ICX279AK - Sony Component Solutions Business Division (CSBD)

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E00Z51B82

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by

any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the

operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

ICX279AK

14 pin DIP (Plastic)

Description

The ICX279AK is an interline CCD solid-state

image sensor suitable for PAL color video cameras

with a diagonal 4.5mm (Type 1/4) system. Compared

with the current product ICX209AK, basic

characteristics such as sensitivity, smear and

dynamic range are improved drastically through the

adoption of EXview HAD CCDTM technology.

This chip features a field period readout system and

an electronic shutter with variable charge-storage time.

The package is a 10mm-square 14-pin DIP (Plastic).

EXview HAD CCDTM has different spectral

characteristics from the current CCD.

Features

•High sensitivity (+5dB compared with the ICX209AK)

•Low smear (–20dB compared with the ICX209AK)

•High D range (+2dB compared with the ICX209AK)

•Horizontal register: 3.3 to 5.0V drive

•Reset gate: 3.3 to 5.0V drive

•No voltage adjustment

(Reset gate and substrate bias need no adjustment.)

•High resolution, low smear and low dark current

•Excellent antiblooming characteristics

•Continuous variable-speed shutter

•Recommended range of exit pupil distance: –20 to –100mm

•Ye, Cy, Mg, and G complementary color mosaic filters on chip

Device Structure

•Interline CCD image sensor

•Image size: Diagonal 4.5mm (Type 1/4)

•Number of effective pixels: 752 (H) × 582 (V) approx. 440K pixels

•Total number of pixels: 795 (H) × 596 (V) approx. 470K pixels

•Chip size: 4.43mm (H) ×3.69mm (V)

•Unit cell size: 4.85µm (H) × 4.65µm (V)

•Optical black: Horizontal (H) direction: Front 3 pixels, rear 40 pixels

Vertical (V) direction: Front 12 pixels, rear 2 pixels

•Number of dummy bits: Horizontal 22

Vertical 1 (even fields only)

•Substrate material: Silicon

Optical black position

(Top View)

Pin 1

Pin 8 40

∗EXview HAD CCD is a trademark of Sony Corporation.

EXview HAD CCD is a CCD that drastically improves light efficiency by including near infrared light region as a basic structure of

HAD (Hole-Accumulation-Diode) sensor.

Diagonal 4.5mm (Type 1/4) CCD Image Sensor for PAL Color Video Cameras

– 2 –

ICX279AK

USE RESTRICTION NOTICE (December 1, 2003 ver.)

This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the CCD

products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may, at any time, modify

this Notice which will be available to you in the latest specifications book for the Products. You should abide by

the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the

Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor. You

should consult a sales representative of the subsidiary or distributor of Sony on such a use restriction notice

when you consider using the Products.

Use Restrictions

• The Products are intended for incorporation into such general electronic equipment as office products,

communication products, measurement products, and home electronics products in accordance with the

terms and conditions set forth in this specifications book and otherwise notified by Sony from time to time.

• You should not use the Products for critical applications which may pose a life- or injury- threatening risk or

are highly likely to cause significant property damage in the event of failure of the Products. You should

consult your Sony sales representative beforehand when you consider using the Products for such critical

applications. In addition, you should not use the Products in weapon or military equipment.

• Sony disclaims and does not assume any liability and damages arising out of misuse, improper use,

modification, use of the Products for the above-mentioned critical applications, weapon and military

equipment, or any deviation from the requirements set forth in this specifications book.

Design for Safety

• Sony is making continuous efforts to further improve the quality and reliability of the Products; however,

failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care to

ensure the safe design of your products such as component redundancy, anti-conflagration features, and

features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or other social

damage as a result of such failure.

Export Control

• If the Products are controlled items under the export control laws or regulations of various countries, approval

may be required for the export of the Products under the said laws or regulations. You should be responsible

for compliance with the said laws or regulations.

No License Implied

• The technical information shown in this specifications book is for your reference purposes only. The

availability of this specifications book shall not be construed as giving any indication that Sony and its

licensors will license any intellectual property rights in such information by any implication or otherwise. Sony

will not assume responsibility for any problems in connection with your use of such information or for any

infringement of third-party rights due to the same. It is therefore your sole legal and financial responsibility to

resolve any such problems and infringement.

Governing Law

• This Notice shall be governed by and construed in accordance with the laws of Japan, without reference to

principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating to this

Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the court of first

instance.

Other Applicable Terms and Conditions

• The terms and conditions in the Sony additional specifications, which will be made available to you when you

order the Products, shall also be applicable to your use of the Products as well as to this specifications book.

