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Document No: 0011-00-07-01-000 (Issue H)
Date Published: October 11, 2016 Page 1
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MeshConnect™ EM35x Mini Modules
DESCRIPTION
The MeshConnect™ EM35x Mini Modules from
California Eastern Laboratories (CEL) combine high
performance RF solutions with the market's premier
ZigBee® and Thread stacks. Available in low and
high output power options (+8dBm and +20dBm),
these modules can accommodate variable range
and performance requirements. The tiny module
footprint makes them suitable for a wide range of
ZigBee and Thread applications. The MeshConnect
EM35x Mini Modules are certied and qualied,
enabling customers to accelerate time to market by
greatly reducing the design and certication phases
of development.
CEL’s MeshConnect EM35x Mini Modules
(ZICM35xSP0 and ZICM35xSP2) are based on the
Ember EM35x (EM357 and EM358x) System on Chip
(SoC) radio ICs. Each IC is a complete single-chip
solution, compliant with ZigBee, Thread, and IEEE
802.15.4. specications.
CEL’s EM358x-based Mini Modules (ZICM358xSP0
and ZICM358xSP2) are ideal for customers requiring
Over-the-Air (OTA) programming without an external
Flash memory (such as Smart Energy or Home
Automation), a larger memory footprint for complex
application control, or the additional resources to run
an IPv6-based networking stack like Thread. They
also feature an optional on-board Universal Serial
Bus (USB) 2.0 full-speed peripheral.
Integrated Transceiver Modules for ZigBee®/ Thread / IEEE 802.15.4
Development Kit Available: ZICM-EM35X-DEV-KIT-3
EM35x Mini Modules
ZICM35xSP0 and ZICM35xSP2
EmberTM EM35x Transceiver-Based Modules
• Data Rate: 250kbps
• Advanced Power Management
• 16 RF Channels
• Industry's Premier Wireless
Networking Stacks: EmbeZNet
PRO™ (ZigBee) and Silicon
Labs Thread
• Mini Footprint:
- 0.940" x 0.655"
(23.9mm x 16.6 mm)
ADDITIONAL FEATURES
• Antenna Options:
1) Integrated PCB Trace Antenna
2) RF Port for External Antenna
• Supports Mesh Networks
• AES Encryption
• FCC, CE and IC Certications
• RoHS Compliant
APPLICATIONS
• Smart Energy/Grid Markets
- Thermostats
- In-Home Displays
- Smart Plugs
• Home Automation and Control
- Energy Management
- Security Devices
- HVAC Control
• Building Automation and Control
• Commercial and Residential
Lighting
- Fixtures and Control
• Solar Inverters and Control
• General ZigBee and Thread
Wireless Sensor Networking
ZICM35xSP0 ZICM35xSP2
+8dBm +20 dBm
-100dBm -103dBm
+108dB +123dB
Tx:
Rx:
Link Budget:
KEY FEATURES:
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/ Slave),
TWI and UART
• Timers and Serial
Wire/ JTAG Interface
• 5-Channel 14-bit ADC
EM357
• 12kB SRAM
• 192kB Flash
EM358x
• Up to 64kB SRAM
• Up to 512kB Flash
(Supports OTA)
• Optional USB
Controller
Powered by Ember® ZigBee® & Thread Solutions
or
EM35x Mini Modules
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Document No: 0011-00-07-01-000 (Issue H)
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Introduction and Overview
Description..............................................................................................................................................................................................
1
Features
................................................................................................................................................................................................... 1
Applications
............................................................................................................................................................................................
1
Ordering Information..............................................................................................................................................................................
3
ZICM35xSPx Product Comparison Table..............................................................................................................................................
4
Module Block Diagram...........................................................................................................................................................................
4
Development Tools..................................................................................................................................................................................
5
System Level Function
Transceiver IC..........................................................................................................................................................................................
6
Antenna....................................................................................................................................................................................................
6
Power Amplier.......................................................................................................................................................................................
