LIS2L02AL - STMicroelectronics

May 2006 Rev 2 1/17

LIS2L02AL

MEMS INERTIAL SENSOR:

2-axis - +/-2g ultracompact linear accelerometer

Features

■2.4V to 5.25V single supply operation

■Low power consumption

■±2g full-scale

■0.3mg resolution over 100Hz bandwidth

■Embedded self test

■Output voltage, offset and sensitivity

ratiometric to the supply voltage

■High shock survivability

■ECOPACK® Lead-free compliant

(see Section 6)

Description

The LIS2L02AL is a low-power 2-axis linear

capacitive accelerometer that includes a sensing

element and an IC interface able to take the

information from the sensing element and to

provide an analog signal to the external world.

The sensing element, capable of detecting the

acceleration, is manufactured using a dedicated

process developed by ST to produce inertial

sensors and actuators in silicon.

The IC interface is manufactured using a standard

CMOS process that allows high level of

integration

to design a dedicated circuit which is trimmed to

better match the sensing element characteristics.

The LIS2L02AL has a full scale of ±2g and it is

capable of measuring accelerations over a

bandwidth of 2.0 kHz for all axes. The device

bandwidth may be reduced by using external

capacitances. A self-test capability allows to

check the mechanical and electrical signal path of

the sensor.

The LIS2L02AL is available in plastic SMD

package and it is guaranteed to operate over an

extended temperature range of -40°C to +85°C.

The LIS2L02AL belongs to a family of products

suitable for a variety of applications:

– Mobile terminals

– Gaming and Virtual Reality input devices

– Free-fall detection for data protection

– Antitheft systems and Inertial Navigation

– Appliance and Robotics.

Order codes

LGA-8

Part number Temp range, °CPackage Packing

LIS2L02AL -40°C to +85°C LGA-8 Tray

LIS2L02ALTR -40°C to +85°C LGA-8 Tape & Reel

www.st.com

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Contents LIS2L02AL

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Contents

1 Block diagram & pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 5

2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.4 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.2 IC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.2 Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.1 Mechanical characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

5.2 Mechanical characteristics derived from measurement in the

-40°C to +85°C temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5.3 Electrical characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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LIS2L02AL Block diagram & pins description

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1 Block diagram & pins description

1.1 Block diagram

Figure 1. Block diagram

1.2 Pin description

Figure 2. Pin connection

DEMUX

S/H

CHARGE

AMPLIFIER

S/H

MUX

Y+

Y-

Voutx

Vouty

Routx

Routy

TRIMMING CIRCUIT CLOCK

X+

X-

SELF TEST

REFERENCE

DIRECTION OF THE

DETECTABLE

ACCELERATIONS

LIS2L02AL

GND

Voutx

Vouty

Reserved

Vdd

BOTTOM VIEW

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Block diagram & pins description LIS2L02AL

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Table 1. Pin description

Pin # Pin Name Function

1 ST Self Test (Logic 0: normal mode; Logic 1: Self-test)

2 NC Not connected

3 GND 0V supply

4 Reserved Leave unconnected

5 Reserved Leave unconnected

6 Vouty Output Voltage Y channel

7 Voutx Output Voltage X channel

8 Vdd Power supply

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LIS2L02AL Mechanical and electrical specifications

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2 Mechanical and electrical specifications

2.1 Mechanical characteristics

Table 2. Mechanical characteristics(1)

(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V,

T = 25°C unless otherwise noted

Symbol Parameter Test Condition Min. Typ.(2) Max. Unit

Ar Acceleration Range(3) ±1.8 ±2.0 g

So Sensitivity(4) Full-scale = 2g Vdd/5–10% Vdd/5 Vdd/5+10% V/g

SoDr Sensitivity Change Vs

Temperature Delta from +25°C ±0.01 %/°C

Voff Zero-g Level(4) T = 25°C Vdd/2-6% Vdd/2 Vdd/2+6% V

OffDr Zero-g level Change Vs

Temperature Delta from +25°C ±0.2 mg/°C

NL Non Linearity(5)

Best fit straight line

Full-scale = 2g

X, Y axis

±0.3 ±1.5 %

CrossAx Cross-Axis(6) ±2±4%

An Acceleration Noise

Density

Vdd=3.3V;

Full-scale = 2g 30 µg/

Vt Self test Output Voltage

Change(7),(8)

T = 25°C

Vdd=3.3V

Full-scale = 2g

X axis

-20 -50 -100 mV

T = 25°C

Vdd=3.3V

Full-scale = 2g

Y axis

20 50 100 mV

Fres Sensing Element

Resonance Frequency(9) all axes 2.0 kHz

Top Operating Temperature

Range -40 +85 °C

Wh Product Weight 0.08 gram

1. The product is factory calibrated at 3.3V. The device can be powered from 2.4V to 5.25V. Voff, So and Vt parameters will

vary with supply voltage.

