ISL9206ADHZ-T - Intersil - Product.Network

FN6651.1

ISL9206A

FlexiHash+™ For Battery Authentication

The ISL9206A is a highly cost-effective fixed-secret hash

engine based on Intersil’s second generation FlexiHash™

technology. The device authentication is achieved through a

challenge-response scheme customi zed for low-cost

applications, where cl oning via eavesdropping witho ut

knowledge of the device’s secret code is not economically

viable. When used for its intended applications, the

ISL9206A offers the same level of effectiveness as other

significantly more expensive high-maintenance hash

algorithm and authentication schemes.

The ISL9206A has a wide operating voltage range, and is

suitable for direct powering from a 1-cell Li-i on/Li-Poly or a

3-cell series NiMH battery pack. The ISL9206A can also be

3.3V or higher. The device connects directly to the cell

terminals of a battery pack, and includes on-chip voltage

regulation circuit, POR, and a non-crystal based oscillator for

bus timing reference.

Communication wi th the host is achie ved th rough a singl e

wire XSD interface (a light-weight subset o f Intersil’ s ISD bus

interface). The XSD bus is comp atible for use with se rial port s

offered by all 82 50 compatible UART’ s or a si ngle GPIO

(General Purpose Input and Output) pin of a microprocessor.

A clone prevention solution utilizing the ISL9206A offers

safety and revenue protection at the lowest cost and power ,

and is suitable for protection against after-market

replacement for a wide variety of low-co st applications.

Features

• Challenge-response based authentication scheme using

32-Bit challenge code and 8-Bit authentication code.

• Fast and flexible authentication process. Multi-pass

authentication can be used to achieve the highest security

level if necessary.

• 16x8 OTP ROM stores up to three sets of 32-Bit

host-selectable secrets with additional programmable

memory for storage of up to 48-Bits of ID code and/or pack

information.

• FlexiHash+™ engine uses two sets of 32-Bit secrets for

authentication code generation.

• Non-unique mapping of the secret key to an 8-Bit

authentication code maximizes hacking difficulty due to

need for exhaustive key search (superior to SHA-1).

• Supports 1-cell Li-ion/Li-Poly and 3-cell series NiMH

battery packs (2.6V ~ 4.8V operation), or powered by the

XSD bus.

• XSD single-wire host bus interface communicates with all

8250-compatible UART’ s or a single GPIO. Supports CRC

on read data and transfer bit-rate up to 23kbps.

• True “Ze r o Power” Sleep mode (automatically entered

after a bus inactivity time-out period)

• 5 Ld SOT-23 or 8 Ld TDFN (2mmx3mm) packages

• -25°C to +85°C operating temperature range

• Pb-free (RoHS compliant)

Applications

• Battery Pack Authentication

• Printer Cartridges

• Add-on Accessories

• Other Non-Monetary Authentication Applications

Related Literature

• Application Note AN1165 “ISL6296 Evaluatio n Kit”

• Application Note AN1167 “Implementing XSD Host Using

a GPIO”

• Technical Brief TB363 “Guidelines fo r Handling and

Processing Moisture Sensitive Surface Mo unt Devices

(SMDs)”

Ordering Information

PART NUMBER

(Note) PART

MARKING TEMP.

RANGE (°C) PACKAGE

(Pb-free) PKG.

DWG. #

ISL9206ADHZ-T* 206A -25 to +85 5 Ld SOT-23 P5.064

ISL9206ADRTZ-T* 06A -25 to +85 8 Ld 2x3 TDFN L8.2x3A

*Please refer to TB347 for details on reel specifications.

NOTE: These Intersil Pb-free plastic packaged products employ special

Pb-free material sets, molding compounds/die attach materials, and

100% matte tin plate plus anneal (e3 termination finish, which is RoHS

compliant and compatible with both SnPb and Pb-free soldering

operations). Intersil Pb-free products are MSL classified at Pb-free peak

reflow temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020.

PinoutsISL9206A

(8 LD 2X3 TDFN)

TOP VIEW

ISL9206A

(5 LD SOT-23)

TOP VIEW

VSS

VDD

XSD

TIO

XSD

TIO

VSS

VDD

Data Sheet July 30, 2008

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

1-888-INTERSIL or1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.

FlexiHash is a trademark of Intersil Americas Inc. All other trademarks mentioned are the property of their respective owners.

2FN6651.1

July 30, 2008

Absolute Maximum Ratings (Reference to GND) Thermal Information

Supply Voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V

All Other Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VDD + 0.5V

ESD Rating

Human Body Model (Per MIL-STD-883 Method 3015.7). . .4000V

Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .400V

Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . .1000V

Recommended Operating Conditions

Ambient Temperature Range. . . . . . . . . . . . . . . . . . .-25°C to +85°C

Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W)

SOT-23 Package (Note 1) . . . . . . . . . . 200 N/A

2x3 TDFN Package (Notes 2, 3) . . . . . 70 10.5

Maximum Junction Temperature (Plastic Package) . . . . . . .+125°C

Maximum Storage Temperature Range. . . . . . . . . .-40°C to +125°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact prod uct reliability and

result in failures not covered by warranty.

NOTES:

1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

2. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See

Tech Brief TB379.

3. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.

Electrical Specifications Unless otherwise noted, all parameters are established over the operational supply voltage and temperature

range of the device as follows: TA = -25°C to +85°C; VDD = 2.6V to 4.8V; Parameters with MIN and/or MAX

limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization

and are not production tested.

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

DC CHARACTERISTICS

Supply Voltage VDD During normal operation 2.6 - 4.8 V

During OTP ROM programming 2.8 - 4.8 V

Run Mode Supply Current

(Exclude I/O Current) IDD VDD = 4.2V - 38 55 µA

VDD = 4.8V - 40 65 µA

VDD = 1.5V 5.0 8.0 µA

Sleep Mode Supply Current IDDS VDD = 4.2V, XSD pin floating - 0.15 0.5 µA

OTP Programming Mode Supply Current IDDP For ~ 1.8ms duration per write operation - 250 500 µA

Internal Regulated Supply Voltage VRG Observable only in test mode 2.3 2.5 2.7 V

Internal OTP ROM Programming Voltage V PP Observable only in test mode 11 12 13 V

