3 A, Low VIN, Low Noise,
CMOS Linear Regulator
Data Sheet
ADP1763
Rev. C Document Feedback
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FEATURES
3 A maximum output current
Low input voltage supply range
VIN = 1.10 V to 1.98 V, no external bias supply required
Fixed output voltage range: VOUT_FIXED = 0.9 V to 1.5 V
Adjustable output voltage range: VOUT_ADJ = 0.5 V to 1.5 V
Ultralow noise: 2 µV rms, 100 Hz to 100 kHz
Noise spectral density
4 nV/√Hz at 10 kHz
3 nV/√Hz at 100 kHz
Low dropout voltage: 95 mV typical at 3 A load
Operating supply current: 4.5 mA typical at no load
±1.5% fixed output voltage accuracy over line, load, and
temperature
Excellent power supply rejection ratio (PSRR) performance
59 dB typical at 10 kHz at 3 A load
43 dB typical at 100 kHz at 3 A load
Excellent load/line transient response
Soft start to reduce inrush current
Optimized for small 10 µF ceramic capacitors
Current-limit and thermal overload protection
Power-good indicator
Precision enable
16-lead, 3 mm × 3 mm LFCSP package
APPLICATIONS
Regulation to noise sensitive applications such as radio
frequency (RF) transceivers, analog-to-digital converter
(ADC) and digital-to-analog converter (DAC) circuits,
phase-locked loops (PLLs), voltage controlled oscillators
(VCOs) and clocking integrated circuits
Field-programmable gate array (FPGA) and digital signal
processor (DSP) supplies
Medical and healthcare
Industrial and instrumentation
GENERAL DESCRIPTION
The ADP1763 is a low noise, low dropout (LDO) linear regulator. It
is designed to operate from a single input supply with an input
voltage as low as 1.10 V without the requirement of an external bias
supply to increase efficiency and provide up to 3 A of output current.
The low 95 mV typical dropout voltage at a 3 A load allows the
ADP1763 to operate with a small headroom while maintaining
regulation and providing better efficiency.
The ADP1763 is optimized for stable operation with small 10 µF
ceramic output capacitors. The ADP1763 delivers optimal
transient performance with minimal board area.
TYPICAL APPLICATION CIRCUITS
VIN
EN
SS
VREG
VOUT
SENSE
C
OUT
10µF
PG
R
PULL-UP
100kΩ PG
VADJ
GNDREFCAP
C
IN
10µF
ON
OFF
12923-001
V
OUT
= 1.5V
ADP1763
V
IN
= 1.8V
C
REG
1µF C
REF
1µF
C
SS
10nF
Figure 1. Fixed Output Operation
VIN
EN
SS
VREG
VOUT
SENSE
PG
RPULL-UP
100kΩ PG
VADJ
GND
REFCAP
CREG
1µF CREF
1µF
RADJ
10kΩ
CSS
10nF
ON
OFF
12923-002
VOUT = 1. 5V
ADP1763
VIN = 1.8V
COUT
10µF
CIN
10µF
Figure 2. Adjustable Output Operation
Table 1. Related Devices
Device
Input
Voltage
Maximum
Current
Fixed/
Adjustable Package
ADP1761 1.10 V to
1.98 V
1 A Fixed/adjustable 16-lead
LFCSP
ADP1762 1.10 V to
1.98 V
2 A Fixed/adjustable 16-lead
LFCSP
ADP1740/
ADP1741
1.6 V to
3.6 V
2 A Fixed/adjustable 16-lead
LFCSP
ADP1752/
ADP1753
1.6 V to
3.6 V
0.8 A Fixed/adjustable 16-lead
LFCSP
ADP1754/
ADP1755
1.6 V to
3.6 V
1.2 A Fixed/adjustable 16-lead
LFCSP
The ADP1763 is available in fixed output voltages ranging from
0.9 V to 1.5 V. The output of the adjustable output model can be
set from 0.5 V to 1.5 V through an external resistor connected
between VADJ and ground.
The ADP1763 has an externally programmable soft start time by
connecting a capacitor to the SS pin. Short-circuit and thermal
overload protection circuits prevent damage in adverse conditions.
The ADP1763 is available in a small 16-lead LFCSP package for the
smallest footprint solution to meet a variety of applications.
ADP1763 Data Sheet
Rev. C | Page 2 of 18
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Typical Application Circuits ............................................................ 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Input and Output Capacitor: Recommended
Specifications ................................................................................ 4
Absolute Maximum Ratings ............................................................ 5
Thermal Data ................................................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
Theory of Operation ...................................................................... 11
Soft Start Function ..................................................................... 11
Adjustable Output Voltage ........................................................ 12
Enable Feature ............................................................................ 12
Power-Good (PG) Feature ........................................................ 12
Applications Information .............................................................. 13
Capacitor Selection .................................................................... 13
Undervoltage Lockout ............................................................... 14
Current-Limit and Thermal Overload Protection ................. 14
Paralleling ADP1763 for High Current Applications ............ 14
Thermal Considerations ............................................................ 15
PCB Layout Considerations ...................................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 18
REVISION HISTORY
9/2017—Rev. B to Rev. C
Change to Thermal Considerations Section ............................... 17
5/2017—Rev. A to Rev. B
Change to Figure 19 Caption, Figure 20 Caption, and
Figure 21 Caption ............................................................................. 9
Change to Figure 22 Caption ........................................................ 10
Updated Outline Dimensions ....................................................... 18
9/2016—Rev. 0 to Rev. A
Changes to Figure 23 and Figure 24 ............................................. 11
4/2016—Revision 0: Initial Version
Data Sheet ADP1763
Rev. C | Page 3 of 18
SPECIFICATIONS
VIN = VOUT + 0.2 V or VIN = 1.1 V, whichever is greater, ILOAD = 10 mA, CIN = 10 µF, COUT = 10 µF, CREF = 1 µF, CREG = 1 µF, TA = 25°C,
Minimum and maximum limits at TJ = −40°C to +125°C, unless otherwise noted.
