TEA1521T/N2 - NXP Semiconductors

1. General description

The TEA152x family STARplug is a Switched Mode Power Supply (SMPS) controller IC

that operates directly from the rectified universal mains. It is implemented in the

high-voltage EZ-HV SOI process, combined with a low-voltage Bipolar Complementary

Metal-Oxide Semiconductor (BiCMOS) process. The device includes a high-voltage

power switch and a circuit for st art-up directly from the rectified mains voltage.

A dedicated circuit for valley switching is built in, which makes a very efficient slim-line

electronic power- plug concept possible.

In its most basic version of application, the TEA152x family acts as a voltage source.

Here, no additional secondary electronics are required. A combined voltage and current

source can be realized with minimum costs for external components. Implementation of

the TEA152x family renders an efficient and low cost power supply system.

2. Features and benefits

Designed for general purpose supplies up to 30 W

Integrated power switch:

TEA1520x: 48 Ω; 650 V

TEA1521x: 24 Ω; 650 V

TEA1522x: 12 Ω; 650 V

TEA1523P: 6.5 Ω; 650 V

Operates from universal AC mains supplies (8 0 V to 276 V)

Adjustable frequ ency for flexible design

RC oscillator for load insensitive regulation loop constant

Valley switching for minimum switch-on loss

Frequency reduction at low power output makes low standby power possible

(< 100 mW)

Adjustable overcurrent protection

Undervoltage prot ect i on

Temperature protection

Short-circuit win din g pr ot ec tio n

Simple application with both primary and secondary (opto) feedback

Available in DIP8 and SO14 packages

TEA152x

SMPS ICs for low-power systems

Rev. 04 — 14 September 2010 Product data sheet

Product data sheet Rev. 04 — 14 September 2010 2 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

3. Applications

Chargers

Adapters

Set-Top Box (STB)

DVD

CD(R)

TV/monitor standby supplies

PC peripherals

Microcontroller supplies in home applications and small portable equipment, etc.

4. Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Vdrain voltage on pin DRAIN Tj>0°C−0.4 - +650 V

RDSon drain - so urce on-st a te

resistance

TEA1520x Isource =−0.06 A

Tj=25°C - 48 55.2 Ω

Tj= 100 °C - 68 78.2 Ω

TEA1521x Isource =−0.125 A

Tj=25°C - 24 27.6 Ω

Tj= 100 °C - 34 39.1 Ω

TEA1522x Isource =−0.25 A

Tj=25°C - 12 13.8 Ω

Tj= 100 °C - 17 19.6 Ω

TEA1523P Isource =−0.50 A

Tj=25°C-6.57.5Ω

Tj= 100 °C - 9.0 10.0 Ω

VCC supply voltage continuous −0.4 - +40 V

fosc oscillator frequency 10 100 200 kHz

Idrain current on pin DRAIN Vdrain >60V;

no auxiliary supply -1.52mA

Product data sheet Rev. 04 — 14 September 2010 3 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

5. Ordering information

6. Block diagram

Table 2. Orderi ng information

Type number Package

Name Description Version

TEA1520P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1521P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1522P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1523P DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

TEA1520T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

TEA1521T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

TEA1522T SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

Pin numbers without parenthesis refer to DIP8 packages and within parenthesis refer to SO14 packages.

Fig 1. Block diagra m

mgt419

PROTECTION

LOGIC

SUPPLY

TEA152x VALLEY

POWER-UP

RESET

THERMAL

SHUTDOWN

OSCILLATOR

PWM

stop

low freq

100 mV

0.75 V

0.5 V

blank

short circuit winding

overcurrent

10x

2.5 V

1.8 U

1 (1)

2 (2, 3, 4,

5, 9, 10)

3 (6)

4 (7)

8 (14)

7 (12, 13)

6 (11)

5 (8)

DRAIN

n.c.

GND

SOURCE

AUX

REG

VCC

Product data sheet Rev. 04 — 14 September 2010 4 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

7. Pinning information

7.1 Pinning

7.2 Pin description

8. Functional description

The TEA152x family is the heart of a compact flyback converter, with the IC placed at the

primary side. The auxiliary winding of the transformer can be used for indirect feedback to

control the isolated output. This additional winding also powers the IC. A more accurate

control of the output voltage and/or current can be implemented with an additional

secondary sensing circuit and optocoupler feedback.