POR Release Threshold VPOR+ 1.9 2.2 2.4 V

POR Assertion Threshold VPOR- 1.5 1.8 2.1 V

XSD PIN CHARACTERISTICS

XSD Input Low Voltage VIL -0.4 - 0.5 V

XSD Input High Voltage VIH 1.5 - VDD + 0.4V V

XSD Input Hysteresis VHYS - 400 - mV

XSD Internal Pull-down Current IPD VDD = 2.6V - 0.8 - µA

VDD = 4.2V - 1.2 2.0 µA

VDD = 4.8V - 1.8 2.5 µA

XSD Output Low Voltage VOL IOL = 1mA - - 0.4 V

XSD Input Transition Time tX10% to 90% transition time - - 2 µs

XSD Output Fall Time tF90% to 10%, CLOAD = 12pF - - 50 ns

XSD Pin Capacitance CPIN -6 -pF

ISL9206A

3FN6651.1

July 30, 2008

XSD BUS TIMING CHARACTERISTICS (Refer to XSD Bus Symbol Timing Definitions Tables beginning on page 8)

Programming Bit Rate x = 0.5 to 4 2.89 - 23.12 kHz

XSD Input De-glitch Time tWDG Pulse width narrower than the de-glitch time will not

cause the device to wake up 7- 20µs

Device Wake-up Time tWKE From falling-edge of break command issued by host to

falling-edge of break command returned by device 130 160 200 µs

Device Sleep Wait Time tSLP From when the ‘11’ Opcode is detected to the shut-off

of the internal regulator 4- -µs

Auto-Sleep Time-out Period tASLP From the last transition detected on the XSD bus to the

device going into sleep mode -1 - s

OTP ROM Write Time tEEW From the last BT of the 2nd write data frame to when

device is ready to accept the next instruction -1.81.9ms

Hash Calculation Time tHASH From the last BT of the Challenge Code Word from the

host to the Authentication Code being available for

read

-1 -BT

Soft-Reset Time tSRST From the last BT of the Soft-Reset instruction issued

by the host to the falling-edge of break command

returned by device

-- 30µs

Electrical Specifications Unless otherwise noted, all parameters are established over the operational supply voltage and temperature

range of the device as follows: TA = -25°C to +85°C; VDD = 2.6V to 4.8V; Parameters with MIN and/or MAX

limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization

and are not production tested. (Continued)

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

Pin Descriptions

SOT-23

PIN NUMBER TDFN

PIN NUMBER PIN NAME DESCRIPTION

1 1 VSS System ground.

2 2, 3, 6, 7 NC No connection.

3 4 VDD Supply voltage.

4 5 TIO Production test I/O pin. Used only during production testing. Must be left floating during

normal operation.

5 8 XSD Communication bus with weak internal pull-down to VSS. This pin is a Schmitt-trigger input

and an open-drain output. An appropriate pull-up resistor is required on the host side.

ISL9206A

4FN6651.1

July 30, 2008

Typical Applications

Block Diagram

FIGURE 1. TYPICAL APPLICATION WITH THE ISL9206A POWERED BY THE BATTERY

PROTECTION

ISL9206A

VSS

VDDXSD

R1R2

PACK+

PACK-

XSD 100Ω100Ω

5.1V 0.1µF

FIGURE 2. TYPICAL APPLICATION WITH THE ISL9206A POWERED BY THE XSD BUS

PROTECTIONISL9206A

VSS

VDDXSD

PACK+

PACK-

XSD 100Ω

5.1V 0.1µF

FIGURE 3. FUNCTIONAL BLOCK DIAGRAM

DIGITAL

POR/2.5V

REGULATOR OSCILLATOR

XSD

COMM

INTERFACE

DCFG (1 BYTE)

DTRM (1 BYTE)

SECRET #1

(4 BYTES)

SECRET #2

(4 BYTES)

SECRET #3

(4 BYTES)

GENERAL PURPOSE

(2 BYTES)

16 BYTES

OTPROM

SESL

AUTH

CHLG

FLEXIHASH+™

ENGINE

MSCR STAT CONTROL/STATUS/

TEST INTERFACE

VDD

XSD

TIO

VSS

ESD DIODE

ANALOG

ISL9206A

5FN6651.1

July 30, 2008

Theory of Operation

The ISL9206A contains all circuitry required to support

battery pack authentication based on a challenge-response

scheme. It provides a 16-Byte One-Time Programmab le

Read-Only Memory (OTPROM) space for the storage of up

to 96-Bit of secret for the authentication and other user

information. A 32-Bit hash engine (FlexiHash+™) calculates

the authentication result immediately after receiving a 32-Bit

random challenge code. The communication between the

ISL9206A and the host is implemented through the XSD

single-wire communication bus.

Major functions within the ISL9206A include the following, as

shown in Figure 3.

• Power-on reset (POR) and a 2.5V regulator to power all

internal logic circuits.

• 16x8-Bit (16-Byte) OTP ROM, as shown in Table 8. The

first part (two bytes) contains the device default

configuration (DCFG) information (such as the device

address and the XSD communication speed) and the

default trimming (DTRM) information (such as the internal

oscillator frequency trimming). The second part contains

two groups (12-Byte) of memory that can be

independently locked out for the storage of up to three

sets of secret. The last part provides two additional bytes

of space for general-purpose information.

• Control functions, including master control (MSCR) and

status (STAT) registers (as shown in Table 9), interrupt

generation, and the test-related interface.

• FlexiHash+™ engine that includes the 32-Bit highly

non-linear proprietary hash engine, secret selection

result register. Table 10 shows all the registers.

• XSD communication bus Interface. The XSD device

address and the communication speed are configured in

the DCFG address in the OTPROM, as given in Table 8.

• Time Base Reference.

The following explains in det ail th e operation of the ISL9206A.

Power-On Reset (POR)

The ISL9206A powers up in Sleep mode. It remains in Sleep

mode until a power-on ‘break’ co mmand is received from the

host through th e XSD bus. Th e initial power-on ’break’ can be

of any pulse wid th as long as i t is wider than the XSD input de-

glitch time (20µs). Once the ‘break’ comma nd is received, th e

internal regulator is powere d up. About 20µs after the falling

edge of the power-on ‘bre ak’, an internal POR circuit releases

the reset to the digital blo ck and a POR sequence i s st arted.

During the POR sequence, the ISL9206A in itializes itself by

loading the defaul t device configuration in fo rmatio n from pre-

assigned locations within the OTP ROM memory. After

initialization, a ‘break’ comma nd is returned to the host to

indicate that the ISL9206A is ready and wai ting for a bus

transaction from the host.

Note that th e ISL9206A will initia te the powe r-on sequence

without waiting for the powe r-on ‘brea k’ signal to return to the

high state . If the host sends an initi al ‘break’ pulse wider than

60µs, the device-ready ‘break’ retu rned by the ISL9206A will

likely be merged with the pulse sent by the host and,

therefore, may not be detectable. Figure 4 illustrates the

waveforms during the Power-on Reset. Figure 4A repre sent s

the case when the power-on ‘break’ rising edge occu rs af ter

the device start s sending the ‘break’. Figure 4B represents the

case when the power-on ‘break’ finishes be fore the device

sends its ‘break’. The device break signal is always 1.391

times of the device bit-time (BT, see XSD Bus Interface

section beginning on p age 8). Either case in Figure 4 will

wake-up the de vi ce successfully if the device is in the sleep

mode.

