• All specifications are subject to change without notice.
(1/2)
004-02 / 20050618 / e9412_mmz0603.fm
EMC Components MMZ Series MMZ0603 Type
Chip Beads
SMD Size: JIS/IEC 0603, EIA 0201
FEATURES
• This is a multilayered chip bead product with dimensions of
L0.6×W0.3×T0.3mm.
• The product is magnetically shielded, allowing high density
mounting.
• We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
•
The products contain no lead and also support lead-free soldering.
APPLICATIONS
The removal of EMI components from signal lines in various mod-
ules, cellular phones and other sets that use very small compo-
nents.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
ELECTRICAL CHARACTERISTICS TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
MMZ0603S100C MMZ0603S800C MMZ0603S121C
0.3
0.6
0.3
Weight: 0.3mg
Dimensions in mm
0.30 0.250.25
0.30
Part No. Impedance
(Ω)[100MHz]
DC resistance
(Ω)max.
Rated current
(mA)max.
MMZ0603S100C 10±25% 0.15 500
MMZ0603S800C 80±25% 0.5 200
MMZ0603S121C 120±25% 0.8 200
MMZ0603S241C 240±25% 1.0 100
MMZ0603S471C 470±25% 1.8 50
MMZ0603S601C 600±25% 2.0 50
MMZ0603Y121C 120±25% 0.8 200
MMZ0603Y241C 240±25% 1.0 100
MMZ0603Y471C 470±25% 1.8 50
MMZ0603D330C 33±25% 1.0 100
MMZ0603F100C 10±5Ω0.8 200
Operating/storage –55 to +125°C
Packaging style Quantity
Taping 15000 pieces/reel
450
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
50
45
40
35
30
25
20
15
10
5
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
450
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
•Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
(2/2)
004-02 / 20050618 / e9412_mmz0603.fm
EMC Components MMZ Series MMZ0603 Type
Chip Beads
SMD Size: JIS/IEC 0603, EIA 0201
TYPICAL ELECTRICAL CHARACTERISTICS
IMPEDANCE vs. FREQUENCY CHARACTERISTICS
MMZ0603S241C MMZ0603S471C MMZ0603S601C
MMZ0603Y121C MMZ0603Y241C MMZ0603Y471C
MMZ0603D330C MMZ0603F100C
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
450
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
1000
900
800
700
600
500
400
300
200
100
0
Z
X
R
1 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
800
700
600
500
400
300
200
100
0
Z
X
R
450
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
450
400
350
300
250
200
150
100
50
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