6
USB
........................................................................................................................................................................................................... 7
Software/Firmware
................................................................................................................................................................................. 7
Electrical Specication
Absolute Maximum Ratings
................................................................................................................................................................... 8
Recommended Operating Condition
..................................................................................................................................................... 8
DC Characteristics..................................................................................................................................................................................
8
RF Characteristics
.................................................................................................................................................................................. 9
Pin Signal and Interfaces
Pin Signals I/O Conguration
............................................................................................................................................................... 10
I/O Pin Assignment
................................................................................................................................................................................ 10
Module Dimensions
................................................................................................................................................................................ 11
Module Land Footprint
........................................................................................................................................................................... 12
Processing
.......................................................................................................................................................................................... 13
Agency Certications
.................................................................................................................................................................... 15
Software Compliance
.................................................................................................................................................................... 16
Shipment, Storage and Handling
............................................................................................................................................. 18
Quality
................................................................................................................................................................................................... 18
References
.......................................................................................................................................................................................... 19
Revision History
............................................................................................................................................................................... 19
TABLE OF CONTENTS
EM35x Mini Modules
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ORDERING INFORMATION
Part Number Order Number Description Min/
Multiple
MeshConnect
EM35x Mini Modules
ZICM357SP0-1-R EM357 IC, +8dBm output power, PCB trace antenna; Tape and Reel Package 600/ 600
ZICM357SP0-1C-R EM357 IC, +8dBm output power with castellation pin for external antenna; Tape and Reel Package 600/ 600
ZICM357SP2-1-R * EM357 IC, +20dBm output power, PCB trace antenna; Tape and Reel Package 600/ 600
ZICM357SP2-1C-R * EM357 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package 600/600
ZICM357SP2-2-R EM357 IC, +20dBm output power, PCB trace antenna; Tape and Reel Package 600/ 600
ZICM357SP2-2C-R EM357 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package 600/600
ZICM3588SP0-1-R EM3588 IC, +8dBm output power, PCB trace antenna; Tape and Reel Package 600/ 600
ZICM3588SP0-1C-R EM3588 IC, +8dBm output power with castellation pin for external antenna; Tape and Reel Package 600/ 600
ZICM3588SP2-1-R * EM3588 IC, +20dBm output power, PCB trace antenna; Tape and Reel Package 600/ 600
ZICM3588SP2-1C-R * EM3588 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package 600/ 600
ZICM3588SP2-2-R * EM3588 IC, +20dBm output power, PCB trace antenna; Tape and Reel Package 600/ 600
ZICM3588SP2-2C-R * EM3588 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package 600/ 600
MeshConnect EM35x
Development Kit ZICM-EM35X-DEV-KIT-3 MeshConnect EM35x Ember Companion Kit for Ember EM35x Development Kit 1/1
*Note: ZICM35xSP2-1(C) modules are not recommended for new designs, although there are no plans to stop production. Use ZICM35xSP2-2(C)
instead. The -2 part numbers allow for faster 'time to sleep' state at the expense of one less GPIO (PC6).