It is important to keep in mind that a narrow ‘break’ signal will

be taken as a normal bit signal and cause errors, if the

device is not in the sleep mode. For this reason, the narrow

power-on ‘break’ signal should be used only if the user has

to see the returned ‘break’ signal.

Auto-Sleep

While the ISL9206A is powered up and there is no bus

activity for more than about 1 second, the device will

automatically return to Sleep mode. Sleep mode can be

entered independent of whether the XSD bus is held high or

low. While the ISL 9206A is in Sleep mode, it is

recommended that the XSD bus be held low to eliminate

current drain through the XSD-pin internal pull-down current.

Auto-Sleep mode can be disabled by clearing the ASLP bit

in the MSCR register. By default, Au to-Sleep is always

enabled at power-up and after a soft reset. Auto-sleep

FIGURE 4A. WHEN THE HOST POWER-ON BREAK IS WIDER

THAN 60µs

FIGURE 4B. WHEN THE HOST POWER-ON IS NARROWER

THAN 60µs

FIGURE 4. POWER-ON BREAK SIGNAL TO WAKE-UP THE

ISL9206A FROM SLEEP MODE

HOST BREAK

DEVICE BREAK

XSD BUS

WAVEFORM

60µs

TYP

1.391

BTD

HOST BREAK

DEVICE BREAK

XSD BUS

WAVEFORM

ISL9206A

6FN6651.1

July 30, 2008

function can be permanently disabled by clearing the 0-00[2]

bit (the ASLP bit in DCFG) during OTP ROM progra mmin g.

OTP ROM

The 16-Byte OTP ROM memory is based on EEPROM

technology and is incorporated into the ISL9206A for storage

of non-volatile information. OTP ROM contents (refer to

Table 8) can include, but are not limited to:

1. Device default settings (address 0-00)

2. Factory programmed trim parameters (address 0-01)

3. Device authentication secrets (address 0-02 to 0-0D)

4. Pack information and ID (address 0-0E and 0-0F)

The memory can be written multiple times before two lock-out

bits (SLO[1:0 ] in DCFG, see Tabl e 8) are set. The SL O[1] (bit

1) locks out the memory between 0-02 and 0-09 and th e

SLO[0] (bit 0) locks out the memory between 0-0A to 0-0D.

These two bits can be set ind ependently. Prior to lock-out, the

memory can be written and read di rectly through the XSD bus

interface. After lock-out, w riting to all ROM addresses and

reading from secret code locations will be permanently

disabled af ter performing a rese t cycle.

Writing to the EEPROM requires the supply voltage at the VDD

pin be maintained at a minimum of 2.8V. Failure to do so may

result in unreliable ROM programming or total write failure.

The OTP ROM must be written two bytes at a time, but 2, 4

or 16-Bytes of data can be read by the host in a single bus

transaction. Only even addresses are allowed in OTP ROM

read/write. A 16-Byte read with CRC allows the entire ROM

content to be quickly verified by simply checking the CRC

byte. The DTRM address stores the default trimming

parameters and is a read-only address. The DCFG and

DTRM (0-00 and 0-01 addresses) need to be written

simultaneously but the data to the DRTM address is ignored.

The OTP ROM writing process takes approximately 1.8ms

per two-bytes. While the write process is t aking place, no bus

transaction is allowed. Attempting to access the ISL92 06A

during an on-going write process wi ll result in the de vice

ignoring the access instruction and i ssuing an interrupt to th e

host. The OTP ROM programming is register based, and may

be performed at the pack manufacturer’s facility.

Device Control and Status

The ISL9206A has a control and a status register. The

control register can be read and written by the host but the

status register is read only. Both registers cont ain the device

configuration information (see Table 9). The status register

also contains the device status information that may lead to

an interrupt signal to the host.

Following a host-initiated power-on ‘break’ signal or soft

reset command, the ISL9206A will configure its default mode

of operation based on information stored within DCFG

address of the OTP ROM. The default configuration is

loaded into the master cont rol (MSCR) and the status

(STAT) registers. Functions that are configured by OTP

ROM settings include:

1. Device address (DAB[1:0])

2. XSD bus speed (SPD[1:0])

3. Register default settings (eINT and ASLP)

4. ROM read/write lock-out (SLO[1:0])

The ISL9206A incorporates inte rrupt functions to allow the

host to be quickly informed of device status and error

conditions. Available interrupts are summarized in Table 1.

When an interrupt enable bit is set, a ’break’ command is

sent to the host whenever its corresponding interrupt status

bit is set. After this, the host should read the STAT register

immediately. If the following instruction frame from the host

does not access the STAT register, ano ther ‘break’ will be

sent immediately after receiving the full instruction frame.

This process is repeated until the host reads from the STAT

be cleared.

Refer to Tables 14 and 15 for detailed explanations of the

interrupt functions.

FlexiHash+™ Engine

The FlexiHash+™ engine contains a 32-Bit highly non-linear

proprietary hash engine and three registers. Table 10 lists

the three registers. The 1-Byte secret selection (SESL)

OTP ROM to program the hash engine. The 4-Byte

challenge code register (CHLG) receives the challenge code

from the host through the XSD bus. Once the challenge

code is received, the hash engine generates a 1-Byte

authentication result code and stores in the AUTH regi ster

for the host to read. Figure 5 shows the data flow of the

authentication process. The following sections describe the

authentication process and FlexiHash +™ encoding scheme

in detail.

THE DEVICE AUTHENTICATION PROCESS

To start an authentication process, the host sends a ‘break’

command to wake-up the ISL9206A. Then the host writes to

the SESL register to select the two sets of secret s to be used

for authentication code generation. After that, the host

generates a pseudo-random 4-Byte challenge code to input

into the CHLG register to initiate the authentication process.

Upon receiving the fourth byte of the challenge code, the

ISL9206A immediately starts computing the authentication

code. Once the computation is completed, the 8-Bit

authentication code is made available at the AUTH register

for the host to read out. The host reads this code and,

concurrently, calculates the correct authentication code

based on the challenge code it generated and the same

secrets chosen, and finally compares the result with the

authentication code read from the device. If the codes do not

match up, the device is a fake device and the host may shut

ISL9206A

7FN6651.1

July 30, 2008

itself down. The flow chart in Figure 6 summarizes the

process that the host needs to execute.

It is recommended that device authentication be done once

in a while to maximize its effectiveness. Before a new

challenge code can be accepted by the device, the SESL

seeds are re-loaded from the OTP ROM into the hash

engine prior to performing the next authentication code

calculation. Failure to follow the sequence will result is a bus

error, causing the sBER flag to be set in the STAT register.