You should review those terms and conditions when you consider purchasing and/or using the Products.

– 3 –

ICX279AK

Block Diagram and Pin Configuration

(Top View)

OUT

GND

Vφ

GND

φSUB

Hφ

7 6 5 4 3 2 1

8 9 10 11 12 13 14

Note)

Note) : Photo sensor

Horizontal Register

Vertical Register

Pin No. Symbol Description Pin No. Symbol Description

Vφ4

Vφ3

Vφ2

Vφ1

GND

VOUT

Vertical register transfer clock

GND

Signal output

VDD

GND

φSUB

Hφ1

Hφ2

Supply voltage

GND

Substrate clock

Protective transistor bias

Reset gate clock

Horizontal register transfer clock

Pin Description

Absolute Maximum Ratings

∗1+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

Item

VDD, VOUT, RG – φSUB

Vφ1, Vφ3 – φSUB

Vφ2, Vφ4, VL – φSUB

Hφ1, Hφ2, GND – φSUB

VDD, VOUT, RG – GND

Vφ1, Vφ2, Vφ3, Vφ4 – GND

Hφ1, Hφ2 – GND

Vφ1, Vφ3 – VL

Vφ2, Vφ4, Hφ1, Hφ2, GND – VL

Voltage difference between vertical clock input pins

Hφ1 – Hφ2

Hφ1, Hφ2 – Vφ4

Against φSUB

Against GND

Against VL

Between input clock

pins

Storage temperature

Operating temperature

–40 to +8

–50 to +15

–50 to +0.3

–40 to +0.3

–0.3 to +18

–10 to +18

–10 to +6

–0.3 to +28

–0.3 to +15

to +15

–5 to +5

–13 to +13

–30 to +80

–10 to +60

°C

∗1

Ratings Unit Remarks

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ICX279AK

Bias Conditions

∗1VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL

power supply for the V driver should be used.

∗2Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated

within the CCD.

Supply voltage

Protective transistor bias

Substrate clock

Reset gate clock

Item

VDD

φSUB

φRG

Symbol

15.0

∗1

∗2

Min.

Unit RemarksTyp. Max.

14.55 15.45

DC Characteristics

Supply current

Item

IDD

Symbol

Min. Unit RemarksTyp. Max.

mA6

Clock Voltage Conditions

Readout clock voltage

Vertical transfer clock

voltage

Horizontal transfer

clock voltage

Reset gate clock

voltage

Substrate clock voltage

Item

VVT

VVH1, VVH2

VVH3, VVH4

VVL1, VVL2,

VVL3, VVL4

VφV

VVH3 – VVH

VVH4 – VVH

VVHH

VVHL

VVLH

VVLL

VφH

VHL

VφRG

VRGLH – VRGLL

VRGL – VRGLm

VφSUB

Symbol

14.55

–0.05

–0.2

–8.0

6.3

–0.25

3.0

–0.05

3.0

21.0

Min.

15.0

–7.0

7.0

3.3

22.0

Typ.

15.45

0.05

–6.5

8.05

0.1

0.3

5.25

0.05

5.5

0.4

0.5

23.5

Max. Unit

Waveform

diagram

VVH = (VVH1 + VVH2)/2

VVL = (VVL3 + VVL4)/2

VφV = VVHn – VVLn (n = 1 to 4)

High-level coupling

Low-level coupling

Input through 0.1µF

capacitance

Low-level coupling

Remarks

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ICX279AK

Horizontal transfer clock equivalent circuitVertical transfer clock equivalent circuit

Reset gate clock equivalent circuit

Hφ

Cφ

Rφ

Vφ

Cφ

V12

Vφ

Cφ

V34

Cφ

V23

Cφ

V41

Cφ

V13

Cφ

V24

Cφ

GND

Rφ

RGφ

Cφ

Clock Equivalent Circuit Constant

CφV1, CφV3

CφV2, CφV4

CφV12, CφV34

CφV23, CφV41

CφV13

CφV24

CφH1, CφH2

CφHH

CφRG

CφSUB

R1, R2, R3, R4

RGND

RφH

RφRG

Symbol

Capacitance between vertical transfer clock

and GND

Capacitance between vertical transfer clocks

Capacitance between horizontal transfer clock

and GND

Capacitance between horizontal transfer clocks

Capacitance between reset gate clock and GND

Capacitance between substrate clock and GND

Vertical transfer clock series resistor

Vertical transfer clock ground resistor

Horizontal transfer clock series resistor

Reset gate clock series resistor

Item Min.

1200

680

220

150

180

Typ. Max.

