DESCRIPTION
Document No. 480 7244-001.B00 04/21/15 Page 1
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX424C15FBK4/32
32GB (8GB 1G x 64-Bit x 4 pcs.)
DDR4-2400 CL15 288-Pin DIMM
Continued >>
kingston.com/hyperx
FEATURES
HyperX HX424C15FBK4/32 is a kit of four 1G x 64-bit (8GB)
DDR4-2400 CL15 SDRAM (Synchronous DRAM) 2Rx8, memory
module, based on sixteen 512M x 8-bit FBGA components per
module. Each module kit supports Intel® Extreme Memory
Profiles (Intel® XMP) 2.0. Total kit capacity is 32GB. Each
module has been tested to run at DDR4-2400 at a low latency timing
of 15-15-15 at 1.2V. Additional timing parameters are shown in
the Plug-N-Play (PnP) Timing Parameters section below.
The JEDEC standard electrical and mechanical specifications
are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command T ime (tRFCmin)
Row Active T ime (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.75ns(min.)
260ns(min.)
29.125ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
JEDEC/XMP TIMING PARAMETERS
• JEDEC/PnP: DDR4-2400 CL15-15-15 @1.2V
DDR4-2133 CL14-14-14 @1.2V
•XMP Profile #1: DDR4-2400 CL15-15-15 @1.2V
• Power Supply: VDD = 1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD = 2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 1.340” (34.04mm), w/o heatsink
Note: The PnP feature offers a range of speed and timing options to support
the widest variety of processors and chipsets. Your maximum speed will
be determined by your BIOS.
Document No. 4807244-001.B00 Page 2
continued HyperX
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
kingston.com/hyperx
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the
published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than
the published speed. Overclocking or modifying your system timing may result in damage to computer components.
MODULE DIMENSIONS
3.35
Detail E
2.10
±
0.15
64.60
56.10
2.70
±
0.15
31.25
17.60
133.35
129.55
Detail A
14.60
3.00
28.90
Pin 35 Pin 47
Pin 1
22.95
Pin 105 Pin 117
Detail B Detail D Detail C
8.00
11.00
MODULE WITH HEAT SPREADER
7.08 mm
133.35 mm
34.04 mm
