SFH5712-2/3 - OSRAM Opto Semiconductors

SFH 5712

Hochgenauer Umgebungslichtsensor mit I²C Bus Schnittstelle

High Accuracy Ambient Light Sensor with I²C Bus Interface

Lead (Pb) Free Product - RoHS Compliant

2010-03-31 1

Wesentliche Merkmale

• Gut an die Augenempfindlichkeit (Vλ)

angepasst

• Hohe Genauigkeit von 3 - 65.000lx

• I²C Bus Schnittstelle

100kbit/s; 400kbit/s; 1,0 Mbit/s und 3,4 Mbit/s

• Niedriger Temperaturkoeffizient der

Fotoempfindlichkeit

Anwendungen

für Consumer und Mobilegeräte

• Umgebungslicht Messung

• Steuerung von Displayhinterleuchtungen

• Sonnenlicht Sensor

Typ

Type Bestellnummer

Ordering code Digitaler Ausgang, Ev= 1000lx, (white LED)

Digital out

Out

SFH 5712-2/31)

1) Nur eine Gruppe innerhalb einer Verpackungseinheit (Streuung kleiner als 2:1)

Only one bin within one packing unit (variation lower 2:1)

Q65110A8485 500-1600

Features

• Good match to Human Eye Sensitivity (Vλ)

• High accuracy from 3 - 65,000lx

• I²C bus Interface

100kbit/s; 400kbit/s; 1.0 Mbit/s and 3.4 Mbit/s

• Low temperature coefficient of photosensitivity

Applications

for consumer and mobile applications

• Ambient light measurement

• Control of display backlighting

• Sunlight sensor

SFH 5712

2010-03-31 2

Application diagram and basic operation

Proposed size for the pull-up resistor is 560W

Basic operation

switch VDD on

Wait >1ms

0x80 Write 03 Ambient Light Sensor in ACTIVE mode

Wait >250 ms

0x8C Read data read LSB data from ambient light measurement

(LSB = least significant Byte of 16bit output)

0x8D Read data read MSB data from ambient light measurement

(MSB = most significant Byte of 16bit output)

0x80 Write 00 Ambient Light Sensor in STAND-BY mode

SFH 5712

GND

VDD

SDA

SCL MCU

pull-up

VDD = 2.5V

100nF

VIO = 1.8V

IIO

SFH 5712

GND

VDD

SDA

SCL MCU

pull-up

VDD = 2.5V

100nF

VIO = 1.8V

SFH 5712

GND

VDD

SDA

SCL MCU

pull-uppull-up

VDD = 2.5V

100nF

VIO = 1.8V

IIO

SFH 5712

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Addressing for basic operation

I2C interface

• 1.8V IO-logic level for SDA and SCL

• IO-pins are open drain type and logic high level is set with external pull-up resistor

•SFH 5712-1/2 operates always as slave, address is 0x29 (7bits). Bit 0 is used to change between

Read (R/W bit =1) and Write mode (R/W bit =0)..

• Designed for the I2C-High Speed modes (3.4Mbit/s)

• see I2C Bus specification UM10204 from NXP for detailed information

•Spikes up to 10 ns are suppressed on SDA & SCL

Address 0x29

Bit 7 6 5 4 3 2 1 0

Address R/W bit

default 0101001X

SAddress 0x29 W

Communication from master to SFH 5712

Communication from SFH 5712 to master

W= Master writes

R = Master reads

A = acknow ledge

LS B = least significant byte

SAddress 0x29 WRegister 0x8CA A P

SAddress 0x29 RLSB DATAANA P

SAddress 0x29 WRegister 0x8DA A P

SAddress 0x29 RMSB DATAANA P

SAddress 0x29 WRegister 0x80A A 0x00 A P

NA= not acknowledge

S = START condit ion

P = STOP conditio n

MSB = most sign ificant byte

SAddress 0x29 W

Communication from master to SFH 5712

Communication from SFH 5712 to master

W= Master writes

R = Master reads

A = acknow ledge

LS B = least significant byte

SAddress 0x29 WRegister 0x8CA A P

SAddress 0x29 RLSB DATAANA P

SAddress 0x29 WRegister 0x8DA A P

SAddress 0x29 RMSB DATAANA P

SAddress 0x29 WRegister 0x80A A 0x00 A P

NA= not acknowledge

S = START condit ion

P = STOP conditio n

MSB = most sign ificant byte

SFH 5712

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Modes

OFF If VDD = 0 or not connected the device is inactive. Other units may use the I2C bus

without any restrictions; I/O pins are in Z state.

