheet No.: D1-A01401EN

PT481FE0000F

■External Dimensions

R0.8

±0.1

2-C0.5

2.15

2.95

(6°)

1.6

(6°)

(6°) (6°)

(6°)(6°)

2.8

(2.54)

3.0

0.15

0.2 MAX.

Resin burr

0.5 MAX.

Gate burr

1.0 MAX.

resin burr

0.5 MIN.

17.5

1.4

(1.7)

Black

Marking

1.5

4.0

+1.5

-1.0

2 - 0.4

+0.3

-0.1

0.5

0.75

1.15

(60°)

2 - 0.45

+0.3

-0.1

2 - 0.8

(4°)

0.15 MAX.

φ1.5 E. PIN

R0.5

Emitter

Collector

No. Name

Pin Arrangement

Terminal connection

NOTES:

1. Units: mm

2. Unspecified tolerence: ±0.2 mm

3. ( ): Reference dimensions

4. Package: Visible light cut-off epoxy resin (black)

5. Mold burrs (0.05 mm MAX.) are not included in outline dimensions

6. Resin protrusion: 1.0 mm MAX.

7. Lead step is 1.4 mm MAX. from the part’s resin

Sheet No.: D1-A01401EN

PT481FE0000F

■Absolute Maximum Ratings

*1 5 s (MAX.) no closer than 1.4 mm from resin edge.

■Electro-optical Charactertistics

*1 Ee: Irradiance by CIE standard light source A (tungsten lamp)

Parameter Symbol Rating Unit

Collector-emitter voltage VCEO 35 V

Emitter-collector voltage VECO 6V

Collector current IC50 mA

Collector power dissipation PC75 mW

Operating temperature Topr -25 to +85 °C

Storage temperature Tstg -40 to +85 °C

Soldering temperature *1 Tsol 260 °C

Parameter Symbol Conditions *1 MIN. TYP. MAX. Unit

Collector current ICEe = 0.1 mW/cm2, VCE = 2 V0.9 – 27 mA

Dark current ICEO Ee = 0, VCE = 10 V– 1.0 1000 nA

Collector-emitter saturation voltage VCE(sat) Ee = 1 mW/cm2, IC = 1.5 mA – 0.7 1.0 V

Collector-emitter breakdown voltage BVCEO IC = 0.1 mA, Ee = 0 35 – – V

Emitter-collector breakdown voltage BVECO IE = 0.01 mA, Ee = 0 6 – – V

Peak sensitivity wavelength λp – – 860 – nm

Response time (Rise) tr VCE = 2 V, IC = 10 mA,

RL = 100 Ω

–80 –µs

Response time (Fall) tf – 70 – µs

Fig. 1 Collector Power Dissipation vs.

Ambient Temperature

0-25 0 25

Ambient temperature Ta (°C)

Collector power dissipation PC (mW)

50 75 85100

Fig. 2 Spectral Sensitivity (TYP.)

100

Wavelength λ(nm)

400 500 600 700 800 900 1000 1100

Relative sensitivity (%)

Ta = 25°C

(Ta = 25°C)

Sheet No.: D1-A01401EN

PT481FE0000F

Fig. 3 Collector Dark Current vs.

Ambient Temperature

Fig. 4 Collector Current vs. Irradiance

Collector dark current ICEO (A)

VCE = 10 V

10-6

10-8

10-7

10-9

10-10

10-11

10-12

10-13

025-25

Ambient temperature Ta (°C)

50 75 100

2510

-1

Irradiance Ee (mW/cm2)

Collector current IC (mA)

VCE = 2 V

Ta = 25°C

Fig. 5 Relative Collector Current vs.

Ambient Temperature

Fig. 6 Collector Current vs.

Collector-Emitter Voltage

175

150

125

100

-25 0 25

Ambient temperature Ta (°C)

Relative collector current (%)

50 75 100

VCE = 2 V

Ee = 0.1 mW/cm2

0.08 mW/cm2

0.06 mW/cm

0.04 mW/cm2

0.02 mW/cm2

Collector-emitter voltage VCE (V)

Collector current IC (mA)

46810 12 14 16

Ta = 25°C

PC (MAX.)

0.15 mW/cm2

0.1 mW/cm

Ee = 0.2 mW/cm2

Sheet No.: D1-A01401EN

PT481FE0000F

Fig. 7 Response Time vs.

