DATASHEET ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E The Intersil ISL32x7xE are 16.5kV IEC61000-4-2 ESD Protected, 3.0V to 5.5V powered, QUAD transmitters for balanced communication using the RS-422 standard. These drivers have very low output leakage currents (10A), so they present a low load to the RS-422 bus. FN6824 Rev 2.00 August 13, 2015 Features * IEC61000 ESD protection on RS-422 outputs . . 16.5kV - Class 3 ESD level on all other pins . . . . . . . 12kV HBM - High machine model ESD level on all pins. . . . . . 700V * Wide supply range . . . . . . . . . . . . . . . . . . . . 3.0V to 5.5V Driver (Tx) outputs are tri-statable, and incorporate a hot plug feature to keep them disabled during power-up and down. Versions are available with a common EN/EN (`172 pinout), a two channel EN12/EN34 (`174 pinout), or a versatile combination of individual and group channel enables (see Table 1). * Specified for +125C operation * Available in industry standard pinouts (`172/'174) or in a space saving QFN (ISL32179E) with added features * Logic supply pin (VL) eases operation in mixed supply systems (ISL32179E only) * User selectable data rate (ISL32179E only) The ISL32372E, ISL32374E utilize slew rate limited drivers which reduce EMI and minimize reflections from improperly terminated transmission lines, or from unterminated stubs in multidrop and multipoint applications. Drivers on the other versions are not limited, so they can achieve the 10Mbps or 32Mbps data rates. All versions are offered in industrial and extended industrial (-40C to +125C) temperature ranges. * Hot plug - Tx outputs remain three-state during power-up and power-down * Low Tx leakage allows > 256 devices on the bus * High data rates . . . . . . . . . . . . . . . . . . . . . . up to 32Mbps * Low quiescent supply current. . . . . . . . . . . . 0.8mA (max) - Low shutdown supply current . . . . . . . . . . . . . . . . 60A A 50% smaller footprint (compared to the TSSOP) is available with the ISL32179E's QFN package. This device also features a logic supply pin (VL), that sets the switching points of the enable and DI inputs to be compatible with a lower supply voltage in mixed voltage systems. Two speed select pins allow the ISL32179E user to select from three slew rate options for 460kbps, 10Mbps, or 32Mbps data rates. Individual channel and group enable pins increase the ISL32179E's flexibility. * Current limiting and thermal shutdown for driver overload protection * Tri-statable Tx outputs * 5V tolerant logic inputs when VCC 5V * Pb-free (RoHS compliant) Applications * Telecom equipment * Motor controllers/encoders * Programmable logic controllers * Industrial/process control networks TABLE 1. SUMMARY OF FEATURES PART NUMBER DATA FUNCTION RATE (Mbps) SLEW RATE LIMITED? HOT VL PLUG? PIN? TX ENABLE TYPE LOW QUIESCENT POWER PIN ICC (mA) SHUTDOWN? COUNT ISL32172E 4 Tx 32 NO YES NO EN, EN <1 NO 16 ISL32272E 4 Tx 10 NO YES NO EN, EN <1 NO 16 ISL32372E (No longer available or supported) 4 Tx 0.46 YES YES NO EN, EN <1 NO 16 ISL32174E 4 Tx 32 NO YES NO EN12, EN34 <1 NO 16 ISL32274E (No longer available or supported) 4 Tx 10 NO YES NO EN12, EN34 <1 NO 16 ISL32374E (No longer available or supported) 4 Tx 0.46 YES YES NO EN12, EN34 <1 NO 16 ISL32179E 4 Tx YES YES <1 YES 24 FN6824 Rev 2.00 August 13, 2015 32, 10, 0.46 SELECTABLE Indiv. and group enables Page 1 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Pinouts ISL32174E, ISL32274E, ISL32374E (16 LD N-SOIC, TSSOP) TOP VIEWS ISL32172E, ISL32272E, ISL32372E (16 LD N-SOIC, TSSOP) TOP VIEWS DI1 1 16 VCC DI1 1 Y1 2 15 DI4 Y1 2 Z1 3 D D EN 4 Z2 5 Y2 6 D D 14 Y4 Z1 3 13 Z4 EN12 4 12 EN Z2 5 11 Z3 Y2 6 16 VCC 15 DI4 D D 14 Y4 13 Z4 12 EN34 D D 11 Z3 DI2 7 10 Y3 DI2 7 10 Y3 GND 8 9 DI3 GND 8 9 DI3 Y1 DI1 SHDNEN VCC VL DI4 ISL32179E (24 LD QFN) TOP VIEW 24 23 22 21 20 19 Z1 1 18 Y4 EN1 2 17 Z4 EN2 3 16 EN4 EN 4 15 EN3 Z2 5 7 8 9 10 11 12 GND SPB DI3 Y3 13 Z3 SPA 6 DI2 Y2 14 EN EP Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (C) PACKAGE (RoHS Compliant) PKG. DWG. # ISL32172EFBZ ISL32172 EFBZ -40 to +125 16 Ld SOIC M16.15 ISL32172EFVZ 32172 EFVZ -40 to +125 16 Ld TSSOP MDP0044 ISL32172EIBZ ISL32172 EIBZ -40 to +85 16 Ld SOIC M16.15 ISL32172EIVZ 32172 EIVZ -40 to +85 16 Ld TSSOP MDP0044 ISL32174EFVZ 32174 EFVZ -40 to +125 16 Ld TSSOP MDP0044 ISL32174EIBZ ISL32174 EIBZ -40 to +85 16 Ld SOIC M16.15 ISL32179EFRZ 321 79EFRZ -40 to +125 24 Ld QFN L24.4x4C ISL32179EIRZ 321 79EIRZ -40 to +85 24 Ld QFN L24.4x4C ISL32272EFBZ ISL32272 EFBZ -40 to +125 16 Ld SOIC M16.15 ISL32272EFVZ 32272 EFVZ -40 to +125 16 Ld TSSOP MDP0044 ISL32274EFBZ (No longer available or supported) ISL32274 EFBZ -40 to +125 16 Ld SOIC M16.15 ISL32274EFVZ (No longer available or supported) 32274 EFVZ -40 to +125 16 Ld TSSOP MDP0044 ISL32274EIBZ (No longer available or supported) ISL32274 EIBZ -40 to +85 16 Ld SOIC M16.15 ISL32274EIVZ (No longer available or supported) 32274 EIVZ -40 to +85 16 Ld TSSOP MDP0044 FN6824 Rev 2.00 August 13, 2015 Page 2 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Ordering Information (Continued) PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (C) PACKAGE (RoHS Compliant) 16 Ld SOIC PKG. DWG. # ISL32372EFBZ (No longer available or supported) ISL32372 EFBZ -40 to +125 M16.15 ISL32372EFVZ (No longer available or supported) 32372 EFVZ -40 to +125 16 Ld TSSOP