SET-UP FOR DEVICE AUTHENTICATION SUPPORT

To configure the host and the ISL9206A to support device

authentication function, the pack manufacturer will need to

select at least 2 sets of 32-Bit secret codes. For greater

security, a third set of 32-Bit secret may be used. The

FlexiHash+™ engine requires two sets of 32-Bit secrets for

use in its hash calculation: the first set to define its the hash

function, and the second set to initialize its seed for the hash

calculation. These two sets can be selected from the same

secret location. The chosen secret codes are to be kept by

the pack manufacturer and maintained at utmost

confidentiality.

After the secrets have been determined, they are written into

the device’s OTP ROM. After verifying that the codes have

been written correctly, the relevant secrets’ lock-out bits at

the ROM address location 0-00 should be set. Once set, the

lock-out bits can no longer be cleared. Thereafter , read/write

access to the secret information will no longer be possible,

and the secret codes are made available only to the

FlexiHash+™ engine for generation of authentica tion code

based on a challenge code input from the host.

On the host side, the same secret codes will need to be kept,

and the same FlexiHash+™ engine will have to be

implemented in firmware. It is important that the secret

codes be stored scrambled in the host’s non-volatile memory

so that the secret information cannot be easily revealed by

monitoring signal transfer on the host PCB.

THE HASH ENGINE

The hash engine consists of a cascade of programmable

highly non-linear proprietary encoders. Details on the

proprietary encoder implementation will be made available to

users under NDA only.

FIGURE 5. AUTHENTICATION PROCESS FLOW DIAGRAM

FLEXIHASH+™

ENGINE

8-BIT AUTHENTICATION CODE

32-BIT PSEUDO-RANDOM

CHALLENGE WORD FROM HOST

64-BIT SECRET

32-BIT HASH FUNCTION

64-BIT HASH SEED

FIGURE 6. FLOW CHART FOR AUTHENTICATION PROCESS

START

WAKE UP ISL9206A USING A

REGULAR BREAK SIGNAL

SELECT HASH FUNCTION AND SEED

BY WRITING TO SESL REGISTER

SEND A 32-BIT RANDOM

CHALLENGE TO CHLG REGISTER

READ THE AUTHENTICATION

RESULT FROM AUTH REGISTER,

AFTER WAITING FOR 1 BTD

END

CALCULATE THE EXPECTED

AUTHENTICATION RESULT

BASED ON THE SAME SECRETS

THE TWO RESULTS MATCH?

SHUT DOWN

THE SYSTEM

YES

ISL9206A

8FN6651.1

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XSD Host Bus Interface

Communication with the host is achieved through XSD, a

light-weight subset of Intersil’s ISD single-wire bus interface.

XSD is a programmable-rate pseudo-synchronous

bidirectional host-initiated instru ction-based serial

communication interface that allows up to two slave devices

to be attached and addressed separately. It includes

features to enable quick and reliable communication. The

communication protocol is optimized for efficient transfer of

data between the device and the host. The following list

outlines the features supported by the XSD bus interface:

• Programmable bit-rate up to 23kbps

• Up to 2 devices can be connected to the host and

addressed separately

• 16-bit host instruction frame supports multi-byte register

read and write

• Built-in communication error detection

• CRC generation capability

• Supports interrupt signaling

• Integrated bus inactivity de tector for automatic activation

of sleep mode

XSD BUS PHYSICAL MODEL

The physical model of the XSD bus is shown in Figure 7.

The model shows a single-wire connection between the host

and the device, not including the ground signal. The input

logic on the device side is designed to be compatible with

any voltage between 1.8V to 5.0V. The host interface should

contain an open-drain or open-collector output. The pull-up

resistor RPU can be connected either to the host supply

voltage VDDH or the device supply voltage VDDD. Typically,

the host supply voltage should be used for pull-up.

DAT A TRANSFER PROTOCOL

To initiate a transaction, the host first sends a 16-b it

instruction frame to the device, followed by data byte

frame(s) if the instruction is a write operation. The instruction

frame consists of a chip-select code, operation code,

information, as shown in Figure 9. If the instruction is a read

operation, the device will re turn 1 to 17 byte frames of data

back to the host. The serial data transfer always takes place

with the LSB first. The following explains the bus symbols

and the transaction frames are introduced in later sections.

BUS SIGNALING SYMBOLS

The XSD bus is nominally held high. Various bus symbols

and commands are generated by active-low pulse width

modulation. Following are the set of valid bus signalin g

symbols supported by the XSD interface:

1) break (issued by host):

• used to wake the device up from Sleep mode (Note: a

narrow ‘break’ can also be used to wake up the device

from the Sleep mode, as described in “Power-On Reset

(POR)” on page 5)

• used to reset the device’s XSD bit counters and time

qualifiers

• used to signal a change in communicati on channel (from

one slave device to another)

2) break (issued by device):

• used as ‘device-ready’ indication to the host (after a

Soft-reset or wake-up from Sleep mode)

• used as an interrupt indicator

3) ‘1’ symbol:

• used for instruction and data coding

4) ‘0’ symbol:

• used for instruction and data coding

SYMBOL TIMING DEFINITIONS

Symbol timings are defined in terms of bit-time (BT),

determined by the selected bus transfer bit-rate

pre-programmed into the device’s OTP ROM location

0-00[5:4]. Selectable bus speeds are: 2.89kHz (x = 0.5),

5.78kHz (x = 1), 11.56kHz (x = 2) and 23.12kHz (x = 4).

An instruction or data frame consists of a sequence of ‘1’

and/or ‘0’ symbols. Figure 8 illustrates the timing definitions.

A ‘1’ symbol is nominally 0.3 BT wide while a ‘0’ symbol is

nominally 0.7 BT wide. One ‘1’ or ‘0’ symbol is represented

in each BT period. Any detected pulse width less than 0.124

BT wide will be interpreted as a glitch and will result in a bus

error. Table 2 and 3 summarize the timing definitions of all

the supported symbols and bus signali ng.

TABLE 1. INTERRUPT EVENT SUMMARY

CONDITION INTERRUPT

ENABLE BIT INTERRUPT

STATUS FLAG INTERRUPT EVENT

OTP ROM Write-in-

Progress eEEW

(fixed) sEEW Accessing the ISL9206A during an on-going ROM write process (used only during initial

OTP ROM programming).

XSD Bus Error eINT sBER XSD bus error or invalid instruction frame detected. Improper authentication sequence

detected.

Error eINT sACC Accessing protected registers.

