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INTEGRATED CIRCUITS DIVISION

www.ixysic.com

DS-CPC1117N-R08 1

CPC1117N

Single-Pole, Normally Closed

4-Lead SOP OptoMOS® Relay

Part # Description

CPC1117N 4-Lead SOP (100/tube)

CPC1117NTR 4-Lead SOP (2000/reel)

Parameter Rating Units

Blocking Voltage 60 VP

Load Current 150 mArms / mADC

On-Resistance (max) 16 

LED Current to Operate 1 mA

Applications

Features

Description

Ordering Information

• Security

• Passive Infrared Detectors (PIR)

• Data Signalling

• Sensor Circuitry

• Instrumentation

• Multiplexers

• Data Acquisition

• Electronic Switching

• I/O Subsystems

• Meters (Watt-Hour, Water, Gas)

• Medical Equipment—Patient/Equipment Isolation

• Aerospace

• Industrial Controls

• Designed for use in security systems complying

with EN50130-4

• Only 1mA of LED current required to operate

• 1500Vrms Input/Output Isolation

• Small 4-Lead SOP Package

• TTL/CMOS Compatible input

• No Moving Parts

• High Reliability

• Arc-Free With No Snubbing Circuits

• No EMI/RFI Generation

• Immune to radiated EM fields

• SMD Pick & Place, Wave Solderable

• Tape & Reel Version Available

The CPC1117N is a miniature single-pole, normally

closed (1-Form-B) solid state relay in a 4-lead SOP

package that employs optically coupled MOSFET

technology to provide 1500Vrms of input/output

isolation. The efficient MOSFET switches and

photovoltaic die use IXYS Integrated Circuits Division’s

patented OptoMOS architecture. The optically coupled

output is controlled by the input's highly efficient

GaAlAs infrared LED.

IXYS Integrated Circuits Division’s state of the art

double-molded vertical construction packaging makes

the CPC1117N one of the world’s smallest relays. It

offers board space savings of at least 20% over the

competitor’s larger 4-lead SOP relay.

Approvals

• UL Recognized Component: File E76270

• CSA Certified Component: Certificate 1175739

• EN/IEC 60950-1 Certified Component:

TUV Certificate B 10 05 49410 006

Form-B

10%

90%

ILOAD

ton

toff

Pin Configuration

Switching Characteristics

of Normally Closed Devices

+ Control

– Control

Load

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2R08

CPC1117N

Absolute Maximum Ratings are stress ratings. Stresses in

excess of these ratings can cause permanent damage to

the device. Functional operation of the device at conditions

beyond those indicated in the operational sections of this

data sheet is not implied.

Absolute Maximum Ratings @ 25ºC

Parameter Ratings Units

Blocking Voltage 60 VP

Reverse Input Voltage 5 V

Input Control Current 50 mA

Peak (10ms) 1 A

Input Power Disipation 70 mW

Total Power Dissipation 1400 mW

Isolation Voltage, Input to Output 1500 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

1 Derate linearly 3.33 mW / ºC

Parameter Conditions Symbol Min Typ Max Units

Output Characteristics

Load Current

Continuous 1IF=0mA IL- - 150 mArms / mADC

Peak t=10ms ILPK - - ±350 mAP

On-Resistance 2IF=0mA, IL=120mA RON -516 

Off-State Leakage Current IF=1mA, VL=60VPILEAK --1 µA

Switching Speeds

Turn-On IF=2mA, VL=10V ton - 0.316 10 ms

Turn-Off toff - 1.55 10

Output Capacitance IF=1mA, VL=50V, f=1MHz COUT -10- pF

Input Characteristics

Input Control Current to Activate (Output Open) 3-I

F- 0.16 1 mA

Input Control Current to Deactivate (Output Closed) IL=120mA IF0.1 0.14 - mA

Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V

Reverse Input Current VR=5V IR- - 10 µA

Common Characteristics

Capacitance Input to Output - - - 1 - pF

1 Load current derates linearly from 150mA @ 25oC to 100mA @85oC.

2 Measurement taken within 1 second of on-time.

3 For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended.

Electrical Characteristics @ 25ºC

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CPC1117N

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R08

PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁ cations, please

contact our application department.

1.17 1.19 1.21 1.23 1.25

LED Forward Voltage Drop (V)

Device Count (N)

Typical LED Forward Voltage Drop

(N=50, IF=5mA, TA=25ºC)

Turn-On Time (ms)

0.28 0.30 0.32 0.34 0.36 0.38

Device Count (N)

Typical Turn-On Time

(N=50, IF=2mA, IL=100mA, TA=25ºC)

Turn-Off Time (ms)

1.15 1.30 1.45 1.60 1.75 1.90 2.05

Device Count (N)

Typical Turn-Off Time

(N=50, IF=2mA, IL=100mA, TA=25ºC)

LED Current (mA)

0.11 0.13 0.15 0.17 0.19 0.21 0.23

Device Count (N)

Typical IF for Switch Operation

(N=50, IL=150mA, TA=25ºC)

5.0 5.2 5.4 5.65.1 5.3 5.5

Device Count (N)

