1
FEATURES DESCRIPTION
APPLICATIONS
SENSE1
SENSE2
WDI
GND
VDD
MR
RESET
RESET
DORDGNPACKAGE
(TOPVIEW)
5V
External
Reset
Source
VDD
VI/O
VCORE
VIN
VIN VOUT
VOUT
MR
RESET RESET
WDI WDO
GND GND
GND
GND
SENSE1
SENSE2
TPS3305-18
TPS73233
TPS73618
3.3V
1.8V
DSP
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008www.ti.com
DUAL PROCESSOR SUPERVISORS
2
•Dual Supervisory Circuits for DSP- and
The TPS3305 family is a series of micropower supplyProcessor-Based Systems
voltage supervisors designed for circuit initialization.Its dual monitor topology is well-suited to use in DSP•Power-On Reset Generator with Fixed Delay
and processor-based systems, which often requireTime of 200ms; no External Capacitor Needed
two supply voltages, core and I/O.•Watchdog Timer Retriggers the RESET Output
RESET is asserted when the voltage at eitherat SENSEn ≥V
IT+
SENSEn pin falls below its threshold voltage, V
IT
.•Temperature-Compensated Voltage Reference
When both SENSEn pins are again above their•Maximum Supply Current of 40 µA
respective threshold voltages, RESET is held low forthe factory-programmed delay time (200ms typ).•Supply Voltage Range: 2.7V to 6V
RESET is also asserted if the watchdog input (WDI)•Defined RESET Output From V
DD
≥1.1V
is not toggled for more than 1.6s typ.•MSOP-8 and SO-8 Packages
The TPS3305-xx devices are available in either 8-pin•Temperature Range: – 40 °C to +85 °C
MSOP or SO packages, and are specified foroperation over a temperature range of – 40 °C to+85 °C.•Processor Supply Monitoring•Industrial Equipment•Automotive Systems•Portable/Battery-Powered Equipment•Wireless Communication Systems•Notebook/Desktop Computers
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 1998 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1) (2)
DISSIPATION RATINGS TABLE
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
NOMINAL SUPERVISED VOLTAGE THRESHOLD VOLTAGE (TYP)
DEVICE SENSE1 SENSE2 SENSE1 SENSE2
TPS3305-18 3.3 V 1.8 V 2.93 V 1.68 VTPS3305-25 3.3 V 2.5 V 2.93 V 2.25 VTPS3305-33 5.0 V 3.3 V 4.55 V 2.93 V
(1) For the most current specifications and package information, see the Package Option Addendum at the end of this document, or see theTI website at www.ti.com .
Over operating junction temperature range (unless otherwise noted).
UNIT
Supply voltage range, V
DD
– 0.3V to +7VV
MR
, V
WDI
– 0.3V to V
DD
+ 0.3VInput voltage at SENSE1 and SENSE2, V
I
(V
DD
+ 0.3)V
IT
/ 1.25VV
RESET
, V
RESET
– 0.3V to +7VMaximum low output current, I
OL
5mAMaximum high output current, I
OH
– 5mAInput clamp current, I
IK
(V
I
< 0 or V
I
> V
DD
) ± 20mAOutput clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
) ± 20mAContinuous total power dissipation See Dissipation Ratings TableOperating junction temperature range, T
J
– 40 °C to +85 °CStorage temperature range, T
stg
– 65 °C to +150 °CSoldering temperature +260 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to GND.
T
A
≤+25 °C DERATING FACTOR T
A
= +70 °C T
A
= +85 °CPACKAGE POWER RATING ABOVE T
A
= +25 °C POWER RATING POWER RATING
DGN 2.14W 17.1mW/ °C 1.37W 1.11WD 725mW 5.8mW/ °C 464mW 377mW
2Submit Documentation Feedback Copyright © 1998 – 2008, Texas Instruments Incorporated
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www.ti.com
ELECTRICAL CHARACTERISTICS
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008
Over operating junction temperature range (unless otherwise noted).
