FEATURES
•WIDEBAND RESPONSE:
fu = 2.9 GHz TYP at 3dB bandwidth
•NOISE FIGURE:
NF = 2.3 dB TYP at f = 1.5 GHz
•POWER GAIN:
GP = 20.5 dB TYP at f = 1.5 GHz
•SUPPLY VOLTAGE:
VCC = 4.5 to 5.5 V
•HIGH DENSITY SURFACE MOUNTING:
6-pin super mini-mold package
UPC3215TB
5V, SUPER MINIMOLD
BIPOLAR ANALOG INTEGRATED CIRCUIT
SI MMIC WIDEBAND AMPLIFIER
V
CC
= 5.0 V
P
IN
= -30 dBm
25
1.00.30.1
20
15
10
5
0
3.0
Frequency, f (GHz)
G ,niaG
S
)Bd(
INSERTION POWER GAIN
vs. FREQUENCY
DESCRIPTION
The UPC3215TB is a Silicon Monolithic IC designed as a
wideband amplifier. The UPC3215TB is suitable for systems
requiring wideband operation from HF to L band.
This IC is manufactured using a 30 GHz fmax UHS0
(Ultra High Speed Process) silicon bipolar process. The pack-
age is 6-pin super minimold suitable for surface mount.
The UPC3215TB is manufactured according to stringent
quality assurance standards to ensure highest reliability
and consistent superior performance.
APPLICATIONS
•Systems requiring wideband operation from HF to L band.
•DBS receivers and tuners
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
BT5123CPUREBMUN TRAP
60SENILTUO EGAKCAP
SEULAV ECNEREFERSCITSIRETCARAHC DRADNATSSLOBMYS
PSAT Saturated Output Power, PIN 5.3+mBdmBd 0 =
OIP3Output Intercept Point f1 = 1.5 GHz, f201+mBdzHG 105.1 =
ΔGP0.1BdzHG 51.2 ot 1.0 = f,ssentalF niaG
ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
BT5123CPUREBMUN TRAP
60SENILTUO EGAKCAP
XAMPYTNIMSTINUSNOITIDNOC DNA SRETEMARAPSLOBMYS
ICC 5.710.415.01Am)langis on( tnerruC tiucriC
GPP ,zHG 5.1 = f,niaG rewoP IN -5.025.81BdmBd 03- =
0.33.2-BdzHG 5.1 = f,erugiF esioNFN
fuUpper Limit Operating Frequency (The gain at fu is 3 dB down from the gain at 100 MHz) GHz 2.5 2.9 -
-4493BdzHG 5.1 = f,noitalosILOSI
RLIN -5101BdzHG 5.1 = f,ssoL nruteR tupnI
RLOUT -5.95.6BdzHG 5.1 = f,ssoL nruteR tuptuO
P1dB-5.1-4-mBdzHG 5.1 = f,tnioP noisserpmoC Bd 1
CIRCUIT CURRENT vs. VOLTAGE
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
PIN = -30 dBm
25
1.00.30.1
20
15
10
5
0
3.0
Supply Voltage, VCC (V)
Circuit Current, I
CC
(mA)
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
20
+75+500-25-50
15
10
5
0
+100+25
No input signal
V
CC
= 5 V
Circuit Current, I
CC
(mA)
Operating Ambient Temperature (°C)
Frequency, f (GHz)
Gain, G
S
(dB)
Noise Figure, NF (dB)
INSERTION POWER GAIN
vs. FREQUENCY
TYPICAL PERFORMANCE CURVES (TA = 25°C)
UPC3215TB
ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C)
SYMBOLS PARAMETERS UNITS RATINGS
VCC Supply Voltage V 6.0
ICC Total Supply Current mA 30
PIN Input Power dBm +10
PTTotal Power Dissipation2mW 270
TOP Operating Temperature °C -40 to +85
TSTG Storage Temperature °C -55 to +150
Notes:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Mounted on a 50 X 50 X 1.6 mm epoxy glass PWB, with copper
patterning on both sides. (TA = 85°C).
RECOMMENDED
OPERATING CONDITIONS
SYMBOLS PARAMETERS UNITS MIN TYP MAX
VCC Supply Voltage V 4.5 5.0 5.5
TAOperating Ambient °C -40 +25 +85
Temperature
PIN Input Power dBm 0
fIN Input Frequency GHz 2.9
TEST CIRCUIT
V
CC
1000 pF
C
3
C
2
C
1
6
41
2,3,5
1000 pF
1000 pF
50 Ω50 Ω
IN OUT
20
54210
15
10
5
0
63
No input signal
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
INSERTION POWER GAIN vs.