STAND-BY This is the initial mode after power-up. IDD is below 2.5μA. No measurement is

performed. Only register 0x80 can be read and written. Device can be activated by

I2C bus communication.

ACTIVE Measurements are triggered internally by SFH5712. The measurement repetition

rate is 2/s. Measurement results can be read from the data register

OFF STAND-BY ACTIVE

VDD connected

VDD= 0V

activation

deactivation

VDD= 0 V

SFH 5712

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Maximum Ratings

Parameter Symbol Value Unit

Storage temperature Tstg – 40 … + 85 °C

Supply voltage VDD -0.3 ... +4.5 V

I²C - Bus voltage VIO -0.3 ... +2.5 V

Electrostatic discharge

Human Body Model according to

EOS/ESD-5.1-1993

ESDhbm 2 kV

Electrostatic discharge

charge device model according to

JEDEC JESD22-C101D

ESDcdm 500 V

Operating Conditions

Parameter Symbol Value Unit

min. typ. max.

Operating temperature Top -15 70 °C

Supply voltage VDD 2.3 3.0 V

Supply voltage ripple

(frequency: 0...100Mhz, sinus wave) dVDD 100 mV

Digital output range Out 365k counts

I²C - Bus voltage VIO 1.6 2.0 V

Output current „Low“1)

1) FAST MODE PLUS: requirement of Iout_low 20mA is not met.

IIO 312 mA

SFH 5712

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Characteristics

Parameter Symbol Value Unit

min. typ. max.

Mean current consumption

ACTIVE mode, EV = 0lx, VDD = 2.5 V IDD 145 200 μA

Mean curre nt consumption

ACTIVE mode, EV = 1000lx, VDD = 2.5 V IDD 170 μA

Mean curre nt consumption

STAND-BY mode, VDD = 2.5 V IDD 2.5 μA

Spectr al range of s ensitivity λ20% 400 ...

680 nm

Wavelength of max. photosensitivity λs max 500 nm

Dimensions of radiant sensitive area L x W 0.4 x

0.4 mm x mm

I²C power up time after Vdd “ON“

(see Appendix 1: flicker reduction and timing) ton 40 µs

Output update time for first measurement

(see Appendix 1: flicker reduction and timing) tupd 11.5 ms

Resolution of the digital output signal

(3lx ....65klx) Out 1count/lx

Digital output signal variation

for VDD = VDD, min to VDD, max; EV = 1000lx ± 10 counts

Deviation from linear output characteristics1)

X = 100-65klx

X = 10-100lx

X = 3-10lx

flin ±5

±10

±20

Temperature coefficient of the output signal

Top= 0...50°C

Top= -15...0°C & 50...70°C

(1000lx; Norm light A)

TCEV <0.2

<0.25

%/K

Flicker reduction at the output

(noise frequency: 50...60Hz)

(see Appendix 1: flicker reduction and timing)

13 dB

SFH 5712

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1) The deviation of the linear output characteristic is referenced to 1000lx and follows the formula:

X: sensor illumination level in lux

YX: sensor output / measurement value at illumination level X

Y1000lX: sensor output / measurement value at illumination level 1000lx

flin YX

Y1000lx

------------------ 1000lx

------------------1–×

⎝⎠

⎛⎞

100%×=

OHF04370

/ lx

lin

-25%

-15%

-5%

15%

25%

1 10 100 1000 10000 100000

SFH 5712

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Binning (TA = 25 °C)

Parameter Symbol Value Unit

-2 -3

Output signal

EV = 1000lx (white LED LW 541C)

