74LVC2G08
Document number: DS37928 Rev 1 - 2
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NEW PROD UCT
74LVC2G08
DUAL 2-INPUT AND GATE
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and
Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total
Br + Cl) and <1000ppm antimony compounds.
Description
The 74LVC2G08 is a dual, two input AND gate. Both gates have
push-pull outputs designed for operation over a power supply range
of 1.65V to 5.5V. The device is fully specified for partial power down
applications using IOFF. The IOFF circuitry disables the output,
preventing damaging current backflow when the device is powered
down. Each gate performs the positive Boolean function:
BAY
or
BAY
Features
Wide Supply Voltage Range from 1.65 to 5.5V
± 24mA Output Drive at 3.3V
CMOS low power consumption
IOFF Supports Partial-Power-Down Mode Operation
Inputs accept up to 5.5V
Schmitt Trigger Action at all inputs makes the circuit tolerant
for slower input rise and fall times. The hysteresis is typically
100mV at VCC = 3.0V.
ESD Protection Exceeds JESD 22
2000-V Human Body Model (A114)
Exceeds 1000-V Charged Device Model (C101)
Latch-Up Exceeds 100mA per JESD 78, Class I
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Pin Assignments
1A
1B
2Y
GND 2A
2B
1Y
VCC
(Top View)
1
2
3
45
6
7
8
X2-DFN2010-8
X2-DFN1410-8
X2-DFN1210-8
Applications
Voltage Level Shifting
General Purpose Logic
Power Down Signal Isolation
Wide Array of Products Such as:
PCs, Networking, Notebooks, Netbooks, PDAs
Tablet Computers, E-readers
Computer Peripherals, Hard Drives, CD/DVD ROMs
TVs, DVDs, DVRs, Set Top Boxes
Cell Phones, Personal Navigation / GPS
MP3 Players, Cameras, Video Recorders
74LVC2G08
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74LVC2G08
Ordering Information (Note 4)
74LVC2G 08 XXX -7
Logic Device
Function
Package
Packing
74 : Logic Prefix
08 :
2-Input
HD4 : X2-DFN2010-8
-7 : 7” Tape & Reel
LVC : 1.65V to 5.5V
AND Gate
HK3 : X2-DFN1410-8
Logic Family
RA3 : X2-DFN1210-8
2G : Dual Gate
Device
Package
Code
Package
(Note 5)
Package
Size
7” Tape and Reel (Note 6)
Quantity
Part Number
Suffix
74LVC2G08HD4-7
HD4
X2-DFN2010-8
1.95mm x 1.0mm x 0.4mm
0.5 mm lead pitch
5,000/Tape & Reel
-7
74LVC2G08HK3-7
HK3
X2-DFN1410-8
1.35mm x 1.0mm x 0.35mm
0.4 mm lead pitch
5,000/Tape & Reel
-7
74LVC2G08RA3-7
RA3
X2-DFN1210-8
1.2mm x 1.0mm x 0.35mm
0.3 mm lead pitch
5,000/Tape & Reel
-7
Notes: 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
5. Pad layout as shown in Diodes Incorporated’s package outline PDFs, which can be found on our website at http://www.diodes.com/package-
outlines.html.
6. The taping orientation is located on our website at http://www.diodes.com/datasheets/ap02007.pdf.
Pin Descriptions
Pin Name
Pin No.
Description
1A
1
Data Input
1B
2
Data Input
2Y
3
Data Output
GND
4
Ground
2A
5
Data Input
2B
6
Data Input
1Y
7
Data Output
VCC
8
Supply Voltage
Logic Diagram
11A
27
1Y
1B
52A
63
2Y
2B
Function Table
Inputs
Output
A
B
Y
L
L
L
L
H
L
H
L
L
H
H
H
74LVC2G08
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74LVC2G08
Absolute Maximum Ratings (Notes 7 & 8)
Symbol
Description
Rating
Unit
ESD HBM
Human Body Model ESD Protection
2
kV
ESD CDM
Charged Device Model ESD Protection
1
kV
VCC
Supply Voltage
-0.5 to +6.5
V
VI
Input Voltage
-0.5 to +6.5
V
VO
Output Voltage -Active Mode
-0.5 to VCC +0.5
V
Output Voltage Power Down Mode
-0.5 to +6.5
V
IIK
Input Clamp Current VI<0
-50
mA
IOK
Output Clamp Current (VO < 0 OR VO > Vcc )
±50
mA
IO
Continuous Output Current (VO = 0 to VCC)
±50
mA
ICC
Continuous Current Through VCC
100
mA
IGND
Continuous Current Through GND
-100
mA
TJ
Operating Junction Temperature
-40 to +150
°C
TSTG
Storage Temperature
-65 to +150
°C
Notes: 7. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device
operation should be within recommend values.
8. Forcing the maximum allowed voltage could cause a condition exceeding the maximum current or conversely forcing the maximum current could
cause a condition exceeding the maximum voltage. The ratings of both current and voltage must be maintained within the controlled range.
Recommended Operating Conditions (Note 9)
Symbol
Parameter
Min
Max
Unit
VCC
Operating Voltage
Operating
1.65
5.5
V
Data Retention Only
1.5
—
VI
Input Voltage
0
5.5
V
VO
Output Voltage Active Mode
0
VCC
V
Output Voltage Power-Down Mode
0
5.5
IOH
High-Level Output Current
VCC = 1.65V
—
-4
mA
VCC = 2.3V
—
-8
VCC = 2.7V
—
-12
VCC = 3.0V
—
-16
—
-24
VCC = 4.5V
—
-32
IOL
Low-Level Output Current
VCC = 1.65V
—
4
mA
VCC = 2.3V
—
8
VCC = 2.7V
—
12
VCC = 3.0V
—
16
—
24
VCC = 4.5V
—
32
Δt/ΔV
Input Transition Rise or Fall Rate
VCC = 1.65V to 2.7V
—
20
ns/V
VCC = 2.7V to 5.5V
—
10
TA
Operating Free-Air Temperature
-40
+125
°C
Note: 9. Unused inputs should be held at VCC or Ground.
74LVC2G08
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74LVC2G08
Electrical Characteristics (All typical values are at TA = +25°C)
Symbol
Parameter
Test Conditions
VCC
-40°C to +85°C
-40°C to +125°C
Unit
Min
Typ.
Max
Min
Max
VIH
High-Level
Input Voltage
—
VCC = 1.65V to 1.95V
0.65 x VCC
—
—
0.65 x VCC
—
V
VCC = 2.3V to 2.7V
1.7
—
—
1.7
—
VCC = 2.7V to 3.6V
2.0
—
—
2.0
—
VCC = 4.5V to 5.5V
0.7 x VCC
—
—
0.7 x VCC
—
VIL
Low-Level
Input Voltage
—
VCC = 1.65V to 1.95V
—
—
0.35 x VCC
—
0.35 x VCC
V
VCC = 2.3V to 2.7V
—
—
0.7
—
0.7
VCC = 2.7V to 3.6V
—
—
0.8
—
0.8
VCC = 4.5V to 5.5V
—
—
0.3 x VCC
—
0.3 x VCC
VOH
High-Level
Output
Voltage
IOH = -100μA
1.65V to 5.5V
VCC – 0.1
Vcc
—
VCC – 0.1
—
V
IOH = -4mA
1.65V
1.2
1.53
—
0.95
—
IOH = -8mA
2.3V
1.9
2.13
—
1.7
—
IOH = -12mA
2.7
2.2
2.5
—
1.9
—
IOH = -16mA
3V
2.4
2.7
—
2.2
—
IOH = -24mA
2.3
2.6
—
2.0
—
IOH = -32mA
4.5V
3.8
4.1
—
3.4
—
VOL
Low-Level
Output
Voltage
IOL = 100μA
1.65V to 5.5V
—
0
0.1
—
0.1
V
IOL = 4mA
1.65V
—
0.08
0.45
—
0.7
IOL = 8mA
2.3V
—
0.14
0.3
—
0.45
IOL = 12mA
2.7V
—
0.19
0.4
—
0.6
IOL = 16mA
3V
—
0.25
0.4
—
0.6
IOL = 24mA
—
0.37
0.55
—
0.8
IOL = 32mA
4.5V
—
0.43
0.55
—
0.8
II
Input Current
VI = 5.5V or GND
0V to 5.5V
—
± 0.1
±5
—
± 20
μA
IOFF
Power Down
Leakage
Current
VI or VO = 5.5V
0V
—
± 0.1
±10
—
±20
μA
ICC
Supply
Current
VI = 5.5V or GND
IO=0A
1.65V to 5.5V
—
0.1
10
—
40
μA
ΔICC
Additional
Supply
Current
One input at
VCC – 0.6V
Other inputs at VCC
or GND
2.3V to 5.5V
—
5
500
—
5,000
μA
CI
Input
Capacitance
VI = VCC or GND
3.3V
—
2.5
—
—
—
pF
74LVC2G08
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74LVC2G08
Operating Characteristics
Parameter
Test
Conditions
VCC = 1.8V
VCC = 2.5V
VCC = 3.3V
VCC = 5V
Unit
Typ.
Typ.
Typ.
Typ.
Cpd
Power Dissipation
Capacitance
f = 10MHz
17
17
17
20
pF
Package Characteristics
Symbol
Parameter
Package
Test Conditions
Min
Typ.
Max
Unit
θJA
Thermal Resistance Junction-
to-Ambient
X2-DFN2010-8
(Note 10)
—
313
—
°C/W
X2-DFN1410-8
—
321
—
X2-DFN1210-8
—
395
—
θJC
Thermal Resistance Junction-
to-Case
X2-DFN2010-8
(Note 10)
—
145
—
°C/W
X2-DFN1410-8
—
166
—
X2-DFN1210-8
—
236
—
Note: 10. Test condition for each package type: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
Switching Characteristics
Typical Values at TA = +25°C and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V. See Figure 1.