The TEA152x family uses voltage mode control. The frequency is determined by the

maximum transformer demagnetizing time and the time of the oscillator. In the first case,

the converter operates in the Self-Oscillating Power Supply (SOPS) mode. In the latter

case, it operates at a constant frequency, which can be adjusted with externa l

Fig 2. Pin confi gura t io n DIP8 Fig 3. Pin configuration SO14

TEA152xP

DRAIN

GND n.c.

RC SOURCE

REG AUX

001aae137

TEA152xT

VCC DRAIN

GND n.c.

GND SOURCE

GND GND

RC GND

REG AUX

001aae138

7 8

Table 3. Pin descripti on

Symbol Pin Description

DIP8 SO14

VCC 1 1 supply voltage

GND 2 2, 3, 4,

5, 9, 10 ground

RC 36frequency setting

REG 4 7 regulation input

AUX 5 8 input for voltage from the auxiliary winding for timing

(demagnetization)

SOURCE 6 11 source of the internal MOS switch

n.c. 7 12, 13 not connected

DRAIN 8 14 drain of the internal MOS switch; input for the start-up current

and valley sensing

Product data sheet Rev. 04 — 14 September 2010 5 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

component s RRC and CRC. This mode is called Pulse Width Modulation (PWM).

Furthermore, a prima ry stroke is started only in a valley of the secondary ringing. This

valley switching principle minimizes capacitive switch-on losses.

8.1 Start-up and Underoltage lockout

Initially, the IC is self supplying from the rectified main s volt age. The IC st art s switching as

soon as the voltage on pin VCC passes the VCC(startup) level. The supply is taken over by

the auxiliary winding of the transformer as soon as VCC is high enough and the supply

from the line is stopped for high efficiency operation.

When for some reason the auxiliary supply is not sufficient, the high-voltage supply also

supplies the IC. As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC

stops switching an d restarts from the rectified mains voltage.

8.2 Oscillator

The frequency of the oscillator is set by the external resistor and cap acitor on pin RC. The

external capacitor is charged rapidly to the VRC(max) level and, st arting from a new primary

stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the

relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost

equal to the sensitivity at high duty factors. This results in a more constant gain over the

duty factor range compared to PWM systems with a linear sawtooth oscillator. Stable

operation at low duty factors is easily realized. For high efficiency, the frequency is

reduced as soon as the duty factor drops below a certain value. This is accomplished by

increasing the oscillator charge time.

To ensure that the capacitor can be charged within the charge time, the value of the

oscillator capacitor should be limited to approximately 1 nF.

8.3 Duty factor control

The duty factor is controlled by the internal regulation voltage and the oscillator signal on

pin RC. The interna l re gulat ion vo ltage is equal to the extern al reg ulation voltage (−2.5 V)

multiplied by the gain of the error amplifier (typically 20 dB which is 10×).

8.4 Valley switching

A new cycle is started when the primary switch is switched on (see Figure 4). After a

certain time (determined by the oscillator volt age RC and the internal regulation level), the

switch is turned off and the secondary stroke starts. The internal regulation level is

determined by the voltage on pin REG.

After the secondary stroke, the drain voltage shows an oscillation with a frequency of

approximately:

(1)

where:

Lp = primary self-inductance

Cp = parasitic capacit ance on drain node

2π× LpCp

×()×

----------------------------------------------

Product data sheet Rev. 04 — 14 September 2010 6 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

As soon as the oscillator voltage is high again and the secondary stroke has ended, the

circuit waits for a low drain voltage before starting a new primary stroke.

Figure 4 shows the drain voltage together with the valley signal, the signal indi cating the

secondary stroke and the RC voltage.

The primary stroke starts some time before the actual valley at low ringin g frequencies,

and some time after the actual valle y at high ring ing fre quen cie s.

Figure 5 shows a typical curve for a reflected output voltage N ×Vo of 80 V. This voltage is

the output volt age Vo (see Figure 6) transferred to the primary side of the transformer with

the factor N (determined by the turns ratio of the transformer). Figure 5 shows that the

system switches exactly at minimum drain voltage for rin ging frequencies of 480 kHz, thus

reducing the switch-on losses to a minim um. At 200 kHz, the next primary stroke is started

at 33° before the valley. The switch-on losses are still reduced significantly.