MDP0044 ISL32372EIBZ (No longer available or supported) ISL32372 EIBZ -40 to +85 16 Ld SOIC M16.15 ISL32372EIVZ (No longer available or supported) 32372 EIVZ -40 to +85 16 Ld TSSOP MDP0044 ISL32374EFBZ (No longer available or supported) ISL32374 EFBZ -40 to +125 16 Ld SOIC M16.15 ISL32374EFVZ (No longer available or supported) 32374 EFVZ -40 to +125 16 Ld TSSOP MDP0044 ISL32374EIBZ (No longer available or supported) ISL32374 EIBZ -40 to +85 16 Ld SOIC M16.15 ISL32374EIVZ (No longer available or supported) 32374 EIVZ -40 to +85 16 Ld TSSOP MDP0044 NOTES: 1. Add "-T" suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E. For more information on MSL, please see tech brief TB363. Truth Tables ISL32172E, ISL32272E, ISL32372E INPUTS ISL32179E OUTPUTS INPUTS OUTPUTS EN EN DIX ZX YX X 0 1/0 0/1 1/0 0 X X X X X Z Z Chan X outputs disabled 1 X 0/1 1/0 0/1 X 0 1 X X X Z Z All outputs disabled 0 1 X Z Z 1 X 0 1/0 1 1 1 1 X 0/1 1 1 1 X 0 1/0 0 1 1 1 X 0/1 0 1 1 X 0 1/0 X* 0 1 1 X 0/1 X* 0 ENX EN EN DIX SPA SPB ZX YX NOTE: Z = Tri-state ISL32174E, ISL32274E, ISL32374E INPUTS OUTPUTS EN12 EN34 DIX Z1 Y1 Z2 Y2 Z3 Y3 Z4 Y4 0 0 X Z Z Z Z Z Z Z Z 0 1 1/0 Z Z Z Z 0/1 1/0 0/1 1/0 1 0 1/0 0/1 1/0 0/1 1/0 Z Z Z Z 1 1 1/0 0/1 1/0 0/1 1/0 0/1 1/0 0/1 1/0 COMMENTS 0/1 1/0 Individual ENX controls chan X (32Mbps) 1/0 0/1 0/1 1/0 Individual ENX controls chan X (10Mbps) 1/0 0/1 0/1 1/0 Individual ENX controls chan X (460kbps) 1/0 0/1 NOTE: *Keep SPA = 1 for lowest current in SHDN. If using individual channel enables, and the SHDN mode, connect EN and EN to VCC for the lowest SHDN current. ISL32179E enters SHDN when SHDNEN = 1 and all channels are disabled. Z = Tri-state. NOTE: Z = Tri-state FN6824 Rev 2.00 August 13, 2015 Page 3 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Pin Descriptions PIN FUNCTION EN, EN Group driver output enables, that are internally pulled high to VCC. All ISL32x72E driver outputs, Y and Z, are enabled by driving EN high OR EN low, and the outputs are high impedance when EN is low AND EN is high (i.e., if using only the active high EN, connect EN directly to VCC or VL; if using only the active low EN, connect EN directly to GND). On the ISL32179E accomplish group enable by connecting all the ENX pins to VCC or VL, and then use the EN or EN pin as previously described. If the group driver enable function isn't required (see Note 4), connect EN to VCC, or connect EN to GND. (ISL32x72E and ISL32179E only) EN12, EN34 Paired driver output enables, that are internally pulled high to VCC. Driving EN12 (EN34) high enables Channel 1 and 2 (3 and 4) outputs (Y and Z). Driving EN12 (EN34) low disables Channel 1 and 2 (3 and 4) outputs. If the driver enable function isn't required (see Note 4), connect EN12 and EN34 to VCC. (ISL32x74E only) ENx Individual driver output enables that are internally pulled high to VCC. Forcing ENx high (along with EN high OR EN low) enables the channel X outputs (Y and Z). Driving ENX low disables the Channel X outputs, regardless of the states of EN and EN. Connect both EN and EN to VCC for the lowest SHDN current if utilizing SHDN mode (see SHDNEN below). If the individual driver enable function isn't required (see Note 4), connect ENX to VCC. (ISL32179E only) SHDNEN Low power SHDN mode enable. A high level allows the ISL32179E to enter a low power mode when all channels are disabled. A low level prevents the device from entering the low power mode. (ISL32179E only) DIx Driver input. A low on DI forces the corresponding channel's output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low. SPA, SPB GND Speed select inputs that are internally pulled-high. See ISL32179E Truth Table on page 3. (ISL32179E only) Ground connection. This is also the potential of the QFN thermal pad. Yx 16.5kV IEC61000-4-2 ESD Protected RS-422 level, noninverting transmitter output. Zx 16.5kV IEC61000-4-2 ESD Protected RS-422 level, inverting transmitter output. VCC System power supply input (3.0V to 5.5V). On devices with a VL pin powered from a separate supply, power-up VCC first. VL Logic power supply input. Connecting the VL pin to the lower voltage power supply of a logic device (e.g., UART or controller) interfacing with the ISL32179E tailors its logic pin (DI, EN (all varieties), SHDNEN, and SP) VIL/VIH levels to values compatible with the lower supply voltage. If VL and VCC are different supplies, power-up this supply after VCC, and keep VL VCC. (ISL32179E only) EP Thermal Pad. Connect the EP to GND. (ISL32179E only) NOTE: 4. Unused EN pins of any type should not be left floating, even though they have internal pull-ups. FN6824 Rev 2.00 August 13, 2015 Page 4 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Typical Operating Circuits (1 of 4 Channels Shown) +3.3V TO 5V +3.3V TO 5V + 16 VCC 0.1F 0.1F + 16 VCC ISL32x73E 3 RO ISL32x72E R A 2 B 1 RT 2 Y 3 Z D 12 EN DI 1 EN 4 EN 12 EN GND GND 4 8 8 FIGURE 1. NETWORK USING GROUP ENABLES +3.3V TO 5V +3.3V TO 5V + 16 VCC 0.1F 0.1F + 16 VCC ISL32x75E RT A1 2 3 RO1 4 ISL32x74E R B1 1 2 Y1 3 Z1 EN12 4 D DI1 1 EN12 GND GND 8 8 FIGURE 2. NETWORK USING PAIRED ENABLES 1.8V +3.3V TO 5V +3.3V TO 5V + 22 21 0.1F 0.1F 21 VCC VL 9 SHDNEN VCC LOGIC DEVICE (P, ASIC, UART) 15 EN 4 EN 1 RO1 20 VL SHDNEN 22 ISL32179E EN 14 EN1-EN4 2, 3,15,16 Y DI 23 Z D EN 4 VCC ISL32x77E A1 24 R 2.5V + RT B1 23 2 EN1 GND 10 USING INDIVIDUAL CHANNEL ENABLES AND CONFIGURED FOR LOWEST SHDN SUPPLY CURRENT NOTE: IF POWERED FROM SEPARATE SUPPLIES, POWER-UP VCC BEFORE VL 24 1 VCC LOGIC DEVICE P, ASIC, UART) GND 9 USING ACTIVE HIGH GROUP ENABLE AND CONFIGURED FOR LOWEST SHDN SUPPLY CURRENT NOTE: IF POWERED FROM SEPARATE SUPPLIES, POWER-UP VCC BEFORE VL FIGURE 3. NETWORK WITH VL PIN FOR INTERFACING TO LOWER VOLTAGE LOGIC DEVICES FN6824 Rev 2.00 August 13, 2015 Page 5 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Absolute Maximum Ratings Thermal Information VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V VL to GND (ISL32179E Only) . . . . . . . . . . . . . -0.3V to (VCC +0.3V) Input Voltages DI, EN (all varieties) . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V Output Voltages Y, Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Output Current Y, Z (per output, continuous, TJ 125C) . . . . . . . . . . . . . 100mA ESD Rating . . . . . . . . . . . . . . . . See Specification Table on page 7 Thermal Resistance (Typical) JA (C/W) JC (C/W) 80 N/A 16 Ld SOIC Package (Note 5) . . . . . . . 16 Ld TSSOP Package (Note 5) . . . . . 105 N/A 24 Ld QFN Package (Notes 6, 7). . . . . 42 5 Maximum Junction Temperature (Plastic Package) . . +150C Maximum Storage Temperature Range . . . . . . . . . .-65C to +150C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493 Operating Conditions Temperature Range ISL32x7xEF . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +125C ISL32x7xEI. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to +85C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379 for details. 7. For JC, the "case temp" location is the center of the exposed metal pad on the package underside. Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V and 4.5V to 5.5V; VL = VCC (ISL32179E only); Typicals are at VCC = 3.3V or VCC = 5V, TA = +25C; unless otherwise specified (Notes 8, 12). PARAMETER TEMP (C) MIN (Note 11) No load Full 2.5 - VCC RL = 100 (RS-422) (see VCC 3V Figure 4) VCC 4.5V Full 2 2.6 - Full 3 4 - V IO = -20mA, VOH Full 2.4 2.7 - V SYMBOL TEST CONDITIONS TYP MAX (Note 11) UNIT DC CHARACTERISTICS Differential VOUT Single-ended VOUT (Y or Z) Change in Magnitude of Driver Differential VOUT for Complementary Output States VOD VO V IO = 20mA, VOL Full - 0.2 0.4 V VOD RL = 100 (see Figure 4) Full - 0.01 0.2 V VOC RL = 100 (see Figure 4) Full - 2.6 3 V Change in Magnitude of Driver Common-mode VOUT for Complementary Output States VOC RL = 100 (see Figure 4) Full - 0.01 0.2 V Input High Voltage (Logic Pins, Note 16) VIH1 VL = VCC if ISL32179E VCC 3.6V Full 2.2 - - V VCC 5.5V, DI Full 2.7 - - V Driver Common-mode VOUT VIH2 Full 2.4 - - V VIH3 2.7V VL < 3.0V (ISL32179E only) VCC 5.5V, ENs Full 2 - - V VIH4 2.3V VL < 2.7V (ISL32179E only) Full 1.6 - - V VIH5 1.6V VL < 2.3V (ISL32179E only) Full 0.72*VL - - V VIH6 1.5V VL < 1.6V (ISL32179E only) +25 - 0.45*VL - V VIL1 VL = VCC if ISL32179E Full - - 0.8 V VIL2 VL 2.7V (ISL32179E only) Full - - 0.6 V VIL3 2.3V VL < 2.7V (ISL32179E only) Full - - 0.6 V VIL4 1.6V VL < 2.3V (ISL32179E only) Full - - 0.22*VL V VIL5 1.5V VL < 1.6V (ISL32179E only) +25 - 0.25*VL - V VIH2E Input Low Voltage (Logic Pins, Note 16) FN6824 Rev 2.00 August 13, 2015 Page 6 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V and 4.5V to 5.5V; VL = VCC (ISL32179E only); Typicals are at VCC = 3.3V or VCC = 5V, TA = +25C; unless otherwise specified (Notes 8, 12). (Continued) PARAMETER Logic Input Current Output Leakage Current (Y, Z) Driver Short-circuit Current, VO = High or Low Thermal Shutdown Threshold SYMBOL TEST CONDITIONS TEMP (C) MIN (Note 11) TYP -1 - MAX (Note 11) UNIT IIN1 DIX = 0V or VCC Full IIN2 SP, EN, EN, ENX, SHDNEN = 0V or VCC Full -15 9 15 A IIN3 EN12, EN34 = 0V or VCC Full -30 18 30 A EN = 0, VCC = 0V to 5.5V, -0.25 VO 6V Full -10 - 10 A EN = 0, VCC = 3V to 5.5V, VO = 0V to VCC +25 -8 - 8 nA IOZ IOSD1 1 A (Note 18) -30 - 30 nA EN = 1, VY or VZ = 0V (Note 9) Full - - 150 mA EN = 1, VY or VZ = VCC (Note 9) Full - - 200 mA Full - 160 - C DI = 0V or VCC, EN = 1 Full - 0.6 0.8 mA DI = 0V or VCC, all outputs disabled (Note 17), SHDNEN = 1 (ISL32179E only) Full - 60 90 A IEC61000-4-2, from bus Air gap pins to GND Contact +25 - 16.5 - kV +25 - 9 - kV Human Body Model, from bus pins to GND +25 - 15 - kV TSD SUPPLY CURRENT No-load Supply Current Shutdown Supply Current ICC ISHDN ESD PERFORMANCE RS-422 Pins (Y, Z) All Pins HBM, per MIL-STD-883 Method 3015 +25 - 12 - kV Machine Model +25 - 700 - V VOD = 1.5V, CD = 820pF (see Figure 7) Full 460 4000 - kbps tPLH, tPHL RDIFF = 100, CD = 50pF (see Figure 5) Full - 90 300 ns RDIFF = 100, CD = 50pF (see Figure 5) Full - 55 150 ns DRIVER SWITCHING CHARACTERISTICS (ISL32372E, ISL32374E, ISL32179E, 460kbps) Maximum Data Rate Driver Single-ended Output Delay Driver Single-ended Output Skew fMAX tSSK Channel-to-channel Output Delay Skew tSKCC (Figure 5, Note 13) Full - 60 200 ns Part-to-part Output Delay Skew tSKPP (Figure 5, Note 10) Full - - 300 ns Driver Differential Output Skew tDSK RDIFF = 100, CD = 50pF (see Figure 5) Full - 2 60 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 100, CD = 50pF (see Figure 5) Full 60 100 220 ns Driver Enable to Output High tZH SW = GND (see Figure 6, Note 14) Full - - 200 ns Driver Enable to Output Low tZL SW = VCC (see Figure 6, Note 14) Full - - 200 ns Driver Disable from Output High tHZ SW = GND (see Figure 6) Full - - 100 ns Driver Disable from Output Low tLZ SW = VCC (see Figure 6) Full - - 100 ns Driver Enable from SHDN to High tSDH ISL32179E only, SW = GND (see Figure 6, Note 15) Full - - 750 ns Driver Enable from SHDN to Low tSDL ISL32179E only, SW = VCC (see Figure 6, Note 15) Full - - 750 ns Full 10 20 - Mbps tPLH, tPHL RDIFF = 100, CD = 50pF (see Figure 5) Full - 13 25 ns RDIFF = 100, CD = 50pF (see Figure 5) Full - 2 9 ns DRIVER SWITCHING CHARACTERISTICS (ISL32272E, ISL32274E, ISL32179E, 10Mbps) Maximum Data Rate Driver Single-ended Output Delay Driver Single-ended Output Skew fMAX tSSK VOD = 1.5V, CD = 400pF (see Figure 7) Channel-to-channel Output Delay Skew tSKCC (Figure 5, Note 13) Full - 6 12 ns Part-to-part Output Delay Skew tSKPP (Figure 5, Note 10) Full - - 20 ns Driver Differential Output Skew tDSK RDIFF = 100, CD = 50pF (see Figure 5) Full - 2 6 ns Driver Differential Rise or Fall Time tR, tF RDIFF = 100, CD = 50pF (see Figure 5) Full 7 11 20 ns Driver Enable to Output High tZH SW = GND (see Figure 6, Note 14) Full - - 20 ns Driver Enable to Output Low tZL SW = VCC (see Figure 6, Note 14) Full - - 20 ns FN6824 Rev 2.00 August 13, 2015 Page 7 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Electrical Specifications Test Conditions: VCC = 3.0V to 3.6V and 4.5V to 5.5V; VL = VCC (ISL32179E only); Typicals are at VCC = 3.3V or VCC = 5V, TA = +25C; unless otherwise specified (Notes 8, 12). (Continued) PARAMETER SYMBOL Driver Disable from Output High TEST CONDITIONS TEMP (C) MIN (Note 11) TYP tHZ SW = GND (see Figure 6) Full - - tLZ MAX (Note 11) UNIT 20 ns SW = VCC (see Figure 6) Full - - 20 ns Driver Enable from SHDN to High tSDH ISL32179E only, SW = GND (see Figure 6, Note 15) Full - - 750 ns Driver Enable from SHDN to Low tSDL ISL32179E only, SW = VCC (see Figure 6, Note 15) Full - - 750 ns Driver Disable from Output Low DRIVER SWITCHING CHARACTERISTICS (ISL32172E, ISL32174E, ISL32179E, 32Mbps) VOD = 1.5V, CD = 100pF (see Figure 7) Full 32 50 - Mbps tPLH, tPHL RDIFF = 100, CD = 50pF (see Figure 5) Full 3 8 15 ns Maximum Data Rate Driver Single-ended Output Delay fMAX RDIFF = 100, CD = 50pF (see Figure 5) Full - 1 3.5 ns Channel-to-channel Output Delay Skew tSKCC (Figure 5, Note 13) Full - 3 5.5 ns Part-to-part Output Delay Skew tSKPP (Figure 5, Note 10) Full - - 8 ns Driver Differential Output Skew tDSK RDIFF = 100, CD = 50pF (see Figure 5) Full - 0.5 2 ns Driver Differential Rise or Fall Time tR, tF Driver Single-ended Output Skew tSSK RDIFF = 100, CD = 50pF (see Figure 5) Full - 7 12 ns tZH SW = GND (see Figure 6, Note 14) Full - - 20 ns Driver Enable to Output Low tZL SW = VCC (see Figure 6, Note 14) Full - - 20 ns Driver Disable from Output High tHZ SW = GND (see Figure 6) Full - - 20 ns tLZ Driver Enable to Output High SW = VCC (see Figure 6) Full - - 20 ns Driver Enable from SHDN to High tSDH ISL32179E only, SW = GND (see Figure 6, Note 15) Full - - 750 ns Driver Enable from SHDN to Low tSDL ISL32179E only, SW = VCC (see Figure 6, Note 15) Full - - 750 ns Driver Disable from Output Low NOTES: 8. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise specified. 9. Applies to peak current. See "Typical Performance Curves" beginning on page 12 for more information. 10. tSKPP is the magnitude of the difference in propagation delays of the specified terminals of two units tested with identical test conditions (VCC, temperature, etc.). 11. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 12. EN = 0 indicates that the output(s) under test are disabled via the appropriate logic pin settings. EN = 1 indicates that the logic pins are set to enable the output(s) under test. 13. Channel-to-channel skew is the magnitude of the worst case delta between any two propagation delays of any two outputs on the same IC, at the same test conditions. 14. For ISL32179E, keep SHDNEN low to avoid entering SHDN. 15. Keep SHDNEN high to enter SHDN when all transmitters are disabled (ISL32179E only). 16. Logic Pins are the DIs, the enable variants, and SHDNEN. 17. Only one of the SPX pins low, plus EN1-EN4 low with EN and EN high, or EN low and EN high with EN1-EN4 high. 18. Temperature range is -20C to +40C. FN6824 Rev 2.00 August 13, 2015 Page 8 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Test Circuits and Waveforms RL/2 EN VCC OR VL Z DI VOD D Y VOC RL/2 FIGURE 4. DC DRIVER TEST CIRCUITS DI LOWER OF VCC OR VL 1.5V 1.5V 0V tPHL tPLH OUT (Y) VCC OR VL EN tSSK Z DI RDIFF D VOH 50% 50% tSSK VOL tPLH tPHL CD VOH 50% 50% OUT (Z) Y VOL SIGNAL GENERATOR tDDLH DIFF OUT (Y - Z) tDDHL 90% 0V 10% tR tF tSSK = |tPLH(Y OR Z) - tPHL(Z OR Y)| FIGURE 5A. TEST CIRCUIT +VOD 90% 0V 10% -VOD tDSK = |tDDLH - tDDHL| FIGURE 5B. MEASUREMENT POINTS FIGURE 5. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES EN DI SIGNAL GENERATOR Z 110 VCC D SW Y 3V OR VL EN 1.5V GND 0V 50pF tZH tSDH PARAMETER OUTPUT DI SW tHZ Y/Z 1/0 GND tLZ Y/Z 0/1 VCC tZH (Note 14) Y/Z 1/0 GND tZL (Note 14) Y/Z 0/1 VCC tSDH (Note 15) Y/Z 1/0 GND tSDL (Note 15) Y/Z 0/1 VCC FIGURE 6A. TEST CIRCUIT 1.5V OUTPUT HIGH tHZ VOH - 0.5V 50% OUT (Y, Z) VOH 0V tZL tSDL OUT (Y, Z) tLZ VCC 50% OUTPUT LOW VOL + 0.5V V OL FIGURE 6B. MEASUREMENT POINTS FIGURE 6. DRIVER ENABLE AND DISABLE TIMES FN6824 Rev 2.00 August 13, 2015 Page 9 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Test Circuits and Waveforms (Continued) VCC OR VL EN + Z DI 100 D CD Y LOWER OF VCC OR VL DI 0V VOD - SIGNAL GENERATOR +VOD DIFF OUT (Y - Z) -VOD 0V FIGURE 7B. MEASUREMENT POINTS FIGURE 7A. TEST CIRCUIT FIGURE 7. DRIVER DATA RATE Application Information RS-422 is a differential (balanced) data transmission standard for use in long haul or noisy environments. RS-422 is a point-to-multipoint (multidrop) standard, which allows only one driver and up to 10 (assuming one unit load devices) receivers on each bus. Driver Features These RS-422 drivers are differential output devices that deliver at least 2V across a 100 load. The drivers feature low propagation delay skew to maximize bit width, and to minimize EMI. EN3 and EN4 together. For individual channel enables, again connect EN and EN high, and drive the appropriate ENX (active high) for the particular channel. All of the enable pins incorporate pull-up resistors to VCC, but unused enable pins of any type should be externally connected high, rather than being left floating. Connecting to VCC is the best choice, but VL may be utilized as long as SHDN power isn't a primary concern (for each VL connected input, ICC increases by ((VCC - VL)/600k). If VCC or VL transients might exceed 7V, then inserting a series resistor between the input(s) and the supply limits the current that will flow if the input's ESD protection starts conducting. The 460kbps driver outputs are slew rate limited to minimize EMI, and to reduce reflections in unterminated or improperly terminated networks. Outputs of the 10Mbps and 32Mbps drivers are not limited, so faster output transition times allow the higher data rates. ENX Driver Enable Functions EN All product types include functionality to allow disabling of the Tx outputs. The ISL32x72E types feature group (all four Tx) enable functions that are active high (EN) or active low (EN). Drivers enable when EN = 1, or when EN = 0, and they disable only when EN = 0 and EN = 1. ISL32x74E versions use active high paired enable functions (EN12 and EN34) that enable (when high) or disable (when low) the corresponding pairs of Tx. All four of these enable pins have internal pull-up resistors to VCC, but unused enable pins that need to be high (e.g., EN when using the EN input for enable control, or EN12 and EN34 when using always enabled drivers) should always be connected externally to VCC. If VCC transients might exceed 7V, then inserting a series resistor between the input(s) and VCC limits the current that will flow if the input's ESD protection starts conducting. The ISL32179E has the most flexible enable scheme. Its six enable pins allow for group, paired, or individual channel enable control. Figure 8 details the ISL32179E's internal enable logic. To utilize a group enable function, connect all the ENx pins high, and handle the EN and EN pins as described in the previous paragraph. For paired enables, connect EN and EN high (for the lowest current in SHDN mode, if SHDN is used) and tie EN1 and EN2 together, and FN6824 Rev 2.00 August 13, 2015 1 OF 4 CHANNELS VCC VCC CHX EN EN VCC FIGURE 8. ISL32179E ENABLE LOGIC Wide Supply Range These ICs are designed to operate with a wide range of supply voltages from 3.0V to 5.5V, and they meet the RS-422 specifications for that full supply voltage range. 5.5V TOLERANT LOGIC PINS Logic input pins (driver inputs, enables, SHDNEN) contain no ESD nor parasitic diodes to VCC (nor to VL), so they withstand input voltages exceeding 5.5V regardless of the VCC and VL voltages. Input voltages up to 7V are easily tolerated. Logic Supply (VL Pin, ISL32179E Only) Note: If powered from separate supplies, power-up VCC before powering up the VL supply. If unused enable pins are connected to VL rather than to VCC, then a small ICC ((VCC - VL)/600k) will flow due to the internal pull-up resistor connecting to VCC. The ISL32179E includes a VL pin that powers the logic inputs (driver inputs, enables, SHDNEN). These pins Page 10 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E interface with "logic" devices such as UARTs, ASICs, and controllers, and today most of these devices use power supplies significantly lower than 3.3V. Thus, the logic device's low VOH might not exceed the VIH of a 3.3V or 5V powered DI or enable input. Connecting the VL pin to the power supply of the logic device (as shown in Figure 9) reduces the DI and enable input switching points to values compatible with the logic device's output levels. Tailoring the logic pin input switching points to the supply voltage of the UART, ASIC, or controller eliminates the need for a level shifter/translator between the two ICs. VCC = +3.3V VCC = +2V Hot Plug Function When a piece of equipment powers up, there is a period of time where the processor or ASIC driving the RS-422 control lines (EN, EN, ENx) is unable to ensure that the RS-422 Tx outputs remain disabled. If the equipment is connected to the bus, a driver activating prematurely during power-up may drive invalid data on the bus. To avoid this scenario, this family incorporates a "Hot Plug" function. During power-up, circuitry monitoring VCC ensures that the Tx outputs remain disabled for a period of time, regardless of the state of the enable pins. This gives the processor/ASIC a chance to stabilize and drive the RS-422 control lines to the proper states. ESD Protection DI EN GND