Umbrella Specification Rev 5.02, based on ZVEI Layo ut, EPCO S AG, Dr. G. Schulz, Dept. TQ, 08/2014 EPCOS AG 201 4•page: 1/2
Transformer Material Data Sheet
Product Class:
SMD Transformer
B78476*****A003
Date
11.04.2018
IMDS ID i f availabl e
Version:
17
Product Part
(IMDS: semi
component)
(IMDS: Material)
Material
(Classification)
VDA 231
Substance
TMPS**)
[wt%]
CAS
if applicable
typical mass of
material
[wt-%]
Traces
see 1)
Active Part
4B
Mang anes e Zi nc Fer r it e
100
12645-49-7
27.9
2C
Parylene
100
25722-33-2
0.9
1C
Cu
100
7440-50-8
14.4
2B
Polyurethane (PUR)
100
68400-67-9
0.8
Encapsulation
and
Mounting
Thermoplastic 2A Diallyle phthalate (DAP) 30 25053-15-0 33.8
Aluminium hydroxide
40
21645-51-2
Glass Fiber
30
65997-17-3
2B
Polydimethylsiloxane (MQ)
100
63148-62-9 15.2
1C
Sn
100
7440-31-5
0.2
Termination
Heavy Metal
1C
Cu
94
7440-50-8
6.7
1C Sn 6 7440-31-5
1C
Sn
100
7440-31-5
0.1
Sum in total:
100.0
Weight
[approx. in g]
1.80
1.50
1.80
0.80
3.70
1.25
2.74
3.37
1.80
0.86
3.20
0.86
0.86
1.71
0.86
Part Numbers
B78476A1889A003
B78476A7694A003
B78476A7903A003
B78476A8065A003
B78476A8066A003
B78476A8067A003
B78476A8068A003
B78476A8101A003
B78476A8135A003
B78476A8245A003
B78476A8246A003
B78476A8247A003
B78476A8248A003
B78476A8249A003
B78476A9730A003
Weight
[approx. in g]
2.94
2.10
2.90
1.80
2.23
2.00
0.80
1.91
3.40
2.00
1.71
0.26
2.13
0.25
Part Numbers
B78476A8250A003
B78476A8251A003
B78476A8252A003
B78476A8253A003
B78476A8317A003
B78476A8382A003
B78476A8443A003
B78476A8575A003
B78476A8584A003
B78476A8643A003
B78476A8856A003
B78476A9489A003
B78476A9558A003
B78476A9588A003
Weight
[approx. in g]
1.37
2.10
0.88
2.80
2.31
2.43
2.25
2.15
2.83
0.80
2.70
0.55
1.80
0.80
0.16
Part Numbers
B78476A9594A003
B78476A9608A003
B78476A9612A003
B78476A9629A003
B78476A9642A003
B78476A9644A003
B78476A9645A003
B78476A9659A003
B78476A9683A003
B78476A9684A003
B78476A9700A003
B78476A9712A003
B78476B8135A003
B78476A8572A003
B78476A9718A003
Not part of a Product Class
Contact
Dr. Johann Reindl, EPQM
Important r emarks:
1) The declaration limit is 0.1% as defined by IEC 62474 (IEC PAS 61906) Traces are
product parts, substances etc. that are below a percentage of 0.1 % by weight, if not
otherwise regulated
2) This Material Data Sheet contains typical values of the respective products set forth
herein. We expressly point out that all values and statements contained herein are
based on our best present knowledge and cannot be regarded as binding statements or
binding product specifications, unless otherwise explicitly agreed in writing. EPCOS AG
AND ITS AFFILIATES HEREBY EXPRESSLY DISCLAIM ANY REPRESENTATION
OR WARRANTY, WHETHER EXPRESS, IMPLIED OR STATUTORY, WITH REGARD
TO THE STATEMENT S AND VALUES CON TAINED HEREIN, INCLUDING BUT NOT
LIMITED TO ANY REPR ESENTATION OR WARRANTY OF MERCHANTABILIT Y OR
SUITABILITY FOR ANY PURPOSE.
Division
EPCOS AG , Magnetics Business Group (MAG )
Address
Rosen hei m er Str as se 11 6b, 81 669 M unich
Tel: +49 89 54020 3030
mailto:
johann.reindl@epcos.com
*) ot hers: .(not d eclarable or prohibi ted substances acc. GA DSL)
**) typical mas s percentage of subst ance
The products set forth herein are “RoHS-compatible”. RoHS-compatible means that products are compatible with the requirements according to Art. 4 (substance restrictions) of
Directive 2011/65/EU of the European Parliament and of the Council of June 8th, 2011 on the restriction of the use of certain hazardous substances in el ec tr i c al a nd elec tr o nic equipment.
Umbrella Specification Rev 5.02, based on ZVEI Layo ut, EPCO S AG, Dr. G. Schulz, Dept. TQ, 08/2014 EPCOS AG 201 4•page: 2/2
RoHS - Exempt ion s for the Product Class / Product according to A nnex III: (
valid not valid )
no exemptions;
Exemption 6 (a): Lead as an alloying element i n steel for m achini ng purposes and in galvanized steel containing up to 0, 35 % lead by weight;
Exemption 6 (b): Lead as an alloying element i n alumini um cont ai ni ng up t o 0,4 % lead by weight;
Exemption 6 (c): Copper alloy containing up to 4 % lead by weight;
Exemption 7 (a): Lead in high m elting temperature type solder (i.e. l ead-based alloys containing 85 % by weight or more lead);
Exemption 7 (c)-I: Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capa cit ors, e.g. piezoelectroni c devices, or in a glass or ceramic mat rix compound;
Exemption 7 (c)-II: Lead in dielectric ceramic in cap acitors for a rated voltage of 125 V AC or 250 V DC or higher;
Exemption 7 (c)-III: Lead in dielect ric ceramic in capacitors for a rated voltage of l ess than 125 V AC or 250 V DC;
Exemption 15: Lead in solders to complete a viable elect rical connection between semi conductor die an d carrier within integrat ed circuit Flip Chip package s;
Other Exempt ion than above ....................................................................