Parameter
From
Input
To
Output
VCC
TA = -40°C to +85°C
TA = -40°C to +125°C
Unit
Min
Typ
Max
Min
Max
tpd
A or B
Y
1.8V ± 0.15V
1.0
3.2
9.0
1.0
11.3
ns
2.5V ± 0.2V
0.5
2.2
5.1
0.5
6.4
2.7V
1.0
2.5
5.3
1.0
6.7
3.3V ± 0.3V
0.5
2.1
4.7
0.5
5.9
5.0V ± 0.5V
0.5
1.7
3.8
0.5
4.8
74LVC2G08
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74LVC2G08
Parameter Measurement Information
RL
CL
(see Note A)
From Output
Under Test
VCC
Inputs
VM
CL
RL
VI
tr/tf
1.8V ± 0.15V
VCC
≤2ns
VCC/2
30pF
1kΩ
2.5V ± 0.2V
VCC
≤2ns
VCC/2
30pF
500Ω
2.7V
2.7V
≤2.5ns
1.5V
50pF
500Ω
3.3V ± 0.3V
2.7V
≤2.5ns
1.5V
50pF
500Ω
5.0V ± 0.5V
VCC
≤2.5ns
VCC/2
50pF
500Ω
Input
tW
VMVM
Vl
0 V
Voltage Waveform Pulse Duration
Input VMVM
Vl
0 V
tPHL
tPLH
tPHL
VMVM
VM
tPLH
VOH
VOL
VOH
VOL
Output
Output VM
Voltage Waveform Propagation Delay Times
Inverting and Non Inverting Outputs
Figure 1. Load Circuit and Voltage Waveforms
Notes: A. Includes test lead and test apparatus capacitance.
B. All pulses are supplied at pulse repetition rate ≤ 10MHz.
C. Inputs are measured separately one transition per measurement.
D. tPLH and tPHL are the same as tpd.
74LVC2G08
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Marking Information
Part Number
Package
Identification Code
74LVC2G08HD4-7
X2-DFN2010-8
9E
74LVC2G08HK3-7
X2-DFN1410-8
9F
74LVC2G08RA3-7
X2-DFN1210-8
9G
Y : Year : 0~9
(Top View)
X : Internal Code
Y W X
XX XX : Identification Code
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
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74LVC2G08
X2-DFN1210-8 Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1210-8
Ek1
L(7x)
D
ez(4x)
k
L1 z1(4x)
b
(Pin #1 ID)
C0.5X45°
Seating Plane
AA1
X2-DFN1210-8
Dim
Min
Max
Typ
A
-
0.35
0.30
A1
0
0.03
0.02
b
0.10
0.20
0.15
D
1.15
1.25
1.20
E
0.95
1.05
1.00
e
-
-
0.30
k
-
-
0.25
k1
-
-
0.20
L
0.25
0.35
0.30
L1
0.30
0.40
0.35
z
0.050
0.100
0.075
z1
0.050
0.100
0.075
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1210-8
X1
Y2
CX
Y
G
Dimensions
Value
(in mm)
C
0.300
G
0.150
X
0.150
X1
1.050
Y
0.500
Y1
1.150
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74LVC2G08
X2-DFN1410-8 Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1410-8
1
A1
AA3
E
D
b
L(7x)
La
e
A
e1
X2-DFN1410-8
Dim
Min
Max
Typ
A
0.30
0.35
0.33
A1
0.00
0.03
0.02
A3
--
--
0.10
b
0.12
0.20
0.15
D
1.30
1.40
1.35
E
0.95
1.05
1.00
e
--
--
0.35
e1
--
--
0.55
L
0.27
0.35
0.30
L1
0.32
0.40
0.35
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN1410-8
1
X1
Y2
Y
Y
Y1
XC
Dimensions
Value
(in mm)
C
0.350
X
0.200
X1
1.250
Y
0.600
Y1
0.650
Y2
1.400
74LVC2G08
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X2-DFN2010-8 Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN2010-8
D
E
e
b
L
A
A3
Seating Plane
z(4x)
A1
R0.075
X2-DFN2010-8
Dim
Min
Max
Typ
A
--
0.40
--
A1
0.00
0.05
0.02
A3
--
--
0.13
b
0.20
0.30
0.25
D
1.950
2.05
2.00
E
0.95
1.05
1.00
e
--
--
0.50
L
0.30
0.40
0.35
z
--
--
0.125
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X2-DFN2010-8
X1
Y1
X C
Y
Dimensions
Value
(in mm)
C
0.500
X
0.300
X1
1.800
Y
0.600
Y1
1.400
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes
Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales
channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify
and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and
markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is
the final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the
express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for
use provided in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems,
and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-
related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and
its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or
systems.
Copyright © 2016, Diodes Incorporated
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