5962R0253801VZA - ANALOG DEVICES

REVISIONS

LTR DESCRIPTION DATE (YR-MO-DA) APPROVED

Delete the Int egral nonlinearity (INL) test as specified under table I. - ro

03-05-28 R. MONNIN

REV

SHEET

REV A

SHEET 15

REV STATUS REV A A A A A A A A A A A A A A

OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14

PMIC N/A PREPARED BY

RICK OFFICER

DEFENSE SUPPLY CENTER COLUMBUS

STANDARD

MICROCIRCUIT

DRAWING

CHECKED BY

RAJESH PITHADIA

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

APPROVED BY

RAYMOND MONNI N

MICROCI RCUIT, DIGITAL-LINEAR, 12- BIT,

41 MSPS ANALOG TO DIGITAL CONVERTER,

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

DRAWING APPROVAL DATE

02-08-01

MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

A SIZE

A CAGE CO DE

67268

5962-02538

SHEET

1 OF

DSCC FORM 2233

APR 97 5962-E405-03

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

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1. SCOPE

1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and

M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the

Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the

PIN.

1.2 PIN. The PIN is as shown in the following example:

5962 R 02538 01 V X X

Federal

stock class

designator

RHA

designator

(see 1.2.1)

Device

type

(see 1.2.2)

Device

class

designator

Case

outline

(see 1.2.4)

Lead

finish

(see 1.2.5)

\ /

(see 1.2.3)

Drawing number

1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and

are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A

specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

1.2.2 Device type(s). The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function

01 AD9042S 12-bit, 41 MSPS analog to digital converter

1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as

follows:

Device class Device requirements documentation

M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-

JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A

Q or V Certification and qualification to MIL-PRF-38535

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style

X CDIP2-T28 28 Dual in line

Z CDFP3-F28 28 Flat pack

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

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1.3 Absolute maximum ratings. 1/

CC voltage ................................................................................................................ 7 V

Analog input voltage ..................................................................................................... 0.5 V to 4.5 V

Analog input current ...................................................................................................... 20 mA

Digital input voltage (ENCODE) .................................................................................... 0 V to AVCC

ENCODE,

ENCODE differential voltage ...................................................................... 4 V

Digital output current ..................................................................................................... ±40 mA

Maximum junction temperature (TJ) .............................................................................. +175 °C

Lead temperature (soldering, 10 seconds) ................................................................... +300°C

Storage temperature range ........................................................................................... -65°C to +150°C

Thermal resistance, junction-to-case (θJC)

Case X ....................................................................................................................... 14°C/W

Case Z ....................................................................................................................... 22°C/W

Thermal resistance, junction-to-ambient (θJA) :

Case X ....................................................................................................................... 34°C/W

Case Z ....................................................................................................................... 60°C/W

1.4 Recommended operating conditions.

CC voltage ................................................................................................................ 5 V

Ambient operating temperature range (TA) ................................................................... -55°C to +125°C

1.5 Radiation features.

Maximum total dose available (dose rate = 50 – 300 rads(Si) / s) ................................ 100 Krads (Si) 2/

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a

part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in

the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the

solicitation.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-883 - Test Method Standard Microcircuits.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

_____

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability. TA = +25°C.

2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.

Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,

method 1019, condition A.

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HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 - List of Standard Microcircuit Drawings.

MIL-HDBK-780 - Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Block diagram. The block diagram shall be as specified on figure 2.

3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in

MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.

3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535

listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see

6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this

drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535

and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

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TABLE I. Electrical performance characteristics.

Test

Symbol

Conditions 1/ 2/ 3/

-55°C ≤ TA ≤ +125°C

unless otherwise specified

Group A

subgroups

Device

type

Limits Unit

Min Max

Static characteristics

VCC supply

ICC

(total)

1,2,3 01 146 mA

M,D,P,L,R 1 146

Power dissipation 4/

PD 1,2,3 01 735 mW

Power supply 4/

rejection ratio

PSRR TA = 25°C 1 01 -20 20 mV/V

DC accuracy 4/

No missing codes

Offset error

OE 1,2,3 01 -10 10 mV

M,D,P,L,R 1 -10 10

Gain error

GE 4,5,6 01 -6.5 6.5 %FS

M,D,P,L,R 4 -6.5 6.5

ANALOG INPUT (AIN) section

Input voltage range 4/

IVR 1,2,3 01

VREF

-0.5 VREF

+0.5

Input resistance 4/ 5/

RIN T

A = 25°C 4 01 200 300

Ω

ENCODE INPUT section (Logic compatibility, TTL / CMOS)

Logic “1” voltage 4/

VIH 1,2,3 01 2 5 V

Logic “0” voltage 4/

VIL 1,2,3 01 0 0.8 V

Logic “1” current

IIH V

INH = 5 V 1,2,3 01 450 800

µA

M,D,P,L,R 1 450 800

See footnotes at end of table.