ISL9206A

9FN6651.1

July 30, 2008

TABLE 2. HOST TIMING DEFINITIONS OF SYMBOLS AND BUS SIGNALING

PARAMETER SYMBOL DESCRIPTION MIN TYP MAX UNIT

Bit Time BTHx = 0.5, 1, 2, or 4 173.6/x µs

De-glitch period tg PW (Pulse Width) less than this will result in a frame error 0.124 BTH

‘1’ pulse width t1HPW in this range will be interpreted as a ‘1’ code 0.227 0.453 BTH

‘0’ pulse width t0HPW in this range will be interpreted as a ‘0’ code 0.591 0.824 BTH

‘break’ time tbHPW in this range will be interpreted as a ‘break’ command 1 100 BTH

NOTE: Unless otherwise stated, all pulse width (PW) referenced are with respect to an active-low pulse.

TABLE 3. DEVICE TIMING DEFINITIONS OF SYMBOLS AND BUS SIGNALING

PARAMETER SYMBOL DESCRIPTION MIN TYP MAX UNIT

Bit Time BTDx = 0.5, 1, 2, or 4 164.2/x 172.8/x 181.4/x µs

‘1’ pulse width t1D ‘1’ code transmit pulse width 0.304 BTD

‘0’ pulse width t0D ‘0’ code transmit pulse width 0.696 BTD

‘break’ time tbDPW in this range will be interpreted as a ‘break’ command 1.391 BTD

FIGURE 7. THE CIRCUIT MODEL FOR THE XSD SERIAL BUS

VDDD

VDDH

RPU

HOST

DEVICE

Open-Drain

Port Pin

1.5μA

ESD

Diode

ESD

Diode

6pF

OPEN-DRAIN

PORT PIN

ESD

DIODE

ESD

DIODE

FIGURE 8. THE BUS SIGNAL TIMING DIAGRAM

glitch

t1 t0 tb

XSD

10 Break

GLITCH BREAK

FIGURE 9. THE 16-BIT INSTRUCTION FRAME FIELD DEFINITION

015

OPCODEBANKADDRESSBYTES CS

015

OPCODEBANKADDRESSBYTES CS

015

OPCODEBANKADDRESSBYTES CS

BYTES ADDRESS BANK OPCODE CS

15 0

ISL9206A

10 FN6651.1

July 30, 2008

Access Instruction Frame

The XSD access instruction frame is shown in Figure 9. The

instruction frame consists of 16 bits of digital signal with the

contents described in the following.

CS FIELD

The CS field is a 1-bit Chip Address Selection. An initial 1-bit

Chip Address code of ‘0’ is pre-programmed into the

device’s OTP ROM address location 0-00[7:6] at the time of

chip manufacture, and ma y be re-programmed by the pack

manufacturer if needed. If the CS code in the instruction

does not match the device’s Chip Address code, the

instruction, and any subsequent frames that follow , will be

ignored until a break command is received.

OPCODE FIELD

The OPCODE is a 2-bit field that defines the operation of the

transaction following the instruction frame. The operations

are described in Table 4.

BANK FIELD

The memories in the ISL9206A are divided into four banks.

The BANK field is defined in Table 5.

ADDRESS FIELD

The address field indicates the sta rting address of a memory

or register read or write sequence . Keep in mind that only odd

starting addresses are all owed fo r the OTP ROM access.

BYTES FIELD

The bytes field indicates the number of data bytes to read or

write, not including the CRC byte. Not all BYTES Field

settings are supported. Only settings marked with an ‘X’ are

valid for a particular bus instruction, as indicated in Table 6.

Attempting to read or write with an invalid BYTES setting

may yield unpredictable results.

Writing to OTP ROM can occur at only two bytes at a time,

but reading from OTP ROM can happen at 2, 4 or 16 byte s

at a time. Writing to and reading from OTP ROM in any other

byte denomination will yield unpredictable results and should

therefore be strictly prohibited.

Bus Transaction Protocol

The XSD bus for the ISL9206A defines three types of bus

transactions. Figure 10 shows the bus transaction protocol.

The blue color represents the signal sent by the host and the

green color stands for the signal sent by the device. Before

the transaction starts, the host should make sure that the

XSD device is not in the sleep mode. One method is to

always send a ‘break’ signal before starting the transaction,

as shown in Figure 10. If the device is not in the sleep mode,

the ‘break’ signal is not mandatory. The ‘break’ pulse width

may appear to be wider than what the host sends out

because of the reason explained in Figure 4. The symbols in

Figure 10 are explained in Table 7.

TABLE 4. DEFINITION OF THE OPCODE FIELD

OPCODE DESCRIPTION ACTION

00 Write Operation Write to device register

01 Read Operation (normal) Read from device register

10 Read Operation (with CRC) Read from device register. Append 1-Byte CRC to the end of the last read frame.

11 Sleep Mode Activation Immediately sets the device in Sleep mode.

Note: After detecting the ‘11’ Opcode, the device immediately enters sleep mode. If more than 3 bits

sent, subsequent pulses may wake the device up again.

TABLE 5. BANK FIELD DEFINITION.

BANK MEMORY/REGISTER BANK SELECTION

00 OTP ROM

01 Control and Status Registers

10 Device Authentication Registers

11 Test Registers (Reserved)

TABLE 6. DEFINITION OF THE BYTES FIELD

BYTES

FIELD DATA BYTES

TO FOLLOW OTP ROM

WRITE OTP ROM

READ REG READ

OR WRITE CHLG CO DE

WRITE COMMENTS

0 0 Invalid selection. Causes a bus error.

1 1 X Must use 1-Byte read for clearing of the STAT register.

22XXX

3 N/A Invalid selection. Causes a bus error.

44 X X

5 to 6 N/A Invalid selection. Causes a bus error.

7 16 X For reading from OTP ROM only (prior to lock-out).

ISL9206A

11 FN6651.1

July 30, 2008

Passive CRC Support

The CRC feature only supports the read transaction in the

ISL9206A. When the OPCODE in the instructi on is ‘10’, an

8-Bit CRC is automatically calculated for the data bytes

being transferred out. The CRC result is then appended after

the last data byte is read out.

CRC is generated using the DOW CRC polynomial as

shown in Equation 1:

The CRC generation algorithm is logically illustrated in

Figure 11. Prior to a new CRC calculation, the LFSR (linear

feedback shift register) is initialized to zero. The read data to

be transmitted out is concurrently shifted into the CRC

calculator. After the actual data is transmitted out, the final

content of the LFSR is the resulting CRC value. This value is

transmitted out after the read data, with LSB being

transmitted out first.

Analog Biasing Components and Clock Generation

The analog section of the ISL9206A mainly includes the

T ime Base Generator and the internal regulator for powering

the circuits in the ISL9206A.

