SFH4259-Z - OSRAM Opto Semiconductors

SFH 4258

SFH 4259

IR-Lumineszenzdiode (850 nm) mit hoher Ausgangsleistung

High Power Infrared Emitter (850 nm)

Lead (Pb) Free Product - RoHS Compliant

2009-05-14 1

Wesentliche Merkmale

• Infrarot LED mit hoher Ausgangsleistung

• Halbwinkel SFH 4258: ± 15°

• Halbwinkel SFH 4259: ± 25°

• Hohe Bestromung bei hohen Temperaturen

möglich

• Kurze Schaltzeiten

Anwendungen

• Infrarotbeleuchtung für CMOS Kameras

• IR-Datenübertragung

• Sensorik

Sicherheitshinweise

Je nach Betriebsart emittieren diese Bauteile

hochkonzentrierte, nicht sichtbare Infrarot-

Strahlung, die gefährlich für das menschliche

Auge sein kann. Produkte, die diese Bauteile

enthalten, müssen gemäß den Sicherheits-

richtlinien der IEC-Normen 60825-1 und 62471

behandelt werden.

Typ

Type Bestellnummer

Ordering Code Strahlstärkegruppierung1) (IF = 100 mA, tp = 20 ms)

Radiant Intensity Grouping1)

Ie (mW/sr)

SFH 4258 Q65110A2975 ≥ 40 (typ. 90)

SFH 4259 Q65110A2464 ≥ 25 (typ. 55)

1) gemessen bei einem Raumwin ke l Ω = 0.01 sr / measured at a solid angle of Ω = 0.01 sr

Features

• High Power Infrared LED

• Half angle SFH 4258: ± 15°

• Half angle SFH 4259: ± 25°

• High forward current allowed at high

temperature

• Short switching ti mes

Applications

• Infrared Illumination for CMOS cameras

• IR Data Transmission

• Optical sensors

Safety Advices

Depending on the mode of operation, these

devices emit highly concentrated non visible

infrared light which can be hazardous to the

human eye. Products which incorporate these

devices have to follow the safety precautions

given in IEC 60825-1 and IEC 62471.

2009-05-14 2

SFH 4258, SFH 4259

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top , Tstg – 40 … + 100 °C

Sperrspannung

Reverse voltage VR5 V

Vorwärtsgleichstrom

Forward current IF100 mA

Stoßstrom, tp = 100 μs, D = 0

Surge current IFSM 1.5 A

Verlustleistung

Power dissipation Ptot 180 mW

Wärmewiderstand Sperrschicht - Umgebung bei

Montage auf FR4 Platine, Padgröße je 16 mm2

Thermal resistance junction - ambient mounted

on PC-board (FR4), padsize 16 mm2 each

Wärmewiderstand Sperrschicht - Lötstelle bei

Montage auf Metall-Block

Thermal resistance junction - soldering point,

mounted on metal block

RthJA

RthJS

300

140

K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 100 mA

λpeak 860 nm

Centroid-Wellenlänge der Strahlung

Centroid wavelength

IF = 100 mA

λcentroid 850 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 100 mA

Δλ 42 nm

Abstrahlwinkel

Half angle

SFH 4258

SFH 4259

± 15

± 25

Grad

deg.

SFH 4258, SFH 4259

2009-05-14 3

Aktive Chipfläche

Active chip area A0.09 mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip area L × B

L × W0.3 × 0.3 mm²

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, bei IF = 100 mA, RL = 50 Ω

Switching times, Ιe from 10% to 90% and from

90% to 10%, IF = 100 mA, RL = 50 Ω

tr, tf12 ns

Durchlassspannung

Forward voltage

IF = 100 mA, tp = 20 ms

IF = 1 A, tp = 100 µs

1.5 (< 1.8)

2.4 (< 3.0)

Sperrstrom

Reverse current IRnot designed for

reverse

operation

μA

Gesamtstrahlungsfluss

Total radiant flux

IF = 100 mA, tp = 20 ms

Φe typ 50 mW

Temperaturkoeffizient von Ie bzw. Φe,

IF = 100 mA

Temperature coefficient of Ie or Φe, IF = 100 mA

TCI– 0.5 %/K

Temperaturkoeffizient von VF, IF = 100 mA

Temperature coefficient of VF, IF = 100 mA TCV– 0.7 mV/K

Temperaturkoeffizient von λ, IF = 100 mA

Temperature coefficient of λ, IF = 100 mA TCλ+ 0.3 nm/K

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

2009-05-14 4

SFH 4258, SFH 4259

Strahlstärke Ie in Achsrichtung1)

gemessen bei einem Raumwinkel Ω = 0.01 sr

Radiant Intensity Ie in Axial Direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

SFH 4258

-U SFH 4258

-V SFH 4258

-AW

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie min

Ie max

80 63

125 100

200 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 1A, tp = 100 µs

Ie typ. 400 600 800 mW/sr

SFH 4259

-T SFH 4259

-U

Strahlstärke

Radiant intensity

IF = 100 mA, tp = 20 ms

Ie min

Ie max

50 40

80 mW/sr

mW/sr

Strahlstärke

Radiant intensity

IF = 1A, tp = 100 µs

Ie typ. 250 350 mW/sr

1) Nur eine Gruppe in einer Verp ackungseinheit (Streuung kleiner 2:1) /

Only one group in one packing unit (variation lower 2:1)

