GP2W0004YP/XP IrDA Technical Information Infrared Transceiver DESCRIPTION The SHARP GP2W0004YP has a wide operating voltage range and is one of the smallest IrDA onemeter transceiver modules. It provides the interface between logic and IR signals for through-air, serial, half-duplex IR wireless data links and is designed to satisfy the IrDA physical layer specifications. This part features an integral Electro-Magnetic Interference (EMI) shield. IR energy is inherently immune to EMI; however, the receiving devices are sensitive to EMI. The shield provides additional protection in noisy environments such as PCs and other digital products. FEATURES * IrDA 115 kbit/s, 1 meter Transceiver * Small Package Design - W 9.21 x D 3.86 x H 2.71 mm * Receiver Output Provides a Gated Output Pulse for the Received Input Signal * Fits Within Mobile Phone Connector Dimensions * Low Power Consumption and Built-in Shut-Down Mode (1 A MAX.) * Wide Range Operating Voltage - VCC = 2.4 V - 5.5 V * Wide Operating Temperature Range - -20C to +85C * Split Voltage Design - LED Voltage Separate from Operating Voltage * Internal Echo-Cancel Function - RX Data Output Disabled when the Transmit LED is Active * LED Disabled During Shutdown Mode * Solder Reflow Capability for Automated Production Process * GP2W0004YP is Electrically and Mechanically Compatible with IRMS5000, HSDL-3000, CHX1010, MiniSIR2-1 * Top View Version: GP2W0004XP IrDA Technical Information The SHARP GP2W0004YP infrared transceiver module contains a high speed, high efficiency, low power consumption AlGaAs LED, silicon PIN photodiode, and low power bipolar integrated circuit. The IC contains an LED driver circuit and a receiver, which provides the RX output. IrDA data rates of 2.4 kbit/s to 115.2 kbit/s are supported at both the 20 cm and one meter distances. Emitter current is approximately IF = 100 mA at the one meter range, and the IrDA low power option communication mode is IF = 27 mA. This dual mode communication capability provides wider application use in a final product, such as a wireless data link with PCs, PDAs, or any other IrDA compliant application already introduced to the marketplace. The GP2W0004YP transceiver module operates over a power supply range of 2.4 V to 5.5 V without any performance degradation. This provides a single part with a wide variety of design applications. The LED voltage is separate and may be provided from a second source, allowing the main power supply voltage to directly interface to the IC controller. The LED may be connected to the device battery or some other higher level source. The GP2W0004YP also includes an integral echocancel function that disables the RX Data Output when the Transmit LED is driven by TX data. The transceiver module has a built-in shutdown mode for those applications that are very conscious about current consumption. This reduces the current consumption of the receiver circuit to 1 A (MAX.) during shutdown mode. During shutdown, the transmitter output is disabled so that data on the input will not drive the LED when the IrDA transceiver is one of several devices on an I/O line. 1 GP2W0004YP/XP Infrared Transceiver PACKAGE FRONT The dimensional drawing is available in the specification, which is available from your Sharp Components representative. The specification will have the most upto-date information. PIN 1 Table 1. Pin Names PIN NO. DESCRIPTION SYMBOL 1 LED Anode 2 Transmitter Data Input TxD 3 Receiver Data Output RxD 4 Shut Down Circuit Input SD 5 Supply Voltage VCC 6 Ground GND PIN 6 REAR LEDA PIN 6 PIN 1 GP2W0004YP-6 Figure 1. Package Orientation ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage SYMBOL MIN. MAX. UNIT VDD 0 6.0 V LED Supply Voltage VLEDA 0 7.0 V Operating Temperature TOPR -10 +70 C Storage Temperature TSTG -20 +85 C Soldering Temperature* TSOL 240 C NOTE: *Solder reflow time is 5 seconds. RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL OPERATING CONDITIONS UNIT VDD 2.4 to 5.5 V LED Supply Voltage VLEDA VCC + 4.0 (MAX.) V Logic HIGH Transmitter Input Voltage (TXIN) VIHTXD 2/3 x VCC V Logic LOW Transmitter Input Voltage (TXIN) VILTXD 1/3 x VCC V BR 9.6 to 115.2 kbit/s Shutdown circuit HIGH level input voltage VIHSD VCC - 0.5 V Shutdown circuit LOW level input voltage VILSD 0 V Operating Temperature TOPR -25 to +85 C Supply Voltage Data Rate CONDITIONS VCC + 2.4 V to 5.5 V NOTES: 1. An in-band optical signal is a pulse/sequence where the peak wavelength, P, is defined as 850 nm P 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specifications. 2. See IrDA Serial Infrared Physical Layer Link Specification Appendix A for ambient light. 2 IrDA Technical Information Infrared Transceiver GP2W0004YP/XP ELECTRICAL AND OPTICAL SPECIFICATIONS tF Specifications hold over the Recommended Operating Conditions, unless otherwise noted. All typical values are at 25C. Figure 2 through Figure 5 show typical signals and test conditions. tR VOH 90% 50% 10% VOL T1 tW T2 GP2W0004YP-3 Figure 3. Output Waveform RADIATION INTENSITY OF TRANSMITTER 3.6 mW/sr (MIN.) RLEDA = 5.1 VCC = 5 V NOTES: At BR = 2.4 kbit/s: T1 = 416.7 s, T2 = 78.1 s At BR = 115.2 kbit/s: T1 = 8.68 s, T2 = 1.63 s GP2W0004YP-2 1.63 s Figure 2. Input Signal Waveform, Detector Side TX GP2W0004YP VIN TX = 5.0 V GP2W0004YP-5 Figure 4. Recommended Circuit, Emitter Side TRANSMITTER (NOTE 1) GP2W0004YP OSCILLOSCOPE L NOTE: 1. Transmitter uses GP2W0004YP (p = 870 nm TYP.) with the radiation intensity attenuated to 3.6 mW/sr. 2. Indicates horizontal and vertical directions. 3. Ee: Detector face illuminance < 10 x GP2W0004YP-4 Figure 5. Standard Optical System, Detector Side IrDA Technical Information 3 GP2W0004YP/XP Infrared Transceiver ELECTRICAL DESIGN APPLICATION TIPS Shutdown Mode Figure 6 shows the recommended application circuit and passive values for GP2W0004YP. The table in Figure 6 provides some approximate external passive values for design reference. See the specification for complete optical/electrical characteristic data. The `Shutdown' pin (Pin 4) is an active HIGH terminal and controls the power saving mode as shown in Table 2 and Figure 7. Application Circuit and External Passives The application circuit and external passives shown in Figure 6 enable GP2W0004YP to operate at both one meter and in 20 cm low power option communication mode at VCC = 3.0 V. Shutdown mode affects the power consumption of the Receiver circuits and inhibits the transmitter LED. The two circuits are internally connected. The transmitter circuit does not conduct current during the shutdown mode. After shutdown, the Receiver circuits require 40 ms to wakeup. Table 2. Shutdown Pin Functions 6 5 4 3 2 INPUT PERFORMANCE LOW Normal Mode HIGH Shutdown Mode Open Shutdown Mode 1 CX1 RLED VIH SD CX2 VIL (or OPEN) HIGH NORMAL RxD VCC SD LOW RxD TxD VLEDA 40 ms COMPONENTS RECOMMENDED VALUES CX1 47 F, 6.3 V or as appropriate CX2 1,500 pF, 25 V, or as needed GP2W0004YP-8 Figure 7. Shutdown-Receiver Wakeup Time 2.2 5%, 1/2 W,1 meter at VCC = 3.0 V RLED 33 1%, 1/8 W, 20 cm low power option at VCC = 3.0 V NOTE: All recommended values are for VCC = 3.0 V GP2W0004YP-7 Figure 6. Application Circuit 4 IrDA Technical Information Infrared Transceiver GP2W0004YP/XP Signal Waveform Example Figure 9 provides examples of each waveform when correctly operating the GP2W0004YP in a manner conforming to IrDA standards. Refer to the Basic System Block Diagram in Figure 8 for the positions that correspond to each waveform. Note that the IrDA bit stream is inverted in the encoder and decoder circuits, and the output pulse is sent during a `0' bit time. The waveform examples are applicable as a design and evaluation reference only, for understanding the GP2W0004YP hardware implementation, as well as for performing measurements. 