Out 500...1000 800...1600 count

Pin functions

Pin Description

VDD supply voltage

GND ground

SCL I²C bus clock serial I/O terminal (SCL)

SDA I²C bus serial data I/O terminal (SDA)

Figure 1 Circuitry

OHF04366

A/D

converterAmplifier

Digital & data

Address

fixed

Two wire serial interface

Photo-

diode

DD SDA

SCLGND

SFH 5712

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Relative Spectral Sensitivity

Srel = f (λ); TA = 25 °C

Output

Out = f (EV); TA = 25 °C

400

0nm

OHF04364

100

rel

500 600 700 800 900 1100

SFH 5712

OHF04363

Out

Directional Characteristics

Srel = f (

); TA = 25 °C

Current Consumption

IDD = f (VDD); TA = 25 °C; VDD = 2.5V;

ACTIVE mode

OHF04367

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0

100˚

90˚

80˚

70˚

60˚

50˚

0˚10˚20˚30˚40˚

0.2

0.4

0.6

0.8

1.0

2.2

140 V

µA

OHF04365

141

142

143

144

145

146

147

148

150

2.4 2.6 2.8 3 3.2

SFH 5712

2010-03-31 10

Appendix 1: Flicker reduction and timing

Sensor is smoothing the output signal by averaging up to 32 single measurements. Flicker caused by

artificial light sources e.g. from fluorescent lamps usually occurs at 100Hz or 120Hz. Oscillation of the

optical input signal will be reduced by 13dB at the output for sinus signals. E.g. the sensor output varation

will only be 5% of the optical input peak to peak variation from fluorescent light. The flicker reduction is

calculated by the relative variation of the optical input signal (a/A) compared to the sensor output (b/B),

see figure 2.

Figure 2 flicker reduction (average of 32 measurements)

To achieve the maximum flicker reduction performance the 32fold averaged output value should be

used. Typically 186ms (max. 250ms) after sensor activation the first full averaged signal ca n be read at

the sensor output. The sensor allows to read intermediate signal output values prior to 250ms (see

figure 3):

- single measurement after typ. 1ms

- average of 8 measurements after typ 45ms

- average of 16 measurements after typ 92ms

After the first full averaged measurement value (t>250ms) the output will be refreshed automatically

twice a second with 32fold averaged values. Single, 8 and 16fold averaged measurements are only

performed after activation of the sensor.

OHF04362

Time

SFH 5712 out (B) Actual light level

10log [(b/B) / (a/A)]

SFH 5712 Out

optical input (A) and

Average signal level of

SFH 5712

2010-03-31 11

Figure 3: SFH 5712 averaging and timing

Appendix 2: Digital Interface characteristics

Interface and control is accomplished through a two-wire I²C bus serial interface. The sensor works in

multi-master/multi-slave environment, multiple devices may be connected to the same bus. The device

conforms to I²C interface specification version 3.0 Rev. 03 dated 19 June 2007.

http://www.standardics.nxp.com/support/documents/i2c/pdf/ics.bus.specification.pdf

The de vice implements the I²C write protocol as well as the I²C read (combined mode) protocol. In b lock

read mode (as slav e) the device will transmit registers in a cyclic manner until master issues a stop con-

dition. E.g. if host uses block read and starts from register Ch, slave will return the following sequence

of register values:

Ch, Dh, 0h, Ah, Bh, Ch, Dh, 0h,....

until host issues a stop condition.

The address counter alwa ys increases th e register addre ss after output o f register content. Th is is also

valid, if the device is powered down (stand-by mode) between readings.

OHF04371

typ. 565 ms

Operation mode

max. 750 ms

typ. 186 ms

max. 250 ms

typ. 92 ms

max. 125 ms

max. 65 ms

typ. 45 ms

typ. 1 ms

max. 1.5 ms

typ. 40 µs

upd

Delay time until sensor

can be addressed

1st measurement 32 measurements

2nd

Avg. of

Avg. of 8 measurements

Avg. of 16 measurements

Avg. of 32 measurements

No additional avg.

values in between

for following readings

dd off

Output

actualisation

ACTIVE

STAND-BY

SFH 5712

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Part number and revision identification

Manufacturer identification

Ambient light measurement data (LSB 8bit)

Ambient light measurement data (MSB 8bit)

The result of the ambient light sensor is a 16bit word split in MSB and LSB and is stored in two registers .