TPS3305-xx
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
DD
Input supply range 2.7 6.0 VT
J
Operating junction temperature range – 40 +85 °CV
DD
= 2.7V to 6V,
V
DD
– 0.2V VI
OH
= – 20 µAV
OH
High-level output voltage
V
DD
= 3.3V, I
OH
= – 2mA V
DD
– 0.4V VV
DD
= 6V, I
OH
= – 3mA V
DD
– 0.4V VV
DD
= 2.7V to 6V,
0.2 VI
OL
= 20 µAV
OL
Low-level output voltage
V
DD
= 3.3V, I
OL
= 2mA 0.4 VV
DD
= 6V, I
OL
= 3mA 0.4 VPower-up reset voltage
(1)
V
DD
≥1.1V, I
OL
= 20 µA 0.4 V1.64 1.68 1.72 V2.20 2.25 2.30 VVSENSE1, V
DD
= 2.7V to 6V,VSENSE2 T
A
= 0 °C to +85 °C
2.86 2.93 3.0 V4.46 4.55 4.64 VNegative-going input thresholdV
IT –
voltage
(2)
1.64 1.68 1.73 V2.20 2.25 2.32 VVSENSE1, V
DD
= 2.7V to 6V,VSENSE2 T
A
= – 40 °C to +85 °C
2.86 2.93 3.02 V4.46 4.55 4.67 VV
IT –
= 1.68V 15 mVV
IT –
= 2.25V 20 mVV
hys
Hysteresis at VSENSEn input
V
IT –
= 2.93V 30 mVV
IT –
= 4.55V 40 mVWDI = V
DD
= 6VI
H(AV)
Average high-level input current WDI 100 150 µATime average (dc = 88%)WDI = 0V, V
DD
= 6VI
L(AV)
Average low-level input current WDI – 15 – 20 µATime average (dc = 12%)V
IH
High-level input voltage at MR and WDI 0.7 x V
DD
VV
IL
Low-level input voltage at MR and WDI 0.3 x V
DD
V
Δt / ΔV Input transition rise and fall rate at MR 50 ns/VWDI WDI = V
DD
= 6V 120 170 µAMR MR = 0.7 ×V
DD
, V
DD
= 6V – 130 – 180 µAI
H
High-level input current
SENSE1 VSENSE1 = V
DD
= 6V 5 8 µASENSE2 VSENSE2 = V
DD
= 6V 6 9 µAWDI WDI = 0V, V
DD
= 6V – 120 – 170 µAI
L
Low-level input current MR MR = 0V, V
DD
= 6V – 430 – 600 µASENSEn VSENSE1,2 = 0V – 1 1 µAI
DD
Supply current 40 µAC
I
Input capacitance V
I
= 0V to V
DD
10 pF
(1) The lowest supply voltage at which RESET becomes active. t
r
, V
DD
≥15 µs/V.(2) To ensure best stability of the threshold voltage, a bypass capacitor (0.1 µF ceramic) should be placed close to the supply terminals.
Copyright © 1998 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS3305
www.ti.com
MR
t
t
t
t
V(nom)
VIT-
SENSEn
WDI
RESET
0
1
0
1
0
1
tt(out)
td
td
tdtd
RESETbecauseofWDI
RESETbecauseof MR
RESETbecauseofSENSEbelowVIT-
RESETbecauseofSENSEbelowVIT-
RESETbecause
ofSENSEbelowVIT-
TIMING REQUIREMENTS
SWITCHING CHARACTERISTICS
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008
TIMING DIAGRAM
At V
DD
= 2.7V to 6V, R
L
= 1M Ω, C
L
= 50pF, and T
J
= +25 °C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SENSEn V
SENSEnL
= V
IT –
– 0.2V, V
SENSEnH
= V
IT+
+0.2V 6 µst
w
Pulse width MR 100 nsV
IH
= 0.7 ×V
DD
, V
IL
= 0.3 ×V
DDWDI 100 ns
At V
DD
= 2.7V to 6V, R
L
= 1M Ω, C
L
= 50pF, and T
J
= +25 °C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
I(SENSEn)
≥V
IT+
+0.2V, MR ≥0.7 ×t
t(out)
Watchdog time-out V
DD
1.1 1.6 2.3 sSee Timing DiagramV
I(SENSEn)
≥V
IT+
+0.2V, MR ≥0.7 ×V
DDt
d
Delay time 140 200 280 msSee Timing DiagramPropagation (delay) time, MR to RESET, V
I(SENSEn)
≥V
IT+
+0.2V,t
PHL
200 500 nshigh-to-low level output MR to RESET V
IH
= 0.7 ×V
DD
, V
IL
= 0.3 ×V
DD
Propagation (delay) time, MR to RESET, V
I(SENSEn)
≥V
IT+
+0.2V,t
PLH
200 500 nslow-to-high level output MR to RESET V
IH
= 0.7 ×V
DD
, V
IL
= 0.3 ×V
DD
Propagation (delay) time, SENSEn to RESET, V
IH
= V
IT+
+0.2V, V
IL
= V
IT –
– 0.2V,t
PHL
1 5 µshigh-to-low level output SENSEn to RESET MR ≥0.7 ×V
DD
Propagation (delay) time, SENSEn to RESET, V
IH
= V
IT+
+0.2V, V
IL
= V
IT –
– 0.2V,t
PLH
1 5 µslow-to-high level output SENSEn to RESET MR ≥0.7 ×V
DD
4Submit Documentation Feedback Copyright © 1998 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TPS3305
www.ti.com
DEVICE INFORMATION
FUNCTION/TRUTH TABLE
(1)
40kW
R1
R3
R2
14kW
R4
Reference
Voltage
of1.25V Oscillator
RESET
Logic+Timer
Watchdog
Logic+Timer
Transition
Detection
VDD
MR
SENSE1
SENSE2
GND
WDI
RESET
RESET
TPS3305
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008
MR SENSE1 > V
IT1
SENSE2 > V
IT2
RESET RESET
L X X L HH 0 0 L HH 0 1 L HH 1 0 L HH 1 1 H L
(1) X= Don't care
FUNCTIONAL BLOCK DIAGRAM
TERMINAL FUNCTIONS
TERMINAL
NAME NO. DESCRIPTION
GND 4 GroundMR 7 Manual resetRESET 5 Active-low reset outputRESET 6 Active-high reset outputSENSE1 1 Sense voltage input 1SENSE2 2 Sense voltage input 2WDI 3 Watchdog timer inputV
DD
8 Supply voltage
Copyright © 1998 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPS3305
www.ti.com
TYPICAL CHARACTERISTICS
4
0
−6
−10
