www.osram-os.com Produktdatenblatt | Version 1.1 LE B Q7WP LE B Q7WP OSRAM OSTAR (R) Projection Compact Compact light source in SMT technology, glass window on top, RoHS compliant Applications ----Stage Lighting (LED & Laser) ----Projection Home LED & Laser ----Projection Professional LED & Laser Features: ----Package: compact lightsource in SMT technology with glass window on top ----Chip technology: UX:3 ----Typ. Radiation: 120 (Lambertian emitter) ----Color: dom = 459 nm ( blue) ----Corrosion Robustness Class: 3B ----ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) Ordering Information Type LE B Q7WP-5C8C-24 1 Version 1.10 | 2018-10-10 Total radiant flux1) IF=1400mA e 2800 ... 4500 mW Ordering Code Q65111A8287 LE B Q7WP Maximum Ratings Parameter Symbol Operating Temperature Top min. max. -40 C 125 C Storage Temperature Tstg min. max. -40 C 125 C Junction Temperature Tj max. 150 C Forward Current TS=25C; per chip IF min. max. 40 mA 5000 mA Forward Current pulsed D=0.5; f=120Hz; TS=25C; per chip IF pulse ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD Reverse current2) IR 2 Version 1.10 | 2018-10-10 Values 6000 mA 2 kV max. 200 mA LE B Q7WP Characteristics IF=1400mA; TS=25C; per chip Parameter Symbol Peak Wavelength peak typ. 455 nm Dominant Wavelength3) dom min. typ. max. 452 nm 459 nm 465 nm Spectral bandwidth at 50% Irel,max typ. 27 nm Viewing angle at 50 % IV 2 typ. 120 Radiating surface Acolor typ. 1.52 x 2.49 mm Partial Flux acc. CIE 127:20074) E/V 120 = x * E/V 180 E/V, 120 typ. 0.82 Forward Voltage5) IF = 1400 mA; per Chip VF min. typ. max. 2.80 V 2.95 V 3.50 V Reverse voltage (ESD device) VR ESD min. 45 V Reverse voltage2) IR=20mA VR max. 1.2 V Real thermal resistance junction/solderpoint6) RthJS real typ. max. 1.00 K / W 1.30 K / W Electrical thermal resistance junction/solderpoint6) withefficiencye=37% RthJS elec. typ. max. 0.63 K / W 0.82 K / W 3 Version 1.10 | 2018-10-10 Values LE B Q7WP Brightness Groups Group Total radiant flux 1) IF=1400mA min. e Total radiant flux 1) IF=1400mA max. e 5C 2800 mW 3150 mW 6C 3150 mW 3550 mW 7C 3550 mW 4000 mW 8C 4000 mW 4500 mW Wavelength Groups Group Dominant Wavelength 3) min. dom Dominant Wavelength 3) max. dom 2 452 nm 456 nm 3 456 nm 460 nm 4 460 nm 465 nm Group Name on Label Example: 5C-2 Brightness Wavelength 5C 2 4 Version 1.10 | 2018-10-10 LE B Q7WP Relative Spectral Emission 4) Erel = f (); IF = 1400 mA; TJ = 25 C; per Chip E LE B Q7WP 1.0 : V : blue 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 800 / Radiation Characteristics 4) Irel=f(); TJ=25C LE B Q7WP / -40 -50 -20 -10 0 10 20 30 40 50 60 70 80 90 1.0 -30 0.8 0.6 -60 -70 -80 -90 -100 5 Version 1.10 | 2018-10-10 0.4 0.2 0.0 I LE B Q7WP Relative Partial Flux 4) V/E(2)/V/E(180) = f(); TJ=25C E(2) 1.0 E(180) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 10 20 6 Version 1.10 | 2018-10-10 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 2* [] LE B Q7WP Forward current Relative Radiant Power 4), 7) IF = f(VF); TJ = 25 C; per Chip IF / mA E/E(1400 mA) = f(IF); TJ = 25 C; per Chip LE B Q7WP e LE B Q7WP 6000 4), 7) e(1400mA) 3.5 5000 3.0 2.5 4000 2.0 3000 1.5 2000 1.0 0.5 1000 Dominant Wavelength 4) dom = f(IF); TJ = 25 C; per Chip LE B Q7WP dom / nm 6 4 2 0 -2 -4 60 00 50 00 40 00 30 00 20 00 10 00 40 -6 IF / mA 7 Version 1.10 | 2018-10-10 60 00 50 00 3.6 VF / V 40 00 3.4 30 00 3.2 20 00 3.0 10 00 2.8 40 0.0 40 2.5 2.6 IF / mA LE B Q7WP Forward Voltage Relative Radiant Power 4) VF = VF - VF(25 C) = f(Tj); IF = 1400 mA; per Chip LE B Q7WP 0.3 VF / V 4) E/E(25 C) = f(Tj); IF = 1400 mA; per Chip e LE B Q7WP 1.2 e (25C) 0.2 1.0 0.1 0.8 0.0 0.6 -0.1 0.4 -0.2 0.2 -0.3 -40 -20 0 20 40 60 80 100 120 140 Tj / C Dominant Wavelength 4) dom = dom - dom(25 C) = f(Tj); IF = 1400 mA; per Chip dom / nm LE B Q7WP 10 8 6 4 2 0 -2 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 Tj / C 8 Version 1.10 | 2018-10-10 0.0 -40 -20 0 20 40 60 80 100 120 140 Tj / C LE B Q7WP Max. Permissible Forward Current IF=f(T) IF [mA] LE B Q7WP 5500 5000 4500 4000 3500 3000 : Ts 2500 2000 1500 1000 500 0 0 20 40 60 80 100 120 T [C] Permissible Pulse Handling Capability Permissible Pulse Handling Capability IF=f(tp);D:Dutycycle IF=f(tp);D:Dutycycle LE B Q7WP LE B Q7WP TS = 0C ... 100C TS = 125C IF / A IF / A 7 7 6 : D = 1.0 : D = 0.5 : D = 0.2 : D = 0.1 : D = 0.05 : D = 0.02 : D = 0.01 : D = 0.005 6 5 4 5 10-6 : D = 1.0 : D = 0.5 : D = 0.2 : D = 0.1 : D = 0.05 : D = 0.02 : D = 0.01 : D = 0.005 3 10-5 10-4 10-3 0.01 0.1 1 10-6 10 / 9 Version 1.10 | 2018-10-10 10-5 10-4 10-3 0.01 0.1 1 10 / LE B Q7WP Permissible Pulse Handling Capability IF=f(D) f: Frequency TS = 0C ... 100C LE B Q7WP IF [A] : f = 60Hz : f = 240Hz : f = 400Hz : f = 800Hz : f = 1000Hz 6 4 2 0 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle [%] Permissible Pulse Handling Capability IF=f(D) f: Frequency TS = 125C LE B Q7WP IF [A] 6 : f = 60Hz : f = 240Hz : f = 400Hz : f = 800Hz : f = 1000Hz 4 2 0 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle [%] 10 Version 1.10 | 2018-10-10 LE B Q7WP Dimensional Drawing 8) Approximate Weight: 96.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43) ESD advice: The device is protected by ESD device which is connected in parallel to the Chip. 11 Version 1.10 | 2018-10-10 LE B Q7WP Recommended Solder Pad 8) Do not use exposed copper MCPCB technology for automotive applications. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning. 12 Version 1.10 | 2018-10-10 LE B Q7WP Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 C T 250 Tp 245 C 240 C tP 217 C 200 tL 150 tS 100 50 25 C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 C to 150 C tS Time tS TSmin to TSmax Ramp-up rate to peak*) TSmax to TP Liquidus temperature 60 2 3 100 120 2 3 Unit K/s s K/s TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 C Time within 5 C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 C 10 Time 25 C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.10 | 2018-10-10 C 480 s K/s s LE B Q7WP Taping 8) 14 Version 1.10 | 2018-10-10 LE B Q7WP Tape and Reel 9) Reel dimensions [mm] A 180 mm W Nmin 12 + 0.3 / - 0.1 15 Version 1.10 | 2018-10-10 W1 60 W2 max 12.4 + 2 18.4 Pieces per PU 1000 LE B Q7WP Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co C 72 si nd H ou 5 te 48 C su es e H co 24 6 da e y 40 be oc tim C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 16 Version 1.10 | 2018-10-10 LE B Q7WP Transportation Packing and Materials 8) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 195 5 mm 195 5 mm 17 Version 1.10 | 2018-10-10 M Y DE -1 +Q -1 R 18 P OHA02044 Dimensions of transportation box in mm Width RO UP : M RA OS PR O D 5 14 2 110 0 G 4 01 4 C: D/ (9 D) 20 00 (Q )Q TY : O TC P) (6 T LO (1 T) O D PR D EM Y 18 R -1 : Q + P -1 G R O U P: u L lt S iT Y O T6 P 7 L 6 M 14 4 (G ) E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R ditio 0 C R 07 PA 7 na RT l TE C KV XT AR Muster A o M n O d u p cto to rs R 34 ic N O : O S H 12 G BA TC H (1 T) LO T N O :1 (6 P) 23 em 8 2199 2100 5 14 2 110 0 (X ) O M O PT O M 998 NO : CThISTU SE S 21 2100 BA _ < s ur s ). Ho ururs s de Ho co 72 Ho ur te 48 e Ho 24 6 da 40 be tim e e C or th r pr < ll tim ct ). 