EM35x Mini Modules
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Radio
Micro
LPF
Balun
Castellation
Edge Connector
Ember EM35x
24MHz
XTAL
EM35x Mini Module (ZICM35xSP0)
Radio
Micro
PA
LNA
LPF
TX/RX
Switch
Castellation
Edge Connector
Ember EM35x
24MHz
XTAL
EM35x Mini Module (ZICM35xSP2)
MODULE BLOCK DIAGRAMS
ZICM35xSPx PRODUCT COMPARISON TABLE
Order Number
MCU Performance
Comments
Flash
Memory
SRAM
Memory USB I/O
Tx
Power
Output
Rx
Sensitivity
Rx
Current
Tx
Current
Sleep /
Suspend
Current
dBm dBm mA mA µA
ZICM357SP0-1
ZICM357SP0-1C
192 kB 12 kB –
23 +8 -100 30 44
1
ZICM357SP2-1
ZICM357SP2-1C 22
+20 -103 34 150
ZICM357SP2-2
ZICM357SP2-2C 21 Reduced GPIO allows for
faster 'time to sleep' state
ZICM3588SP0-1
ZICM3588SP0-1C
512 kB 64 kB ü
23 +8 -100 30 44
2.4
2.4 µA with entire RAM
retained. Lower sleep
current can be achieved
by retaining less RAM
ZICM3588SP2-1
ZICM3588SP2-1C 22
+20 -103 34 150
ZICM3588SP2-2
ZICM3588SP2-2C
1) 2.4 µA with entire RAM
retained. Lower sleep
current can be achieved
by retaining less RAM
2) Reduced GPIO allows
for faster 'time to sleep'
state
21
EM35x Mini Modules
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DEVELOPMENT TOOLS
Ember Companion Kit
CEL’s MeshConnect EM35x Ember Companion Kit is
designed to work with the Silicon Laboratories/ Ember
Development Kits (EM35X-DEV and EM35X-DEV-IAR).
Each module in the CEL Development Kit is soldered on
a carrier board making it pin-for-pin compatible with the
Ember Development Board.
Mini Modules Programming Fixture
CEL's MeshConnect EM35x Mini Modules Programming
Fixture is a programming assembly designed to be used
with the CEL ZICM35xSPx MeshConnect Mini Modules. It
is useful for production programming or during application
development when multiple rmware images are required
to be loaded into a CEL Mini Module for testing and
debugging. The programming assembly must be used in
conjunction with an Ember Debug/InSight Adapter (ISA3)
from Silicon Labs.
For more information regarding the MeshConnect
Development Tools, refer to the respective documents, or
visit www.cel.com/MeshConnect.
EM35x Programming Fixture
DEVELOPMENT TOOLS ORDERING INFORMATION
Part Number Order Number Description
MeshConnect
EM35x Ember Companion Kit ZICM-EM35X-DEV-KIT-3 MeshConnect EM35x Ember Companion Kit for Silicon Laboratories/
Ember EM35x Development Kit
MeshConnect
EM35x Programming Fixture ZICM35xSPx-PF-1 MeshConnect EM35x Mini Modules (ZICM35xSPx) Programming Fixture
EM35x Ember Companion Kit
Kit Contents:
• ZICM357SP0-1C-SL
• ZICM357SP2-1-SL
• ZICM357SP2-1C-SL
• ZICM3588SP0-1C-SL
• ZICM3588SP2-1-SL
• ZICM3588SP2-1C-SL
EM35x Mini Modules
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TRANSCEIVER IC
CEL’s MeshConnect EM35x Mini Modules use the Ember EM35x transceiver (EM357 or EM358x) IC. The IC
incorporates a RF transceiver with baseband modem, a hardwired MAC and an embedded ARM® Cortex™-M3
microcontroller, offering an excellent low cost, high performance solution for all IEEE 802.15.4/ZigBee/Thread
applications. For more information about the EM35x IC, visit www.silabs.com.
ANTENNA
CEL’s MeshConnect EM35x Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna.
An optional conguration which uses a castellation pin on the module allows the user to connect an external
antenna. The ZICM35xSP0 has been certied with the PCB trace antenna and two external antennas (E-2820-
CA, LSR 001-0100). The ZICM35xSP2 has been certied with the PCB trace antenna and a Nearson half-wave
dipole antenna (part number: S181AH-2450S) on a 4 inch cable using the castellation pin of the module. Please
refer to the document Mini Module External Antenna Implementation for details describing the requirements that
must be followed to take advantage of the CEL certication. See Ordering Information on Page 3.
The PCB antenna employs a topology that is compact and highly efcient. To maximize range, an adequate ground
plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute
signicantly to the antenna performance (it should not be directly under the module PCB Antenna). The position of
the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor
design affects radiation patterns and can result in reection, diffraction and/or scattering of the transmitted signal.
