High Temperature, Low Drift,
Micropower 2.5 V Reference
Data Sheet
ADR225
Rev. B Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
r
ights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2013 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Extreme high temperature operation
−40°C to +210°C, 8-lead FLATPACK
−40°C to +175°C, 8-lead SOIC
Temperature coefficient
40 ppm/°C, 8-lead FLATPACK
10 ppm/°C, 8-lead SOIC
High output current: 10 mA
Low supply current: 50 µA maximum
Initial accuracy: ±0.4% (±10 mV maximum), 8-lead SOIC
Low dropout voltage
Wide supply range: 3.3 V to 16 V
APPLICATIONS
Down-hole drilling and instrumentation
Avionics
Heavy industrial
High temperature environments
PIN CONFIGURATION
NC
1
V
S2
NC
3
GND
4
NC
8
NC
7
OUTPUT
6
NC
5
NOTES
1. NC = NO CO NNE C T. DO NOT
CONNE CT TO THIS PIN.
ADR225
TOP VIEW
(No t t o Scal e)
11525-001
Figure 1. Pin Configuration for SOIC and FLATPACK Packages
GENERAL DESCRIPTION
The ADR225 is a precision 2.5 V band gap voltage reference
specified for a high temperature operation of 175°C and 210°C.
It uses a micropower core topology and laser trimming of highly
stable, thin film resistors to achieve a temperature coefficient of
30 ppm/°C (maximum) up to 175°C and an initial accuracy of 0.4%
(±10 mV maximum). A maximum operating current of 50 µA
and a low dropout voltage allow the ADR225 to function very
well in battery-powered equipment.
The ADR225 voltage reference is offered in an 8-lead SOIC
package with an operating temperature range of −40°C to +175°C.
It is also available in an 8-lead ceramic flat pack (FLATPACK)
with an operating temperature range of −40°C to +210°C. Both
devices are designed for robustness at extreme temperatures
and are qualified for 1000 hours of operation at the maximum
temperature rating.
The ADR225 is a member of a growing series of high temperature
qualified products offered by Analog Devices, Inc. For a complete
selection table of the available high temperature products, see
the high temperature product list and qualification data available
at www.analog.com/hightemp.
ADR225* Product Page Quick Links
Last Content Update: 11/01/2016
Comparable Parts
View a parametric search of comparable parts
Documentation
Data Sheet
•ADR225-KGD-CHIPS: Known Good Die Data Sheet
•ADR225: High Temperature, Low Drift, Micropower 2.5 V
Reference Data Sheet
Reference Designs
•CN0365
Reference Materials
Press
•Analog Devices Introduces Industry’s Fastest, Most
Accurate and Lowest Power High-Temperature SAR A/D
Converter
Technical Articles
•MS-2707: Harsh Environments Conquered - Low Power,
Precision, High Temperature Components for Extreme High
Temperature Applications
Design Resources
•ADR225 Material Declaration
•PCN-PDN Information
•Quality And Reliability
•Symbols and Footprints
Discussions
View all ADR225 EngineerZone Discussions
Sample and Buy
Visit the product page to see pricing options
Technical Support
Submit a technical question or find your regional support
number
* This page was dynamically generated by Analog Devices, Inc. and inserted into this data sheet. Note: Dynamic changes to
the content on this page does not constitute a change to the revision number of the product data sheet. This content may be
frequently modified.
ADR225 Data Sheet
Rev. B | Page 2 of 12
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Pin Configuration ............................................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Electrical Characteristics ............................................................. 3
Absolute Maximum Ratings ............................................................ 4
Predicted Lifetime vs. Operating Temperature .........................4
Thermal Resistance .......................................................................4
ESD Caution...................................................................................4
Typical Performance Characteristics ..............................................5
Theory of Operation .........................................................................9
Basic Voltage Reference Connections ........................................9
Outline Dimensions ....................................................................... 10
Ordering Guide .......................................................................... 10
REVISION HISTORY
11/13—Rev. A to Re v. B
Change to Features Section ............................................................. 1
Added Caption to Figure 1 .............................................................. 1
Changes to Table 1 ............................................................................ 3
Added Figure 6, Figure 7, Figure 8, Figure 12, Figure 13,
Figure 14, Figure 18, and Figure 19; Renumbered
Sequentially ....................................................................................... 5
9/13—Re v. 0 to Re v. A
Changes to Data Sheet Title and Added Wide Supply Range: 3.3 V
to 16 V to Features Section .............................................................. 1
Changed Supply Voltage from −0.3 V to +15 V to −0.3 V to
+18 V; Table 2 .................................................................................... 4
7/13—Revision 0: Initial Version
Data Sheet ADR225
Rev. B | Page 3 of 12
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS
VS = 3.3 V, VOUT = 2.5 V, TMIN < TA < TMAX, unless otherwise noted.