Load Resistance

Fig. 8 Test Circuit for Response Time

Fig. 9 Collector-to-Emitter Saturation

Voltage vs. Irradience

Response time (

VCE = 2 V

IC = 10 mA

Ta = 25°C

100

Load resistance RL (

)

1000

100

5000

1000

Output

Input

tdts

90%

10%

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.01 0.10.005 0.5 10.02

Irradiance Ee (mW/cm

)

0.05 0.2

Collector-emitter

saturation voltage V

(sat) (V)

= 0.5 mA

1 mA

2 mA

5 mA

10 mA

20 mA

(Ta = 25°C)

Fig. 10 Relative Output vs Distance

Fig. 11 Sensitivity vs. Axis (TYP.)

Relative output (%)

110

Emitter: GL480E00000F

100

Distance between emitter and detector (mm)

Angular displacement θ

Relative sensitivity (%)

-30°

-20°-10°+10°+20°0°

-40°

-50°

-60°

-70°

-80°

-90°

+30°

(Ta = 25°C)

+40°

+50°

+60°

+70°

+80°

+90°

100

Graph data is for reference only and is not guaranteed data.

Sheet No.: D1-A01401EN

PT481FE0000F

■Design Notes

1. This product is not designed to resist electromagnetic and ionized-particle radiation.

■Manufacturing Guidelines

●Soldering Instructions

1. Sharp does not recommend soldering this part using preheat or solder reflow methods. Leads on this part are

pre-coated with lead-free solder.

2. If hand soldering, use temperatures ≤260° for ≤5 seconds.

3. When mounting this device, care should be taken to prevent any boundary exfoliation (pad lifting) between the

solder, the pad, and the circuit board.

4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

●Cleaning Instructions

1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

Fig. 12 Soldering Area

1.4 mm

Solderable

Sheet No.: D1-A01401EN

PT481FE0000F

■Presence of ODCs (RoHS Compliance)

This product shall not contain the following materials, and they are not used in the production process for this product:

• Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific

brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).

• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl

ethers (PBDE).

• Content information about the six substances specified in “Management Methods for Control of Pollution

Caused by Electronic Information Products Regulation” (Chinese: )

NOTE: ✓ indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement

as described in SJ/T 11363-2006 standard.

Category

Toxic and Hazdardous Substances

Lead (Pb) mercury (Hg) Cadmium (Cd) Hexavalent

chromiun (Cr6+)

Polybrominated

biphenyls (PBB)

Polybrominated

diphenyl ethers

(PBDE)

Photo Transistor ✓✓✓✓✓✓

Sheet No.: D1-A01401EN

PT481FE0000F

■Packing Specifications

1. Parts are packed in a plastic zipper bag, with a quantity of 1000 pieces per bag.

2. Bags are secured in a box as shown in Figure 13.

3. Product mass: 0.09 g (approximately)

Fig. 13 Packing Composition

Inner packing

Plastic zipper bag with products (2 bags)

Cellophane tape

Packing case

Model No., Quantity, and Lot No.

Cushioning material (2 sheets)

Plastic zipper bag

Product (1000 pcs)

NOTES:

1. Inner packing material : Plastic zipper Bag (Polyethylene)

2. Quantity: 1000 pcs/bag

NOTES:

1. Outer material : Packing case (Corrugated cardboard),

Cushioning material (Urethane), Cellophane tape

2. Quantity: 2000 pcs/box

3. Regular packaged mass: Approximately 270 g

4. Indication: Model No., Quantity, and Lot No.

Outer packing

Cushioning material (2 sheets)

■Important Notices

· The circuit application examples in this publication are

provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems

related to any intellectual property right of a third party

resulting from the use of SHARP’s devices.

· Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the

specifications, characteristics, data materials, struc-

ture, and other contents described herein at any time

without notice in order to improve design or reliability.

Manufacturing locations are also subject to change

without notice.

· Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used specified in the relevant specification

sheet nor meet the following conditions:

(i) The devices in this publication are designed for use

in general electronic equipment designs such as:

--- Personal computers

--- Office automation equipment

--- Telecommunication equipment (terminal)

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

(ii) Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

with equipment that requires higher reliabilty such as:

--- Transportation control and safety equipment

(i.e., aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-

tion with equipment that requires an extremely high

level of reliability and safety such as:

--- Space applications

--- Telecommunication equipment (trunk lines)

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.

scuba)

· If the SHARP devices listed in this publication fall

within the scope of strategic products described in the

Foreign Exchange and Foreign Trade Law of Japan, it

is necessary to obtain approval to export such SHARP

devices.

· This publication is the proprietary product of SHARP

duced or transmitted in any form or by any means,

electronic or mechanical, for any purpose, in whole or

in part, without the express written permission of

SHARP. Express written permission is also required

before any use of this publication may be made by a

third party.

· Contact and consult with a SHARP representative if

there are any questions about the contents of this pub-

lication.

Sheet No.: D1-A01401EN

PT481FE0000F