SFH 4273
Rote Lumineszenzdiode
Red Emitter
Lead (Pb) Free Product - RoHS Compliant
2007-06-18 1
Wesentliche Merkmale
Schwarz eingefärbtes TOPLED-Gehäuse
Typische Emissionswellenlänge 660nm
Verbesserte Abbildungseigenschaften durch
Absorption der Seitenstrahlung
Größe der Leuchtquelle 325 µm x 325 µmt
Feuchte-Empfindlichkeitsstufe 2 nach JEDEC
Standard J-STD-020C
Anwendungen
Miniaturlichtschranken und Lichtschranken
über große Entfernungen
Industrieelektronik
„Messen/Steuern/Regeln“
Sensorik
Alarm- und Sicherungssysteme
Typ
Type
Bestellnummer
Ordering Code
Strahlstärkegruppierung1) (IF = 50 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
1) gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr
Achtung: Es wird empfohlen, das Bauteil nicht bei extremer Luftfeuchtigkeit zu betreiben. Ist dies dennoch vorgesehen,
setzen Sie sich bitte mit OSRAM OS in Verbindung
Attention: It is recommended not to operate the device under extreme humdity. If this is designated though, please
contact OSRAM OS.
SFH 4273 Q65110A2523 > 0.63 (typ. 1.0)
Features
Black colored TOPLED-package
Typical peak wavelength 660nm
Improved imaging characteristics due to
absorption of side emission
Size of emitting area 325µm x 325µm
Moisture sensitivity level 2 according to JEDEC
Standard J-STD-020C
Applications
Miniature and long distance photointerrupters
Industrial electronics
For drive and control circuits
Sensor technology
Alarm and safety equipment
2007-06-18 2
SFH 4273
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebs- und Lagertemperatur
Operating and storage temperature range
Top; Tstg – 40 + 100 °C
Sperrspannung
Reverse voltage
VR3 V
Durchlassstrom
Forward current
IF50 mA
Stoßstrom, τ = 10 µs, D = 0
Surge current
IFSM 1 A
Verlustleistung
Power dissipation
Ptot 125 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
450
200
K/W
K/W
SFH 4273
2007-06-18 3
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 50 mA, tp = 20 ms
λpeak 660 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 50 mA
∆λ 25 nm
Abstrahlwinkel
Half angle
ϕ± 60 Grad
deg.
Aktive Chipfläche
Active chip area
A0.106 mm2
Abmessungen der aktiven Chipfläche
Dimensions of the active chip area
L × B
L × W
0.325 × 0.325 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 50 mA, RL = 50
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 50 mA, RL = 50
tr, tf100 ns
Kapazität
Capacitance
VR = 0 V, f = 1 MHz
Co30 pF
Durchlassspannung
Forward voltage
IF = 50 mA, tp = 20 ms
VF2.1 ( 2.8) V
Sperrstrom,
Reverse curr50mA50 mAent
VR = 5 V
IR0.01 ( 1) µA
Gesamtstrahlungsfluss
Total radiant flux
IF = 50 mA, tp = 20 ms
Φe5mW
Temperaturkoeffizient von Ie bzw. Φe,
IF = 50 mA
Temperature coefficient of Ie or Φe, IF = 50 mA
TCI– 0.4 %/K
Temperaturkoeffizient von VF, IF = 50 mA
Temperature coefficient of VF, IF = 50 mA
TCV– 3 mV/K
Temperaturkoeffizient von λ, IF = 50 mA
Temperature coefficient of λ, IF = 50 mA
TCλ+ 0.16 nm/K
2007-06-18 4
SFH 4273
Strahlstärke Ie in Achsrichtung
gemessen bei einem Raumwinkel = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of = 0.01 sr
Bezeichnung
Parameter
Symbol Werte
Values
Einheit
Unit
Strahlstärke
Radiant intensity
IF = 50 mA, tp = 20 ms
Ie> 0.63 (typ. 1.0) mW/sr
SFH 4273
2007-06-18 5
Relative Spectral Emission
Irel = f (λ)
Forward Current
IF = f (VF) single pulse, tp = 20 µs
Radiation Characteristics Irel = f (ϕ)
λ
OHR01869
0
rel
Ι
600
20
40
60
80
%
100
nm650 700 750
V
OHR01871
F
F
Ι
0
3
10
2
10
1
10
10
0
mA
V
1 2 3 4 5 6 7
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚
20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Radiant Intensity
Ie/Ie(50mA) = f (IF)
Single pulse, tp = 20 µs
Permissible Pulse Handling
Capability IF = f (tp), TA = 25 °C
duty cycle D = parameter
OHR01870
10 0
Ι
F
1
10 2
10 10 3
mA
-2
10
10 -1
10 0
10 1
10 2
Ιe 50 mA
e
Ι
t
OHR01872
P
10 -5 s
Ι
F
10 -4 10 -3 10 -2 10 -1 10 1
10
T
tP
D=
tP
T
Ι
F
D =
0.005
0.01
0.02
0.05
mA
4
10
10 3
10 2
1
10
DC
0.5
0.2
0.1
Max. Permissible Forward Current
IF = f (TA)
T
OHR01461
A
0
F
Ι
0 20 40 60 80 100
˚C
20
40
60
80
100
120
mA
2007-06-18 6
SFH 4273
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Gehäuse / Package TOPLED®, klarer Verguss / TOPLED®, clear resin
Anschlussbelegung
Pin configuration
abgeschrägte Ecke: Kathode
beveled edge: Cathode
Farbe
Color
schwarz
black
Brechungsindex Verguss
Refractive index resin
1.53
1.53
GPLY6724
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Cathode marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4˚±1
A
C
SFH 4273
2007-06-18 7
Empfohlenes Lötpaddesign Reflow Löten
Recommended Solder Pad Reflow Soldering
Maße in mm (inch) / Dimensions in mm (inch)
OHLPY970
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Cu-area > 16 mm
Cu-Fläche > 16 mm
2
2
Solder resist
Lötstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2007-06-18 8
SFH 4273
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C +0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C -0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
OHLY0598
0
0
50 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
SFH 4273
2007-06-18 9
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.