1 T T 0 1 0 1 1 0 1 3/16T 2 3 4 3 2 4 ENCODER CIRCUIT 1 DECODER CIRCUIT 5 5 GP2W0004YP-9 0 NOTES: 1 Transmit data waveform 2 Encoder circuit output waveform 3 Transmitter output optical signal waveform Figure 8. Basic System Block Diagram 4 GP2W0004YP receiver output waveform 5 Receive data waveform MECHANICAL DESIGN TIPS Recommended Footprint T= Figure 10 shows the recommended footprint for PCB design when using the SHARP GP2W0004YP infrared transceiver module. All values in the figure are applicable as a design reference and are in mm. 1 Data Rate Data rate: 2.4 kbit/s, 9.6 kbit/s, 19.2 kbit/s, 38.4 kbit/s, 57.6 kbit/s, 115.2 kbit/s GP2W0004YP-10 Figure 9. Basic System Waveforms 1.1 6 - 2.6 1.1 6 - 0.9 P 1.55 P 1.55 x 5 = 7.75 NOTE: Dimensions are in mm. GP2W0004YP-11 Figure 10. Recommended Footprint IrDA Technical Information 5 GP2W0004YP/XP Infrared Transceiver Solder Paste Footprint 5.60 2.3 The solder paste footprint drawing for GP2W0004XP is shown in Figure 12. 0.775 1.825 0.80 The solder paste footprint drawing for GP2W0004YP is shown in Figure 11. Note that the shield contact for GP2W0004YP is applied through the Ground pin in position 6. The shield is soldered to the back of the transceiver at the ground pin, and a separate contact for a ground tab is not required. For complete mechanical dimensions, refer to the full specification. 1 0.85 2 3 4 5 6 0.775 2.325 LENS (PD/LED) SIDE NOTES: 1. Dimensions are in mm. 2. 6 5 4 3 2 1 3.875 Soldering paste area. GP2W0004YP-15 2.3 Figure 12. GP2W0004XP Solder Paste Footprint 0.85 0.775 P 1.55 x 5 = 75 NOTE: Viewed from the parts side of PCB. GP2W0004YP-1 Figure 11. GP2W0004YP Solder Paste Footprint 6 IrDA Technical Information Infrared Transceiver GP2W0004YP/XP Designing the IR Cosmetic Window W = 2 x L x tan 18 + w Figure 13 provides example calculations and design hints for IR cosmetic windows with viewing angles of 18 in both the vertical and horizontal axes. All values given here for the transceiver dimensions are only for design reference and are in mm. The optical window size should be the minimum size of W x H, rectangular or elliptical, in order to not reduce IrDA data transfer performance. The dimensions for W can be calculated by the formula: and the dimensions for H can be calculated by the formula: H = 2 x L x tan 18 + h in the case where the viewing angle is +18, which conforms to or exceeds the IrDA Serial Infrared Physical Layer Link Specification. Any values to be calculated with these formula must be given in mm. L 18 w (8.475) 18 18 L h (3.15) H 18 W NOTE: Dimensions are in mm. GP2W0004YP-12 Figure 13. IR Window Cosmetic Design IrDA Technical Information 7 GP2W0004YP/XP Infrared Transceiver Product Packaging The characteristic of any plastic used in a final product should be kept in mind and not attenuated at this wavelength. Many products that use infrared communication locate their reception component behind dark plastic. This often fits in with the overall design and coloring of the product and has an intentional design purpose as well. Figure 14 shows the basic characteristic of a highpass filter. The exact position of the slope and increasing response will depend on the material selected. The intent is to surprise visible light and neighboring wavelengths, and pass the desired 880 nm. The photodiode that is used in optical receivers is sensitive to a range of light wavelengths, not only the wavelength intended for reception. Visible light has many component factors and sources