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BL
Document Number 0280009 BLGALAXY ELECTRICAL 1.
GALAXY ELECTRICAL
FEATURES
MECHANICAL DATA
Ratings at 25
o
C ambient tempe r ature unl ess ot her wi se specified
US3D US3G US3J US3K US3M
US3D US3G US3J US3K US3M
Maximum repetitive peak reverse voltage VRRM 200 400 600 800 1000 V
Maximum RMS voltage VRWS 140 280 420 560 700 V
Maximum DC blocking voltage VDC 200 400 600 800 1000 V
Maximum average forward rectified current at
TL=110OCIF(AV) A
Peak forw ard surge curre nt 8.3ms single half-
sine-w ave superimposed on rated load(JEDEC
Method) IFSM A
Maximum instantaneous forward voltage at 3A VF V
Maximum DC reverse curren t @TA=25oC
at rated DC blockjing voltage @TA=125oC
Maximum reverse re covery time at IF=0.5A
IR=1.0A Irr=0.25A
trr
ns
Typical junction capacitance at 4.0V,1MHZ CJ pF
Operati n g temperature range TJoC
Storage temperatur e range TSTG oC
-55--------+150
UNITS
50 100
35 70
50 100
US3A
70
300.0
-55--------+150
10.0
IR
NOTE: 1.P.C.B. mounted on 0. 2X0.2"(5.0X5. 0mm)copper pad area
75
US3A---US3M
1111REVERSE VOLTAGE: 50 - 1000 V
FORWARD CURRENT: 3.0 A
◇ B ui lt- in stra in r elief, ideal for automat ed plac ement
Device marking code
SURFACE MOUNT RECTIFIER
◇ Glass passivated chi p junc tions
◇ Plastic package has underwriters laboratories
vvvvvflammability classification 94V-0
◇ For surface mount applic ations
DO-214AB(SMC)
Maximum thermal resistance (NOTE1)
oC/W
US3B
◇ Hi gh temperatur e solder ing:
111 250oC/10 seconds on terminals
US3A
◇ P ol ar ity: Color band denot es c athode end
◇ Weight: 0.007 ounces, 0.21 gram
μA
◇
T
erm
i
na
l
s:
S
o
ld
er
Pl
a
t
e
d
, so
ld
era
bl
e per
MIL
-
STD
-
750
,
1111Method 2026
100
50
1.0 1.7
3.0
US3B
◇ Low for war d voltage, l ow power loss
◇ Low pr ofile pack age
◇ E asy pick and place
◇ Ultrafast recovery times for high efficiency
◇ Case:JEDEC DO-214AB,molded plastic body
1111c over passivated chip
MAXIMUM RATINGS AND ELE CTRICAL CHARACTERISTICS
50
RθＪＡ 25
0.4
0.001
0.01
0.1
1
0.6 0.8 1.0 1.2 1.4 1.6 1.8
10
PULSE WIDTH=300μ
s1%DUTY CYCL E T J
=25
US3A-US3G
US3J-US3M
00
RESISTIVE OR INDUCTIVE
LOAD
25 50 75 100 125 150
1.5
2.5
2.0
0.5 0.2X0.2"(5.0X5.0mm )
COPPER PAD
AREAS
1.0
3.0
0110 100
30
20
50
10
40
60
100
90
80
70
TL=110℃
8.3ms SINGLE HALF SINE-WAVE
(JEDEC METHOD)
BLGALAXY ELECTRICAL
Document Number 0280009 2.
www.galaxycn.com
0
0.1
10
20 40 60 80 100
0.01
TJ=125℃
125℃
100℃
25℃
1
100
0.1 1 10
0.01
0.1
1
10
100
100
AVERAGE FORWARD RECTIFIED
CURRENT,AMPERES
PEAK FORWARD SURGE
CURRENT,AMPERES
IF-INSTA NT ANEOUS FORWARD
CURRENT,AMPERES
IR-INSTANTANEOUS REVERSE
LEAKAGE CURRENT(mA)
REVER SE VOLTAGE(V)
FIG.2 -- MAXIMUM NON-REPETITIVE PEAK FORWA RD
SURGE CURRENT
LEAD TEMPERATURE ℃ NUMBE R OF CYCLES AT 60HZ
INSTANTANEOUS FORWARD VOLTAGE(V)
FIG.6 -- TYPICA L TRA NSIENT THERMAL IMPEDANC E
PF-JUNCTIO N CAPACI T ANCE(pF)
PERCENT OF RAT ED PEAK REVERSE VOLTAGE.( ％)
T,PULSE DURA TION,
RATINGS AND CHARACTERISTIC CURVES US3A---US3M
FIG.3 -- TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS FIG.4 -- TYPICAL REVERSE CHARACTERISTICS
FIG.5 -- TYPICAL JUNCTION CAPACITANCE
TRANSIENT THERMAL IMPEDANCE
(OC/W)
FIG.1 -- FORWARD CURRENT DERATING CURVE
TJ=25
1
2
4
6
10
20
40
60
100
200
0.1 0.2 0.4 1 2 4 10 40 10020
US3K,US3M
US3A-US3J