2. Typical specifications are not guaranteed

3. Guaranteed by wafer level test and measurement of initial offset and sensitivity

4. Zero-g level and sensitivity are essentially ratiometric to supply voltage

5. Guaranteed by design

6. Contribution to the measuring output of the inclination/acceleration along any perpendicular axis

7. Self test “output voltage change” is defined as Vout(Vst=Logic1)-Vout(Vst=Logic0)

8. Self test “output voltage change” varies cubically with supply voltage

9. Minimum resonance frequency Fres=2.0KHz. Sensor bandwidth=1/(2*π*110kΩ*Cload) with Cload>1nF.

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Mechanical and electrical specifications LIS2L02AL

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2.2 Electrical characteristics

Table 3. Electrical characteristics(1)

(Temperature range -40°C to +85°C) All the parameters are specified @ Vdd =3.3V, T=25°C

unless otherwise noted

Symbol Parameter Test Condition Min. Typ.(2) Max. Unit

Vdd Supply Voltage 2.4 3.3 5.25 V

Idd Supply Current mean value 0.85 1.5 mA

Vst Self Test Input Logic 0 level 0 0.3*Vdd V

Logic 1 level 0.7*Vdd Vdd V

Rout Output Impedance 80 110 140 kΩ

Cload Capacitive Load Drive(3) 1nF

To p Operating Temperature

Range -40 +85 °C

1. The product is factory calibrated at 3.3V

2. Typical specifications are not guaranteed

3. Minimum resonance frequency Fres=2.0kHz. Sensor bandwidth=1/(2*π*110kΩ*Cload) with Cload>1nF

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LIS2L02AL Mechanical and electrical specifications

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2.3 Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage

to the device. This is a stress rating only and functional operation of the device under these

conditions is not implied. Exposure to maximum rating conditions for extended periods may

affect device reliability.

2.4 Terminology

Sensitivity describes the gain of the sensor and can be determined by applying 1g

acceleration to it. As the sensor can measure DC accelerations this can be done easily by

pointing the axis of interest towards the center of the earth, note the output value, rotate the

sensor by 180 degrees (point to the sky) and note the output value again thus applying ±1g

acceleration to the sensor. Subtracting the larger output value from the smaller one and

dividing the result by 2 will give the actual sensitivity of the sensor. This value changes very

little over temperature (see sensitivity change vs. temperature) and also very little over time.

The Sensitivity Tolerance describes the range of Sensitivities of a large population of

sensors.

Zero-g level describes the actual output signal if there is no acceleration present. A sensor

in a steady state on a horizontal surface will measure 0g in X axis and 0g in Y axis. The

output is ideally for a 3.3V powered sensor Vdd/2 = 1650mV. A deviation from ideal 0-g level

(1650mV in this case) is called Zero-g offset. Offset of precise MEMS sensors is to some

extend a result of stress to the sensor and therefore the offset can slightly change after

mounting the sensor onto a printed circuit board or exposing it to extensive mechanical

stress. Offset changes little over temperature - see “Zero-g level change vs. temperature” -

the Zero-g level of an individual sensor is very stable over lifetime. The Zero-g level

tolerance describes the range of Zero-g levels of a population of sensors.