A: Start of new cycle with valley switching

B: Start of new cycle in a classical PWM system

Fig 4. Signals for valley switching

mgt42

drain

valley

secondary

ringing

secondary

stroke

primary

stroke

secondary

stroke

oscillator

regulation level

Product data sheet Rev. 04 — 14 September 2010 7 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

8.5 Demagnetization

The system operates in discontinuous conduction mode all the time. As long as the

secondary stroke has not ended, the oscillator will not start a new primary stroke. During

the first tsuppr seconds, demagnetization recogni tion is suppressed. This suppre ssion may

be necessary in app lications where the transform er has a large leakage induct ance and at

low output voltages.

8.6 Minimum and maximum duty factor

The minimum duty factor of the switched mod e power supply is 0 %. The maximum duty

factor is set to 75 % (typical value at 100 kHz oscillation frequency).

8.7 OverCurrent Protection (OCP)

The cycle-by-cycle peak drain current limit circuit us es the ex ternal sourc e resistor RI to

measure the current. The circuit is activa ted after the leading edg e bla nking time tleb. The

protection circuit limits the source voltage to Vsource(max), and thus limits the primary peak

current.

8.8 Short-circuit winding protection

The short-circuit winding p rotection circuit is also activated af ter the leading edge bla nking

time. If the source volt age exceeds the short-circuit winding protection voltage V swp, the IC

stops switching. Only a power-on reset will restart normal operation. The short-circuit

winding protection also protects in case of a secondary diode short circuit.

8.9 OverTemperature Protection (OTP)

An accurate temperature protection is provided in the device. When the junction

temperature exceeds the thermal shutdown temperature, the IC stops switching. During

thermal protection, the IC current is lowered to the start-up current. The IC continues

normal operation as soon as the overtemperature situation has disappeared.

Fig 5. Typical phase of drain ringing at switch-on (at N ×Vo=80V)

0 200 400 800

f (kHz)

phase

(deg)

−20

−40

mgt424

600

Product data sheet Rev. 04 — 14 September 2010 8 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

8.10 OverVoltage Protection (OVP)

Overvoltage protection can be achieved in the application by pulling pin REG above its

normal operation level. The cu rrent pr imary stroke is terminated imme diately, and no new

primary stroke is started until the voltage on pin REG drops to its normal operation level.

Pin REG has an internal clamp. The cu rrent feed into this pin must be limited.

8.11 Output characteristics of complete power-plug

Typical characteristics:

•Output power: A wide range of output power levels can be handled by choosing the

RDS(on) and package of the TEA152x family. Power levels up to 30 W can be realized.

•Accuracy: The ac cu ra cy of the co mp le te conv er te r, functioning as a voltage sour ce

with primary sensing, is approximately 8 % (mainly dependent on the transformer

coupling). The accuracy with secondary sensing is defined by the accuracy of the

external components. For safety requirements in case of optocoupler feedback loss,

the primary sens in g rema in s active when an overvoltage circuit is connected.

•Efficiency: An efficiency of 75 % at maximum output power can be achieved for a

complete converter designed for universal mains.

•Ripple: A minimum ripple is obtained in a system designed for a maximum duty factor

of 50 % under normal operating conditions, and a minimized dead time. The

magnitude of the ripple in the output voltage is determined by the frequency and duty

factor of the converter, the output current level and the value and ESR of the output

capacitor.

8.12 Input characteristics of complete power-plug

Typical characteristics:

•The input voltage range comprises the universal AC mains (80 V to 276 V)

Product data sheet Rev. 04 — 14 September 2010 9 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

9. Limiting values

[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. All pins

are 2500 V maximum, except pin DRAIN, which is 1000 V maximum.

[2] Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω series

resistor.

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured

with respect to ground; positive currents flow into the device; pins VCC and RC are not allowed to be

current driven and pins REG and AUX are not allowed to be voltage driven.

Symbol Parameter Conditions Min Max Unit

Voltages

VCC supply voltage continuous −0.4 +40 V

VRC voltage on pin RC −0.4 +3 V

Vsource voltage on pin SOURCE DMOS power

transistor −0.4 +5 V

Vdrain voltage on pin DRAIN Tj>0°C−0.4 +650 V

Currents

IREG current on pin REG - 6 mA

IAUX current on pin AUX −10 +5 mA

Isource source current

TEA1520x −0.25 +0.25 A

TEA1521x −0.5 +0.5 A

TEA1522x −1+1A

TEA1523P −2+2A

Idrain drain current

TEA1520x −0.25 +0.25 A

TEA1521x −0.5 +0.5 A

TEA1522x −1+1A

TEA1523P −2+2A

General

Ptot total power dissipation

DIP8 package Tamb <45°C-1.0W

SO14 package Tamb <50°C-1.0W

Tstg storage temperature −55 +150 °C

Tjjunction temperature −40 +145 °C

Vesd electrostatic discharge voltage human body model [1] -±2500 V

machine model [2] -±200 V

Product data sheet Rev. 04 — 14 September 2010 10 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

10. Thermal characteristics

[1] Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the

printed-circuit board. See the TEA152x application note for details.