Unit Remarks

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ICX279AK

Drive Clock Waveform Conditions

(1) Readout clock waveform

(2) Vertical transfer clock waveform

VVH = (VVH1 + VVH2)/2

VVL = (VVL3 + VVL4)/2

VφV = VVHn – VVLn (n = 1 to 4)

100%

90%

10%

0% tr tf 0V

twh

φM

VVH1 VVHH

VVHL

VVH

VVLH

VVL1

VVLL

VVHL

VVHH

VVL

VVHH VVH

VVLH

VVLL

VVL

VVHL

VVL3

VVHL

VVH3

VVHH

VVH2

VVHH

VVHL

VVH

VVLH

VVL2

VVLL

VVL

VVH

VVL

VVHL

VVLH

VVLL

VVHL

VVH4

VVHH VVHH

VVL4

Vφ1Vφ3

Vφ2Vφ4

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ICX279AK

(3) Horizontal transfer clock waveform

(4) Reset gate clock waveform

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from

Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and

VRGLL.

VRGL = (VRGLH + VRGLL)/2

Assuming VRGH is the minimum value during the interval twh, then:

VφRG = VRGH – VRGL

Negative overshoot level during the falling edge of RG is VRGLm.

(5) Substrate clock waveform

100%

90%

10%

SUB

(A bias generated within the CCD) tr tftwh

φM

Vφ

SUB

tr twh tf

90%

10%

twl

Vφ

Point A

twl

VφRG

VRGH

VRGL

VRGLH

RG waveform

VRGLL

Hφ1 waveform

twhtr tf

VφH/2 [V]

VRGLm

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ICX279AK

Clock Switching Characteristics

Min.

twh

Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.

twl tr tf

2.3

1.5

2.5

28.5

5.38

1.8

28.5

5.38

0.5

6.5

0.01

9.5

0.5

6.5

0.01

250

9.5

0.5

Unit

µs

Remarks

During

readout

∗1

∗2

When draining

charge

Item

Readout clock

Vertical transfer

clock

During

imaging

During

parallel-serial

conversion

Reset gate clock

Substrate clock

Symbol

Vφ1, Vφ2,

Vφ3, Vφ4

Hφ1

Hφ2

Hφ1

Hφ2

φRG

φSUB

Horizontal

transfer clock

∗1When vertical transfer clock driver CXD1267AN is used.

∗2When VφH = 3.0V. tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2

waveforms must be at least VφH/2 [V].

∗3The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.

Min.

two

Typ. Max.

22 26

Unit

RemarksItem

Horizontal transfer clock

Symbol

Hφ1, Hφ2∗3

– 9 –

ICX279AK

Zone Definition of Video Signal Shading

Measurement System

Note) Adjust the amplifier gain so that the gain between [∗A] and [∗Y] , and between [∗A] and [∗C] equals 1.

Ignored region

Effective pixel region

Zone 0, I

Zone II, II'

752 (H)

582 (V)

CCD C.D.S

LPF1

AMP

CCD signal output Y signal output

Chroma signal output

(3dB down 6.3MHz)

(3dB down 1MHz)

[∗C]

S/H

LPF2

[∗Y]

[∗A]

Image Sensor Characteristics (Ta = 25°C)

Item

Sensitivity

Sensitivity ratio

Saturation signal

Smear

Video signal shading

Uniformity between video

signal channels

Dark signal

Dark signal shading

Flicker Y

Flicker R-Y

Flicker B-Y

Line crawl R

Line crawl G

Line crawl B

Line crawl W

Lag

Symbol

RMgG

RYeCy

Ysat

SHy

ΔSr

ΔSb

Ydt

ΔYdt

Fcr

Fcb

Lcr

Lcg

Lcb

Lcw

Lag

Min.

640

0.93

1.15

900

Typ.

800

–108

Max.

1.35

1.53

–100

0.5

Unit

Measurement method

Remarks

Ta = 60°C

Zone 0 and I

Zone 0 to II'

Ta = 60°C

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ICX279AK

Image Sensor Characteristics Measurement Method

Measurement conditions

1) In the following measurements, the device drive conditions are at the typical values of the bias and clock

voltage conditions.

2) In the following measurements, spot pixels are excluded and, unless otherwise specified, the optical black

level (OB) is used as the reference for the signal output, which is taken as the value of Y signal output or

chroma signal output of the measurement system.

Color coding of this image sensor & Composition of luminance (Y) and chroma (color difference) signals

As shown in the left figure, fields are read out. The charge is

mixed by pairs such as A1 and A2 in the A field. (pairs such

as B in the B field)

As a result, the sequence of charges output as signals from

the horizontal shift register (Hreg) is, for line A1, (G + Cy),

(Mg + Ye), (G + Cy), and (Mg + Ye).