For optimum antenna performance, the MeshConnect Modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the
host board under the module, up to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of
an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this
layer. CEL can provide assistance with your PCB layout.
The following are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module
• Never place the antenna close to metallic objects
• In the overall design, ensure that wiring and other components are not placed near the antenna
• Do not place the antenna in a metallic or metalized plastic enclosure
• Keep plastic enclosures 1cm or more away from the antenna in any direction
This radio transmitter IC: 8254A-ZICM357SP0 & IC: 8254A-ZICM357SP2 has been approved by IC Canada
to operate with the antenna types listed above with the maximum permissible gain of 2dBi. Antenna types not
included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Cet émetteur radio IC: 8254A-ZICM357SP0 & IC: 8254A-ZICM357SP2 a été approuvé par IC Canada pour
fonctionner avec les types d'antenne énumérés ci-dessus avec le gain maximal admissible de 2dBi. Types
d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont
strictement interdits pour une utilisation avec cet appareil.
POWER AMPLIFIER
CEL’s MeshConnect EM35x High Power Mini Module (ZICM35xSP2) includes a Power Amplier (PA). This PA
delivers high efciency, high gain and high output power (Pout = +20.0dBm typical) to provide an extended range
and reliable transmission for fewer nodes in a network. For the ZICM35xSP2, Power Mode 2 with Power Setting
-2 is the maximum setting allowed for FCC Compliance. Operating in Power Mode 3 at higher power settings
may damage the PA.
EM35x Mini Modules
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USB
The ZICM3588SPx-x Modules have an integrated USB 2.0-compliant, full-speed (12Mbps) device peripheral. For
more information, refer to the EM35x SoC Datasheet link provided in the References Section of this document.
SOFTWARE/FIRMWARE
CEL’s MeshConnect EM35x Mini Modules are ideal platforms for EmberZNet PRO, the industry’s most deployed
and eld proven ZigBee compliant stack supporting the ZigBee PRO feature set. EmberZNet PRO is a complete
ZigBee protocol software package containing all the elements required for mesh networking applications. The
ZICM3588SPx variants are also ideal platforms for Thread, an IP-based mesh networking stack that allows direct
IPv6 connectivity to all devices within the network. For more information regarding the software development for
the EM35x IC family, visit www.silabs.com.
CEL provides reference software that runs multiple functions and executes various commands. For example,
users can set up a simple ZigBee network to perform Range and Packet Error Rate (PER) tests between two
devices. This allows the user to evaluate the module's RF performance in their own environment. The software
can also place the module in various operating modes which allows for testing of low-level RF performance,
GPIO functionality, etc.
The ZICM35xSP0 Module uses the transceiver's primary RF ports for transmitting and should use Power Mode 1
(EMBER_TX_POWER_MODE_BOOST in the EmberZNet API).
The ZICM35xSP2 Module uses the transceiver's alternate RF ports for transmitting and should use Power Mode 2
(EMBER_TX_POWER_MODE_ALTERNATE in the EmberZNet API). GPIO PC5 must also be congured as
ALT_OUT (push/pull).