Table 2.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
INPUT VOLTAGE SUPPLY RANGE
V
IN
T
J
= −40°C to +125°C
1.10
1.98
V
CURRENT
Operating Supply Current IGND ILOAD = 0 µA 4.5 8 mA
ILOAD = 10 mA 4.9 8 mA
ILOAD = 100 mA 5.5 8.5 mA
ILOAD = 3 A 12 16 mA
Shutdown Current IGND-SD EN = GND 2 µA
TJ = −40°C to +85°C,
VIN = (VOUT + 0.2 V) to 1.98 V
180 µA
TJ = 85°C to 125°C,
VIN = (VOUT + 0.2 V) to 1.98 V
800 µA
OUTPUT NOISE1 OUTNOISE 10 Hz to 100 kHz, VIN = 1.1 V, VOUT = 0.9 V 12 µV rms
100 Hz to 100 kHz, VIN = 1.1 V, VOUT = 0.9 V 2 µV rms
10 Hz to 100 kHz, VIN = 1.5 V, VOUT = 1.3 V 15 µV rms
100 Hz to 100 kHz, VIN = 1.5 V, VOUT = 1.3 V 2 µV rms
10 Hz to 100 kHz, VIN = 1.7 V, VOUT = 1.5 V 21 µV rms
100 Hz to 100 kHz, VIN = 1.7 V, VOUT = 1.5 V 2 µV rms
Noise Spectral Density OUTNSD VOUT = 0.9 V to 1.5 V, ILOAD = 100 mA
At 10 kHz 4 nV/√Hz
At 100 kHz 3 nV/√Hz
POWER SUPPLY REJECTION RATIO1 PSRR ILOAD = 3 A, modulated VIN
10 kHz, VOUT = 1.3 V, VIN = 1.7 V 59 dB
100 kHz, VOUT = 1.3 V, VIN = 1.7 V 43 dB
1 MHz, VOUT = 1.3 V, VIN = 1.7 V 37 dB
10 kHz, VOUT = 0.9 V, VIN = 1.3 V 62 dB
100 kHz, VOUT = 0.9 V, VIN = 1.3 V 45 dB
1 MHz, VOUT = 0.9 V, VIN = 1.3 V 33 dB
OUTPUT VOLTAGE
Output Voltage Range
T
A
= 25°C
VOUT_FIXED 0.9 1.5 V
VOUT_ADJ 0.5 1.5 V
Fixed Output Voltage Accuracy VOUT ILOAD = 100 mA, TA = 25°C −0.5 +0.5 %
10 mA < ILOAD < 3 A, VIN = (VOUT + 0.2 V) to
1.98 V, TJ = 0°C to 85°C
−1 +1.5 %
10 mA < ILOAD < 3 A, VIN = (VOUT + 0.2 V) to
1.98 V
−1.5 +1.5 %
ADJUSTABLE PIN CURRENT
I
ADJ
T
A
= 25°C
49.5
50.0
50.5
µA
VIN = (VOUT + 0.2 V) to 1.98 V 48.8 50.0 51.0 µA
ADJUSTABLE OUTPUT VOLTAGE GAIN FACTOR AD TA = 25°C 3.0
VIN = (VOUT + 0.2 V) to 1.98 V 2.95 3.055
REGULATION
Line Regulation ∆VOUT/∆VIN VIN = (VOUT + 0.2 V) to 1.98 V −0.15 +0.15 %/V
Load Regulation
2
∆V
OUT
/∆I
OUT
I
LOAD
= 10 mA to 3 A
0.12
0.45
%/A
DROPOUT VOLTAGE3 VDROPOUT ILOAD = 100 mA, VOUT ≥ 1.2 V 12 23 mV
ILOAD = 3 A, VOUT ≥ 1.2 V 95 145 mV
START-UP TIME1, 4 tSTART-UP CSS = 10 nF, VOUT = 1.3 V 0.6 ms
SOFT START CURRENT ISS 1.1 V ≤ VIN ≤ 1.98 V 8 10 12 µA
CURRENT-LIMIT THRESHOLD5 ILIMIT 3.3 4 5 A
ADP1763 Data Sheet
Rev. C | Page 4 of 18
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
THERMAL SHUTDOWN
Threshold TSSD TJ rising 150 °C
Hysteresis TSSD-HYS 15 °C
POWER-GOOD (PG) OUTPUT THRESHOLD
Output Voltage
Falling PGFALL 1.1 V ≤ VIN ≤ 1.98 V −7.5 %
Rising PGRISE 1.1 V ≤ VIN ≤ 1.98 V −5 %
PG OUTPUT
Output Voltage Low PGLOW 1.1 V ≤ VIN ≤ 1.98 V, IPG ≤ 1 mA 0.35 V
Leakage Current IPG-LKG 1.1 V ≤ VIN ≤ 1.98 V 0.01 1 µA
Delay
1
PG
DELAY
EN
RISING
to PG
RISING
0.75
ms
PRECISION EN INPUT 1.1 V ≤ VIN ≤ 1.98 V
Logic Input
High ENHIGH 595 625 690 mV
Low ENLOW 550 580 630 mV
Input Logic Hysteresis ENHYS 45 mV
Input Leakage Current IEN-LKG EN = VIN or GND 0.01 1 µA
Input Delay Time tIEN-DLY From EN rising from 0 V to VIN to 0.1 × VOUT 100 µs
UNDERVOLTAGE LOCKOUT UVLO
Input Voltage
Rising UVLORISE TJ = −40°C to +125°C 1.01 1.06 V
Falling
UVLO
FAL L
T
J
= −40°C to +125°C
0.87
0.93
V
Hysteresis UVLOHYS 80 mV
1 Guaranteed by design and characterization; not production tested.
2 Based on an endpoint calculation using 10 mA and 3 A loads.
3 Dropout voltage is defined as the input to output voltage differential when the input voltage is set to the nominal output voltage, which applies only for output
voltages above 1.1 V.