These signals are processed to form the Y signal and chroma (color difference) signal. The Y signal is formed

by adding adjacent signals, and the chroma signal is formed by subtracting adjacent signals. In other words,

the approximation:

Y = {(G + Cy) + (Mg + Ye)} × 1/2

= 1/2 {2B + 3G + 2R}

is used for the Y signal, and the approximation:

R – Y = {(Mg + Ye) – (G + Cy)}

= {2R – G}

is used for the chroma (color difference) signal. For line A2, the signals output from Hreg in sequence are

(Mg + Cy), (G + Ye), (Mg + Cy), (G + Ye).

The Y signal is formed from these signals as follows:

Y = {(G + Ye) + (Mg + Cy)} × 1/2

= 1/2 {2B + 3G + 2R}

This is balanced since it is formed in the same way as for line A1.

In a like manner, the chroma (color difference) signal is approximated as follows:

– (B – Y) = {(G + Ye) – (Mg + Cy)}

= – {2B – G}

In other words, the chroma signal can be retrieved according to the sequence of lines from R – Y and – (B – Y)

in alternation. This is also true for the B field.

Cy Ye Cy Ye

GMgGMg

Cy Ye Cy Ye

Mg G Mg G

Hreg

Color Coding Diagram

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ICX279AK

Definition of standard imaging conditions

1) Standard imaging condition I:

Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern

for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter

and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the

standard sensitivity testing luminous intensity.

2) Standard imaging condition II:

Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.

Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted

to the value indicated in each testing item by the lens diaphragm.

3) Standard imaging condition III:

Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.

Use a testing standard lens (exit pupil distance –33mm) with CM500S (t = 1.0mm) as an IR cut filter. The

luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

1. Sensitivity

Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of

1/250s, measure the Y signal (Ys) at the center of the screen and substitute the value into the following

formula.

S = Ys × [mV]

2. Sensitivity ratio

Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal

output is 200mV, and then measure the Mg signal output (SMg [mV]) and G signal output (SG [mV]), and Ye

signal output (SYe [mV]) and Cy signal output (SCy [mV]) at the center of the screen with frame readout

method. Substitute the values into the following formula.

RMgG = SMg/SG

RYeCy = SYe /SCy

3. Saturation signal

Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with

average value of the Y signal output, 200mV, measure the minimum value of the Y signal.

4. Smear

Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity to

500 times the intensity with average value of the Y signal output, 200mV. When the readout clock is stopped

and the charge drain is executed by the electronic shutter at the respective H blankings, measure the

maximum value (YSm [mV]) of the Y signal output and substitute the value into the following formula.

Sm = 20 × log × × [dB] (1/10V method conversion value)

250

500

YSm

200

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ICX279AK

5. Video signal shading

Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity

so that the average value of the Y signal output is 200mV. Then measure the maximum (Ymax [mV]) and

minimum (Ymin [mV]) values of the Y signal and substitute the values into the following formula.

SHy = (Ymax – Ymin)/200 × 100 [%]

6. Uniformity between video signal channels

Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal

output is 200mV, and then measure the maximum (Crmax, Cbmax [mV]) and minimum (Crmin, Cbmin

[mV]) values of the R – Y and B – Y channels of the chroma signal and substitute the values into the

following formula.

ΔSr = | (Crmax – Crmin)/200 | × 100 [%]

ΔSb = | (Cbmax – Cbmin)/200 | × 100 [%]

7. Dark signal

Measure the average value of the Y signal output (Ydt [mV]) with the device ambient temperature 60°C and

the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

8. Dark signal shading

After measuring 7, measure the maximum (Ydmax [mV]) and minimum (Ydmin [mV]) values of the Y signal

output and substitute the values into the following formula.

ΔYdt = Ydmax – Ydmin [mV]

9. Flicker

1) Fy

Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal

output is 200mV, and then measure the difference in the signal level between fields (ΔYf [mV]). Then

substitute the value into the following formula.

Fy = (ΔYf/200) × 100 [%]

2) Fcr, Fcb

Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal

output is 200mV, insert an R or B filter, and then measure both the difference in the signal level between

fields of the chroma signal (ΔCr, ΔCb) as well as the average value of the chroma signal output (CAr, CAb).

Substitute the values into the following formula.

Fci = (ΔCi/CAi) × 100 [%] (i = r, b)

– 13 –

ICX279AK

10. Line crawls

Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Y signal

output is 200mV, and then insert a white subject and R, G, and B filters and measure the difference

between Y signal lines for the same field (ΔYlw, ΔYlr, ΔYlg, ΔYlb [mV]). Substitute the values into the

following formula.