Table 4. Absolute maximum ratings

Symbol Ratings Maximum Value Unit

Vdd Supply voltage -0.3 to 7 V

Vin Input Voltage on Any Control pin (ST) -0.3 to Vdd +0.3 V

APOW Acceleration (Any axis, Powered, Vdd=3.3V) 3000g for 0.5 ms

10000g for 0.1 ms

AUNP Acceleration (Any axis, Not powered) 3000g for 0.5 ms

10000g for 0.1 ms

TSTG Storage Temperature Range -40 to +125 °C

ESD Electrostatic Discharge Protection

2kV HBM

200V MM

1500V CDM

This is a Mechanical Shock sensitive device, improper handling can cause permanent

damages to the part

This is an ESD sensitive device, improper handling can cause permanent damages to

the part

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Mechanical and electrical specifications LIS2L02AL

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Self Test allows to test the mechanical and electric part of the sensor, allowing the seismic

mass to be moved by means of an electrostatic test-force. The Self Test function is off when

the ST pin is connected to GND. When the ST pin is tied at Vdd an actuation force is applied

to the sensor, simulating a definite input acceleration. In this case the sensor outputs will

exhibit a voltage change in their DC levels which is related to the selected full scale and

depending on the Supply Voltage through the device sensitivity. When ST is activated, the

device output level is given by the algebraic sum of the signals produced by the acceleration

acting on the sensor and by the electrostatic test-force. If the output signals change within

the amplitude specified inside Table 2, than the sensor is working properly and the

parameters of the interface chip are within the defined specification.

Output impedance describes the resistor inside the output stage of each channel. This

resistor is part of a filter consisting of an external capacitor of at least 1nF and the internal

resistor. Due to the high resistor level only small, inexpensive external capacitors are

needed to generate low corner frequencies. When interfacing with an ADC it is important to

use high input impedance input circuitries to avoid measurement errors. Note that the

minimum load capacitance forms a corner frequency beyond the resonance frequency of

the sensor. For a flat frequency response a corner frequency well below the resonance

frequency is recommended. In general the smallest possible bandwidth for an particular

application should be chosen to get the best results.

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LIS2L02AL Functionality

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3 Functionality

The LIS2L02AL is a high performance, low-power, analog output 2-axis linear

accelerometer packaged in a LGA package. The complete device includes a sensing

element and an IC interface able to take the information from the sensing element and to

provide an analog signal to the external world.

3.1 Sensing element

A proprietary process is used to create a surface micro-machined accelerometer. The

technology allows to carry out suspended silicon structures which are attached to the

substrate in a few points called anchors and are free to move in the direction of the sensed

acceleration. To be compatible with the traditional packaging techniques a cap is placed on

top of the sensing element to avoid blocking the moving parts during the moulding phase of

the plastic encapsulation.

When an acceleration is applied to the sensor the proof mass displaces from its nominal

position, causing an imbalance in the capacitive half-bridge. This imbalance is measured

using charge integration in response to a voltage pulse applied to the sense capacitor.

At steady state the nominal value of the capacitors are few pF and when an acceleration is

applied the maximum variation of the capacitive load is up to 100fF.

3.2 IC Interface

In order to increase robustness and immunity against external disturbances the complete

signal processing chain uses a fully differential structure. The final stage converts the

differential signal into a single-ended one to be compatible with the external world.

The signals of the sensing element are multiplexed and fed into a low-noise capacitive

charge amplifier that implements a Correlated Double Sampling system (CDS) at its output

to cancel the offset and the 1/f noise. The output signal is de-multiplexed and transferred to

two different S&Hs, one for each channel and made available to the outside.

The low noise input amplifier operates at 200 kHz while the two S&Hs operate at a sampling

frequency of 66 kHz. This allows a large oversampling ratio, which leads to in-band noise

reduction and to an accurate output waveform.

All the analog parameters (Zero-g level, sensitivity and self-test) are ratiometric to the

supply voltage. Increasing or decreasing the supply voltage, the sensitivity and the offset will

increase or decrease almost linearly. The self test voltage change varies cubically with the

supply voltage.

3.3 Factory calibration

The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Voff).

The trimming values are stored inside the device by a non volatile structure. Any time the

device is turned on, the trimming parameters are downloaded into the registers to be

employed during the normal operation. This allows the user to employ the device without

further calibration.

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Application hints LIS2L02AL

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4 Application hints

Figure 3. LIS2L02AL Electrical connection

Power supply decoupling capacitors (100nF ceramic or polyester + 10µF Aluminum) should

be placed as near as possible to the device (common design practice).

The LIS2L02AL allows to band limit Voutx and Vouty through the use of external capacitors.