SFH 4258, SFH 4259

2009-05-14 5

Abstrahlcharakteristik

Radiation Characteristics Irel = f (ϕ)

Abstrahlcharakteristik

Radiation Characteristics Irel = f (ϕ)

0.2

0.4

1.0

0.8

0.6

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚ OHL00021

50˚

60˚

70˚

80˚

90˚

100˚ 0 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

SFH 4258

SFH 4259

OHL00999

0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0

100˚

90˚

80˚

70˚

60˚

50˚

0˚10˚20˚30˚40˚

0.2

0.4

0.6

0.8

1.0

SFH 4258, SFH 4259

2009-05-14 6

Relative Spectral Emission

Irel = f (λ)

Forward Current IF = f (VF)

Single pulse, tp = 20 μs

700

0nm

OHF04135

100

950750 800 850

rel

OHL01713

-4

0.5 1 1.5 2 2.5 V3

-1

-2

-3

Radiant Intensity

Single pulse, tp = 20 μs

Permissible Pulse Handling

Capability IF = f (τ), TA = 25 °,

duty cycle D = parameter

Ie 100 mA = f (IF)

OHL01715

-3

-1

-2

e (100 mA)

1055

0.05

210-1-2-3-4-5

1010 1010 10

10 10s10

0.1

0.005

0.02

0.01

OHF02505

0.2

0.5

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.033

Max. Permissible Forward Current

IF = f (TA), RthJA = 300 K/W

0˚C

OHL01716

100

120

20 40 60 80 120

SFH 4258, SFH 4259

2009-05-14 7

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

Gehäuse / Package Power TOPLED® mit Linse, klarer Verguss / Power TOPLED® with lens, clear

resin

Anschlussbelegung

pin configuration 1 = Kathode / cathode

2/3/4 = Anode / anode

3.8 (0.150) max.

ø2.55 (0.100)

0.13 (0.005)

0.18 (0.007)

0.1 (0.004) typ

1.1 (0.043)

0.5 (0.020)

2.6 (0.102)

3.4 (0.134)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

3.0 (0.118)

3.7 (0.146)

3.3 (0.130)

4˚±1

GPLY6127

0.4 (0.016)

0.6 (0.024)

0.9 (0.035)

0.7 (0.028)

1.7 (0.067)

2.1 (0.083)

0.6 (0.024)

0.8 (0.031)

ø2.60 (0.102)

Package marking

(2.4) (0.095)

SFH 4258

3.5 (0.138) max.

ø2.55 (0.100)

0.13 (0.005)

0.18 (0.007)

0.1 (0.004) typ

1.1 (0.043)

0.5 (0.020)

2.6 (0.102)

3.4 (0.134)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

3.0 (0.118)

3.7 (0.146)

3.3 (0.130)

4˚±1

GPLY6128

0.4 (0.016)

0.6 (0.024)

0.9 (0.035)

0.7 (0.028)

1.7 (0.067)

2.1 (0.083)

ø2.60 (0.102)

Package marking

(2.4) (0.095)

SFH 4259

2009-05-14 8

SFH 4258, SFH 4259

Empfohlenes Lötpaddesign Reflow Löten

Recommended Solder Pad Design Reflow Soldering

Empfohlenes Lötpaddesign Wellenlöten TTW

Recommended Solder Pad Design TTW Soldering

OHFP3021

Padgeometrie für

verbesserte Wärmeableitung

improved heat dissipation

Paddesign for

Lötstoplack

Solder resist

0.8 (0.031)

3.7 (0.146)

1.1 (0.043)

2.3 (0.091)

3.3 (0.130)

1.5 (0.059)

11.1 (0.437)

Cu Fläche / 16 mm per pad

Cu-area

3.3 (0.130)

0.7 (0.028)

OHPY3040

6.1 (0.240)

2.8 (0.110)

2 (0.079)

3 (0.118)

6 (0.236)

2 (0.079)

1 (0.039)

2.8 (0.110) 0.5 (0.020)

Solder resist

Lötstoplack

PCB-direction

Bewegungsrichtung

der Platine

2 (0.079)

Padgeometrie für

improved heat dissipation

verbesserte Wärmeableitung

Paddesign for

Cu Fläche / > 16 mm per pad

Cu-area

SFH 4258, SFH 4259

2009-05-14 9

Lötbedingungen Vorbehandlung nach JEDEC Level 2

Soldering Conditions Preconditioning acc. to JEDEC Level 2

Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)

Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)

Wellenlöten (TTW) (nach CECC 00802)

TTW Soldering (acc. to CECC 00802)

OHLA0687

˚C

120 s max

100

150

200

250

300

Ramp Up

100 s max

50 100 150 200 250 300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C +0 ˚C

-5 ˚C

245 ˚C ±5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

235 ˚C -0 ˚C

+5 ˚C

Minimum Solder Profile

10 s min

OHLY0598

050 100 150 200 250

100

150

200

250

300

235 C

10 s

C... 260

1. Welle

1. wave

2. Welle

2. wave

5 K/s 2 K/s

ca 200 K/s

CC... 130100

2 K/s Zwangskühlung

forced cooling

Normalkurve

standard curve

Grenzkurven

limit curves

2009-05-14 10

SFH 4258, SFH 4259

Published by

OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as as sured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in question please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be use d in life-support devices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain

and sustain human life. If they fail, it is reas onable to assume that the health of the user may be endangered.