Table 1.
8-Lead SOIC 8-Lead FLATPACK
−40°C ≤ T
A
≤ +175°C
−40°C ≤ T
A
≤ +210°C
Parameter Symbol Test Conditions/Comments Min Typ Max Min Typ Max Unit
SUPPLY CURRENT ISY No load 30 50 40 60 µA
INITIAL ACCURACY1 VO IOUT = 0 mA ±2 ±10 ±5 ±60 mV
TEMPERATURE COEFFICIENT2 TCVOUT IOUT = 0 mA 10 30 40 80 ppm/°C
REGULATION
Line Regulation ΔVOUT/ΔVIN 3.0 V ≤ VS ≤ 15 V, IOUT = 0 mA 0.025 0.1 0.25 1.5 mV/V
Load Regulation3 ΔVOUT/ΔVLOAD VS = 5.0 V, 0 mA ≤ IOUT ≤ 10 mA 0.025 0.1 0.25 1.5 mV/mA
VOLTAGE
Dropout Voltage VS − VOUT ILOAD = 10 mA 1.00 1.00 V
Noise Voltage eN 0.1 Hz to 10 Hz 25 25 µV p-p
1 For proper operation, a 1 µF capacitor is required between the OUTPUT pin and the GND pin of the device.
2 TCVOUT is defined as the ratio of output change with temperature variation to the specified temperature range expressed in ppm/°C.
TCVOUT = (VMAX − VMIN)/VOUT(TMAX − TMIN)
3 Load regulation specification includes the effect of self-heating.
ADR225 Data Sheet
Rev. B | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage −0.3 V to +18 V
OUTPUT to GND −0.3 V to VS + 0.3 V
Storage Temperature Range −65°C to +150°C
Operating Temperature Range
8-Lead SOIC −40°C to +175°C
8-Lead FLATPACK −40°C to +210°C
Junction Temperature Range
8-Lead SOIC
−40°C to +200°C
8-Lead FLATPACK −40°C to +245°C
Lead Temperature (Soldering 60 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PREDICTED LIFETIME vs. OPERATING
TEMPERATURE
Comprehensive reliability testing is performed on the ADR225.
Product lifetimes at extended operating temperature are obtained
using high temperature operating life (HTOL). Lifetimes are
predicted from the Arrhenius equation, taking into account
potential design and manufacturing failure mechanism
assumptions. HTOL is performed to JEDEC JESD22-A108. A
minimum of three wafer fab and assembly lots are processed
through HTOL at the maximum operating temperature.
Comprehensive reliability testing is performed on all Analog
Devices, Inc., high temperature (HT) products.
1
100k
10k
1k
100
10
120 210
200
190180170160
150
140130
PREDICTED LIFETIME (Hours)
OP E RATING T E M P E RATURE (°C)
11525-021
Figure 2. Predicted Lifetime vs. Operating Temperature
THERMAL RESISTANCE
θJA is specified for worst-case conditions; that is, θJA is specified
for the device soldered in the circuit board.
Table 3.
Package Type θJA θJC Unit
8-Lead SOIC 121 43 °C/W
8-Lead FLATPACK 100 15 °C/W
ESD CAUTION
Data Sheet ADR225
Rev. B | Page 5 of 12
TYPICAL PERFORMANCE CHARACTERISTICS
VS = 3.3 V, VOUT = 2.5 V, TMIN ≤ TA ≤ TMAX for 8-lead SOIC package, unless otherwise noted.