4 Start-up time is defined as the time from the rising edge of EN to VOUT being at 90% of its nominal value.
5 Current-limit threshold is defined as the current at which the output voltage drops to 90% of the specified typical value. For example, the current limit for a 1.0 V
output voltage is defined as the current that causes the output voltage to drop to 90% of 1.0 V, or 0.9 V.
INPUT AND OUTPUT CAPACITOR: RECOMMENDED SPECIFICATIONS
Table 3.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
CAPACITANCE1 TA = −40°C to +125°C
Input CIN 7.0 10 µF
Output COUT 7.0 10 µF
Regulator CREG 0.7 1 µF
Reference
C
REF
0.7
1
µF
CAPACITOR EQUIVALENT SERIES RESISTANCE (ESR) RESR TA = −40°C to +125°C
CIN, COUT 0.001 0.5 Ω
CREG, CREF 0.001 0.2 Ω
1 The minimum input and output capacitance must be >7.0 µF over the full range of the operating conditions. Consider the full range of the operating conditions in the
application during device selection to ensure that the minimum capacitance specification is met. X7R and X5R type capacitors are recommended. Y5V and Z5U
capacitors are not recommended for use with any LDO.
Data Sheet ADP1763
Rev. C | Page 5 of 18
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
VIN to GND −0.3 V to +2.16 V
EN to GND
−0.3 V to +3.96 V
VOUT to GND −0.3 V to VIN
SENSE to GND −0.3 V to VIN
VREG to GND −0.3 V to VIN
REFCAP to GND −0.3 V to VIN
VADJ to GND −0.3 V to VIN
SS to GND −0.3 V to VIN
PG to GND −0.3 V to +3.96 V
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +125°C
Operating Junction Temperature 125°C
Lead Temperature (Soldering, 10 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL DATA
Absolute maximum ratings apply only individually, not in
combination. The ADP1763 may be damaged when junction
temperature limits are exceeded. Monitoring ambient temperature
does not guarantee that the junction temperature is within the
specified temperature limits. In applications with high power
dissipation and poor thermal resistance, the maximum ambient
temperature may need to be derated.
In applications with moderate power dissipation and low printed
circuit board (PCB) thermal resistance, the maximum ambient
temperature can exceed the maximum limit as long as the junction
temperature is within specification limits. The junction
temperature (TJ) of the device is dependent on the ambient
temperature (TA), the power dissipation of the device (PD), and the
junction to ambient thermal resistance of the package (θJA). TJ is
calculated using the following formula:
TJ = TA + (PD × θJA)
The junction to ambient thermal resistance (θJA) of the package
is based on modeling and a calculation using a 4-layer board.
The junction to ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The specified
values of θJA are based on a 4-layer, 4 in × 3 in circuit board. For
details about board construction, refer to JEDEC JESD51-7.
ΨJB is the junction to board thermal characterization parameter
with units of °C / W. ΨJB of the package is based on modeling and
a calculation using a 4-layer board. The JEDEC JESD51-12
document, Guidelines for Reporting and Using Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. ΨJB measures the component
power flowing through multiple thermal paths rather than a single
path, as in thermal resistance (θJB). Therefore, ΨJB thermal paths
include convection from the top of the package as well as radiation
from the package, factors that make ΨJB more useful in real-
world applications. The maximum junction temperature (TJ) is
calculated from the board temperature (TB) and power dissipation
(PD), using the following formula:
TJ = TB + (PD × ΨJB)
Refer to the JEDEC JESD51-8 and JESD51-12 documents for
more detailed information about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance for a 4-Layer 6400 mm2 Copper Size
Package Type θJA ΨJB Unit
16-Lead LFCSP 56 28.4 °C/W
ESD CAUTION
ADP1763 Data Sheet
Rev. C | Page 6 of 18
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
12
11
10
1
3
49
2
6
5
7
8
16
15
14
13
VIN
VIN
VIN
VIN
VOUT
NOTES
1.THE EXPOSED PAD IS ELECTRICALLY
CONNECTED TOGND. IT IS RECOMMENDED
THAT THIS PAD BE CONNECTED TO A GROUND
PLANE ON THE PCB. THEEXPOSEDPADIS
ON THE BOTTOM OF THE PACKAGE.
SENSE
SS
PG
EN
VOUT
VOUT
VOUT
REFCAP
VREG
GND
VADJ
ADP1763
TOP VIEW
(Not to Scal e)
12923-003
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 VIN Regulator Input Supply. Bypass VIN to GND with a 10 µF or greater capacitor. Note that all four VIN pins must be
connected to the source supply.
5 REFCAP Reference Filter Capacitor. Connect a 1 µF capacitor from the REFCAP pin to ground. Do not connect a load to
ground.
6 VREG Regulated Input Supply to LDO Amplifier. Bypass VREG to GND with a 1 µF or greater capacitor. Do not connect
a load to ground.
7 GND Ground.
8 VADJ Adjustable Voltage Pin for the Adjustable Output Option. Connect a 10 kΩ external resistor between the VADJ
pin and ground to set the output voltage to 1.5 V. For the fixed output option, leave this pin floating.
9 to 12 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 10 µF or greater capacitor. Note that all four VOUT pins
must be connected to the load.
13 SENSE Sense Input. The SENSE pin measures the actual output voltage at the load and feeds it to the error amplifier.
Connect VSENSE as close to the load as possible to minimize the effect of IR voltage drop between VOUT and the load.
14 SS Soft Start Pin. A 10 nF capacitor connected to the SS pin and ground sets the start-up time to 0.6 ms.
15 PG Power-Good Output. This open-drain output requires an external pull-up resistor. If the device is in shutdown
mode, current-limit mode, or thermal shutdown mode, or if VOUT falls below 90% of the nominal output
voltage, the PG pin immediately transitions low.
16 EN Enable Input. Drive the EN pin high to turn on the regulator. Drive the EN pin low to turn off the regulator. For
automatic startup, connect the EN pin to the VIN pin.