11. Characteristics

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient in free air [1]

DIP8 package 100 K/W

SO14 package 91 K/W

Table 6. Characteristics

Tamb =25

C; no overtemperature; all voltages are measured with respect to ground; currents are

positive when flowing into the IC; unless oth erwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supply

ICC(oper) operating supply current normal operation - 1.3 1.9 mA

ICC(startup) start-up supply current start-up - 180 400 μA

ICC(ch) charge supply current Vdrain >60V −6−4−3mA

VCC(startup) start-up supply voltage 9 9.5 10 V

VCC(stop) stop supply voltage undervoltage lockout 7.0 7.5 8.0 V

Idrain current on pin DRAIN Vdrain >60V

no auxiliary supply - 1.5 2 mA

with auxiliary

supply - 30 125 μA

Pulse-width modulator

δmin minimum duty factor - 0 - %

δmax maximum duty cycle f = 100 kHz - 75 - %

SOPS

Vdet(demag) demagnetization detection

voltage 50 100 150 mV

tsup(xfmr_ring) transformer ringing

suppression time start of 2nd stroke 1.0 1.5 2.0 μs

RC oscillator

VRC(min) minimum voltage on pin RC 60 75 90 mV

VRC(max) maximum voltage on pin RC 2.4 2.5 2.6 V

tch(RC) charge time on pin RC - 1 - μs

fosc oscillator frequency 10 100 200 kHz

Duty factor regulator: pin REG

VREG voltage on pin REG 2.4 2.5 2.6 V

Gvvoltage gain error amplifier - 20 - dB

Vclamp(REG) clamp voltage on pin REG IREG =6mA --7.5V

Product data sheet Rev. 04 — 14 September 2010 11 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

Valley switching

(ΔV/Δt)vrec valley recognition voltage

change with time −102 - +102 V/μs

fvalley ringing frequency for valley

switching N×Vo= 100 V 200 550 800 kHz

td(vrec-swon) valley recognition to

switch-on delay time -150-ns

Current and short-circuit winding protec tion

Vsource(max) maximum voltage on pin

SOURCE ΔV/Δt=0.1V/μs 0.470.500.53V

td(prop) delay from detecting

Vsource(max) to switch-off ΔV/Δt=0.5V/μs - 160 185 ns

Vswp short-winding protection

voltage ΔV/Δt=0.5V/μs 0.7 0.75 0.8 V

tleb leading edge blanking time 250 350 450 ns

FET output stage

IL(drain) leakage current on pin

DRAIN Vdrain = 650 V - - 125 μA

VBR(DRAIN) breakdown vo ltage on pin

DRAIN Tj>0°C 650 - - V

RDSon drain - so urce on-st a te

resistance

TEA1520x Isource =−0.06 A

Tj=25°C - 48 55.2 Ω

Tj=100°C - 68 78.2 Ω

TEA1521x Isource =−0.125 A

Tj=25°C - 24 27.6 Ω

Tj=100°C - 34 39.1 Ω

TEA1522x Isource =−0.25 A

Tj=25°C - 12 13.8 Ω

Tj=100°C - 17 19.6 Ω

TEA1523P Isource =−0.50 A

Tj=25°C-6.57.5Ω

Tj=100°C - 9.0 10.0 Ω

tf(DRAIN) fall time on pin DRAIN Vi=300V;

no external capacitor

at drain

-75-ns

Temperature protection

Tprot(max) maximum threshold

temperature 150 160 170 °C

Tprot(hys) hysteresis of protection

temperature -2-°C

Table 6. Characteristics …continued

Tamb =25

C; no overtemperature; all voltages are measured with respect to ground; currents are

positive when flowing into the IC; unless oth erwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 04 — 14 September 2010 12 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

12. Application information

Further application information can be found in the TEA152x application note.

Fig 6. Primary sensed application; configu ration for TEA152xP (DIP8)

mgt425

TEA152xP

DRAIN

n.c.