VIH 2 TXD VOH 2 VIH 2 DEN VOH 2 ISL32172E GND UART/PROCESSOR VCC = +3.3V VCC = +2V VL DI EN GND VIH = 0.85V TXD VOH 2 VIH = 0.85V ISL32179E IEC61000-4-2 Testing DEN VOH 2 All pins on these devices include class 3 (>12kV) Human Body Model (HBM) ESD protection structures, but the RS-422 pins (driver outputs) incorporate advanced structures allowing them to survive ESD events in excess of 15kV HBM, and 16.5kV to IEC61000-4-2. The RS-422 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, and without degrading the RS-422 common mode range of -0.3V to +6V. This built-in ESD protection eliminates the need for board level protection structures (e.g., transient suppression diodes), and the associated, undesirable capacitive load they present. GND UART/PROCESSOR FIGURE 9. USING VL PIN TO ADJUST LOGIC LEVELS VL can be anywhere from VCC down to 1.5V, and Table 2 indicates typical VIH and VIL values for various VL settings so the user can ascertain whether or not a particular VL voltage meets his needs. TABLE 2. VIH AND VIL vs VL FOR VCC = 3.3V OR 5V VL (V) VIH (V) VIL (V) 1.6 0.7 0.45 2 0.85 0.6 2.3 1.1 0.75 2.7 1.4 (DI), 1.1 (ENs) 0.85 2.7 2 0.8 3.3 2.2 0.8 The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-422 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The IEC61000 standard's lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device's RS-422 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-422 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results. The RS-422 pins withstand 16.5kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap FN6824 Rev 2.00 August 13, 2015 Page 11 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 9kV. Devices in this family survive 9kV contact discharges on the RS-422 pins. Data Rate, Cables and Terminations exceeds the RS-422 specification. A novel design sets the short circuit current limit depending on the VCC value, so unlike some competing devices, the VCC = 5V short circuit current is only slightly higher than the corresponding VCC = 3.3V level (see Figure 15). RS-422 is intended for network lengths up to 4000', but the maximum system data rate decreases as the transmission length increases. Devices operating at 32Mbps handle lengths up to 328' (100m) in 5V systems, and lengths up to 200' (62m) in 3.3V systems (see Figures 34 and 35). The 460kbps versions can operate at full data rates with lengths of thousands of feet. Note that system jitter requirements may limit a network to shorter distances. In the event of a major short circuit condition, devices also include a thermal shutdown feature that disables the drivers whenever the die temperature becomes excessive. This eliminates the power dissipation, allowing the die to cool. The drivers automatically reenable after the die temperature drops about 20. If the fault persists, the thermal shutdown/reenable cycle repeats until the fault is cleared. Twisted pair is the cable of choice for RS-422 networks. Twisted pair cables tend to pick up noise and other electromagnetically induced voltages as common mode signals, which are effectively rejected by the differential receivers in RS-422 ICs. With TA = +125C and VCC = 5.5V, four 100 differentially terminated drivers in the TSSOP package put the IC at the edge of its maximum allowed junction temperature. Using larger termination resistors, a lower maximum supply voltage, or one of the packages with a lower thermal resistance (JA) provides more safety margin. When designing for +125C operation, be sure to measure the application's switching current, and include this in the thermal calculations. Proper termination is imperative, when using the 10Mbps or 32Mbps devices, to minimize reflections. Short networks using the 460kbps versions need not be terminated, but, terminations are recommended unless power dissipation is an overriding concern. In point-to-point, or point-to-multipoint (multiple receivers on bus) networks, the main cable should be terminated in its characteristic impedance (typically 120) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main cable should be kept as short as possible. Built-In Driver Overload Protection The driver output stages incorporate short circuit current limiting circuitry which ensures that the output current never Typical Performance Curves High Temperature Operation Low Power Shutdown Mode (ISL32179E Only) These BiCMOS transmitters all use a fraction of the power required by their bipolar counterparts, but the QFN version includes a shutdown feature that reduces the already low quiescent ICC by 90%. The ISL32179E enters shutdown (SHDN) whenever the SHDNEN pin is high and all four drivers are disabled (see "Pin Descriptions" on page 4). Note that the enable times from SHDN are longer than the enable times when the IC isn't in SHDN. VCC = VL = 3.3V or 5V, TA = +25C, unless otherwise specified. VL notes apply to the ISL32179E only. 4.3 +85C +25C 90 80 DIFFERENTIAL OUTPUT VOLTAGE (V) DRIVER OUTPUT CURRENT (mA) 110 100 +85C 70 +25C 60 +125C 50 +125C 40 30 20 VCC = 3.3V 10 0 0 0.5 VCC = 5V 1.0 1.5 2.0 2.5 3.0 3.5 4.0 DIFFERENTIAL OUTPUT VOLTAGE (V) 4.5 5.0 FIGURE 10. DRIVER OUTPUT CURRENT vs DIFFERENTIAL OUTPUT VOLTAGE FN6824 Rev 2.00 August 13, 2015 RDIFF = 100 4.1 VCC = 5V 3.9 3.7 3.5 3.3 3.1 2.9 VCC = 3.3V 2.7 2.5 -40 -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 125 FIGURE 11. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs TEMPERATURE Page 12 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Typical Performance Curves +25C 140 100 +125C +25C 80 +85C VCC = 3.3V +125C RDIFF = 60 40 20 VOL 0 0 1.0 1.5 2.0 2.5 Y OR Z OUTPUT VOLTAGE (V) 3.0 500 60 40 20 VOL 0 0.5 VOH 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Y OR Z OUTPUT VOLTAGE (V) 4.5 5.0 FIGURE 13. DRIVER SINGLE-ENDED (Y OR Z) OUTPUT CURRENT vs OUTPUT VOLTAGE 150 VCC = 5V VCC = 3.3V 100 OUTPUT CURRENT (mA) 450 400 350 300 Y OR Z = LOW 50 0 -50 VCC = 3.3V -100 250 VCC = 3.3V 200 -40 -25 VCC = 5V -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 125 -150 -0.5 0 Y OR Z = HIGH 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 OUTPUT VOLTAGE (V) FIGURE 15. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT VOLTAGE FIGURE 14. SUPPLY CURRENT vs TEMPERATURE 60 94 VL = 1.6V TO VCC tSSK 92 VCC = 5V 50 90 40 SKEW (ns) PROPAGATION DELAY (ns) VCC = 5V RDIFF = +125C 80 0 EN = VCC VCC = 5V +125C +25C +85C 100 3.3 FIGURE 12. DRIVER SINGLE-ENDED (Y OR Z) OUTPUT CURRENT vs OUTPUT VOLTAGE ICC (A) 120 VOH 0.5 +25C +85C +85C DRIVER OUTPUT CURRENT (mA) DRIVER OUTPUT CURRENT (mA) 120 VCC = VL = 3.3V or 5V, TA = +25C, unless otherwise specified. VL notes apply to the ISL32179E only. (Continued) 88 86 tDDLH tSSK VCC = 3.3V 30 VL = 1.6V TO VCC 20 84 tDDHL 10 82 VCC = 3.3V OR 5V tDSK 80 -40 -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 125 FIGURE 16. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL32372E, ISL32374E, ISL32179E, 460kbps OPTION) FN6824 Rev 2.00 August 13, 2015 0 -40 -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 125 FIGURE 17. DRIVER SKEW vs TEMPERATURE (ISL32372E, ISL32374E, ISL32179E, 460kbps OPTION) Page 13 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Typical Performance Curves VCC = VL = 3.3V or 5V, TA = +25C, unless otherwise specified. VL notes apply to the ISL32179E only. (Continued) 20 3.0 18 17 VL = 1.6V TO VCC 2.5 tDDLH tSSK VL = 1.6V, VCC = 3.3V OR 5V 16 SKEW (ns) PROPAGATION DELAY (ns) 19 tDDHL 15 14 2.0 1.5 13 12 tDDLH 11 10 -40 1.0 VL = VCC = 3.3V OR 5V tDSK tDDHL -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 0.5 -40 110 125 FIGURE 18. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL32272E, ISL32274E, ISL32179E, 10Mbps OPTION) -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 125 FIGURE 19. DRIVER SKEW vs TEMPERATURE (ISL32272E, ISL32274E, ISL32179E, 10Mbps OPTION) 1.2 16 15 1.0 13 tDDLH 12 VL = 1.6V, VCC = 3.3V OR 5V tDDHL 11 SKEW (ns) 0.8 10 8 tDSK tDDLH 7 tDDHL -25 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 0 1.5 Y DRIVER OUTPUT (V) 2 Y-Z -1 -2 -3 TIME (40ns/DIV) FIGURE 22. DRIVER WAVEFORMS, LOW TO HIGH (ISL32372E, ISL32374E, ISL32179E) FN6824 Rev 2.00 August 13, 2015 -10 5 20 35 50 65 TEMPERATURE (C) 80 95 110 125 FIGURE 21. DRIVER SKEW vs TEMPERATURE (ISL32172E, ISL32174E, ISL32179E, 32Mbps OPTION) VH = VCC OR VL 3 0 DRIVER INPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) VH Z -25 VCC = 3.3V, VL = 1.6V TO VCC RDIFF = 100, CD = 50pF DI 1 0 -40 110 125 FIGURE 20. DRIVER DIFFERENTIAL PROPAGATION DELAY vs TEMPERATURE (ISL32172E, ISL32174E, ISL32179E, 32Mbps OPTION) VCC = 3.3V, VL = 1.6V TO VCC VL 3V, VCC = 3.3V OR 5V 0.2 VL 3V, VCC = 3.3V OR 5V DRIVER OUTPUT (V) 6 -40 0 VL = 1.6V to VCC, VCC = 3.3V OR 5V tSSK 0.6 0.4 9 3.0 VL = 1.6V, VCC = 3.3V OR 5V tDSK RDIFF = 100, CD = 50pF VH DI 0 3.0 1.5 Y Z 0 VH = VCC OR VL 3 2 1 0 -1 -2 -3 Y-Z TIME (40ns/DIV) FIGURE 23. DRIVER WAVEFORMS, HIGH TO LOW (ISL32372E, ISL32374E, ISL32179E) Page 14 of 20 DRIVER INPUT (V) PROPAGATION DELAY (ns) 14 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E VCC = 5V, VL = 1.6V TO VCC DI 0 5.0 Y VH = VCC OR VL 5 4 2 Y-Z 0 -2 -4 -5 VH DI 0 5.0 2.5 Y Z 0 VH = VCC OR VL 5 4 2 0 Y-Z -2 -4 -5 TIME (40ns/DIV) TIME (40ns/DIV) FIGURE 24. DRIVER WAVEFORMS, LOW TO HIGH (ISL32372E, ISL32374E, ISL32179E) DI 0 3.0 1.5 Z Y 0 DRIVER INPUT (V) VH DRIVER OUTPUT (V) VCC = 3.3V, VL = 1.6V TO VCC RDIFF = 100, CD = 50pF VH = VCC OR VL 3 DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) VCC = 3.3V, VL = 1.6V TO VCC FIGURE 25. DRIVER WAVEFORMS, HIGH TO LOW (ISL32372E, ISL32374E, ISL32179E) 2 1 Y-Z 0 -1 -2 -3 VH DI 0 3.0 1.5 Y Z 0 VH = VCC OR VL 3 2 1 0 Y-Z -1 -2 -3 TIME (10ns/DIV) TIME (10ns/DIV) FIGURE 26. DRIVER WAVEFORMS, LOW TO HIGH (ISL32272E, ISL32274E, ISL32179E) Z Y VH = VCC OR VL 5 4 2 0 DRIVER OUTPUT (V) 0 DRIVER INPUT (V) VH 5.0 0 VCC = 5V, VL = 1.6V TO VCC RDIFF = 100, CD = 50pF DI 2.5 FIGURE 27. DRIVER WAVEFORMS, HIGH TO LOW (ISL32272E, ISL32274E, ISL32179E) DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) VCC = 5V, VL = 1.6V TO VCC Y-Z -2 -4 -5 TIME (10ns/DIV) FIGURE 28. DRIVER WAVEFORMS, LOW TO HIGH (ISL32272E, ISL32274E, ISL32179E) FN6824 Rev 2.00 August 13, 2015 RDIFF = 100, CD = 50pF DRIVER INPUT (V) 0 RDIFF = 100, CD = 50pF RDIFF = 100, CD = 50pF VH DI 0 5.0 2.5 Y Z 0 VH = VCC OR VL 5 4 2 0 -2 -4 -5 Y-Z TIME (10ns/DIV) FIGURE 29. DRIVER WAVEFORMS, HIGH TO LOW (ISL32272E, ISL32274E, ISL32179E) Page 15 of 20 DRIVER INPUT (V) 2.5 Z DRIVER INPUT (V) VH DRIVER INPUT (V) RDIFF = 100, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) VCC = 5V, VL = 1.6V TO VCC VCC = VL = 3.3V or 5V, TA = +25C, unless otherwise specified. VL notes apply to the ISL32179E only. (Continued) DRIVER OUTPUT (V) Typical Performance