2.490
2.495
2.500
2.505
2.510
–40 –25 –10 520 35 50 65 80 95 110 125 140 155 170
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
11525-004
Figure 3. Output Voltage (VOUT) vs. Temperature
0
2
4
6
8
10
12
14
16
18
–30 –24 –18 –12 –6 0 6 12 18 24 30
NUMBER OF UNIT S
TCV
OUT
(ppm/°C)
11525-005
Figure 4. TCVOUT Distribution, −40°C to +175°C
0
10
20
30
40
50
60
70
–0.5 –0.4 –0.3 –0.2 –0.1 00.1 0.2 0.3 0.4 0.5 0.6
NUMBER OF P ARTS
OUTPUT V OL TAGE ACCURACY ( %)
11525-006
Figure 5. Output Voltage Accuracy at 175°C
2.49
2.50
2.51
2.52
2.53
2.54
2.55
2.56
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
OUTPUT VOLTAGE (V)
TEMPERATURE ( °C)
11525-100
Figure 6. Output Voltage (VOUT) vs. Temperature, FLATPACK Package
0
1
2
3
4
5
6
7
0
4
8
12
16
20
24
28
32
36
40
44
48
52
56
60
64
68
72
76
80
84
88
NUMBER OF UNIT S
TCVOUT (ppm/°C)
11525-101
Figure 7. TCVOUT Distribution, −40°C to +210°C, FLATPACK Package
0
5
10
15
20
25
00.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
NUMBER OF P ARTS
OUTPUT VOLTAGE ACCURACY (%)
11525-102
Figure 8. Output Voltage Accuracy at 210°C, FLATPACK Package
ADR225 Data Sheet
Rev. B | Page 6 of 12
0
5
10
15
20
25
30
35
40
45
50
–40 –25 –10 520 35 50 65 80 95 110 125 140 155 170
SUPPLY CURRENT (µA)
TEMPERATURE ( °C)
11525-007
Figure 9. Supply Current (ISY) vs. Temperature
–30
–25
–20
–15
–10
–5
0
–
40
–
25
–
10 520 35 50 65 80 95 110 125 140 155 170
LOAD REG UL ATION (ppm/mA)
TEMPERATURE ( °C)
11525-009
Figure 10. Load Regulation vs. Temperature (ILOAD = 0 mA to 10 mA)
–10
0
10
20
30
40
50
60
–
40
–
25
–
10 520 35 50 65 80 95 110 125 140 155 170
LINE REGULATION (ppm/V)
TEMPERATURE ( °C)
11525-008
Figure 11. Line Regulation vs. Temperature
5
10
15
20
25
30
35
40
45
50
55
60
SUPP LY CURRENT (µ A)
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
TEMPERATURE (°C)
11525-103
Figure 12. Supply Current (ISY) vs. Temperature, FLATPACK Package
–500
–450
–400
–350
–300
–250
–200
–150
–100
–50
0
50
LOAD REGULATION (ppm/mA)
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
TEMPERATURE (°C)
11525-104
Figure 13. Load Regulation vs. Temperature (ILOAD = 0 mA to 10 mA),
FLATPACK Package
–50
0
50
100
150
200
250
300
350
400
450
500
LINE REGULATION (ppm/V)
–50
–40
–30
–20
–10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
160
170
180
190
200
210
TEMPERATURE (°C)
11525-105
Figure 14. Line Regulation vs. Temperature, FLATPACK Package
Data Sheet ADR225
Rev. B | Page 7 of 12
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 2 4 6 810 12
DROP OUT V OLTAGE (V)
LOAD CURRENT ( mA)
–40°C
+25°C
+175°C
11525-010
Figure 15. Dropout Voltage vs. Load Current (ILOAD)
2.496
2.498
2.500
2.502
2.504
2.506
2.508
40 55 70 85 100 115 130 145 160 175
OUTPUT VOLTAGE (V)
TEMPERATURE ( °C)
UNIT 1
UNIT 3
UNIT 5
11525-011
Figure 16. Thermal Hysteresis, ILOAD = 0 mA
M100µs A CH1 4.4V
2
CH1 2V CH2 1V
1
BW
V
IN
= 2V/ DIV
C
OUT
= 1µF
NO LOAD
V
OUT
= 1V/ DIV
11525-013
Figure 17. Power-On Response (see Figure 25)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0246810 12
DROPOUT VOLTAGE (V)
LOAD CURRENT ( mA)
11525-106