TIME BASE GENERATOR

A time base generator is included on-chip to provide timing

reference for serial data encoding and decoding at the XSD

bus interface. This eliminates the need for an external

crystal. The time base oscillator is trimmed during

manufacturing to a nominal frequency of 532.5kHz. It has a

frequency tolerance better than 5% over operating supply

voltage and temperature range.

TABLE 7. SYMBOLS IN THE BUS TRANSACTION PROTOCOL

SYMBOL DESCRIPTION MIN TYP MAX

IFGHHost inter-frame gap 0 BTH800ms

IFGDDevice inter-frame gap 1 BTD

TAHHost turn-around time 1 BTH800ms

TADDevice turn-around time 1 BTD

Polynom 1 X4X5X8

+++=(EQ. 1)

FIGURE 10A. MULTI-BYTE WRITE INSTRUCTION

FIGURE 10B. MULTI-BYTE READ INSTRUCTION

FIGURE 10C. BACK-TO-BACK TRANSACTION (READ FOLLOWED BY WRITE)

FIGURE 10. XSD BUS TRANSACTION PROTOCOL. THE ‘BREAK’ SIGNAL IS OPTIONAL IF THE DEVICE IS AWAKE

IFGHH

Write Instruction Frame Data Frame 1 Data Frame 2

IFG

break TSD WRITE INSTRUCTION FRAME DATA FRAME 1 DATA FRAME 2

BREAK tSD IFGHIFGH

TAD

Read Instruction Frame Data Frame 1

(output from slave) (output from slave)

Data Frame 2

IFGD

break TSD READ INSTRUCTION FRAME DATA FRAME 1 DATA FRAME 2

(OUPUT FROM SLAVE) (OUPUT FROM SLA VE)

BREAK tSD tAD

tADIFGD

(output from slave)

Read Instruction Frame Data Frame Next Instruction

Frame

TA TAH

break TSD READ INSTRUCTION FRAME DATA FRAME 1

(OUPUT FROM SLAVE)

NEXT INSTRUCTION

FRAME

BREAK tSD tADtAH

1st

Stage 2nd

Stage 3rd

Stage 4th

Stage 5th

Stage 7th

Stage 8th

Stage

Serial

Output

6th

Stage

LSB MSB

FIGURE 11. THE CRC CALCULATOR FOR THE PASSIVE CRC SUPPORT

Data

Serial

1ST

STAGE 2ND

STAGE 3RD

STAGE 4TH

STAGE 5TH

STAGE 6TH

STAGE 7TH

STAGE 8TH

STAGE

MSB

SERIAL

DATA

LSB

ISL9206A

12 FN6651.1

July 30, 2008

INTERNAL VOLTAGE REGULATOR

The ISL9206A incorporates an internal voltage regulator that

maintains a nominal operating voltage of 2.5V within the

device. The regulator draws power directly from the VDD

input. No external component is required to regulate circuit

voltage. The regulator is shut off during Sleep mode.

Memory/Operational Register Description

The ISL9206A memory and register structure is organized

into 4 banks of 256 addressable locatio ns. However, not all

of the addressable registers are used nor implemented.

Accessing an unimplemented register will result in the

access instruction being ignored. A bus error indication may

or may not be flagged.

Bank 0 is dedicated for the OTP ROM. There are 16 memory

locations implemented in the array. W riting to the OTP ROM

has no immediate effect on the chip operation until a

Power-on Reset occurs, or a soft reset is issued. Table 7

describes the OTP ROM memory assignment. The default

factory setting for address [0:00] is given in Table 11.

Bank 1 contains the Control and Status registers. Only 2

registers are implemented. Table 8 shows the register map

of the Bank 1 registers. Detailed descriptions of register

settings are given in Tables 14 and 15.

Bank 2 contains the Authentication registers. Only 3

registers are implemented. These registers are used during

the battery pack authentication process. Table 10 describes

the mapping of the Authentication registers.

Bank 3 is reserved for Intersil production testing only and will

not be accessible during normal operation. Accessing the

Test and Trim Registers when not in test mode will result in a

bus error.

TABLE 8. OTP ROM MEMORY MAP (BANK 0)

ADDRESS NAME DESCRIPTION BIT 7 BIT 6 BIT 5 BIT 4 BIT3 BIT 2 BIT 1 BIT 0

0-00 DCFG Default Configuration DAB[1:0] SPD[1:0] eINT ASLP SLO[1:0]

0-01 DTRM Default Trimming HSF TIBB[2:0] TOSC[3:0]

0-02 SE1A Auth Secret #1A S1A[7:0]

0-03 SE1B Auth Secret #1B S1B[7:0]

0-04 SE1C Auth Secret #1C S1C[7:0]

0-05 SE1D Auth Secret #1D S1D[7:0]

0-06 SE2A Auth Secret #2A S2A[7:0]

0-07 SE2B Auth Secret #2B S2B[7:0]

0-08 SE2C Auth Secret #2C S2C[7:0]

0-09 SE2D Auth Secret #2D S2D[7:0]

0-0A SE3A Auth Secret #3A S3A[7:0]

0-0B SE3B Auth Secret #3B S3B[7:0]

0-0C SE3C Auth Secret #3C S3C[7:0]

0-0D SE3D Auth Secret #3D S3D[7:0]

0-0E INF1 General Purpose General purpose non-volatile memory for storage of model ID, date code, and other

cell information

0-0F INF2 General Purpose

NOTE: Information stored in address 0-0E (INF1) and 0-0F (INF2) is for use by the host firmware only . Actual content depends on the host firmware

customization preference.

TABLE 9. CONTROL AND STATUS REGISTERS (BANK 1)

ADDRESS NAME DESCRIPTION BIT 7 BIT 6 BIT 5 BIT 4 BIT3 BIT 2 BIT 1 BIT 0

1-00 MSCR Master Control eEEW eINT -- -- -- -- ASLP SRST

1-01 STAT Device Status sEEW sBER sACC -- DAB[1:0] SLO[1:0]

ISL9206A

13 FN6651.1

July 30, 2008

ADDRESS 0-00: DEFAULT CONFIGURATION (DCFG)

This address location stores the defa ult configuratio n when

the ISL9206A is manufactured. Table 11 describes each bit in

detail. The legend for the TYPE column is give n in Table 13 .

ADDRESS 0-01: DEFAULT TRIM SETTING (DTRM)

This address location is writable only when the device is in

test mode. During normal operation, any data written to it will

be ignored. Table 12 describes the DTRM address in detail.

ADDRESS 0-02/03/04/05: AUTHENTICATION SECRET

SET #1 (SE1A/B/C/D)

These address locations store the first set of secrets to be used

for hash calculation. Reading and writing to this register can be

disabled by setting the SLO[1] bit at OTP ROM location 0-00[1].