FREQUENCY
Insertion Power Gain, GP (dB)
Frequency, f (GHz)
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
P
IN
= -30 dBm
25
1.00.30.1
20
15
10
5
0
3.0
V
CC
= 5.0 V
UPC3215TB
TYPICAL PERFORMANCE CURVES (TA = 25°)
OUTPUT POWER vs. INPUT POWER
Input Power, PIN (dBm)
Output Power, P
OUT
(dBm)
5
1.00.30.1
4
3
2
1
0
3.0
TA = -40°C
TA = +25°C
TA = +85°C
VCC = 5.0 V
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
PIN = -30 dBm
0
1.00.30.1
-10
-20
-30
-40
-50
3.0
Frequency, f (GHz)
Noise Figure, NF (dB)
NOISE FIGURE vs. FREQUENCY
5
1.00.30.1
4
3
2
1
0
3.0
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
P
IN
= -30 dBm
0
1.00.30.1
-10
-20
-30
-40
-50
3.0
VCC = 4.5 V
VCC = 5.0 V
VCC = 5.5 V
fIN = 1 GHz
+10
0-20-40
0
-10
-20
-30
-10 +10-30
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
P
IN
= -30 dBm
0
1.00.30.1
-10
-20
-30
-40
-50
3.0
Frequency, f (GHz)
Noise Figure, NF (dB)
NOISE FIGURE vs. FREQUENCY
Frequency, f (GHz)
Isolation, ISOL (dB)
ISOLATION vs. FREQUENCY
Frequency, f (GHz)
Input Return Loss, RL
IN
(dB)
INPUT RETURN LOSS vs.
FREQUENCY
Frequency, f (GHz)
Output Return Loss, RL
OUT
(dB)
OUTPUT RETURN LOSS vs.
FREQUENCY
+10
0-20-40
0
-10
-20
-30
-10 +10
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
f
IN
= 1.5 GHz
-30
+10
0-20-40
0
-10
-20
-30
-10 +10
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
f
IN
= 2.15 GHz
-30
+10
0-20-40
0
-10
-20
-30
-10 +10
V
CC
= 4.5 V
V
CC
= 5.0 V
V
CC
= 5.5 V
f
IN
= 2.4 GHz
-30
V
CC
= 5 V
f
1
= 1000 MHz
f
2
= 1001 MHz
+20
0
-60
-80
-40
-20
0-5-10-15-20-25-30-35-40
V
CC
= 5 V
f
1
= 1500 MHz
f
2
= 1501 MHz
+20
0
-60
-80
-40
-20
0-5-10-15-20-25-30-35
-40
V
CC
= 5 V
f
1
= 2150 MHz
f
2
= 2151 MHz
+20
0
-60
-80
-40
-20
0-5-10-15-20-25-30-35
-40
UPC3215TB
OUTPUT POWER vs. INPUT POWER
Output Power, P
OUT
(dBm)
Input Power, PIN (dBm)
OUTPUT POWER vs.
INPUT POWER AND VOLTAGE
Input Power, PIN (dBm)
Output Power, P
OUT
(dBm)
TYPICAL PERFORMANCE CURVES (TA = 25°)
OUTPUT POWER vs. INPUT POWER
Output Power, P
OUT
(dBm)
Input Power, PIN (dBm)
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
Output Power of Each Tone, P
OUT(each)
(dBm)
Input Power of Each Tone, PIN(each) (dBm)
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
Output Power of Each Tone, P
OUT(each)
(dBm)
Input Power of Each Tone, PIN(each) (dBm)
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
Output Power of Each Tone, P
OUT(each)
(dBm)
Input Power of Each Tone, PIN(each) (dBm)
UPC3215TB
V
CC
= 5 V
f
1
= 2400 MHz
f
2
= 2401 MHz
+20
0
-60
-80
-40
-20
0-5-10-15-20-25-30-35
-40
TYPICAL PERFORMANCE CURVES (TA = 25°)
EXAMPLE OF APPLICATION CIRCUIT
V
CC
4
1
2,3,5
1000 pF
1000 pF
50 Ω
50 to 200 Ω
IN OUT
1000 pF
Please connect these
component to stabilize
operation.
2,3,5
6
1
6
4
1000 pF
1000 pF
1000 pF
50 Ω
OUTPUT POWER OF EACH TONE vs.