in a room. The dark plastic used in product faceplates can be formulated to act as a highpass filter, reducing the amount of visible light and other wavelengths landing on the photodiode and raising the internal noise currents. Plastic filters are available on the market, and vendors carry plastic materials that may be cut, bent, or molded. The key to selecting a plastics vendor is to ask about the wavelength characteristics of the materials. The more the vendor knows, the more likely the vendor will be able to help you in a knowledgeable manner when working on both the industrial design and wavelength pass characteristics of your IR window. If the vendor does not know what you are talking about, you need to find a knowledgeable source for filter materials. The reduction of unwanted wavelengths provides for a quieter and more sensitive receiver. The wavelength used for IrDA data communication is 880 nm. 100 90 70 60 500 RED 400 ORANGE 300 YELLOW 20 GREEN 30 BLUE-GREEN 40 VIOLET 50 ULTRAVIOLET RESPONSE % TRANSMISSION 80 10 0 600 700 800 900 1,000 1,100 WAVELENGTH, nm GP2W0004YP-13 Figure 14. Highpass Filter Characteristics 8 IrDA Technical Information Infrared Transceiver GP2W0004YP/XP Soldering Reflow Profile Figure 15 is a straight-line representation of the recommended temperature profile for the IR solder reflow process. The temperature profile is divided into four process sections with three temperature/time change rates. The temperature/time details are described in Table 3. In process section 1, the PCB and SMD GP2W0004YP molded pinout joints are heated to a temperature of 165C to activate the flux in the solder paste. The temperature ramp-up rate R1 should be within the range of 1C to 5C per second. Package temperature must be kept within the temperature range specified in order to avoid localized temperature rise in the resin. In process section 2, sufficient time to dry the solder paste should be provided, a maximum of 120 seconds is recommended for optimum results. A stable temperature is recommended with little temperature increase, preferably staying at the level of 165C. Process section 3 is solder reflow. The temperature should be raised to 240C for 10 seconds, at the rate of 1C to 4C per second (R2) for the desired result. The dwell time above 200C must not exceed 60 seconds. Beyond 60 seconds, weak and unreliable connections will result. Process section 4 is cooling. After solder reflow, the temperature should then be reduced at the rate of -1C to -4C per second (R3). Please note that deformation of the PCB can also affect the pins of the package, which may break the gold wire used in the transceiver module. Full confirmation of the soldering reflow machine condition is highly recommended for optimal results. Hand soldering should be conducted with a soldering iron of less than 25 W, at less than 300C. Soldering time is less than 5 seconds per contact, with a second or two between soldering each contact. The device being soldered by hand should be at room temperature. Use 60/40 or 63/37 solder, or Ag solder if it is available. Table 3. Process Section Information PROCESS SECTION TEMPERATURE SYMBOL TERMPERATURE/TIME MAX. 1. Heat Up ~165C R1 1C - 5C/sec. MAX. 2. Solder Paste Dry 165C 165C - 240C R2 1C - 5C/sec. MAX. ~200C R3 -1C - 4C/sec. MAX. 3. Solder Reflow 4. Cooling IrDA Technical Information 9 GP2W0004YP/XP Infrared Transceiver 240C MAX. TEMPERATURE C 200C R2 165C MAX. 150C R3 100C R1 50C 25C 10 sec. MAX. 60 sec. MAX. 120 sec. MAX. 90 sec. MAX. TIME NOTE: 1. Heat Up 2. Solder Paste Dry 3. Solder Reflow 4. Cooling 1 2 3 4 PROCESS SECTIONS GP2W0004YP-16 Figure 15. IR Solder Reflow Temperature Profile 10 IrDA Technical Information Infrared Transceiver GP2W0004YP/XP Evaluation Board The circuit