1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cps@coilcraft.com
www.coilcraft-cps.com
®
© Coilcraft, Inc. 2011
Specifications subject to change without notice.
Please check our website for latest information.
Outgassing Compliant Chip Inductors AS235RAA
0402 CHIP INDUCTORS
Document AS198-1 Revised 02/25/11
AB CD
max max max ref E F G H IJ
0.047 0.025 0.026 0.010 0.020 0.009 0.022 0.026 0.014 0.018
1,19 0,64 0,66 0,25 0,51 0,23 0,56 0,66 0,36 0,46
A
B
overall
C
D
J
F
F
G
H
E
terminal
Terminal wraparound:
approx 0.007/0,18 both ends
I
I
Suggested
Land Pattern
Core material Ceramic
Terminations Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature –55°C to +125°C with Imax current, +125°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 2000 per 7″ reel
Paper tape: 8 mm wide, 0.68 mm thick, 2 mm pocket spacing
-40-55 -20 0 20 40 60 80 100 160140120
Ambient temperature (°C)
Percent of rated rmsI
120
110
100
90
80
70
60
50
40
30
20
10
0
25°C
Current Derating
Typical Q vs Frequency
0
60
50
40
30
20
10
70
80
90
100
110
120
Q Factor
1 10 100 1000 10000
Frequency (MHz)
12 nH
19 nH
5.6 nH
27 nH
1 nH
56 nH
Typical L vs Frequency
0
10
20
30
40
50
60
1 10 100 1000 10000
Frequency (MHz)
Inductance (nH)
27 nH
56 nH
19 nH
12 nH
5.6 nH
1 nH
■Exceptionally high Q factors
■Outstanding self-resonant frequency
■Tight inductance tolerance
■High temperature materials allow operation in ambient
temperatures up to 155°C.
■Passes NASA low outgassing specifications
■Leach-resistant base metalization with tin-lead (Sn-Pb)
terminations ensures the best possible board adhesion
Note: Dimensions are before solder application. For maximum overall
dimensions including solder, add 0.0025 in / 0,064 mm to B and
0.006 in / 0,15 mm to A and C.
1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cps@coilcraft.com
www.coilcraft-cps.com
®
© Coilcraft, Inc. 2011
Specifications subject to change without notice.
Please check our website for latest information.
AS235RAA Series (0402)
Document AS198-2 Revised 02/25/11
0402 CHIP INDUCTORS
1. When ordering, please specify tolerance and testing codes:
AS235RAAR10GSZ
Tolerance: G =2% J = 5%
Testing: Z = COTS
H= Screening per Coilcraft CP-SA-10001
N= Screening per Coilcraft CP-SA-10003
C= Custom screening (please specify when ordering)
2. Inductance measured at 250 MHz using a Coilcraft SMD-F test fixture
and Coilcraft-provided correlation pieces with an Agilent/HP 4286
impedance analyzer or equivalent.
Inductance2Percent 900 MHz 1.7 GHz SRF min5DCR max6Imax
Part number1(nH) tolerance Q min3L typ Q typ4L typ Q typ4(GHz) (Ohms) (mA)
AS235RAA1N0JSZ 1.0 5 20 1.02 77 1.02 69 >5.00 0.045 1360
AS235RAA1N2JSZ 1.2 5 12 1.17 28 1.17 38 >5.00 0.090 740
AS235RAA1N8JSZ 1.8 5 20 1.78 54 1.78 75 >5.00 0.070 1040
AS235RAA1N9JSZ 1.9 5 20 1.72 68 1.74 82 >5.00 0.070 1040
AS235RAA2N0_SZ 2.0 5,2 20 1.93 54 1.93 75 >5.00 0.070 1040