INPUT POWER OF EACH TONE
Output Power of Each Tone, P
OUT(each)
(dBm)
Input Power of Each Tone, PIN(each) (dBm)
FREQUENCY S11 S21 S12 S22 K
GHz MAG ANG MAG ANG MAG ANG MAG ANG
0.1 0.207 174.1 10.788 -4.6 0.013 6.3 0.285 -3.3 3.38
0.2 0.190 173.1 10.714 -9.8 0.013 -0.5 0.282 -3.7 3.39
0.3 0.186 174.3 10.565 -14.3 0.013 2.7 0.283 -4.6 3.37
0.4 0.192 173.8 10.359 -18.3 0.014 4.7 0.285 -6.2 3.92
0.5 0.200 174.5 10.225 -21.7 0.013 5.3 0.286 -7.6 3.96
0.6 0.201 173.0 10.116 -24.9 0.013 2.1 0.286 -8.8 3.69
0.7 0.204 173.0 10.116 -28.0 0.011 1.6 0.288 -10.4 3.91
0.8 0.206 172.4 10.122 -31.1 0.011 12.9 0.289 -11.7 4.17
0.9 0.210 172.7 10.186 -34.5 0.011 5.1 0.290 -13.5 3.99
1.0 0.212 171.4 10.182 -37.7 0.009 4.1 0.285 -14.9 4.28
1.1 0.218 169.4 10.208 -14.6 0.011 4.9 0.299 -16.8 4.19
1.2 0.217 168.4 10.296 -45.6 0.009 11.0 0.300 -18.0 4.65
1.3 0.221 165.9 10.248 -49.7 0.006 20.5 0.299 -20.2 5.78
1.4 0.228 164.7 10.438 -53.9 0.008 1.6 0.307 -23.1 6.97
1.5 0.233 162.3 10.369 -58.0 0.006 20.5 0.299 -16.8 4.19
1.6 0.238 159.5 10.554 -62.7 0.005 31.6 0.316 -27.5 11.54
1.7 0.244 157.2 10.492 -67.2 0.004 48.5 0.317 -30.5 11.75
1.8 0.246 153.9 10.483 -72.2 0.003 87.2 0.318 -33.3 13.52
1.9 0.248 150.6 10.408 -76.9 0.004 93.4 0.323 -36.9 8.46
2.0 0.246 147.4 10.405 -82.2 0.007 114.5 0.323 -40.6 7.46
2.1 0.241 144.9 10.267 -87.2 0.008 115.4 0.319 -44.9 6.20
2.2 0.236 142.2 10.039 -92.7 0.011 124.0 0.312 -48.9 4.50
2.3 0.229 142.2 9.896 -97.7 0.012 121.6 0.306 -52.6 4.12
2.4 0.219 143.5 9.684 -102.4 0.014 124.9 0.292 -56.3 3.40
2.5 0.215 145.7 -9.348 -107.5 0.015 117.8 0.279 -59.3 3.42
2.6 0.213 149.3 9.068 -112.0 0.018 117.3 0.270 -61.7 3.02
2.7 0.221 150.1 8.673 -116.6 0.017 114.4 0.256 -63.7 3.17
2.8 0.234 151.3 8.437 -121.1 0.020 114.0 0.248 -65.1 2.85
2.9 0.253 152.1 8.080 -124.9 0.021 111.6 0.237 -67.3 2.98
3.0 0.264 150.7 7.791 -129.4 0.020 112.5 0.232 -68.0 2.90
3.1 0.283 148.7 7.458 -132.7 0.022 113.7 0.229 -70.2 3.02
VCC = VOUT = 5.0 V, ICC = 16 mA
TYPICAL SCATTERING PARAMETERS (TA = 25°C)
0.1 GHz
3.1 GHz
0.1 GHz
3.1 GHz
S11 Frequency S22 Frequency
UPC3215TB
Start: 0.1 GHz
Stop: 3.1 GHz
Start: 0.1 GHz
Stop: 3.1 GHz
UPC3215TB
OUTLINE DIMENSIONS (Units in mm)
UPC3215TB
PACKAGE OUTLINE S06
LEAD CONNECTIONS
3
2
1
4
5
6
H3C
3
2
1
4
5
6
1. INPUT
2. GND
3. GND
4. OUTPUT
5. GND
6. VCC
(Top View) (Bottom View)
+0.1
-0
DOT ON
BACK SIDE
+0.1
-0.5
0 ~0.1
0.2
0.15
3
2
16
5
4
0.65
1.3
2.0±0.2
0.65
2.1±0.1
1.25±0.1
0.9 ± 0.1
0.7
EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
Internet: http://WWW.CEL.COM
09/04/2001
DATA SUBJECT TO CHANGE WITHOUT NOTICE
YTQREBMUN TRAP
UPC3215TB-E3-A 3K/Reel
ORDERING INFORMATION
Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated
side of tape.
lanretnInoitpircseDniPdeilppAniPniP
No. NameVoltageVoltage Equivalent
tiucriC)V(
1Input — 0.82Signal input pin. An internal matching circuit, configured
with resistors, enables 50 Ω connection over a wide
band. A multi-feedback circuit is designed to cancel
the deviations of hFE and resistance. This pin must be
coupled to the signal source with capacitor for DC cut.
2 GND 0 — Ground pins. These pins should be connected to system
eht no nrettap dnuorG .ecnatcudni muminim htiw dnuorg3
dnuorg eht llA .elbissop sa ediw sa demrof eb dluohs draob5
pins must be connected together with wide ground pattern
to decrease impedance difference.
4Output — 3.8 Signal output pin. An internal matching circuit, configured
with resistors, enables 50 Ω connection over a wide
band. This pin must be coupled to next stage with capacitor
for DC cut.
6 VCC 4.5 to 5.5 — Power supply pin. This pin should be externally equipped
with a bypass capacitor to minimize ground impedance.
PIN DESCRIPTION
1
3
25
4
6
GND GND
IN
OUT
V
CC