−0.5 0 0.5 1 2.5 3 3.5
8
14
18
4 5 6 7
16
12
10
6
2
−2
−4
−8
1.5 2 4.5 5.5 6.5
I -SupplyCurrent- Am
DD
V -SupplyVoltage-V
DD
TPS3305-33
SENSEn=VDD
MR =Open
T =+25
JC°
1
0.999
0.997
0.995
−40 −15 10 35
1.002
1.003
1.005
60 85
1.004
1.001
0.998
0.996
NormalizedInputThresholdVoltage-V (T ),V (
IT A IT +25 C)
°
T -JunctionTemperature- C
J°
V =6V
DD
MR =Open
5
4
2
0
7
9
10
0 100 200 300 400 500 600 700 800 900 1000
8
6
3
1
t -MinimumPulseDurationatV - s
m
W sense
SENSE-ThresholdOverdrive-mV
VDD =6V
MR =Open
−400
−500
−700
−900
−1 −0.5 0 1 1.5 2.5 3
−200
−100
100
3.5 4 5.5 6.5
0
−300
−600
−800
0.5 2 4.5 5 6
I -InputCurrent- Am
I
V -InputVoltageat -V
IMR
VDD =6V
T =+25
JC°
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008
NORMALIZED SENSE THRESHOLD VOLTAGE SUPPLY CURRENTvs vsJUNCTION TEMPERATURE AT V
DD
SUPPLY VOLTAGE
Figure 1. Figure 2.
INPUT CURRENT MINIMUM PULSE DURATION AT SENSEvs vsINPUT VOLTAGE AT MR THRESHOLD OVERDRIVE
Figure 3. Figure 4.
6Submit Documentation Feedback Copyright © 1998 – 2008, Texas Instruments Incorporated
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3.5
3
2
0
0 −5 −10 −15 −20 −25 −30
4.5
6
6.5
−35 −40 −45 −50
5.5
5
4
2.5
1.5
1
0.5
V -High-LevelOutputVoltage-V
OH
I -High-LevelOutputCurrent-mA
OH
VDD =6V
MR =Open
+85 C°
-40 C°
1
0.5
0
0 0.5 1 1.5 2 3 3.5
1.5
2
2.5
4 4.5 5.5 62.5 5
VDD =2V
MR =Open
+85 C°
-40 C°
V -Low-LevelOutputVoltage-V
OL
I -Low-LevelOutputCurrent-mA
OL
3.5
3
1.5
00 5 10 15 20 30 35
4.5
5.5
6.5
40 50 55 60
6
5
4
2.5
2
1
0.5
25 45
V -Low-LevelOutputVoltage-V
OL
I -Low-LevelOutputCurrent-mA
OL
VDD =6V
MR =Open
+85 C°
-40 C°
TPS3305
SLVS198C – DECEMBER 1998 – REVISED MARCH 2008
TYPICAL CHARACTERISTICS (continued)
HIGH-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGEvs vsHIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
Figure 5. Figure 6.
LOW-LEVEL OUTPUT VOLTAGE LOW-LEVEL OUTPUT VOLTAGEvs vsLOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT CURRENT
Figure 7. Figure 8.
Copyright © 1998 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TPS3305
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS3305-18D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DGN ACTIVE MSOP-
Power
PAD
DGN 8 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DGNG4 ACTIVE MSOP-
Power
PAD
DGN 8 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DGNR ACTIVE MSOP-
Power
PAD
DGN 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DGNRG4 ACTIVE MSOP-
Power
PAD
DGN 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-18DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DGN ACTIVE MSOP-
Power
PAD
DGN 8 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DGNG4 ACTIVE MSOP-
Power
PAD
DGN 8 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DGNR ACTIVE MSOP-
Power
PAD
DGN 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DGNRG4 ACTIVE MSOP-
Power
PAD
DGN 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-25DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33DGN ACTIVE MSOP-
Power
PAD
DGN 8 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33DGNG4 ACTIVE MSOP-
Power
PAD
DGN 8 80 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33DGNR ACTIVE MSOP- DGN 8 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 20-Mar-2008
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Power
PAD no Sb/Br)
TPS3305-33DGNRG4 ACTIVE MSOP-
Power
PAD
DGN 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3305-33DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 20-Mar-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3305-18DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3305-18DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS3305-25DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3305-25DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS3305-33DGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS3305-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3305-18DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TPS3305-18DR SOIC D 8 2500 367.0 367.0 35.0
TPS3305-25DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TPS3305-25DR SOIC D 8 2500 367.0 367.0 35.0
TPS3305-33DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TPS3305-33DR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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