EP Exposed Pad. The exposed pad is electrically connected to GND. It is recommended that this pad be connected
to a ground plane on the PCB. The exposed pad is on the bottom of the package.
Data Sheet ADP1763
Rev. C | Page 7 of 18
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 1.5 V, VOUT = 1.3 V, TA = 25°C, unless otherwise noted.
12923-004
1.295
1.297
1.299
1.301
1.303
1.305
–50 –25 025 50 75 100 125 150
OUTPUT VOLTAGE (V)
JUNCTI ON T E M P E RATURE (° C)
NO LOAD
I
LOAD
= 10mA
I
LOAD
= 100m A
I
LOAD
= 1A
I
LOAD
= 2A
I
LOAD
= 3A
Figure 4. Output Voltage (VOUT) vs. Junction Temperature
12923-005
1.301
1.302
1.302
1.303
1.303
0.01 0.1 110
OUTPUT VOLTAGE (V)
LO AD CURRE NT (A)
Figure 5. Output Voltage (VOUT) vs. Load Current
12923-006
1.298
1.300
1.302
1.304
1.306
1.308
1.310
1.5 1.6 1.7 1.8 1.9 2.0
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
I
LOAD
= 100m A
I
LOAD
= 1A
I
LOAD
= 2A
I
LOAD
= 3A
Figure 6. Output Voltage vs. Input Voltage
0
2
4
6
8
10
12
14
16
–50 –25 025 50 75 100 125 150
GRO UND CURRE NT (mA)
JUNCTI ON T E M P E R ATURE (° C)
NO LOAD
I
LOAD
= 100m A
I
LOAD
= 1A
I
LOAD
= 3A
I
LOAD
= 10mA
I
LOAD
= 500m A
I
LOAD
= 2A
12923-007
Figure 7. Ground Current vs. Junction Temperature
0
2
4
6
8
10
12
14
0.01 0.1 110
GRO UND CURRE NT (mA)
LO AD CURRE NT (A)
12923-008
Figure 8. Ground Current vs. Load Current
0
2
4
6
8
10
12
14
1.5 1.6 1.7 1.8 1.9 2.0
GRO UND CURRE NT (mA)
INPUT VOLTAGE (V)
12923-009
NO LOAD
I
LOAD
= 10mA
I
LOAD
= 100m A
I
LOAD
= 500m A
I
LOAD
= 1A
I
LOAD
= 2A
I
LOAD
= 3A
Figure 9. Ground Current vs. Input Voltage
ADP1763 Data Sheet
Rev. C | Page 8 of 18
–20
0
20
40
60
80
100
120
140
160
180
200
–50 –25 0 25 50 75 100 125 150
SHUTDOWN CURRENT (µA)
JUNCTION TEMPERATURE (°C)
V
IN
= 1.5V
V
IN
= 1.7V
V
IN
= 1.9V
V
IN
= 1.6V
V
IN
= 1.8V
V
IN
= 1.98V
12923-010
Figure 10. Shutdown Current vs. Junction Temperature at
Various Input Voltages (VIN)
12923-011
0
10
20
30
40
50
60
70
80
90
100
0.1 1 10
DROPOUT VOLTAGE (mV)
LOAD CURRENT (A)
Figure 11. Dropout Voltage vs. Load Current, VOUT = 1.3 V
1.10
1.15
1.20
1.25
1.30
1.35
1.2 1.3 1.4 1.5
OUTPUT VOLTAGE (V)
INPUT VOLTAGE (V)
I
LOAD
= 100mA
I
LOAD
= 1A
I
LOAD
= 2A
I
LOAD
= 3A
12923-012
Figure 12. Output Voltage vs. Input Voltage (in Dropout), VOUT = 1.3 V
0
2
4
6
8
10
12
14
1.11.21.31.41.51.6
GROUND CURRENT (mA)
INPUT VOLTAGE (V)
NO LOAD
I
LOAD
= 10mA
I
LOAD
= 100mA
I
LOAD
= 500mA
I
LOAD
= 1A
I
LOAD
= 2A
I
LOAD
= 3A
12923-013
Figure 13. Ground Current vs. Input Voltage (in Dropout), VOUT = 1.3 V
CH1 50.0mV CH2 2.00A M4.00µs A CH2 640mA
1
2
T 18.70%
12923-014
V
OUT
LOAD
3A/µs SLEW RATE
BW
Figure 14. Load Transient Response, COUT = 10 μF, VIN = 1.8 V, VOUT = 1.3 V
CH1 50.0mV CH2 2.00A M4.00µs A CH2 640mA
2
1
T 18.70%
12923-015
V
OUT
LOAD
BW
3A/µs SLEW RATE
Figure 15. Load Transient Response, COUT = 47 μF, VIN = 1.8 V, VOUT = 1.3 V
Data Sheet ADP1763
Rev. C | Page 9 of 18
CH1 5.00mV CH2 500mV M2.00µs A CH2 1.68V
2
1
T 17.50%
12923-016
V
OUT
V
IN
1V/µs SLEW RATE
Figure 16. Line Transient Response, Load Current = 3 A,
VIN = 1.5 V to 1.98 V Step, VOUT = 1.3 V
0
2
4
6
8
10
12
14
16
0.1 1 10
NOISE (µV rms)
LOAD CURRENT (A)
V
OUT
= 1.3V (100Hz TO 100kHz)
V
OUT
= 1.3V (10Hz TO 100kHz)
12923-017
Figure 17. Noise vs. Load Current for Various Output Voltages
0.1
1
10
100
1k
10k
10 100 1k 10k 100k
NOISE SPECTR
A
L DENSITY (nV/
√
Hz)
FREQUENCY (Hz)
V
OUT
= 0.9V
V
OUT
= 1.3V
V
OUT
= 1.5V
12923-018
Figure 18. Noise Spectral Density vs. Frequency for Various Output Voltages,
ILOAD = 100 mA
12923-019
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–
10
1 10 100 1k 10k 100k 1M 10M
PSRR (dB)
FREQUENCY (Hz)
V
IN
= 1.1V
V
IN
= 1.2V
V
IN
= 1.3V
V
IN
= 1.4V
V
IN
= 1.5V
V
IN
= 1.6V
Figure 19. Power Supply Rejection Ratio (PSRR) vs. Frequency for
Various Input Voltages, VOUT = 0.9 V, Load Current = 3 A
12923-020
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–
10
1 10 100 1k 10k 100k 1M 10M
PSRR (dB)
FREQUENCY (Hz)
V
IN
= 1.5V
V
IN
= 1.6V
V
IN
= 1.7V
V
IN
= 1.8V
V
IN
= 1.9V
V
IN
= 1.98V
Figure 20. Power Supply Rejection Ratio (PSRR) vs. Frequency for
Various Input Voltages, VOUT = 1.3 V, Load Current = 3 A
12923-021
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–
10
1 10 100 1k 10k 100k 1M 10M
PSRR (dB)