–40°C
+25°C
+210°C
Figure 18. Dropout Voltage vs. Load Current (ILOAD), FLATPACK Package
2.495
2.500
2.505
2.510
2.515
2.520
2.525
2.530
2.535
2.540
25 40 55 70 85 100 115 130 145 160 175 190 205
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
11525-107
Figure 19. Thermal Hysteresis, ILOAD = 0 mA, FLATPACK Package
10V
5V
0V
2
M200µs A CH1 7.3V
CH1 5V CH2 200mV
BW
1
V
OUT
= 200mV/DIV
V
IN
= 5V/ DIV
C
IN
= C
OUT
= 1µF
R
L
= 10kΩ
11525-014
Figure 20. Line Transient Response (see Figure 25)
ADR225 Data Sheet
Rev. B | Page 8 of 12
CH2 20mVCH1 1V M100µs A CH1 1.32V
1
2
VOUT = 20mV/DIV
COUT = 1µF
LOAD CURRENT 0mA
10mA
11525-012
Figure 21. Load Transient Response
–120
–100
–80
–60
–40
–20
0
POWER SUPPLY REJECT IO N RATIO (dB)
FREQUENCY (Hz)
10 100 1k 10k 100k 1M 10M
11525-015
Figure 22. Power Supply Rejection Ratio (PSRR) vs. Frequency, CLOAD = 1 µF
OUTPUT IMPEDANCE (Ω)
FRE QUENCY ( Hz )
110 100 1k 10k 100k 1M
11525-020
0.01
0.02
0.04
0.08
0.16
0.32
0.64
1.28
2.56
5.12
10.24
Figure 23. Output Impedance (ZOUT) vs. Frequency, CIN = COUT = 1 µF
Data Sheet ADR225
Rev. B | Page 9 of 12
THEORY OF OPERATION
BASIC VOLTAGE REFERENCE CONNECTIONS
The circuit shown in Figure 24 is the basic configuration for the
ADR225. Note that a 10 µF and 0.1 µF bypass network on the input
and at least a 1 µF bypass capacitor on the output are required for
proper device operation. It is recommended that no connections
be made to Pin 1, Pin 3, Pin 5, Pin 7, and Pin 8.
NC
V
S
NC
NC
NC
OUTPUT
NC
NC = NO CONNECT.
ADR225
11525-002
++
1µF
TANT 1µF
10µF 0.1µF
18
27
36
45
Figure 24. Basic Voltage Reference Connections
++
11525-017
U2A
AD8634
U1
ADR225
VS
GND
OUTPUT
C1
10µF C2
0.1µF
C3
1µF C4
0.1µF
VOUT
R2
2.5kΩ
R3
2.5kΩ –IN A
+IN A
VCC
+5V
V+
+5V
+VS
+5V
V–
–VS
–IN
+IN
–5V
–5V RTD
U3
AD8229
R1
2.5kΩ
Figure 25. Typical High Temperature Resistance Temperature Detector (RTD) Signal Conditioning Circuit
ADR225 Data Sheet
Rev. B | Page 10 of 12
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS;INCH DIMENSIONS
(IN PARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPL
IANT TO JEDEC STANDARDS MS-012-AA
012407-A
0.25 (0.0098)
0.17(0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099) 45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8 5
5.00(0.1968)
4.80(0
.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31(0.0122)
COPLANARITY
0.10
Figure 26. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
03-26-2013-A
0.260
0.255 SQ
0.250
1.00
TOP VIEW BOTTOM VIEW
END VIEW
SIDE VIEW
0.012 R
TYP
0.175 0.026 MIN
0.195
0.190 SQ
0.185
0.155
0.150
0.145
0.053
0.050
0.047
0.006
0.005
0.004
0.091
0.083
0.075
0.019
0.017
0.015
1
4
8
5
IDEX
MARK
0.054
0.044
0.034
0.05 TYP
0.024
0.007
MIN
0.035
TYP
Figure 27. 8-Lead Ceramic Flat Package [FLATPACK]
(F-8-2)
Dimensions shown in inches
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
ADR225HRZN −40°C to +175°C 8-Lead Standard Small Outline Package [SOIC_N] R-8
ADR225HFZ −40°C to +210°C 8-Lead Ceramic Flat Package [FLATPACK] F-8-2
1 Z = RoHS Compliant Part.
Data Sheet ADR225
Rev. B | Page 11 of 12
NOTES