23 oo r wi nt tim e at l wi fa r Fl oo tim s at at le C at e. ica l Fl th oo r th va ur nt Fl oo s ui be on if: read w ed l 4 5 Fl la m ide ce eq lo g, oc ve l vi is in en de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo ba Le ve tu re m % ba e al e Le r en re e ed re 10 ois stu ur e tim se fo al op se fo > , M oi r se st ur 3 is is ha se M oi st nk be k, oo . 03 rd g M oi in an in Fl RH g, r-p bla DM ba Ca po If bl th % kinr life is (if . ar ST f p. wi 10 ba to et Jel r th va Ye ar ks s m _ < cat m d, C ed 1 Ye ee ur ire Sh te w, te di at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re qu JE 2. bo ity is M or tim e e 16 re C/ : es id 2b r a) St tim mor is IP ed oo r tim e vic b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l e Le Ba te ur e Le ve Le Da oist stur e ur e M oi st ur M oi st M oi H 12 34 . RH 0% /6 C : L e el selab . , H) nk de co (R bla r S S em R ic AM o n O d u p ct to o H rs NO If 23 G E V E ba ity id m hu e e d tiv re ag NO :1 L la re fra ck 30 Nns IVE RS in pa % k of ai IT TO to 90 ea d ntNS < ns UC or TIO te (p d , g itio ND U g coSE an bjec C sin nd O 5 C su es Ais baRE co IC y M oc (G ) M u L lt S iT Y O T6 P 7 L 6 E D Muster Bi Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: Barcode label Height 30 5 mm LE B Q7WP Type Designation System Wavelength (dom typ.) R: 625 nm A: 617 nm T: 528 nm B: 470 nm RTB: BR: CG: LE: Emission Color Color coordinates according CIE 1931/Emission color: UW: ultra white red amber true green blue amber/true green/blue blue/red color on demand green Package Type Q: OSTAR Compact Light emitting diode LE CG Q Lead / Package Properties 7: 2 Chip Version 1 Chip Version 8: Encapsulant Type / Lens Properties W: Window on top Chip Technology: M: low (750m) high (2mm) P: 18 Version 1.10 | 2018-10-10 7 W P LE B Q7WP Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related informations please visit www.osram-os.com/appnotes 19 Version 1.10 | 2018-10-10 LE B Q7WP Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer - or Customer supplied by Buyer- considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 20 Version 1.10 | 2018-10-10 LE B Q7WP Glossary 1) Brightness:Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of 8 % and an expanded uncertainty of 11 % (acc. to GUM with a coverage factor of k=3). 2) Reverse Operation:Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength:The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of 0.5 nm and an expanded uncertainty of 1 nm (acc. to GUM with a coverage factor of k = 3). 4) Typical Values:Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 5) Forward Voltage:The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of 0.05 V and an expanded uncertainty of 0.1 V (acc. to GUM with a coverage factor of k = 3). 6) Thermal Resistance:Rth max is based on statistic values (6). 7) Characteristic curve:In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 8) Tolerance of Measure:Unless otherwise noted in drawing, tolerances are specified with 0.1 and dimensions are specified in mm. 9) Tape and Reel:All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm. 21 Version 1.10 | 2018-10-10 LE B Q7WP Published by OSRAM Opto Semiconductors GmbH Leibnizstrae 4, D-93055 Regensburg www.osram-os.com (c) All Rights Reserved. 22 Version 1.10 | 2018-10-10