diagram in Figure 16 is the recommended evaluation circuit for the GP2W0004YP. This circuit is provided on an evaluation board for test and evaluation purposes. Samples are available through your Sharp support office, Sales Representative, or Distributor. The resistor value for RL is selected based on the supply voltage. The 5.1 value is selected for VLEDA between 3.6 V and 4.5 V, and has been loaded on the test boards as a nominal value. Adjust it for your operating conditions per Table 4. The capacitor values shown on the board are nominal for this test application. The final values are dependent on the amount and frequency of noise in the final system. Capacitor values need to be properly tailored for the end application. This test and evaluation board is not intended for production applications and should be used for test and evaluation purposes only. Table 4. RL Value The forward current through the LED is adjusted by the resistor value and directly controls the operating range of the LED. J1 GND SD 1 3 5 7 9 + + + + + + + + + + 2x5 RESISTOR VALUE LED SUPPLY VOLTAGE (VLEDA) RANGE 1.0 at 0.5 Watt 2.4 VLEDA 3.3 V 3.0 at 0.5 Watt 3.0 VLEDA 3.6 V 5.1 at 0.5 Watt 3.6 VLEDA 4.5 V 7.5 at 0.5 Watt 4.5 VLEDA 5.5 V RL 5.1 , 1/2 W 2 VCC 4 TXD 6 RXD 8 10 CX1 22 F CX2 0.1 F 1 2 3 4 5 6 LEDA TXD RXD SD VCC GND GP2W0004YP GP2W0004YP-14 Figure 16. GP2W0004YP Recommended Evaluation Circuit IrDA Technical Information 11 GP2W0004YP/XP Infrared Transceiver PACKING INFORMATION Table 5. Packing Materials This section describes the GP2W0004YP moistureproof packing and is only for reference. The same section of the official specifications should be consulted for detailed packing information. ITEM MATERIAL Aluminum Laminate Bag Aluminum Polyethylene Label Paper Desiccant Packing Specifications PACKING MATERIAL The GP2W0004YP reel is moisture-proof packed for shipment. Table 5 describes the materials used for each item of the moisture-proof packing. Outer Case Paper Pads Paper TAPE AND REEL Figures 17 through 19 show the reel dimensions and product orientation in the reel. GP2W0004YP is the side view device, and GP2W0004XP is the top view device. Note that the device orientation in the reel is not the same for both devices. 21 0.8 13 0.2 22.5 MAX. 100 0.1 2 0.5 330 2 17.5 0.5 NOTE: Dimensions are in mm. GP2W0004YP-17 Figure 17. Reel Structure and Dimensions 12 IrDA Technical Information Infrared Transceiver GP2W0004YP/XP PULL-OUT DIRECTION LENS SIDE LABEL GP2W0004YP-18 Figure 18. Direction of Product Insertion (GP2W0004YP) PULL-OUT DIRECTION LABEL GP2W0004YP-19 Figure 19. Direction of Product Insertion (GP2W0004XP) ORDERING INFORMATION Table 6 shows the correct ordering information for the device in both the top view and side view orientation. Table 6. Ordering Information MODEL NUMBER ORIENTATION GP2W0004YP Side View Tape and Reel GP2W0004XP Top View Tape and Reel IrDA Technical Information PACKAGING 13 GP2W0004YP/XP Infrared Transceiver Packing Method (72 hours). Table 7 provides information on how each tape reel is packaged. Each aluminum laminate bag contains one reel (2,000 devices per reel) and desiccant. Four reels in their bags are packed per carton (4 reels/carton; 8,000 transceivers per carton). If long-term storage is needed, devices should either be stored in a dry box or re-sealed in a moisture-proof bag with desiccant and stored in an environment where the temperature is 10C to 30C at the humidity condition of below 60% RH. Devices must be mounted within two weeks. The outer carton will then be sealed with craft tape, with indication of model name, quantity, and outgoing inspection date on the case. Storage Conditions The product should be stored with these conditions: * Storage temperature: 10C to 30C Baking