GND

SOURCE

AUX

R1 D2

C6 - Ycap

Z1 C5

CF2

CF1

mains

RAUX

REG

RRC

CRC

CVCC VCC

Product data sheet Rev. 04 — 14 September 2010 13 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

13. Package outline

Fig 7. Package outline SOT97-1 (DIP8)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05 0.2542.54 7.62 8.25

7.80

10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12 0.010.1 0.3 0.32

0.31

0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

Product data sheet Rev. 04 — 14 September 2010 14 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

Fig 8. Package outline SOT108-1 (SO14)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8 1.27 6.2

5.8

0.7

0.6

0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT108-1

detail X

vMA

(A )

076E06 MS-012

pin 1 index

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15 0.05

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

99-12-27

03-02-19

0 2.5 5 mm

scale

O14: plastic small outline package; 14 leads; body width 3.9 mm SOT108

-1

Product data sheet Rev. 04 — 14 September 2010 15 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

14. Abbreviations

15. Revision history

Table 7. Abbreviations

Acronym Description

BiCMOS Bipolar Complementary Metal-Oxide Semiconductor

DMOS Diffusion Metal-Oxide Semiconductor

ESR Equivalent Series Resistance

EZ-HV SOI Easy High Voltage Silicon-On-Insu lator

FET Field-Effect Transistor

PWM Pulse Width Modulation

SMPS Switched Mode Power Supply

SOPS Self-Oscillating Power Supply

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TEA152X v4.0 20100914 Product data sheet - TEA152X_3

Modifications: •Table 1 “Quick reference da ta” updated

•Table 4 “Limiting values” updated

TEA152X_3 20090323 Product data sheet - TEA152X_FAM_2

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•The minimum value of Tamb has changed in Table 1 and Table 4

•The minimum value of Tj has changed in Table 4

TEA152X_FAM_2 20060125 Product data sheet - TEA152X_FAMILY_1

TEA152X_FAMILY_1 20000908 Product specification - -

Product data sheet Rev. 04 — 14 September 2010 16 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

16. Legal information

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

16.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specif ication.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 04 — 14 September 2010 17 of 20

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omo tive use. It i s neither qua lified nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

16.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

STARplug — is a trademark of NXP B.V.

EZ-HV — is a trademark of NXP B.V.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 04 — 14 September 2010 18 of 20

continued >>

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

18. Tables

Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2

Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3

Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table 4. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . . .9

Table 5. Thermal characteristics . . . . . . . . . . . . . . . . . .10

Table 6. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .1 0

Table 7. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .15

Table 8. Revision history . . . . . . . . . . . . . . . . . . . . . . . .15

Product data sheet Rev. 04 — 14 September 2010 19 of 20

continued >>

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

19. Figures

Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Fig 2. Pin configuration DIP8. . . . . . . . . . . . . . . . . . . . . .4

Fig 3. Pin configuration SO14 . . . . . . . . . . . . . . . . . . . . .4

Fig 4. Signals for valley switching . . . . . . . . . . . . . . . . . .6

Fig 5. Typical phase of drain ringing at switch-on

(at N ×Vo= 80 V). . . . . . . . . . . . . . . . . . . . . . . . . .7

Fig 6. Primary sensed application; configuration

for TEA152xP (DIP8). . . . . . . . . . . . . . . . . . . . . .12

Fig 7. Package outline SOT97-1 (DIP8) . . . . . . . . . . . .13

Fig 8. Package outline SOT108-1 (SO14). . . . . . . . . . .14

NXP Semiconductors TEA152x

SMPS ICs for low-power systems

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 September 2010

Document identifier: TEA152X

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

20. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 4

8.1 Start-up and Underoltage lockout. . . . . . . . . . . 5

8.2 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 Duty factor control . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Valley switching . . . . . . . . . . . . . . . . . . . . . . . . 5

8.5 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7

8.6 Minimum and maximum duty factor . . . . . . . . . 7

8.7 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7

8.8 Short-circuit windi ng protection. . . . . . . . . . . . . 7

8.9 OverTemperature Protection (OTP) . . . . . . . . . 7

8.10 OverVoltage Protection (OVP) . . . . . . . . . . . . . 8

8.11 Output characteristics of complete power-plug. 8

8.12 Input characteristics of complete power-plug . . 8

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Thermal characteristics . . . . . . . . . . . . . . . . . 10

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10

12 Application information. . . . . . . . . . . . . . . . . . 12

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

17 Contact information. . . . . . . . . . . . . . . . . . . . . 17

18 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

19 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20