FREQUENCY (Hz)
V
IN
= 1.7V
V
IN
= 1.8V
V
IN
= 1.9V
V
IN
= 1.98V
Figure 21. Power Supply Rejection Ratio (PSRR) vs. Frequency for
Various Input Voltages, VOUT = 1.5 V, Load Current = 3 A
ADP1763 Data Sheet
Rev. C | Page 10 of 18
110 100 1k 10k 100k 1M 10M
–110
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
PSRR (dB)
FREQUENCY (Hz)
I
LOAD
= 500m A
I
LOAD
= 1A
I
LOAD
= 2A
I
LOAD
= 3A
12923-022
Figure 22. Power Supply Rejection Ratio (PSRR) vs. Frequency for
Various Loads, VOUT = 1.3 V, VIN = 1.7 V
Data Sheet ADP1763
Rev. C | Page 11 of 18
THEORY OF OPERATION
The ADP1763 is an LDO, low noise linear regulator that uses an
advanced proprietary architecture to achieve high efficiency
regulation. It also provides high PSRR and excellent line and load
transient response using a small 10 F ceramic output capacitor.
The device operates from a 1.10 V to 1.98 V input rail to
provide up to 3 A of output current. Supply current in
shutdown mode is typically 2 μA.
SS BLOCK
REFCAP
SS
PG
SHORT-CIRCUIT,
THERMAL
PROTECTION
INTERNAL
BIAS SUPPLY
ADP1763
VIN
VREG
EN
GND
REFERENCE,
BIAS
VOUT
SENSE
12923-023
Figure 23. Functional Block Diagram, Fixed Output
SS BLOCK
SHORT-CIRCUIT,
THERMAL
PROTECTION
INTERNAL
BIAS SUPPLY
REFCAP
SS
PG
VIN
V
RE
G
VADJ
I
ADJ
EN
GND
VOUT
SENSE
12923-024
ADP1763
3×
Figure 24. Functional Block Diagram, Adjustable Output
Internally, the ADP1763 consists of a reference, an error amplifier,
and a pass device. The output current is delivered via the pass
device, which is controlled by the error amplifier, forming a
negative feedback system that ideally drives the feedback
voltage to equal the reference voltage. If the feedback voltage is
lower than the reference voltage, the negative feedback drives
more current, increasing the output voltage. If the feedback
voltage is higher than the reference voltage, the negative feedback
drives less current, decreasing the output voltage.
The ADP1763 is available in output voltages ranging from 0.9 V to
1.5 V for a fixed output. Contact a local Analog Devices, Inc.,
sales representative for other fixed voltage options. The
adjustable output option can be set from 0.5 V to 1.5 V.
The ADP1763 uses the EN pin to enable and disable the VOUT
pin under normal operating conditions. When EN is high, VOUT
turns on. When EN is low, VOUT turns off. For automatic startup,
tie EN to VIN.
SOFT START FUNCTION
For applications that require a controlled startup, the ADP1763
provides a programmable soft start function. The programmable
soft start is useful for reducing inrush current upon startup and
for providing voltage sequencing. To implement soft start, connect
a small ceramic capacitor from SS to GND. At startup, a 10 μA
current source charges this capacitor. The voltage at SS limits
the ADP1763 start-up output voltage, providing a smooth ramp-up
to the nominal output voltage. To calculate the start-up time for
the fixed output and adjustable output, use the following equations:
tSTART-UP_FIXED = tDELAY + VREF × (CSS/ISS) (1)
tSTART-UP_ADJ = tDELAY + VADJ × (CSS/ISS) (2)
where:
tDELAY is a fixed delay of 100 μs.
VREF is a 0.5 V internal reference for the fixed output model option.
CSS is the soft start capacitance from SS to GND.
ISS is the current sourced from SS (10 μA).
VADJ is the voltage at the VADJ pin equal to RADJ × IADJ.
TIME (ms)
V
OUT, EN
(V)
12923-025
–0.1
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
1.7
–0.2 0.3 0.8 1.3 1.8
EN
C
SS
= 0nF
C
SS
= 10nF
C
SS
= 22nF
Figure 25. Fixed VOUT Ramp-Up with External Soft Start Capacitor (VOUT, EN) vs. Time
12923-226
–0.5
0
0.5
1.0
1.5
2.0
–0.2 0.3 0.8 1.3 1.8
V
OUT, EN
(V)
TIME (ms)
EN
V
OUT
= 0.5V; C
SS
= 10nF
V
OUT
= 0.5V; C
SS
= 22nF
V
OUT
= 1.5V; C
SS
= 10nF
V
OUT
= 1.5V; C
SS
= 22nF
Figure 26. Adjustable VOUT Ramp-Up with External Soft Start Capacitor
(VOUT, EN) vs. Time
ADP1763 Data Sheet
Rev. C | Page 12 of 18
ADJUSTABLE OUTPUT VOLTAGE
The output voltage of the ADP1763 can be set over a 0.5 V to
1.5 V range. Connect a resistor (RADJ) from the VADJ pin to
ground to set the output voltage. To calculate the output voltage,
use the following equation:
VOUT = AD × (RADJ × IADJ) (3)
where:
AD is the gain factor with a typical value of 3.0 between the
VADJ pin and the VOUT pin.