AS235RAA2N2_SZ 2.2 5,2 20 2.19 59 2.23 100 >5.00 0.070 960
AS235RAA2N4_SZ 2.4 5,2 20 2.24 51 2.27 68 >5.00 0.068 790
AS235RAA2N7_SZ 2.7 5,2 16 2.58 42 2.60 61 >5.00 0.120 640
AS235RAA3N3_SZ 3.3 5,2 20 3.10 65 3.12 87 >5.00 0.066 840
AS235RAA3N6_SZ 3.6 5,2 20 3.56 45 3.62 71 >5.00 0.066 840
AS235RAA3N9_SZ 3.9 5,2 20 3.89 50 4.00 75 >5.00 0.066 840
AS235RAA4N3_SZ 4.3 5,2 20 4.19 47 4.30 71 >5.00 0.091 700
AS235RAA4N7_SZ 4.7 5,2 20 4.55 48 4.68 68 4.77 0.130 640
AS235RAA5N1_SZ 5.1 5,2 20 5.15 56 5.25 82 4.80 0.083 800
AS235RAA5N6_SZ 5.6 5,2 20 5.16 54 5.28 81 4.80 0.083 760
AS235RAA6N2_SZ 6.2 5,2 20 6.16 52 6.37 76 4.80 0.083 760
AS235RAA6N8_SZ 6.8 5,2 20 6.56 63 6.93 78 4.80 0.083 680
AS235RAA7N5_SZ 7.5 5,2 22 7.91 60 8.22 88 4.80 0.104 680
AS235RAA8N2_SZ 8.2 5,2 22 8.50 57 8.85 84 4.40 0.104 680
AS235RAA8N7_SZ 8.7 5,2 20 8.78 54 9.21 73 3.80 0.195 480
AS235RAA9N0_SZ 9.0 5,2 22 9.07 62 9.53 78 4.66 0.100 680
AS235RAA9N5_SZ 9.5 5,2 20 9.42 54 9.98 69 3.48 0.195 480
AS235RAA10N_SZ 10.0 5,2 21 9.8 50 10.10 67 3.68 0.195 480
AS235RAA11N_SZ 11.0 5,2 24 10.7 52 11.20 78 3.48 0.120 640
AS235RAA12N_SZ 12.0 5,2 24 11.9 53 12.70 71 3.60 0.120 640
AS235RAA13N_SZ 13.0 5,2 20 13.4 51 14.63 57 3.28 0.210 440
AS235RAA15N_SZ 15.0 5,2 22 14.6 55 15.50 77 3.10 0.172 560
AS235RAA16N_SZ 16.0 5,2 23 16.6 46 18.86 47 3.05 0.220 560
AS235RAA18N_SZ 18.0 5,2 24 18.3 57 20.28 62 2.68 0.230 420
AS235RAA19N_SZ 19.0 5,2 24 19.1 50 21.10 67 3.00 0.202 480
AS235RAA20N_SZ 20.0 5,2 24 20.7 52 23.66 53 2.90 0.250 420
AS235RAA22N_SZ 22.0 5,2 24 23.2 53 26.75 53 2.80 0.300 400
AS235RAA23N_SZ 23.0 5,2 24 23.8 49 26.90 64 2.72 0.300 400
AS235RAA24N_SZ 24.0 5,2 24 25.1 51 29.50 50 2.60 0.300 400
AS235RAA27N_SZ 27.0 5,2 24 28.7 49 33.50 63 2.48 0.298 400
AS235RAA30N_SZ 30.0 5,2 24 31.1 46 38.50 39 2.35 0.410 400
AS235RAA33N_SZ 33.0 5,2 20 34.9 31 41.74 32 2.30 0.300 400
AS235RAA36N_SZ 36.0 5,2 24 39.5 44 48.40 53 2.20 0.440 320
AS235RAA39N_SZ 39.0 5,2 24 41.7 47 50.23 45 2.10 0.550 200
AS235RAA40N_SZ 40.0 5,2 24 39.0 44 47.40 33 2.24 0.440 320
AS235RAA43N_SZ 43.0 5,2 22 45.8 46 61.55 34 2.03 0.810 100
AS235RAA47N_SZ 47.0 5,2 20 50.0 38 – – 2.10 0.830 150
AS235RAA51N_SZ 51.0 5,2 19 56.6 40 – – 1.75 0.820 100
AS235RAA56N_SZ 56.0 5,2 22 62.8 42 – – 1.76 0.966 100
AS235RAA68N_SZ 68.0 5,2 22 78.2 36 – – 1.62 1.120 100
AS235RAA82N_SZ 82.0 5,2 25 – – – – 1.26 1.550 100
AS235RAAR10_SZ 100 5,2 25 – – – – 1.16 2.000 50
AS235RAAR12_SZ 120 5,2 22 – – – – 1.20 2.200 50
3. Q measured at 250 MHz using an Agilent/HP 4291A with an Agilent/
HP 16193 test fixture or equivalents.
4. Q measured using an Agilent/HP 4291A with an Agilent/HP 16197A test
fixture.
5. SRF measured using an Agilent/HP 8753ES network analyzer and a
Coilcraft SMD-D test fixture.
6. DCR measured on a micro-ohmmeter.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