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TABLE I. Electrical performance characteristics – Continued.

Test

Symbol

Conditions 1/ 2/ 3/

-55°C ≤ TA ≤ +125°C

unless otherwise specified

Group A

subgroups

Device

type

Limits Unit

Min Max

ENCODE INPUT section – continued (Logic compatibility, TTL / CMOS)

Logic “0” current

IIL V

INL = 5 V 1,2,3 01 -400 -200

µA

M,D,P,L,R 1 -400 -200

DIGITAL OUTPUTS section (Logic compatibility, CMOS)

Logic “1” voltage 4/

VOH I

OH = 10 µA 1,2,3 01 3.5 V

Logic “0” voltage 4/

VOL I

OL = 10 µA 1 01 0.8 V

2,3 1

Dynamic characteristics section

Differential non-linearity

DNL ENCODE = 20 MSPS 4,5,6 01 -2 2 LSB

M,D,P,L,R 4 -2 2

Switching characteristics section

Conversion rate 4/ 5/

CR TA = 25°C 9 01 5 41 MSPS

Output delay 4/ 5/

tOD See figure 3, TA = 25°C 9 01 5 14 ns

ENCODE pulse 4/ 5/

width, high

EPW TA = 25°C 9 01 10 ns

ENCODE pulse 4/ 5/

width, low

EPWL TA = 25°C 9 01 10 ns

Signal to noise ratio 4/ 6/

SNR Analog input at –1 dBFS,

1.2, 9.6, and 19.6 MHz 7 01 52 dB

See footnotes at end of table.

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TABLE I. Electrical performance characteristics – Continued.

Test

Symbol

Conditions 1/ 2/ 3/

-55°C ≤ TA ≤ +125°C

unless otherwise specified

Group A

subgroups

Device

type

Limits Unit

Min Max

Switching characteristics section - continued

Signal to noise and 4/ 7/

distortion ratio

SINAD Analog input at –1 dBFS,

1.2, 9.6, and 19.6 MHz 7 01 52 dB

Worst spur ratio 4/ 8/

WS Analog input at –1 dBFS,

1.2, 9.6, and 19.6 MHz 7 01 57 dBc

1/ Unless otherwise specified, AVCC = DVCC = +5 V, VREF tied to VOFFSET through 50 Ω.

2/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, R of irradiation.

However, this device is only tested at the “R” level. Pre and Post irradiation values are identical unless otherwise

specified in table I. When performing post irradiation electrical measurements for any RHA level, TA = +25°C.

3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.

Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,

method 1019, condition A.

4/ Not tested post irradiation.

5/ Guaranteed by design, not tested.

6/ Analog input signal power at –1 dBFS; signal to noise ratio (SNR) is the ratio of the signal level to total noise

(first five harmonics removed).

7/ Analog input signal power at –1 dBFS; signal to noise and distortion (SINAD) is the ratio of signal level to

total noise + harmonics.

8/ Analog input signal power at –1 dBFS; worst spur is the ratio of the signal level to worst spur, usually limited by

harmonics.

3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for

device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.

3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2

herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535, appendix A.

3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain

the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made

available onshore at the option of the reviewer.

3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in

microcircuit group number 57 (see MIL-PRF-38535, appendix A).

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Device type

Case outlines

X and Z

Terminal

number Terminal

symbol

1 GND

2 DVCC

3 GND

4 ENCODE

5 ENCODE

6 GND

7 GND

8 AIN

9 VOFFSET

10 VREF

11 GND

12 AVCC

13 GND

14 AVCC

15 NC

16 NC

17 D0 (LSB)

18 D1

19 D2

20 D3

21 D4

22 D5

23 D6

24 D7

25 D8

26 D9

27 D10

28 D11 (MSB)

NC = No connection

FIGURE 1. Terminal connections.

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Symbol

Description

GND

Ground

DVCC

+5 V Power supply (digital). Powers output stage only.

ENCODE

Encode input. Data conversion initiated on rising edge.

ENCODE

Complement of ENCODE. Drive di fferentially with ENCODE

or bypass to ground for single-ended clock mode.

AIN

Analog input.

VOFFSET

Voltage offset input. Sets mid-point of analog input range.

Normally tied to VREF through 50 Ω resistor.

VREF

Internal voltage reference. Nominally +2.4 V; normally tied

to VOFFSET through 50 Ω resistor. Bypass to GND with

0.1 µF + 0.01 µF microwave chip capacitor.

AVCC

+5 V power supply (analog).

No connection.

D0 (LSB)

Digital output bit. (Least Significant Bit)

D1 – D10

Digital Output Bits.

D11

Digital output bit. (Most Significant Bit)

FIGURE 1. Terminal connections – continued.

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FIGURE 2. Block diagram.