IADJ is the 50.0 μA constant current out of the VADJ pin.
ENABLE FEATURE
The ADP1763 uses the EN pin to enable and disable the VOUT
pins under normal operating conditions. As shown in Figure 27,
when a rising voltage on EN crosses the active threshold, VOUT
turns on. When a falling voltage on EN crosses the inactive
threshold, VOUT turns off.
CH1 200mV CH2 200mV M4.0ms A CH1 768mV
1
T 8.26ms
BWBW
12923-026
EN
V
OUT
Figure 27. Typical EN Pin Operation
As shown in Figure 28, the EN pin has hysteresis built in. This
hysteresis prevents on/off oscillations that can occur due to
noise on the EN pin as it passes through the threshold points.
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
EN VOLTAGE (V)
0.55 0.56 0.57 0.58 0.59 0.60 0.61 0.62 0.63 0.64 0.65
OUTPUT VOLTAG E (V)
12923-127
Figure 28. Output Voltage vs. Typical EN Pin Voltage, VOUT = 1.3 V
POWER-GOOD (PG) FEATURE
The ADP1763 provides a power-good pin (PG) to indicate the
status of the output. This open-drain output requires an external
pull-up resistor that can be connected to VIN or VOUT. If the
device is in shutdown mode, current-limit mode, or thermal
shutdown, or if it falls below 90% of the nominal output voltage,
PG immediately transitions low. During soft start, the rising
threshold of the power-good signal is 95% of the nominal
output voltage.
The open-drain output is held low when the ADP1763 has
sufficient input voltage to turn on the internal PG transistor. An
optional soft start delay can be detected. The PG transistor is
terminated via a pull-up resistor to VOUT or VIN.
Power-good accuracy is 92.5% of the nominal regulator output
voltage when this voltage is rising, with a 95% trip point when
this voltage is falling.
Regulator input voltage brownouts or glitches trigger a power
no good if VOUT falls below 92.5%.
A normal power-down triggers a power good when VOUT is at 95%.
CH1 1.00V CH2 1.00V M100µs A CH4 420mV
1
2
4
T228.0000µs
CH4 1.00V
V
IN
V
OUT
PG
12923-027
Figure 29. Typical PG Behavior vs. VOUT, VIN Rising (VOUT = 1.3 V)
1
2
4
CH1 1.00V CH2 1.00V M200µs A CH1 3.00V
T 0.000000s
CH4 1.00V
V
IN
V
OUT
PG
12923-128
Figure 30. Typical PG Behavior vs. VOUT, VIN Falling (VOUT = 1.3 V)
Data Sheet ADP1763
Rev. C | Page 13 of 18
APPLICATIONS INFORMATION
CAPACITOR SELECTION
Output Capacitor
The ADP1763 is designed for operation with small, space-saving
ceramic capacitors, but it can function with most commonly
used capacitors as long as care is taken with the effective series
resistance (ESR) value. The ESR of the output capacitor affects
the stability of the LDO control loop. A minimum of 10 µF
capacitance with an ESR of 500 mΩ or less is recommended to
ensure the stability of the ADP1763. Transient response to
changes in load current is also affected by output capacitance.
Using a larger value of output capacitance improves the
transient response of the ADP1763 to large changes in load
current. Figure 31 and Figure 32 show the transient responses
for output capacitance values of 10 µF and 47 µF, respectively.
CH1 50.0mV CH2 2.00A M1.00µs A CH2 640mA
1
2
T 18.70%
12923-030
V
OUT
I
LOAD
BW
Figure 31. Output Transient Response, COUT = 10 μF
CH1 50.0mV CH2 2.00A M1.00µs A CH2 640mA
1
2
T 19.00%
12923-031
V
OUT
I
LOAD
Figure 32. Output Transient Response, COUT = 47 μF
Input Bypass Capacitor
Connecting a 10 µF capacitor from the VIN pin to the GND pin
to ground reduces the circuit sensitivity to the PCB layout,
especially when long input traces or a high source impedance
is encountered. If output capacitance greater than 10 µF is
required, it is recommended that the input capacitor be increased
to match it.
Input and Output Capacitor Properties
Use any good quality ceramic capacitors with the ADP1763, as
long as they meet the minimum capacitance and maximum ESR
requirements. Ceramic capacitors are manufactured with a variety
of dielectrics, each with different behavior over temperature and
applied voltage. Capacitors must have a dielectric adequate to
ensure the minimum capacitance over the necessary temperature
range and dc bias conditions. X5R or X7R dielectrics with a
voltage rating of 6.3 V or 10 V are recommended. Y5V and Z5U
dielectrics are not recommended, due to their poor temperature
and dc bias characteristics.
Figure 33 shows the capacitance vs. bias voltage characteristics
of an 0805 case, 10 µF, 10 V, X5R capacitor. The voltage stability
of a capacitor is strongly influenced by the capacitor size and
voltage rating. In general, a capacitor in a larger package or with
a higher voltage rating exhibits better stability. The temperature
variation of the X5R dielectric is about ±15% over the −40°C to
+85°C temperature range and is not a function of package size
or voltage rating.
0
2
4
6
8
10
12
0123456
DC BIAS VOLTAGE (V)
C
A
PACITANCE (µF)
12923-032
Figure 33. Capacitance vs. DC Bias Voltage
Use Equation 4 to determine the worst case capacitance,
accounting for capacitor variation over temperature, component
tolerance, and voltage.
CEFF = COUT × (1 − tempco) × (1 − TOL) (4)
where:
CEFF is the effective capacitance at the operating voltage.
COUT is the output capacitor.
Tempco is the worst case capacitor temperature coefficient.
TOL is the worst case component tolerance.