EM35x Mini Modules
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ABSOLUTE MAXIMUM RATINGS
Description MeshConnect ZICM35xSPx Module Unit
Min Max
Power Supply Voltage (VDD) -0.3 3.6 VDC
Voltage on any I/O Line -0.3 VDD + 0.3 VDC
RF Input Power ZICM35xSP0
ZICM35xSP2
–
–
+15
+5 dBm
Storage Temperature Range -40 125 °C
Reow Soldering Temperature – 260 °C
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED OPERATING CONDITIONS
Description MeshConnect ZICM35xSPx Module Unit
Min Typ Max
Power Supply Voltage (VDD) 2.1 3.3 3.6 VDC
Input Frequency 2405 – 2480 MHz
Ambient Temperature Range -40 25 85 °C
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM35xSP0 TX Power Mode 1, ZICM35xSP2 TX Power Mode 2)
Description MeshConnect ZICM35xSPx Module Unit
Min Typ Max
Transmit Mode Current @ +8dBm
ZICM35xSP0
– 44 – mA
Transmit Mode Current @ 0dBm – 31 – mA
Receive Mode Current – 30 – mA
Transmit Mode Current @ +20dBm
ZICM35xSP2
– 150 – mA
Transmit Mode Current @ 0dBm – 58 – mA
Receive Mode Current – 34 – mA
Sleep Mode Current ZICM357SPx – 1 – µA
Sleep Mode Current ZICM358xSPx – 2.4*– µA
*Note: The increased sleep current on the ZICM358xSPx is at 3.6VDC with all the RAM retained. Lower sleep currents
can be achieved if less RAM is retained during sleep.
EM35x Mini Modules
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RF CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM35xSP0 TX Power Mode 1, ZICM35xSP2 TX Power Mode 2)
Description MeshConnect ZICM35xSPx Module Unit
Min Typ Max
General Characteristics
RF Frequency Range 2405 – 2480 MHz
RF Channels 11 – 26 –
Frequency Error Tolerance -96.2 – 96.2 kHz
Transmitter
Maximum Output Power
ZICM35xSP0
– +8 – dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 5 35 %
Maximum Output Power
(using Power Mode 2, Power Setting -2)
ZICM35xSP2
– +20 21 dBm
Minimum Output Power – -40 – dBm
Offset Error Vector Magnitude – 5 35 %
Receiver
Sensitivity (1% PER, Boost Mode) ZICM35xSP0 – -100 -94 dBm
Saturation (Maximum Input Level) 0 – – dBm
Sensitivity (1% PER, Normal Mode) ZICM35xSP2 – -103 -97 dBm
Saturation (Maximum Input Level) -10 – – dBm
Note: The ZICM35xSP2, Power Mode 2 with Power Setting -2 is the maximum setting allowed for FCC
Compliance. Operating in Power Mode 3 at higher power settings may damage the PA.
EM35x Mini Modules
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PIN SIGNALS I/O PORT CONFIGURATION
CEL’s MeshConnect Module has 33 edge I/O interfaces for connection to the user’s host board. See the
MeshConnect Module Dimensions Section which details the layout of the 33 edge castellations.
I/O PIN ASSIGNMENTS
CEL MeshConnect
ZICM35xSPx Module
Pin Number
EM35x IC
Pin Number Name Notes
1, 2, 12, 31, 33 49 GROUND
311 PC5
ZICM35xSP0: Digital I/O
ZICM35xSP2: Dedicated as TX_ACTIVE. The EM35x baseband
controls TX_ACTIVE and drives it high when in TX mode; since it is
used internally in the module, PC5 is not connected to module I/O pin 3
4 12 RESET Active Low chip reset (Input)
5 13 PC6
ZICM35xSP0: Digital I/O
ZICM35xSP2-1: Digital I/O
ZICM35xSP2-2: Used internally in the module; PC6 is not connected to
module I/O pin 5
6 14 PC7 Digital I/O
7 18 PA7 Digital I/O
8 19 PB3 Digital I/O
9 20 PB4 Digital I/O
10 21 PA0 Digital I/O
11 22 PA1 Digital I/O
13 16, 23, 28, 37 VDD
14 24 PA2 Digital I/O
15 25 PA3 Digital I/O
16 26 PA4 Digital I/O
17 27 PA5 Digital I/O
18 29 PA6 Digital I/O
19 30 PB1 Digital I /O
20 31 PB2 Digital I /O
21 32 JTCK JTAG clock input from debugger
22 33 PC2 Digital I/O
23 34 PC3 Digital I/O
24 35 PC4 Digital I/O
25 36 PB0 Digital I/O
26 38 PC1 Digital I/O
27 40 PC0 Digital I/O
28 41 PB7 Digital I/O
29 42 PB6 Digital I/O
30 43 PB5 Digital I/O
32 NC RF Out Castellation Pin for external Antenna
EM35x Mini Modules
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MODULE DIMENSIONS
Note: All dimensions are +/- 0.005" (0.12mm) unless otherwise specied.