ADDRESS 0-06/07/08/09: AUTHENTICATION SECRET

SET #2 (SE2A/B/C/D)

These address locations store the second set of secrets to

be used for hash calculation. Reading and writing to this

ROM location 0-00[1 ].

TABLE 10. AUTHENTICATION REGISTERS (BANK 2)

ADDRESS NAME DESCRIPTION BIT 7 BIT 6 BIT 5 BIT 4 BIT3 BIT 2 BIT 1 BIT 0

2-00 SESL Secrets Selection -- -- -- -- CSL[1:0] SSL[1:0]

2-01 CHLG Challenge Code Register CHLG[31:0]

2-05 AUTH Authentication Code Register AUTH[7:0]

TABLE 11. DEFAULT CONFIGURATION (DCFG) REGISTER SETTINGS

BIT NAME TYPE DEFAULT DESCRIPTION

7:6 DAB[1:0] RW 00 Device Address Bit Setting:

00: device responds only when CS field in instruction frame is’0’

01: device responds to any CS field value in instruction frame

10: device responds to any CS field value in instruction frame

11: device responds only when CS field in instruction frame is ‘1’

5:4 SPD[1:0] RW 01 XSD Bus Speed Setting: Configures the bit rate of the XSD bus interface.

00: 0.5x (2.89kbps)

01: 1x (5.78kbps)

10: 2x (11.56kbps)

11: 4x (23.12kbps)

3eINT RW 1 Power-on default setting of eINT bit in the MSCR register.

2ASLP RW 1 Power-on default setting of ASLP bit in the MSCR register.

1:0 SLO[1:0] RW 00 Secrets Lock-out Bits:

Bit 1: Read/Write lock-out bit for address locations 0-02 to 0-09 (Secret Set #1 and #2)

Bit 0: Read/Write lock-out bit for address locations 0-0A to 0-0D (Secret Set #3)

NOTE: Once Bit 0 or Bit 1 is set, writing to the OTP ROM will permanently be disabled

(after a reset cycle).

TABLE 12. DEFAULT TRIMMING (DTRM) REGISTER SETTINGS

BIT NAME TYPE DEFAULT DESCRIPTION

7HSF R 0Unused

6:4 TIBB[2:0] R -- Reference Current Trim Setting

3:0 TOSC[3:0] R -- Oscillator Frequency Trim Setting

TABLE 13. LEGEND FOR THE TYPE COLUMN

TYPE READ ACTION WRITE ACTION

R Read-only Data read Data ignored

W Write-only Zeros read Data written

RW Read/Write Data read Data written

RC Clear after read Data read, then

cleared Data ignored

WC Clear after write Zeros read Data written, then

cleared

<> Default setting loaded from designated OTP ROM bit

locations

WWriting disabled after lock-out

ISL9206A

14 FN6651.1

July 30, 2008

ADDRESS 0-0A/0B/0C/0D: AUTHENTICATION SECRET

SET #3 (SE3A/B/C/D)

These address locations store the optional third set of

secrets to be used for hash calculation. Reading and writing

to this register can be disabled by setting the SLO[0] bit at

OTP ROM location 0-00[0].

Alternately, this memory space can be used to store

additional cell informa tion which can be accessed by the

host. In this case, the SLO[0] bit should not be set.

TABLE 14. MASTER CONTROL REGISTER (MSCR)

BIT NAME TYPE DEFAULT DESCRIPTION

7eEEW R 0

<1/0> OTP ROM Write-in-Progress Interrupt Enable: When enabled, it allows the sEEW bit to flag an

interrupt whenever the sEEW bit is set by its interrupt event. The eEEW bit is fixed at ‘1’ when none

of the OTP ROM lock-out bits are set. When any or both of the lock-out bit s are set, the eEEW bit

will become permanently ‘0’ after a reset.

6eINT RW 0

<1> Global Interrupt Enable: When enabled, it allows the sBER or sACC bit to flag an interrupt to the

host whenever any of the respective interrupt events occur.

(Default setting loaded from OTP ROM location 0-00[3])

5:2 -- R 0 Unused.

1ASLP RW 0

<1> Auto Sleep Mode Enable: When set, the ISL9206A will automatically enter Sleep mode after about

1s of XSD bus inactivity. When cleared, the device can only enter Sleep mode on Opcode

command.

(Default setting loaded from OTP ROM location 0-00[2])

0 SRST WC 0 Soft Reset: When a ‘1’ is written, and all registers are reset to their default states, all bus counters

and timers are reset to their start-up conditions, and device configuration information is reloaded

from OTP ROM. After the reset sequence is completed, a ‘break’ pulse is sent to the host.

TABLE 15. DEVICE STATUS REGISTER (STAT)

BIT NAME TYPE DEFAULT DESCRIPTION

7 sEEW RC 0 OTP ROM Write-in-Progress Flag: This bit is set when an attempt is made by the host to read from

or write to the ISL9206A while the ROM is still processing the previous write instruction.

6 sBER RC 0 XSD Bus Error Flag: This bit is set when one or more of the following occurs at the bus interface:

a) An invalid pulse width is received

b) Bus activity is detected before the device completes its power-up sequence

c) An invalid BYTES field in the instruction frame

d) Improper authentication sequence is detected

e) Reading secret information after the corresponding lock-out bits are set

5 sACC RC 0 Register Access Error Flag: This bit is set whenever an instruction frame attempts to access a

protected register as follows:

a) Writing to OTP ROM after the ISL9206A has been locked out (any or both of the lock-out bits

set)

b) Accessing the ISL9206A’s Test and Trim Registers when the device is not in test mode

4-- R 0Unused

3:2 DAB[1:0] R 00

<00> Device Address Bit Setting:

Loaded from OTP ROM location 0-00[7:6] during power-up.

1:0 SLO[1:0] R 00

<00> Secrets Lock-out Bits Setting:

Loaded from OTP ROM location 0-00[1:0] during power-up.

ISL9206A

15 FN6651.1

July 30, 2008

ADDRESS 0-0E/0F: GENERAL PURPOSE MEMORY

(INF1/2)

These address locations can be used to store information

like model ID, date code, and other cell information, whi c h

can be read by the host.

ADDRESS 1-00: MASTER CONTROL REGISTER (MSCR)

The Master Control Register is defined in Table 14. The

MSCR register can be both read or written by the host

through the XSD bus.

ADDRESS 1-01: DEVICE STATUS REGISTER (STAT)

The STAT register is defined in Table 15. All status bits will be

cleared upon a read to this register. The STAT is a read-only

ADDRESS 2-00: SECRETS SELECTION REGISTER

(SESL)

This register must be written to re-load the hash engine with

secrets stored in OTP ROM prior to presenting a new

challenge code word input.