In this example, the worst case temperature coefficient
(tempco) over −40°C to +85°C is assumed to be 15% for an X5R
dielectric. The tolerance of the capacitor (TOL) is assumed to
be 10%, and COUT = 10 µF at 1.0 V, as shown in Figure 33.
Substituting these values in Equation 4 yields
CEFF = 10 F × (1 − 0.15) × (1 − 0.1) = 7.65 F
ADP1763 Data Sheet
Rev. C | Page 14 of 18
Therefore, the capacitor chosen in this example meets the
minimum capacitance requirement of the LDO over temperature
and tolerance at the chosen output voltage.
To guarantee the performance of the ADP1763, it is imperative
that the effects of dc bias, temperature, and tolerances on the
behavior of the capacitors be evaluated for each application.
UNDERVOLTAGE LOCKOUT
The ADP1763 has an internal undervoltage lockout circuit that
disables all inputs and the output when the input voltage is less
than approximately 1.06 V. The UVLO ensures that the ADP1763
inputs and the output behave in a predictable manner during
power-up.
CURRENT-LIMIT AND THERMAL OVERLOAD
PROTECTION
The ADP1763 is protected against damage due to excessive power
dissipation by current-limit and thermal overload protection
circuits. The ADP1763 is designed to reach the current limit
when the output load reaches 4 A (typical). When the output
load exceeds 4 A, the output voltage is reduced to maintain a
constant current limit.
Thermal overload protection is included, which limits the
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and power
dissipation) when the junction temperature begins to rise above
150°C, the output is turned off, reducing the output current to
zero. When the junction temperature drops below 135°C (typical),
the output is turned on again, and the output current is restored
to its nominal value.
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP1763 reaches the current limit so that only
4 A is conducted into the short circuit. If self heating of the junction
becomes great enough to cause its temperature to rise above 150°C,
thermal shutdown activates, turning off the output and reducing
the output current to zero. As the junction temperature cools and
drops below 135°C, the output turns on and conducts 4 A into
the short circuit, again causing the junction temperature to rise
above 150°C. This thermal oscillation between 135°C and 150°C
causes a current oscillation between 4 A and 0 A that continues
as long as the short circuit remains at the output.
Current-limit and thermal overload protections are intended to
protect the device against accidental overload conditions. For
reliable operation, limit device power dissipation externally so that
junction temperatures do not exceed 125°C.
PARALLELING ADP1763 FOR HIGH CURRENT
APPLICATIONS
In applications where high output current is required while
maintaining low noise and high PSRR performance, connect two
ADP1763 devices in parallel to handle loads up to 5 A.
When paralleling the ADP1763, the two outputs must be of the
same voltage setting to maintain stable current sharing between
the two LDO regulators. To improve current sharing accuracy, add
identical ballast resistors (RBALLAST) at the output of each regulator,
as shown in Figure 34. Note that large ballast resistors improve
current sharing accuracy but degrade the load regulation perform-
ance and increase the losses along the power line; therefore, it is
recommended to keep the ballast resistors at a minimum. In
addition, tie the VA D J, S S , and REFCAP pins of the LDO regu-
lators together to minimize error between the two outputs.
VIN
EN ENABLE
SS
VREG
VOUT
SENSE
C
OUT
10µF
PG
VADJ
GNDREFCAP
C
IN
10µF
R
BALLAST
= 5mΩ
R
BALLAST
= 5mΩ
V
OUT
= 1.2V /5A
ADP1763
V
IN
= 1.5V
VIN
EN
SS
VREG
VOUT
SENSE
C
OUT
10µF
PG
VADJ
GNDREFCAP
C
IN
10µF
ADP1763
C
REG
1µF C
REF
1µF
R
ADJ
4.02kΩ
R
PULLUP
100kΩ
C
SS
1nF
C
REG
1µF C
REF
1µF
12923-133
Figure 34. Two ADP1763 Devices Connected in Parallel to Achieve Higher Current Output
Data Sheet ADP1763
Rev. C | Page 15 of 18
Use Equation 5 to calculate the output of the two paralleled
ADP1763 LDOs.
VOUT = 2 × AD × (RADJ × IADJ) (5)
where:
AD is the gain factor with a typical value of 3.0 between the
VADJ pin and the VOUT pin.
IADJ is the 50.0 μA constant current out of the VADJ pin.
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
ADP1763 must not exceed 125°C. To ensure that the junction
temperature stays below this maximum value, the user needs to be
aware of the parameters that contribute to junction temperature
changes. These parameters include ambient temperature, power
dissipation in the power device, and thermal resistance between
the junction and ambient air (θJA). The θJA value is dependent
on the package assembly compounds used and the amount of
copper to which the GND pin and the exposed pad (EPAD) of the
package are soldered on the PCB. Table 7 shows typical θJA values
for the 16-lead LFCSP for various PCB copper sizes. Table 8
shows typical ΨJB values for the 16-lead LFCSP.
Table 7. Typical θJA Values
Copper Size (mm2) θJA (°C/W), LFCSP
25 138.1
100 102.9
500 76.9
1000 67.3
6400 56
Table 8. Typical ΨJB Values
Copper Size (mm2) ΨJB (°C/W) at 1 W
100 33.3
500 28.9
1000 28.5
To calculate the junction temperature of the ADP1763, use the
following equation:
TJ = TA + (PD × θJA) (6)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = ((VIN − VOUT) × ILOAD) + (VIN × IGND) (7)
where:
VIN and VOUT are the input and output voltages, respectively.
ILOAD is the load current.
IGND is the ground current.
As shown in Equation 6, for a given ambient temperature, and
computed power dissipation, a minimum copper size
requirement exists for the PCB to ensure that the junction
temperature does not rise above 125°C.
Figure 35 through Figure 40 show junction temperature
calculations for different ambient temperatures, load currents,
VIN to VOUT differentials, and areas of PCB copper.