0.655” (16.63mm)
0.940” (23.87mm)
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
0.062” (1.57mm)
0.152” (3.86mm) MAX
EM357
Series
ARM
R6
R7
U1
R1
C7 C7B
L4
L3
C11
R10
C21
C20
L5
R11 C23
C22
R8
C5B
C24
C13
C6A C1
C2
R5
L6
C6B
C6
L2
C14
C10
C9 R2
R9
C15
C16
R4
C17
C4A
XTAL1
EM357
Series
ARM
0000-00-00-00-000
EM300 Series Module
ZICM35xSPx
P
in 1
P
in 11 Pin 22
Pin 33
MeshConnect EM35x Mini Modules
EM35x Mini Modules
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MODULE LAND FOOTPRINT
0.655” [16.64]
0.465” [11.80]
0.221” [5.61]
0.236” [5.98]
0.940” [23.88]
0.985” [25.02]
0.540” [13.73] PITCH 0.050” [1.27]
0.084” [2.13]
0.082” [2.09] 0.490” [12.45]
0.746” [18.95]
0.084” [2.13]
33X 0.090” [2.29] X 0.040” [1.02]
Ø0.140” [Ø3.56]
0.590” [14.98]
Note: Refer to the Antenna Section in this document for layout recommendations which will yield optimal antenna performance.
Dimensions are shown in inches, with millimeter conversions in brackets.
EM35x Mini Modules
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PROCESSING
Recommended Reow Prole
Parameter Values
Ramp Up Rate (from Tsoakmax to Tpeak) 3º/ sec max
Tsoakmin 150ºC
Tsoakmax 200ºC
Soak Time 60-120 sec
TLiquidus 217ºC
Time above TLiquidus 60-150 sec
Tpeak 250ºC
Time within 5º of Tpeak 20-30 sec
Time from 25º to Tpeak 8 min max
Ramp Down Rate 6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the appropriate IPC
Specication. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily
removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering ux residuals and encapsulated water could lead to
short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reow Soldering
Only a single reow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a
single wave soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).
EM35x Mini Modules
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Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be
programmable and the solder joint and module should not exceed the maximum peak reow temperature
of 250ºC.
Caution
If temperature ramps exceed the reow temperature prole, module and component damage may occur due to
thermal shock. Avoid overheating.
Warning
Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate
warranty coverage.
Additional Grounding
Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module
RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufcient
for optimum immunity to external RF interference.
EM35x Mini Modules
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AGENCY CERTIFICATIONS
The following Part Numbers are Certied as shown below:
Part Number Certications Antenna
ZICM35xSP0-1 FCC, IC, CE PCB
ZICM35xSP0-1C FCC, IC, CE E-2820-CA, LSR 001-0100
ZICM35xSP2-x FCC, IC PCB
ZICM35xSP2-xC FCC, IC Nearson S181AH-2450S
FCC and Canada Compliance Statement
This device complies with Part 15 of the FCC Rules and with IC Canada licence-exempt RSS Standards.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Déclaration De Conformité FCC Et Au Canada
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Warning (Part 15.21)
Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.
20cm Separation Distance
To comply with FCC/IC Canada RF exposure limits for general population/uncontrolled exposure, the antenna(s)
used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and
must not be co-located or operated in conjunction with any other antenna or transmitter except in accordance
with FCC muti-transmitter product procedures.
20cm Distance De Séparation
Pour se conformer aux limites d'exposition FCC / IC Canada RF pour la population générale / exposition non
contrôlée, l'antenne(s) utilisée pour ce transmetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toutes les personnes et ne doit pas être co-implantés ou exploités en conjonction avec une autre
antenne ou émetteur, sauf en conformité avec les procédures de produits muti-émetteur FCC.