Lci = (ΔYli/200) × 100 [%] (i = w, r, g, b)

11. Lag

Adjust the Y signal output value generated by strobe light to 200mV. After setting the strobe light so that it

strobes with the following timing, measure the residual signal (Ylag). Substitute the value into the following

formula.

Lag = (Ylag/200) × 100 [%]

Light

Y signal output 200mV Ylag (lag)

FLD

Strobe light

timing

Output

– 14 –

ICX279AK

Drive Circuit

22/16V

0.1

–7.0V

3.3/16V

1/35V 0.1

Hφ1

Hφ2

φSUB

GND

VDD

Vφ4

Vφ3

Vφ2

Vφ1

VOUT

22/20V

CCD OUT

15V

XSUB

XV2

XV1

XSG1

XV3

XSG2

XV4

Hφ1

Hφ2

2200p

100k

3.3/20V

0.01

100

3.9k

2SK523

GND

ICX279

(BOTTOM VIEW)

CXD1267AN

1 2 3 4 5 6 7

14 13 12 11 10 9 8

– 15 –

ICX279AK

Spectral Sensitivity Characteristics (excludes both lens characteristics and light source characteristics)

Sensor Readout Clock Timing Chart

Unit: µs

Odd Field

Even Field

2.6

2.6 2.6 2.6

33.6 1.5

0.2

650600550500450400

Wave Length [nm]

Relative Response

1.0

0.8

0.6

0.4

0.2

700

– 16 –

ICX279AK

Drive Timing Chart (Vertical Sync)

FLD

BLK

CCD

OUT

620

625

310

320

335

330

340

581

582 135

246

135

246 582

581 2

315

325

– 17 –

ICX279AK

Drive Timing Chart (Horizontal Sync)

745

750

752

BLK

SUB

– 18 –

ICX279AK

Notes on Handling

1) Static charge prevention

CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following

protective measures.

a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes.

b) When handling directly use an earth band.

c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.

d) Ionized air is recommended for discharge when handling CCD image sensor.

e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering

a) Make sure the package temperature does not exceed 80°C.

b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W

soldering iron with a ground wire and solder each pin in less than 2 seconds. For repairs and remount,

cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection

Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and

dirt. Clean glass plates with the following operation as required, and use them.

a) Perform all assembly operations in a clean room (class 1000 or less).

b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized

air is recommended.)

c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.

d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences.

e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching)

a) Remain within the following limits when applying a static load to the package. Do not apply any load

more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to

limited portions. (This may cause cracks in the package.)

Plastic package

Cover glass

Compressive strength

50N50N 1.2Nm

Torsional strength

– 19 –

ICX279AK

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for

installation, use either an elastic load, such as a spring plate, or an adhesive.

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,

and indicated values should be transferred to the other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-acrylate

instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)

5) Others

a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high

luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the

image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such

a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-

off mode should be properly arranged. For continuous using under cruel condition exceeding the normal

using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength

are the same.

The cross section of lead frame can be seen on the side of the package for structure A.

Structure A Structure B

Chip

Metal plate

(lead frame)

Package

Cross section of

lead frame

– 20 –

ICX279AK

Sony Corporation

Package Outline Unit: mm

2.5

7.0

2.5

1.0

0.5

5.0

18.9 7

10.0 ± 0.1

8.9

10.0 ± 0.1

10.16

0.25

814

1.7

7.0 2.5

1.0

3.35 ± 0.15

2.6

3.5 ± 0.3

1.27

0.3

0.46

1.27

14 pin DIP (400mil)

0.3

1. “A” is the center of the effective image area.

2. The two points “B” of the package are the horizontal reference.

The point “B'” of the package is the vertical reference.

3. The bottom “C” of the package, and the top of the cover glass “D” are the height reference.

4. The center of the effective image area relative to “B” and “B'” is (H, V) = (5.0, 5.0) ± 0.15mm.

5. The rotation angle of the effective image area relative to H and V is ± 1˚.

6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.

The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.

7. The tilt of the effective image area relative to the bottom “C” is less than 25µm.

The tilt of the effective image area relative to the top “D” of the cover glass is less than 25µm.

8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.

9. The notch of the package is used only for directional index, that must not be used for reference

of fixing.

10. Cover glass defect

Edge part

Length : no matter, Width : less than 0.5mm, Depth : less than the thickness of the glass.

Corner part

Length : less than 1.5mm, Depth : less than the thickness of the glass.

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

Plastic

GOLD PLATING

42 ALLOY

0.60g

DRAWING NUMBER AS-D3-02(E)

0˚ to 9˚