The upper b yte data registers can only be read f ollowing a read to the corresponding lower b yte register .

When the lower b yte register is read, the upper b yte is stored in a temporary register , which is read b y a

Control of ambient light sensor modes

R/W-Register 0x80

Bit 7 6 5 4 3 2 1 0

not used mode of ambient lightsensor

default 00000 00 STAND-BY

00 STAND-BY

11 ACTIVE

R-Register 0x8A

Bit 7 6 5 4 3 2 1 0

Part number ID Revision ID

1000 XXXX (start with 0001)

R-Register 0x8B

Bit 7 6 5 4 3 2 1 0

Manufacturer Identification

0000 0011

R-Register 0x8C

Bit 7 6 5 4 3 2 1 0

LSB data

default 00000000

R-Register 0x8D

Bit 7 6 5 4 3 2 1 0

MSB data

default 00000000

SFH 5712

2010-03-31 13

subsequent read to the upper byte register. The upper register will contain the correct value even if ad-

ditional integration cycles end between the reading of the lower and upper registers.

Example:

LSB data and MSB data neet to be combined to a 16bit word as follows:

LSB data = 0xF0 (1111 0000)

MSB data = 0x83 (1000 0011)

-> in hex: out = 83F0 = 33776 counts

-> in binary: out= 1000 0011 combined with 1111 0000: 1000 0011 1111 0000 = 33776 counts

I2C bus address

7 bit sensor address binary: 0101001 / hex: 29

If the I²C bus ma ster sends a not specified register address (e .g. Eh se e tab le 1), the device (slave) will

not send ACKNOWLEDGE and go to an idle mode and wait for another command.

SFH 5712

2010-03-31 14

Package Outlines

Dimensions in mm (inch)

Pin configuration

Pin # Description

1 VDD

2GND

3SDA

4SCL

OHPY4195

0.35 (0.014)

0.55 (0.022)

1.1 (0.043)

1.3 (0.051)

1.45 (0.057)

1.25 (0.049)

0.7 (0.028)

0.5 (0.020)

0.6 (0.024)

0.8 (0.031)

Pin 2

Pin 1

Pin 3

Pin 4

1.8 (0.071)

2.2 (0.087)

1.8 (0.071)

Pin 1 Pin 4

Pin 3Pin 2

Photosensitive

area 0.16 mm

Package center

Bottom view

Side view

Top view

SFH 5712

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Recommended Solderpad Design

Dimensions in mm

Taping

OHAY4288

180 mm

3000 pcs

Label

Reel size:

Quantity:

Direction of unreeling

Trailer: 160 mm

160 mmGurtende:

Gurtende: 160mm Gurtvorlauf: 400mm

Trailer: 160mm Leader: 400mm

SFH 5712

2010-03-31 16

Soldering Conditions Preconditioning acc. to JEDEC Level 3

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Published by

OSRAM Opto Semiconductors GmbH

Leibnizstrasse 4, D-93055 Regensburg

www.osram-os.com

The information describes the type of component and shall

not be considered as assure d characteristics.

Terms of delivery and rights to change design reserved. Due

to technical requirements components may contain dangerous substances. For information on the types in question

please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unso rted or which we a re not obliged to accept, we sh all have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be use d in life-supp ort devices o r systems 2 with the e xpress written app roval of OSRAM OS.

1 A critical compone nt is a component usedin a life-support dev ice or system whose failure can reasonably be expected

to cause the failure of that life-suppo rt device or sy stem, or to affect its safety or effectiveness of that device or system.

2 Life support devices or sys tems are intended (a ) to be implanted in the human body , or (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

245 ˚C

±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C

-0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min