Curves ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Z 1.5 Y VH = VCC OR VL DRIVER OUTPUT (V) 3 2 1 Y-Z 0 -1 -2 -3 TIME (10ns/DIV) VH 0 5.0 2.5 0 Z Y DRIVER INPUT (V) VH = VCC OR VL 5 4 2 DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) RDIFF = 100, CD = 50pF DI Y-Z 0 -2 -4 -5 TIME (10ns/DIV) 3 DRIVER OUTPUT (V) DRIVER OUTPUT (V) 0 DRIVER + CABLE DELAY 3.0 1.5 Y-Z 0 -1.5 -3.0 3.0 +85C 1.5 Y-Z 0 -1.5 -3.0 (~288ns) DRIVER INPUT (V) 32Mbps DI +125C TIME (80ns/DIV) FIGURE 34. WORST CASE (NEGATIVE) FIVE PULSE DRIVER WAVEFORMS DRIVING 200 FEET (62m) OF CAT5 CABLE (SINGLE TERMINATED WITH 121) (ISL32172E, ISL32174E, ISL32179E) FN6824 Rev 2.00 August 13, 2015 0 3.0 1.5 Y Z 0 VH = VCC OR VL 3 2 1 0 Y-Z -1 -2 -3 TIME (10ns/DIV) VCC = 5V, VL = 1.6V TO VCC RDIFF = 100, CD = 50pF VH DI 0 5.0 2.5 Y Z 0 VH = VCC OR VL 5 4 2 0 Y-Z -2 -4 -5 TIME (10ns/DIV) FIGURE 33. DRIVER WAVEFORMS, HIGH TO LOW (ISL32172E, ISL32174E, ISL32179E) FIGURE 32. DRIVER WAVEFORMS, LOW TO HIGH (ISL32172E, ISL32174E, ISL32179E) VCC = VL = 3V VH DI FIGURE 31. DRIVER WAVEFORMS, HIGH TO LOW (ISL32172E, ISL32174E, ISL32179E) FIGURE 30. DRIVER WAVEFORMS, LOW TO HIGH (ISL32172E, ISL32174E, ISL32179E) VCC = 5V, VL = 1.6V TO VCC RDIFF = 100, CD = 50pF DRIVER INPUT (V) 0 DRIVER OUTPUT (V) 3.0 0 VCC = 3.3V, VL = 1.6V TO VCC 32Mbps VCC = VL = 4.5V 5 DI 4.5 3.0 1.5 0 -1.5 -3.0 -4.5 4.5 3.0 1.5 0 -1.5 -3.0 -4.5 0 DRIVER + CABLE DELAY (~472ns) DRIVER INPUT (V) DI DRIVER INPUT (V) VH DRIVER INPUT (V) RDIFF = 100, CD = 50pF DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) DRIVER OUTPUT (V) VCC = 3.3V, VL = 1.6V TO VCC VCC = VL = 3.3V or 5V, TA = +25C, unless otherwise specified. VL notes apply to the ISL32179E only. (Continued) DRIVER OUTPUT (V) Typical Performance Curves Y-Z +85C Y-Z +125C TIME (80ns/DIV) FIGURE 35. WORST CASE (NEGATIVE) FIVE PULSE DRIVER WAVEFORMS DRIVING 328 FEET (100m) OF CAT5 CABLE (SINGLE TERMINATED WITH 121) (ISL32172E, ISL32174E, ISL32179E) Page 16 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Die Characteristics SUBSTRATE AND QFN THERMAL PAD POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 1682 PROCESS: Si Gate BiCMOS Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION CHANGE August 13, 2015 FN6824.2 Updated Table 1, page 1 and Ordering Information table on page 2 with "(No longer available or supported)" to applicable parts. Updated "About Intersil" section. February 28, 2013 FN6824.1 Added "EP" and description to "Pin Descriptions" on page 4. Added verbiage to clarify that VCC and VL may power up simultaneously, when powered from the same supply ("Pin Descriptions" table entries "VCC" and "VL" on page 4; "Notes" near bottom of page 5; "Note" under "Logic Supply" heading on page 10). Added "Revision History" table, and "About Intersil" sections to page 17. December 16, 2008 FN6824.0 Initial release. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support FN6824 Rev 2.00 August 13, 2015 Page 17 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45 -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e B S NOTES: 1. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. MILLIMETERS 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N 16 0 16 8 0 7 8 Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. "L" is the length of terminal for soldering to a substrate. 7. "N" is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width "B", as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. FN6824 Rev 2.00 August 13, 2015 Page 18 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Package Outline Drawing L24.4x4C 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 10/06 4.00 4X 2.5 A 20X 0.50 B PIN 1 INDEX AREA PIN #1 CORNER (C 0 . 25) 24 19 1 18 4.00 2 . 50 0 . 15 13 0.15 (4X) 12 7 0.10 M C A B 0 . 07 24X 0 . 23 +- 0 . 05 4 24X 0 . 4 0 . 1 TOP VIEW BOTTOM VIEW SEE DETAIL "X" 0.10 C C 0 . 90 0 . 1 BASE PLANE ( 3 . 8 TYP ) SEATING PLANE 0.08 C SIDE VIEW ( 2 . 50 ) ( 20X 0 . 5 ) C 0 . 2 REF 5 ( 24X 0 . 25 ) 0 . 00 MIN. 0 . 05 MAX. ( 24X 0 . 6 ) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature. FN6824 Rev 2.00 August 13, 2015 Page 19 of 20 ISL32172E, ISL32272E, ISL32372E, ISL32174E, ISL32274E, ISL32374E, ISL32179E Thin Shrink Small Outline Package Family (TSSOP) 0.25 M C A B D MDP0044 A THIN SHRINK SMALL OUTLINE PACKAGE FAMILY (N/2)+1 N MILLIMETERS SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE PIN #1 I.D. E E1 0.20 C B A 1 (N/2) B 2X N/2 LEAD TIPS TOP VIEW 0.05 e C SEATING PLANE 0.10 M C A B b 0.10 C N LEADS H A 1.20 1.20 1.20 1.20 1.20 Max A1 0.10 0.10 0.10 0.10 0.10 0.05 A2 0.90 0.90 0.90 0.90 0.90 0.05 b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 5.00 6.50 7.80 9.70 0.10 E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 0.10 e 0.65 0.65 0.65 0.65 0.65 Basic L 0.60 0.60 0.60 0.60 0.60 0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference Rev. F 2/07 NOTES: 1. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. SIDE VIEW 2. Dimension "E1" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side. SEE DETAIL "X" 3. Dimensions "D" and "E1" are measured at dAtum Plane H. 4. Dimensioning and tolerancing per ASME Y14.5M-1994. c END VIEW L1 A A2 GAUGE PLANE 0.25 L A1 0 - 8 DETAIL X (c) Copyright Intersil Americas LLC 2008-2015. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN6824 Rev 2.00 August 13, 2015 Page 20 of 20