OEM Responsibility to the FCC and IC Rules and Regulations
The MeshConnect Mini Module has been certied per FCC Part 15 Rules and to IC Canada license-exempt
RSS Standards for integration into products without further testing or certication. To fulll the FCC and IC
Certication requirements, the OEM of the MeshConnect Module must ensure that the information provided on
the MeshConnect label is placed on the outside of the nal product. The MeshConnect Mini Module is labeled
with its own FCC ID Number and IC ID Number. If the FCC ID and the IC ID are not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display
a label referring to the enclosed module. The exterior label can use wording such as the following:
EM35x Mini Modules
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“Contains Transmitter Module FCC ID: W7Z-ZICM357SP0” or “Contains FCC ID: W7Z-ZICM357SP0”
“Contains Transmitter Module IC: 8254A-ZICM357SP0" or "Contains IC: 8254A-ZICM357SP0”
or
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP2” or “Contains FCC ID: W7Z-ZICM357SP2”
“Contains Transmitter Module IC: 8254A-ZICM357SP2" or "Contains IC: 8254A-ZICM357SP2”
The OEM of the MeshConnect Mini Module may only use the approved antennas (PCB Trace Antenna and external
antenna) that have been certied with this module. The OEM of the MeshConnect Mini Module must test their nal
product conguration to comply with Unintentional Radiator Limits before declaring FCC Compliance per Part 15 of
the FCC Rules. The OEM must also include in their manual the following statement:
FCC and Canada Compliance Statement
This device complies with Part 15 of the FCC Rules and with IC Canada licence-exempt RSS Standards.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Déclaration De Conformité FCC Et Au Canada
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
In addition to using only the approved external antennas, the OEM must follow the layout described in the "Mini
Module External Antenna Implementation Guide" to be covered by the current approval.
CE Certication — Europe
The MeshConnect ZICM35xSP0 Module has been tested and certied for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect Module is to be incorporated into a product, the OEM must verify compliance of the nal
product to the European Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must
be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.
EM35x Mini Modules
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OEM Labeling Requirements
The CE mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials
CE with the following form:
· If the CE marking is reduced or enlarged, the proportions given in the CE
graduated drawing (to the right) must be adhered to
· The CE mark must be a minimum of 5mm in height
· If the use of the module is subject to restrictions in the end application, the CE
marking on the OEM product should also include the alert sign as shown in the
image to the right
Software Compliance
The MeshConnect Mini Modules require software restrictions to meet agency certication requirements.
These restrictions have been implemented in the sample application included with the Software Development Kit.
If a customer is not starting with the CEL Software Development Kit, they must implement the following output
power restrictions to use the FCC, IC or CE Certications:
Part Number Certication RF Channel Valid TX
Power Steps
Typical Max
Output Power
ZICM35xSP0-1 FCC/IC 11 - 25 -43 to 8 8 dBm
26 -43 to 0 1 dBm
ETSI 11 - 26 -43 to 8 8 dBm
ZICM35xSP0-1C FCC/IC 11 - 25 -43 to 8 8 dBm
26 -43 to -7 -7 dBm
ETSI 11 - 26 -43 to 8 8 dBm
ZICM35xSP2-x FCC/IC
11 - 24 -43 to -2 20 dBm
25 -43 to -6 17 dBm
26 -43 to -21 -5 dBm
ZICM35xSP2-xC FCC/IC
11 - 24 -43 to -2 20 dBm
25 -43 to -12 9 dBm
26 -43 to -21 -5 dBm
Note: The ZICM35xSP2, Power Mode 2 with Power Setting -2 is the maximum setting allowed for FCC Compliance.
Operating in Power Mode 3 at higher power settings may damage the PA.
EM35x Mini Modules
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Shipment
The MeshConnect Modules are delivered in Tape and Reel for easy assembly in a manufacturing environment.
