True BGA SocketTM Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com PATENTED How It Works Step 1 * Solder True BGA SocketTM to PCB BGA Device Polyimide Wafer Compression Stroke (Step 4) Step 2 * Align and place BGA device on top of True BGA Socket mating contacts. Place Chip Support Plate over BGA device. Support Plate Not Shown True BGA SocketTM Features * No soldering of BGA device required. * AIC exclusive eutectic solder ball terminals offer superior processing. * Uses same footprint as BGA device. * Designed for production, development, programming and test applications. Type -690 Type -708 Surface Mount Thru-Hole .030 Dia. (0.76) Specifications .018 Dia. (0.46) Terminals for LGA or De-balled BGA Device Applications Type -712 Type -659 .125 (3.18) .018 Dia. (0.46) .125 (3.18) How To Order Type -709 .016 Dia. (0.41) X .030 Dia. (0.76) 1.0mm Pitch Terminals Type -752 Type -754 Surface Mount Thru-Hole .183 (4.65) .030 Dia. (0.76) .193 (4.90) for Test, Development and Production Applications .162 (4.11) .162 (4.11) .183 (4.65) .018 Dia. (0.46) Type -713 .193 (4.90) .125 (3.18) .183 (4.65) Terminals: Brass; Copper Alloy (C36000) Insulator Material: Molded PPS (High Temp. Glass Filled Thermoplastic), U.L. Rated 94V-O, -60C to 260C (-76F to 500F) Solder Ball: Eutectic, 63Sn/37Pb,183C (361F) P.C.B. Terminals for BGA Device Test Applications (Consult Factory for Availability) Type -657 (Heat Sink/Coin Screw, Clamp, Support Plate) ADVANCED(R) .183 (4.65) .183 (4.65) * New Short Slide Clamp reduces required installation space on PCB. Clamp Assembly: Aluminum BGA Standard Terminals for Test, Development and Production Applications * Currently available in 1.0 and 1.27mm pitch. Spring Material: Beryllium Copper Coin Screw or Finned Heat Sink Heat Sink Clamp 1.27mm Pitch Terminal Options * Available with integral, finned heat sink or coin screw clamp assembly. Plating: G - Gold over Nickel P.C.B. Step 4 * Tighten Coin Screw or Finned Heat Sink to engage compression stroke. TSG = Device Pkg. Size + 0.216/(5.5mm) TSH = Device Pkg. Size + 0.374/(9.5mm) Contacts: Beryllium Copper (C17200) Solder Ball Reflowed ADVANCED(R) Step 3 * Slide Clamp over assembly. Allow space on PCB for sliding clamp [approximately 33% of device package size on one side only with new Short Slide Clamp]. Refer to Clamp Sliding Directions for pin 1 location (see page 4). * Compact design maximizes PCB real estate: Terminal Support: Polyimide Film Support Plate Guide Box .125 (3.18) .125 (3.18) .024/(0.61) Dia. .011 Dia. (0.28) TS G XXXX - 690 G G XX Footprint Dash # If Applicable* Clamp Options YH - Heat Sink (3 Fins Std.) YC - Coin Screw True BGA SocketTM Pitch G = .050/(1.27mm) pitch H = .039/(1.0mm) pitch Contact Plating G - Gold Number of Positions *See BGA Footprint Booklet or web site Terminal Type See options above Terminal Plating G - Gold Mechanical specifications for BGA device package required for quoting/ordering. REV. 8/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm). 5 Pop-Top(R) BGA Socket Adapter System 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com How It Works Step 1 * Solder BGA Socket to PCB. Finned Heat Sink (3 Fins Std. Consult Factory for Options) Step 2 * Solder BGA device to Adapter. Step 3 * Align and insert device/ Adapter assembly into BGA Socket. Pop-Top(R) System Features * Designed for large I/O BGA devices. * Patented limited-stroke terminal design allows ultra low insertion and extraction. * AIC patented eutectic solder ball terminals offer superior processing. * Compact design maximizes PCB real estate - only 0.139/(3.52mm) nominal wider than BGA device body size on clip side. Step 4 * Slide Retention Clamp over entire assembly. BGA Solder Joint Adapter Socket Solder Ball .050 (1.27) * Turn Coin Screw (CS) or Finned Heat Sink (HS) to engage Adapter into Socket and lock down NEW Short Slide Clamp For High Density PC Boards (Also Standard On True BGA SocketTM) Retention Clamp Sliding Direction For Pop-Top(R) and True BGA SocketTM * Reduces required installation space (clearance for sliding clamp) by 50 to 75% * Uses same footprint as BGA device. ADVANCED (R) * Currently available in .050/(1.27mm) pitch. ADVANCED(R) Retention Clamp slides to mechanical stop on socket. * Available with integral, finned heat sink or coin screw. Specifications Terminals: Brass; Copper Alloy (C36000), ASTM-B-16 Contacts: Beryllium Copper; Copper Alloy (C17200), ASTM-B-194 Plating: G - Gold over Nickel Body Material: Molded PPS (High Temp. Glass Filled Thermoplastic), U.L. Rated 94V-O, -60C to 260C (-76F to 500F) SLIDE ON ADVANCED(R) How To Order X PTS XXXX - 636 G Patented Pop-Top(R) Action Travel Footprint Dash # If Applicable* Model Type PTS = Pop-Top(R) w/ Short Slide clamp Number of Positions *See BGA Footprint Booklet or web site A B 1.27mm Pitch Terminal Type 1. "Zero" Insertion to point A Pin 1 indicator always shown in lower left corner on Advanced footprint drawings.* *Refer to BGA Footprints Booklet or AIC Web Site for drawings Solder Ball: Eutectic, 63Sn/37Pb, 183C (361.4F) SLIDE OFF Clearance needed approx. 33% of device package size on one side only G HS Clamp Options HS - Heat Sink (3 Fins Std.) CS - Coin Screw QH - Heat Sink w/ Support Plate QS - Coin Screw w/ Support Plate Contact Plating G - Gold Terminal Plating G - Gold 2. After travel & lock down with screw or heat sink to point B Mechanical specifications for BGA device package required for quoting/ordering. 4 REV. 8/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm). 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com REV. 8/01 Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown: inch/(mm).