ADDRESS 2-01: CHALLENGE CODE INPUT REGISTER

(CHLG)

This register is used to input the 32-Bit challenge code

generated by the host for device authentication. All four

bytes of the challenge code should be written sequentially to

this register, starting with the least-sign ificant byte. After the

fourth challenge byte is received, the authentication code

generation process will start. This CHLG is a write-only

ADDRESS 2-05: AUTHENTICATION CODE OUTPUT

This register is used to output the 8-Bit authentication code

calculated from the 32-Bit challenge code. The register

content may be read only once after each challenge code

word is written to the device. Subsequent read to this

error condition.

Applications Information

XSD Bus Implementation

There are two ways to implement the XSD host in a

microprocessor. One way is to use a spare UART (Universal

Asynchronous Receiver/Transmitter). A GPIO (General

Purpose Input/Output) can be used if no UART is available

for the XSD communication. Refer to application note

AN1167 available from Intersil for more information

regarding how to implement the XSD bus within a

microprocessor.

Pull-up Resistor Selection

Since there is an internal pull-down current on the XSD pin,

as shown in Figure 7, it is important to choose a pull-up

resistor value that is low enough so that the small amount of

pull-down current through the resistor does no t cause the

bus voltage to droop below the VIH specification under any

condition. 5kΩ is a typical resistance used for pull-up.

In applications that the device supply voltage is lower than

2.6V (such as an application powered by a single-cell NiMH

battery), or a device that has no power source at all, the

ISL9206A can be powered by the XSD bus. The application

circuit is shown in Figure 2. The conditi on for such

application circuit to function properly is that the bus pull-up

voltage is 3.3V or 5V. The bus pull-up voltage will charge the

capacitor C1 through an internal ESD diode, as shown in

Figure 7. The ESD diode has 0.4V drop typically.

ESD Rating

The ISL9206A ESD specification is ra ted at 4kV of the

Human Body Model. When the ISL9206A is used in a

handheld accessory, higher ESD rating is typically required.

External components are required to enhance the ESD

performance.

Additional Application Information

See “Related Literature” on page 1 for additional application

information.

TABLE 16. SECRETS SELECTION REGISTER (SESL)

BIT NAME TYPE DEFAULT DESCRIPTION

7:4 -- R 0000 Unused

3:2 CSL[1:0] RW 01 Coefficient Definition Secret Selection: Selects the authentication secret code word stored in

OTP ROM to be used as the coefficient definition code for the FlexiHash+™ engine.

00: invalid selection

01: Authentication Secret Set #1

10: Authentication Secret Set #2

11: Authentication Secret Set #3

1:0 SSL[1:0] RW 10 Seed Secret Selection: Selects the authentication secret code word stored in OTP ROM to be

used as the secret seed for the FlexiHash+™ engine.

00: invalid selection

01: Authentication Secret Set #1

10: Authentication Secret Set #2

11: Authentication Secret Set #3

ISL9206A

16 FN6651.1

July 30, 2008

ISL9206A

Small Outline Transistor Plastic Packages (SOT23-5)

AA1

0.20 (0.008) M

0.10 (0.004) C

-C-

SEATING

PLANE

123

VIEW C

4X θ1

GAUGE PLANE

SEATING

αL2

PLANE

BASE METAL

WITH

PLATING

P5.064

5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.036 0.057 0.90 1.45 -

A1 0.000 0.0059 0.00 0.15 -

A2 0.036 0.051 0.90 1.30 -

b 0.012 0.020 0.30 0.50 -

b1 0.012 0.018 0.30 0.45

c 0.003 0.009 0.08 0.22 6

c1 0.003 0.008 0.08 0.20 6

D 0.111 0.118 2.80 3.00 3

E 0.103 0.118 2.60 3.00 -

E1 0.060 0.067 1.50 1.70 3

e 0.0374 Ref 0.95 Ref -

e1 0.0748 Ref 1.90 Ref -

L 0.014 0.022 0.35 0.55 4

L1 0.024 Ref. 0.60 Ref.

L2 0.010 Ref. 0.25 Ref.

N5 55

R 0.004 - 0.10 -

R1 0.004 0.010 0.10 0.25

α0o8o0o8o-

Rev. 2 9/03

NOTES:

1. Dimensioning and tolerance per ASME Y14.5M-1994.

2. Package conforms to EIAJ SC-74 and JEDEC MO178AA.

3. Dimensions D and E1 are exclusive of mold flash, protrusions,

or gate burrs.

4. Footlength L measured at reference to gauge plane.

5. “N” is the number of terminal positions.

6. These Dimensions apply to the flat section of the lead between

0.08mm and 0.15mm from the lead tip.

7. Controlling dimension: MILLIMETER. Converted inch dimen-

sions are for reference only.

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No lice nse is gran t ed by i mpli catio n or other wise u nder an y p a tent or patent rights of Inter sil or it s sub sidi aries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN6651.1

July 30, 2008

ISL9206A

Thin Dual Flat No-Lead Plastic Package (TDFN)

NX (b)

SECTION "C-C"

(A1)

BOTTOM VIEW

AREA

INDEX

0.10

0.08

SIDE VIEW

0.15

C0.15

TOP VIEW

AREA

INDEX

NX L

E2/2

REF.

(Nd-1)Xe

(DATUM A)

(DATUM B)

0.10

N-1

PLANE

SEATING

NX b

D2/2

NX k

FOR EVEN TERMINAL/SIDE

TERMINAL TIP

L8.2x3A

8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

SYMBOL

MILLIMETERS

NOTESMIN NOMINAL MAX

A 0.70 0.75 0.80 -

A1 - - 0.05 -

A3 0.20 REF -

b 0.20 0.25 0.32 5,8

D 2.00 BSC -

D2 1.50 1.65 1.75 7,8

E 3.00 BSC -

E2 1.65 1.80 1.90 7,8

e 0.50 BSC -

k0.20 - - -

L 0.30 0.40 0.50 8

N82

Nd 43

Rev. 0 6/04

NOTES:

1. Dimensioning and tolerancing conform to ASME Y14.5-1994.

2. N is the number of terminals.

3. Nd refers to the number of terminals on D.

4. All dimensions are in millimeters. Angles are in degrees.

5. Dimension b applies to the metallized terminal and is measured

between 0.25mm and 0.30mm from the terminal tip.

6. The configuration of the pin #1 identifier is optional, but must be

located within the zone indicated. The pin #1 identifier may be

either a mold or mark feature.

7. Dimensions D2 and E2 are for the exposed pads which provide

improved electrical and thermal performance.

8. Nominal dimensions are provided to assist with PCB Land

Pattern Design efforts, see Intersil Technical Brief TB389.