Before Mounting In the event that the devices are not maintained in the storage conditions described, or the enclosed desiccant indicator has turned pink in color, baking must be done before devices are to be mounted. Also note that devices should only be baked once. * Humidity: below 60% RH CAUTION CAUTION These devices are hydroscopic, in that the plastic resin will absorb moisture. If the resin absorbs too much moisture, it will undergo rapid mechanical expansion when passed through the IR reflow process. This can cause device failures. The resin material from all device vendors has this characteristic. Baking should be done with the devices removed from the reel, as the reel will melt. To complete the baking properly, devices should either be temporarily mounted to a PCB with adhesive or placed in a metal tray. Any device that has been out of dry pack for more than 72 hours should be dried in some manner prior to any surface mount reflow process. Otherwise these devices should be mounted and soldered by hand. Recommended temperature: 100C, 12 to 24 hours. Treatment After Opening After unsealing, devices should be mounted within the temperature condition of 10C to 30C, at the humidity condition below 60% RH, within 3 days Table 7. Packing Methods 14 PACKING SHAPE PRODUCT QUANTITY PER REEL QUANTITY PER BAG QUANTITY PER CARTON Tape reel ( 300 mm) 1 model 2,000 pieces per reel 1 reel per laminated bag 4 reels per carton IrDA Technical Information GP2W0004YP/XP Infrared Transceiver SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE. Suggested applications (if any) are for standard use; See Important Restrictions for limitations on special applications. See Limited Warranty for SHARP's product warranty. The Limited Warranty is in lieu, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY EXCLUDED. In no event will SHARP be liable, or in any way responsible, for any incidental or consequential economic or property damage. NORTH AMERICA EUROPE JAPAN SHARP Microelectronics of the Americas 5700 NW Pacific Rim Blvd. Camas, WA 98607, U.S.A. Phone: (1) 360-834-2500 Fax: (1) 360-834-8903 www.sharpsma.com SHARP Microelectronics Europe Division of Sharp Electronics (Europe) GmbH Sonninstrasse 3 20097 Hamburg, Germany Phone: (49) 40-2376-2286 Fax: (49) 40-2376-2232 www.sharpsme.com SHARP Corporation Electronic Components & Devices 22-22 Nagaike-cho, Abeno-Ku Osaka 545-8522, Japan Phone: (81) 6-6621-1221 Fax: (81) 6117-725300/6117-725301 www.sharp-world.com TAIWAN SINGAPORE KOREA SHARP Electronic Components (Taiwan) Corporation 8F-A, No. 16, Sec. 4, Nanking E. Rd. Taipei, Taiwan, Republic of China Phone: (886) 2-2577-7341 Fax: (886) 2-2577-7326/2-2577-7328 SHARP Electronics (Singapore) PTE., Ltd. 438A, Alexandra Road, #05-01/02 Alexandra Technopark, Singapore 119967 Phone: (65) 271-3566 Fax: (65) 271-3855 SHARP Electronic Components (Korea) Corporation RM 501 Geosung B/D, 541 Dohwa-dong, Mapo-ku Seoul 121-701, Korea Phone: (82) 2-711-5813 ~ 8 Fax: (82) 2-711-5819 CHINA HONG KONG SHARP Microelectronics of China (Shanghai) Co., Ltd. 28 Xin Jin Qiao Road King Tower 16F Pudong Shanghai, 201206 P.R. China Phone: (86) 21-5854-7710/21-5834-6056 Fax: (86) 21-5854-4340/21-5834-6057 Head Office: No. 360, Bashen Road, Xin Development Bldg. 22 Waigaoqiao Free Trade Zone Shanghai 200131 P.R. China Email: smc@china.global.sharp.co.jp SHARP-ROXY (Hong Kong) Ltd. 3rd Business Division, 17/F, Admiralty Centre, Tower 1 18 Harcourt Road, Hong Kong Phone: (852) 28229311 Fax: (852) 28660779 www.sharp.com.hk Shenzhen Representative Office: Room 13B1, Tower C, Electronics Science & Technology Building Shen Nan Zhong Road Shenzhen, P.R. China Phone: (86) 755-3273731 Fax: (86) 755-3273735 (c)2002 by SHARP Corporation Reference Code SMA02025