Technical Data 10572 Effective June 2017
Supersedes February 2017
Product description
Fast-acting high current fuse
Compact design utilizes less board space
20 A to 50 A current ratings
Ceramic tube, silver plated brass end
cap construction
Halogen free and RoHS compliant
Applications
Primary and secondary circuit protection:
Server and desktop power supplies
Gaming console systems
Voltage Regulator Module (VRM)
Storage system power
Base station power supplies
Basic power supplies
LED and general lighting
Test equipment
Agency information
cURus Recognition file number: E19180,
Guide JDYX2/JDYX8
PSE: JET 7042-31007-1002 (20 A to 30 A)
Ordering
Use ordering number (see page 7 for details)
Packaging suffixes
-TR (20 A to 30 A: 1500 parts per 13” diameter
reel, tape width 24 mm)
(40 A to 50 A: 1000 parts per 13” diameter
reel, tape width 24 mm)
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
HALOGEN
HF
FREE
2
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
Electrical characteristics
% of Amp Rating Opening Time
100 4 hours minimum
200 60 s maximum
Product specifications
Part number4
Current
rating
(A)
Voltage
rating
(VAC)
Voltage
rating
(VDC)
Interrupting
rating at rated
volt age
(AAC)
Interrupting
rating at rated
voltage1
(ADC)
Typical DC
cold resistance2
(mW )
Typical
melting3
I2t (A2s) Part marking cURus PSE
1025HC20-R 20 250 72 100 500 3.1 25 <PS> E JET
BUSS 20A
x x
1025HC25-R 25 250 72 100 500 2.6 50 <PS> E JET
BUSS 25A
x x
1025HC30-R 30 250 72 100 500 1.7 112 <PS> E JET
BUSS 30A
x x
1025HC40-R 40 250 72 300 500 1.3 400 BUSS 40A x
1025HC50-R 50 250 60 300 600 1.1 600 BUSS 50A x
1 DC interrupting rating measured at rated voltage, time constant of less than 1.0 microseconds, battery source
2 Typical DC cold resistance measured at <10% of rated current at an ambient temperature of 20 °C (reference only)
3. Typical melting I²t value is measured at 10In rated current
4. Part number definition: 1025HCxx-R
1025HC= Product code and size
xx= Ampere rating
-R= Rohs compliant
Dimensions (mm)
Rating A B C
20 A to 30 A 10.0 ±0.50 3.15 ±0.15 1.70 ±0.15
40 A to 50 A 12.4 ±0.50 4.50 ±0.15 2.70 ±0.15
Recommended pad layout (mm)
Recommended trace thickness is 3 oz.
Recommended min-trace width is 10 mm (20 A to 30 A) and 15 mm (40 A to 50 A)
20 A to 30 A 40 A to 50 A
3
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
Packaging information (mm)
Temperature derating curve
Ao Bo Ko
20 A to 30 A 3.50 10.4 3.5
40 A to 50 A 4.90 12.7 4.5
Section A-A
User Direction of Feed
0
0.2
0.4
0.6
0.8
1
1.2
-55-35 -155 25 45 65 85 10
5125
Derating Factor
Temperature (°C)
4
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
Time vs. current curve
0.001
0.01
0.1
1
10
100
1000
10000
10 10
01
00
0
Time (s)
Current (A)
20A
25A
30A
40A
50A
40A
30A
25A
20A
50A
5
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
l2t vs. current curve
10
100
1000
10000
100000
1000000
10000000
10 10
01
000
I2t(A2s)
Current (A)
20A
25A
30A
40A
50A
20A
40A
30A
25A
50A
6
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
l2t vs. time curve
10
100
1000
10000
100000
1000000
0.0001 0.0010.010.1 110100 1000
I2t(A2s)
Time (s)
20A
25A
30A
40A
50A
40A
30A
25A
20A
50A
7
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
Environmental data
Operating temperature: - 55 °C to 125 °C (with derating)
Thermal cycling: (100 cycles - 55 °C to 125 °C)
Vibration: (20 g’s, 10 Hz - 2000 Hz)
Board flex: 60 s, 2 mm
Mechanical shock: 3000 g, 0.3 ms
Termination strength: 1.8 kg, 60 s
Solderability test: J-STD- 002, Method B1, G1 and D
Ordering codes
The ordering code is the part number adding the packaging suffix.
Part number
Ordering codes
-TR option
1025HC20-R 1025HC20-RTR
1025HC25-R 1025HC25-RTR
1025HC30-R 1025HC30-RTR
1025HC40-R 1025HC40-RTR
1025HC50-R 1025HC50-RTR
Packaging suffixes
-TR (20 A to 30 A: 1500 parts per 13” diameter reel, tape width 24 mm)
(40 A to 50 A: 1000 parts per 13” diameter reel, tape width 24 mm)
8
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
www.eaton.com/electronics
Wave solder profile
Reference EN 61760-1:2006
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat • Temperature min. (Tsmin)100 °C 100 °C
• Temperature typ. (Tstyp)120 °C 120 °C
• Temperature max. (Tsmax)130 °C 130 °C
• Time (Tsmin to Tsmax) (ts)70 seconds 70 seconds
D preheat to max Temperature 150 °C max. 150 °C max.
Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C
Time at peak temperature (tp)10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25 °C to 25 °C 4 minutes 4 minutes
Manual solder
350 °C, 4-5 seconds (by soldering iron), generally manual, hand soldering is not recommended.
Temperature
Time
T
smin
Tsmax
Tstyp
Tp
tp
First Wave Second Wave
Preheat area Cool down area
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Publication No. 10572 EE-PCN17028
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Technical Data 10572
Effective June 2017
1025HC
Fast-acting, high current, surface mount ceramic tube fuses
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = C/s
Max. Ramp Down Rate = C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin)100 °C 150 °C
• Temperature max. (Tsmax)150 °C 200 °C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3 °C/ Second Max. 3 °C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183 °C
60-150 Seconds
217 °C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6 °C/ Second Max. 6 °C/ Second Max.
Time 25 °C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350
<2.5mm) 235 °C 220 °C
2.5mm 220 °C 220 °C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260 °C 260 °C 260 °C
1.6 – 2.5mm 260 °C 250 °C 245 °C
>2.5mm 250 °C 245 °C 245 °C