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
T
J
MAX
3A 2A
1A
500mA
10mA
100mA
12923-033
Figure 35. 6400 mm2 of PCB Copper, TA = 25°C
3A
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
JUNCTION TEMPER
A
TURE (°C)
2A 1A
500mA
10mA
100mA
12923-034
T
J
MAX
Figure 36. 500 mm2 of PCB Copper, TA = 25°C
T
J
MAX
3A
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
JUNCTION TEMPER
A
TURE (°C)
2A 1A
500mA
10mA
100mA
12923-035
Figure 37. 25 mm2 of PCB Copper, TA = 25°C
ADP1763 Data Sheet
Rev. C | Page 16 of 18
1A
TJ MAX
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
VIN – VOUT (V)
3A
2A
500mA
10mA
100mA
12923-036
Figure 38. 6400 mm2 of PCB Copper, TA = 50°C
T
J
MAX
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
3A 2A 1A
500mA
10mA
100mA
12923-037
Figure 39. 500 mm2 of PCB Copper, TA = 50°C
T
J
MAX
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
3A
2A 1A 500mA
10mA
100mA
12923-038
Figure 40. 25 mm2 of PCB Copper, TA = 50°C
In cases where the board temperature is known, the thermal
characterization parameter (ΨJB) can be used to estimate the
junction temperature rise. The maximum junction temperature
(TJ) is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB) (8)
Figure 41 through Figure 44 show junction temperature
calculations for different board temperatures, load currents,
VIN to VOUT differentials, and areas of PCB copper.
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
3A
2A
1A
500mA
10mA
100mA
12923-039
T
J
MAX
Figure 41. 500 mm2 of PCB Copper, TB = 25°C
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
T
J
MAX
3A 2A
1A
500mA
10mA
100mA
12923-040
Figure 42. 500 mm2 of PCB Copper, TB = 50°C
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
3A
2A
1A
500mA
10mA
100mA
12923-041
T
J
MAX
Figure 43. 1000 mm2 of PCB Copper, TB = 25°C
Data Sheet ADP1763
Rev. C | Page 17 of 18
V
IN
– V
OUT
(V)
0
20
40
60
80
100
120
140
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
JUNCTION TEMPER
A
TURE (°C)
3A 2A
1A
500mA
10mA
100mA
12923-042
T
J
MAX
Figure 44. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP
12923-145
T
B
= 92°C
T
ADP1763
= 112°C
12923-145
Figure 45. Thermal Image of the ADP1763 Evaluation Board at ILOAD = 3 A,
VIN = 1.5 V, VOUT = 1.3 V, TB = 92°C
Figure 45 shows a thermal image of the ADP1763 evaluation
board operating at a 3 A current load. The total power dissipation
on the ADP1763 is 600 mW, which makes the temperature on
the surface of the device higher by 20°C than the temperature of
the evaluation board.
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of ADP1763. However,
as shown in Table 8, a point of diminishing returns is eventually
reached, beyond which an increase in the copper size does not
yield significant heat dissipation benefits.
Use the following recommendations when designing PCBs:
Place the input capacitor as close as possible to the VIN
and GND pins.
Place the output capacitor as close as possible to the VOUT
and GND pins.
Place the soft start capacitor (CSS) as close as possible to the
SS pin.
Place the reference capacitor (CREF) and regulator capacitor
(CREG) as close as possible to the REFCAP pin and VREG pin,
respectively.
Connect the load as close as possible to the VOUT and
SENSE pins.
Use of 0603 or 0805 size capacitors and resistors achieves the
smallest possible footprint solution on boards where area is
limited.
12923-043
Figure 46. Evaluation Board
12923-044
Figure 47. Typical Board Layout, Top Side
12923-045
Figure 48. Typical Board Layout, Bottom Side
ADP1763 Data Sheet
Rev. C | Page 18 of 18
OUTLINE DIMENSIONS
0.30
0.23
0.18
1.75
1.60 SQ
1.45
3.10
3.00 SQ
2.90
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
0.50
0.40
0.30
0.05 M AX
0.02 NO M
0.20 REF
0.20 M IN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS M O-220- WEE D- 6.
PKG-005138
SEATING
PLANE
TOP VIEW
EXPOSED
PAD
02-23-2017-E
PIN 1
INDICATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
FOR PRO P E R CONNECTI ON O F
THE EXPOSED PAD, REFER TO
THE PIN CO NFI GURAT IO N AND
FUNCTION DES CRIPTI ONS
SECTION OF THIS DATA SHEET.
Figure 49. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-22)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range
Output
Voltage (V)2 Package Description
Package
Option Branding
ADP1763ACPZ-R7 −40°C to +125°C Adjustable 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS0
ADP1763ACPZ-0.9-R7 −40°C to +125°C 0.9 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS1
ADP1763ACPZ0.95-R7 −40°C to +125°C 0.95 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LUQ
ADP1763ACPZ-1.0-R7 −40°C to +125°C 1.0 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS2
ADP1763ACPZ-1.1-R7
−40°C to +125°C
1.1
16-Lead Lead Frame Chip Scale Package [LFCSP]
CP-16-22
LS3
ADP1763ACPZ-1.2-R7 −40°C to +125°C 1.2 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS4
ADP1763ACPZ1.25-R7 −40°C to +125°C 1.25 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS5
ADP1763ACPZ-1.3-R7 −40°C to +125°C 1.3 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS6
ADP1763ACPZ-1.5-R7 −40°C to +125°C 1.5 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-22 LS7
ADP1763-1.3-EVALZ 1.3 Evaluation Board
ADP1763-ADJ-EVALZ 1.1 Evaluation Board
1 Z = RoHS Compliant Part.
2 For additional options, contact a local Analog Devices sales or distribution representative. Additional voltage output options available include the following: 0.5 V,
0.55 V, 0.6 V, 0.65 V, 0.7 V, 0.75 V, 0.8 V, 0.85 V, 1.05 V, 1.15 V, 1.35 V, 1.4 V, or 1.45 V.
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D12923-0-9/17(C)