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FIGURE 3. Timing waveforms.

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4. QUALITY ASSURANCE PROVISIONS

4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with

MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan

shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be

in accordance with MIL-PRF-38535, appendix A.

4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted

on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in

accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.

4.2.1 Additional criteria for device class M.

a. Burn-in test, method 1015 of MIL-STD-883.

(1) Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control

and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the

inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1015.

(2) TA = +125°C, minimum.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

4.2.2 Additional criteria for device classes Q and V.

a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the

device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under

document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall

specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test

method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table IIA herein.

c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in

MIL-PRF-38535, appendix B.

4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in

accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for

groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).

4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with

MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for

device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed

for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections

(see 4.4.1 through 4.4.4).

4.4.1 Group A inspection.

a. Tests shall be as specified in table IIA herein.

b. Subgroups 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted.

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TABLE IIA. Electrical test requirements.

Test requirements Subgroups

(in accordance with

MIL-STD-883,

method 5005, table I)

Subgroups

(in accordance with

MIL-PRF-38535, table III)

Device

class M Device

class Q Device

class V

Interim electrical

parameters (see 4.2) 1 1 1

Final electrical

parameters (see 4.2) 1,2,3,7 1/ 1,2,3,7 1/ 1,2,3,7 1/ 2/

Group A test

requirements (see 4.4) 1,2,3,4,5,6,7,9 1,2,3,4,5,6,7,9 1,2,3,4,

5,6,7,9

Group C end-point electrical

parameters (see 4.4) 1 1 1 2/

Group D end-point electrical

parameters (see 4.4) 1 1 1

Group E end-point electrical

parameters (see 4.4) 1 1 1

1/ PDA applies to subgroup 1. Deltas excluded from PDA.

2/ Delta limits as specified in table IIB shall be required where specified, and delta limits

shall be computed with reference to the previous endpoint electrical parameters.

TABLE IIB. 240 hour burn-in and group C end-point electrical parameters.

Parameter Device type Limit Delta Units

Min Max Min Max

ICC 01 146 ±20 mA

VOH 3.5

±0.5 V

VOL 0.8

±0.2 V

4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:

a. Test condition D. The test circuit shall be maintained by the manufacturer under document revision level control and

shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,

outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of

MIL-STD-883.

b. TA = +125°C, minimum.

c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.

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4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,

or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The

test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with

MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify

the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of

MIL-STD-883.

4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.

4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness

assured (see 3.5 herein).

a. End-point electrical parameters shall be as specified in table IIA herein.

b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as

specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to

radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All

device classes must meet the post irradiation end-point electrical parameter limits as defined in table I at TA = +25°C

±5°C, after exposure, to the subgroups specified in table IIA herein.

c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied.

4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883

method 1019 condition A and as specified herein.

5. PACKAGING

5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device

classes Q and V or MIL-PRF-38535, appendix A for device class M.

6. NOTES

6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications

(original equipment), design applications, and logistics purposes.

6.1.1 Replaceability. Mi crocircuits covered by this drawing will replace the same generic device covered by a contractor

prepared specification or drawing.

6.1.2 Substitutability. Device class Q devices will replace device class M devices.

6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for

the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.

6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system

application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users

and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering

microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544.

6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone

(614) 692-0547.

6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535 and MIL-HDBK-1331.

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6.6 Sources of supply.

6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535.

The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to

this drawing.

6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.

The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been

submitted to and accepted by DSCC-VA.

STANDARD MICROCIRCUIT DRAWING BULLETIN

DATE: 03-05-28

Approved sources of supply for SMD 5962-02538 are listed below for immediate acquisition information only and

shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be

revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a

certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next

dated revision of MIL-HDBK-103 and QML-38535.

Standard

microcircuit drawing

PIN 1/

Vendor

CAGE

number

Vendor

similar

PIN 2/

5962-0253801VXA

24355 AD9042SD/QMLV

5962-0253801VZA

24355 AD9042SF/QMLV

5962R0253801VXA

24355 AD9042SD/QMLR

5962R0253801VZA

24355 AD9042SF/QMLR

1/ The lead finish shown for each PIN representing

a hermetic package is the most readily available

from the manufacturer listed for that part. If the

desired lead finish is not listed contact the vendor

to determine its availability.

2/ Caution. Do not use this number for item acquisition.

Items acquired to this number may not satisfy the

performance requirements of this drawing.

Vendor CAGE Vendor name

number and address

24355 Analog Devices

Route 1 Industrial Park

P.O. Box 9106

Norwood, MA 02062

Point of contact: 1500 Space Park Drive

P.O. Box 58020

Santa Clara, CA 95050-8020

The information contained herein is disseminated for convenience only and the

Government assumes no liability whatsoever for any inaccuracies in the

information bulletin.