Typical On-Resistance Distribution

(N=50, IL=150mA, TA=25ºC)

On-Resistance (:)

85 95 105 11590 100 110

Blocking Voltage (VP)

Device Count (N)

Typical Blocking Voltage Distribution

(N=50, IF=1mA, TA=25ºC)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Forward Voltage (V)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

Typical LED Forward Voltage Drop

vs. Temperature

IF=5mA

IF=2mA

IF=1mA

IF=50mA

IF=20mA

IF=10mA

LED Current (mA)

0 1020304050

Turn-On Time (ms)

0.25

0.26

0.27

0.28

0.29

0.30

0.31

0.32

0.33

0.34

0.35

Typical Turn-On Time

vs. LED Forward Current

(IL=100mA, TA=25ºC)

LED Current (mA)

0 1020304050

Turn-Off Time (ms)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Typical Turn-Off Time

vs. LED Forward Current

(IL=100mA, TA=25ºC)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

LED Current (mA)

0.10

0.15

0.20

0.25

0.30

Typical IF for Switch Operation

vs. Temperature

(IL=100mA)

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-On Time (ms)

0.20

0.25

0.30

0.35

0.40

0.45

Typical Turn-On Time

vs. Temperature

(IL=100mA)

IF=10mA

IF=5mA

IF=2mA

IF=1mA

Temperature (ºC)

-40 -20 0 20 40 60 80 100

Turn-Off Time (ms)

Typical Turn-Off Time

vs. Temperature

(IL=100mA)

IF=1mA

IF=2mA

IF=5mA

IF=10mA

INTEGRATED CIRCUITS DIVISION

www.ixysic.com

4R08

CPC1117N

PERFORMANCE DATA*

*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written speciﬁ cations, please

contact our application department.

-40

-20 0 20 40 60 80 100

Typical On-Resistance vs. Temperature

(IF=0mA, IL=150mA)

Temperature (ºC)

On-Resistance (:)

Load Voltage (V)

Load Current (mA)

150

100

-50

-100

-150

-1.00 -0.66 -0.33 0 0.33 0.66 1.00

Typical Load Current vs. Load Voltage

(TA=25ºC)

225

200

175

150

125

100

Temperature (ºC)

Load Current (mA)

-40 -20 0 20 40 60 80 120100

Maximum Load Current

vs. Temperature

(IF=0mA)

Blocking Voltage (VP)

-40

125

120

115

110

105

100

-20 0 20 40 60 80 100

Temperature (ºC)

Typical Blocking Voltage

vs. Temperature

(IF=2mA)

Leakage (µA)

-40

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

-20 0 20 40 60 80 100

Temperature (ºC)

Typical Leakage vs. Temperature

Measured Across Pins 3&4

(IF=2mA, VL=60V)

Load Voltage(V)

0 102030405060

Output Capacitance (pF)

Output Capacitance vs. Load Voltage

(IF=1mA, f=1MHz, TA=25ºC)

Time

Load Current (A)

10μs

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

1ms100μs 100ms 1s

10ms 10s 100s

Energy Rating Curve

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CPC1117N

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Manufacturing Information

Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to

the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product

evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according

to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

Device Moisture Sensitivity Level (MSL) Rating

CPC1117N MSL 3

ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020

must be observed.

Device Maximum Temperature x Time

CPC1117N 260ºC for 30 seconds

Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to

remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as

an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary

if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.

Cleaning methods that employ ultrasonic energy should not be used.

INTEGRATED CIRCUITS DIVISION

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1117N-R08

OptoMOS® is a registered trademark of IXYS Integrated Circuits Division

12/14/2012

For additional information please visit our website at: www.ixysic.com

CPC1117N

Mechanical Dimensions

CPC1117N

CPC1117NTR Tape & Reel

Recommended PCB Land Pattern

2.54

(0.10)

5.60

(0.2205)

1.30

(0.0512)

0.60

(0.0217)

Dimensions

(inches)

Pin 1

4.089 ± 0.203

(0.161 ± 0.008)

2.54 Typ

(0.100 Typ)

6.096 ± 0.102

(0.240 ± 0.004)

3.810 ± 0.076

(0.150 ± 0.003) 0.432 ± 0.127

(0.017 ± 0.005)

0.200 ± 0.025

(0.008 ± 0.001)

1.02 ± 0.025

(0.040 ± 0.001)

2.184 Max

(0.086 Max)

0.381 TYP.

(0.015 TYP.)

Lead to package standoff:

0.0637 ± 0.0383

(0.0025 ± 0.0015)

0.762 ± 0.102

(0.030 ± 0.004)

Dimensions

(inches)

NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted

Embossment

Embossed

Carrier

330.2 Dia

(13.00 Dia)

Top Cover

Tape Thickness

0.102 Max

(0.004 Max)

ser Direction of Feed

User Direction of Feed

K0=2.70

(0.106)

K1=2.30

(0.091)

B0=4.70

(0.185)

W=12.00

(0.472)

P=8.00

(0.315)

A0=6.50

(0.256)