The reel diameter is 12.992 inches (330mm) and contains 600 modules
Tape and Reel Dimensions
Measurements are in inches [mm]
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
Warning
The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection
may destroy or damage the module permanently.
Warning
The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions
are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and < 90% relative humidity.
QUALITY
CEL Modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with
the IPC-A-610 specication, Class II. Our modules go through JESD22 qualication processes which include
high temperature operating life tests, mechanical shock, temperature cycling, humidity and reow testing. CEL
conducts RF and DC factory testing on 100% of all production parts.
CEL builds the quality into our products, giving our customers condence when integrating our products into
their systems.
SHIPMENT, HANDLING AND STORAGE
0.079±0.004 [2.00±0.10]
0.071±0.004 [1.75±0.10]
0.795±0.006 [20.20±0.15]
1.732±0.011 [44.00±0.30]
0.014±0.002 [0.35±0.05]
0.957±0.004 [24.30±0.10]
0.169±0.004 [4.30±0.10] 0.945±0.004 [24.00±0.10]
0.669±0.004 [17.00±0.10]
SECTION A-A
A
A
0.157 [4.00] PITCH
SECTION B-B
B B
EM35x Mini Modules
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REFERENCES
Reference Documents Download
120-035X-000 - Silicon Labs/Ember EM35x SoC Datasheet Link
0011-02-17-00-000 - CEL EM35x Ember Mini Module Companion Kit Technical User Guide Link
0011-01-16-05-000 - Using the ZICM35xSPx Mini Module Programming Fixture Link
0011-00-16-11-000 - CEL ZICM35xSP2-1C External Antenna Implementation Link
REVISION HISTORY
Previous Versions Changes to Current Version Page(s)
0011-00-07-01-000
(Issue A) July 22, 2013 Initial Preliminary Datasheet All
0011-00-07-01-000
(Issue B) August 1, 2013
Updated Development Tools Section, Antenna Section, Agency Certications,
Software Compliance Section 4, 5, 14, 16, 17
0011-00-07-01-000
(Issue C) February 10, 2014 Updated Tape and Reel Packaging 3, 17
0011-00-07-01-000
(Issue D) March 17, 2014
Updated ZICM358xSPx Sleep Mode Current. Removed "Preliminary" status for this
datasheet. Updated Software Compliance "Valid" TX Power Steps" table values 1, 7, 16
0011-00-07-01-000
(Issue E) March 18, 2014
This datasheet is now a "Preliminary Datasheet" due to the addition of new part numbers
(ZICM357SP2-2, ZICM357SP2-2-R, ZICM357SP2-2C and ZICM357SP2-2C-R) to the
"Ordering Information". Added new "ZICM35xSPx Product Comparison Table".
1, 3
0011-00-07-01-000
(Issue F) July 15, 2014
Removed "Preliminary" status for this datasheet. Updated Programming Fixture
Product Photography 1, 5
0011-00-07-01-000
(Issue G) July 20, 2014 Added part numbers ZICM3588SP2-2(C), updated Logos 3
0011-00-07-01-000
(Issue H) October 11, 2016
Changed "Industry Canada" to "IC Canada" throughout document. Updated Antenna
Section and added a new part number to Agency Certications table.
Added ZICM35xSP0-1C to Software compliance table. Removed option for tray
conguration
4,6,15,17,18
EM35x Mini Modules
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The information in this document is current as of the published date. The information is subject to change without notice. For actual
design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specications of CEL
products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and
additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL.
CEL assumes no responsibility for any errors that may appear in this document.
CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising
from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express,
implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor
product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s
equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the
possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons
arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-
containment and anti-failure features.
Disclaimer
For More Information
For more information about CEL MeshConnect products and solutions, visit our website at:
www.cel.com/MeshConnect.
Technical Assistance
For Technical Assistance, visit www.cel.com/MeshConnectHelp.