TD62591~594APG,595~598APG/AFG
2006-06-14
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TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62591APG, TD62592APG, TD62593APG, TD62594APG
TD62595APG, TD62595AFG, TD62596APG, TD62596AFG
TD62597APG, TD62597AFG, TD62598APG, TD62598AFG
8CH SINGLE DRIVER
The TD62591APG Series are comprised of eight NPN Transistor
Arrays.
Applications include relay, hammer, lamp and display (LED)
drivers.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
Output current (single output) 200 mA (Max)
High sustaining voltage output 50V (Min)
Low saturation voltage VCE (sat) = 0.8 V
@Iout = 150mA·inputs compatible with various type logic.
Include Input Resistor
TD62591A, TD62595APG/FG : external.
general purpose
TD62592A, TD62596APG/FG : 10.5 kΩ + 7V
zener diode 14~25 V
PMOS
TD62593A, TD62597APG/FG : 2.7 kΩ
TTL, 5 V CMOS
TD62594A, TD62598APG/FG : 10.5 kΩ
6~15 V PMOS, CMOS
Include Clamp Diode
TD62595APG, TD62595AFG, TD62596APG, TD62596AFG
TD62597APG, TD62597AFG, TD62598APG, TD62598AFG
Package type−APG : DIP−18pin
Package type−AFG : SOP−18pinPin Connection (top view)
TD62591APG, TD62592APG, TD62593APG
TD62594APG, TD62595APG, TD62596APG
TD62597APG, TD62598APG
TD62595AFG, D62596AFG
TD62597AFG, TD62598AFG
Weight
DIP18-P-300-2.54D : 1.47 g (typ.)
SOP18-P-375-1.27 : 0.41 g (typ.)
TD62591APG, TD62592APG, TD62593APG
TD62594APG TD62595APG, TD62595AFG, TD62596APG, TD62596AFG
TD62597APG, TD62597AFG, TD62598APG, TD62598AFG
TD62591~594APG,595~598APG/AFG
2006-06-14
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Schematics (each driver)
TD62591APG TD62592APG, TD62593APG, TD62594APG
TD62595APG, TD62595AFG TD62596APG, TD62596AFG, TD62597APG,
TD62597AFG, TD62598APG, TD62598AFG
Note: The input and output parasitic diodes cannot be used as clamp diodes.
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Collector−Emitter Voltage VCEO 50 V
Collector−Base Voltage VCBO 50 V
Clamp Diode Reverse Voltage VR (Note 1) 50 V
Collector Current IC 200 mA / ch
Input Voltage VIN (Note 2) −0.5~30 V
Input Current IIN (Note 3) 25 mA
Power Dissipation PD (Note 4) 0.96 (Note 5)
/ 1.47 W
Operating Temperature Topr −40~85 °C
Storage Temperature Tstg −55~150 °C
Note 1: Except TD62591~TD62594APG
Note 2: Except TD62591APG, TD62595APG, TD62595AFG
Note 3: Only TD62591APG, TD62595APG, TD62595AFG
Note 4: Delated above 25°C in the proportion of 11.7mW / °C (APG−Type), 7.7mW / °C (AFG−Type)
Note 5: SOP−18pin
TD62591~594APG,595~598APG/AFG
2006-06-14
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Recommended Operating Conditions (Ta = −40~85°C)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Collector−Emitter Voltage VCEO ― 0 ― 50 V
Collector−Base Voltage VCBO ― 0 ― 50 V
Collector Current IC ― 0 ― 150
mA
/ ch
Clamp Diode Reverse Voltage VR (Note1) 7 ― 50 V
Input Voltage VIN (Note2) 0 ― 25 V
Input Current IIN (Note3) 0 ― 10 mA
TD62592
TD62596 14.0 ― 25
TD62593
TD62597 2.4 ― 25
Input Voltage
(Output On)
TD62594
TD62598
VIN (ON) ―
7.0 ― 25
V
APG ― ― ― 0.52
Power Dissipation
AFG
PD ― ― ― 0.355
W
Electrical Characteristics (Ta = 25°C unless otherwise noted)
CHARACTERISTIC SYMBOL
TEST
CIR−
CUIT
TEST CONDITION MIN TYP. MAX UNIT
Output Leakage Current ICEX 1 VCE = 50 V, VIN = 0 ― ― 10 µA
IC = 10 mA, IIN = 0.4 mA ― ― 0.2
Collector−Emitter Saturation Voltage VCE (sat) 2
IC = 150 mA, IIN = 3.0 mA ― ― 0.8
V
(Note 3) 70 ― ―
DC Current Transfer Ratio hFE 2 VCE = 10 V
IC = 10 mA (Note 2) 50 ― ―
―
TD62591
TD62595 IC = 50 mA ― ― 0.65
TD62592
TD62596 VIN = 14V, IC = 50 mA ― ― 0.9
TD62593
TD62597 VIN = 2.4 V, IC = 50 mA ― ― 0.9
Input Current
TD62594
TD62598
IIN (ON) 3
VIN = 7.0 V, IC = 50 mA ― ― 0.9
mA
Turn−On Delay tON ― 0.1 ― µs
Turn−Off Delay tOFF
4 VOUT = 50 V, RL = 330 Ω
― 0.3 ― µs
Note 1: Except TD62591~TD62594APG
Note 2: Except TD62591APG, TD62595APG, TD62595AFG
Note 3: Only TD62591APG, TD62595APG, TD62595AFG
TD62591~594APG,595~598APG/AFG
2006-06-14
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Test Circuit
1. ICEX 2. hFE, VCE (sat)
3. VIN (ON)
4. tON, tOFF
Note 1: Pulse width 50 µs, duty cycle 10%
Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns
Note 2: See below
Input Condition
TYPE NUMBER RIN VIH
TD62591APG, TD62595APG, TD62595AFG 2.7 kΩ 3 V
TD62592APG, TD62596APG, TD62596AFG 0 Ω 15 V
TD62593APG, TD62597APG, TD62597AFG 0 Ω 3 V
TD62594APG, TD62598APG, TD62598AFG 0 Ω 10 V
Note 3: CL includes probe and jig capacitance
Precautions for Using
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
short−circuit between outputs, air contamination fault, or fault by improper grounding.
TD62591~594APG,595~598APG/AFG
2006-06-14
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TD62591~594APG,595~598APG/AFG
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TD62591~594APG,595~598APG/AFG
2006-06-14
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Package Dimensions
DIP18−P−300−2.54D Unit: mm
Weight: 1.47 g (Typ.)
TD62591~594APG,595~598APG/AFG
2006-06-14
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Package Dimensions
SOP18−P−375−1.27 Unit: mm
Weight: 0.50 g (Typ.)
TD62591~594APG,595~598APG/AFG
2006-06-14
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Notes on Contents
1. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
2. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
TD62591~594APG,595~598APG/AFG
2006-06-14
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Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
TD62591~594APG,595~598APG/AFG
2006-06-14
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature
= 230°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature
= 245°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE 060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