The re-commended frequency range spans from DC up to 2.0KHz. In particular, capacitors

must be added at output pins to implement low-pass filtering for antialiasing and noise

reduction. The equation for the cut-off frequency (ft) of the external filters is:

Taking in account that the internal filtering resistor (Rout) has a nominal value equal to

110kΩ, the equation for the external filter cut-off frequency may be simplified as follows:

The tolerance of the internal resistor can vary typically of ±20% within its nominal value of

110kΩ; thus the cut-off frequency will vary accordingly. A minimum capacitance of 1nF for

Cload(x, y) is required in any case.

Table 5. Filter capacitor selection, Cload (x,y)

Cut-off frequency Capacitor value

1 Hz 1500 nF

10 Hz 150 nF

20 Hz 68 nF

50 Hz 30 nF

100 Hz 15 nF

200 Hz 6.8 nF

500 Hz 3 nF

Vout X

100nF

Cload x

LIS2L02AL

10µF

Vdd

Vout Y

GND GND

Cload y

(top view)

Optional

Digital signals

DIRECTION OF THE

DETECTABLE

ACCELERATIONS

GND

2πRout Cload xy,()

⋅⋅

--------------------------------------------------------------=

1.45µF

Cload xy,()

-------------------------------Hz[]=

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LIS2L02AL Application hints

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4.1 Soldering information

The LGA-8 package is compliant with the ECOPACK,RoHs and “Green” standard. It is

qualified for soldering heat resistance according to JEDEC J-STD-020C.

Pin 1 indicator is electrically connected to ST pin. Leave pin 1 indicator unconnected during

soldering.

Land pattern and soldering recommendations are available upon request.

4.2 Output response vs. orientation

Figure 4. Output response vs. orientation

Figure 4 shows LIS2L02AL Output Response vs Orientation at Vdd=3.3V

TOP VIEW

X=1.65V(0g)

Y=0.99V (-1g)

Earth’s Surface

X=1.65V(0g)

Y=2.31V (+1g)

X=2.31V (+1g)

Y=1.65V (0g)

X=0.99V (-1g)

Y=1.65V (0g)

X=1.65V (0g)

Y=1.65V (0g)

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Typical performance characteristics LIS2L02AL

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5 Typical performance characteristics

5.1 Mechanical characteristics at 25°C

Figure 5. x-axis Zero-g level at 3.3V Figure 6. y-axis Zero-g level at 3.3V

Figure 7. x-axis sensitivity at 3.3V Figure 8. y-axis sensitivity at 3.3V

1.55 1.6 1.65 1.7 1.75

Zero−g Level (V)

Percent of parts (%)

1.55 1.6 1.65 1.7 1.75

Zero−g Level (V)

Percent of parts (%)

0.62 0.63 0.64 0.65 0.66 0.67 0.68 0.69 0.7

Sensitivity (V/g)

Percent of parts (%)

0.62 0.63 0.64 0.65 0.66 0.67 0.68 0.69 0.7

Sensitivity (V/g)

Percent of parts (%)

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LIS2L02AL Typical performance characteristics

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5.2 Mechanical characteristics derived from measurement in the

-40°C to +85°C temperature range

Figure 9. x-axis Zero-g level change Vs

temperature

Figure 10. y-axis Zero-g level change Vs

temperature

Figure 11. x-axis sensitivity change Vs

temperature

Figure 12. y-axis sensitivity change Vs

temperature

−0.4 −0.2 0 0.2 0.4 0.6

Zero−g level change (mg/deg. C)

Percent of parts (%)

−0.4 −0.2 0 0.2 0.4 0.6

0−g level change (mg/deg. C)

Percent of parts (%)

−0.05 −0.04 −0.03 −0.02 −0.01 0 0.01 0.02 0.03

Sensitivity Change(%/deg. C)

Percent of parts (%)

−0.05 −0.04 −0.03 −0.02 −0.01 0 0.01 0.02 0.03

Sensitivity Change (%/deg. C)

Percent of parts (%)

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Typical performance characteristics LIS2L02AL

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5.3 Electrical characteristics at 25°C

Figure 13. Noise density at 3.3V (x,y axis) Figure 14. Current consumption at 3.3V

18 20 22 24 26 28 30 32

Noise density (ug/sqrt(Hz))

Percent of parts (%)

0.4 0.6 0.8 1 1.2 1.4

current consumption (mA)

Percent of parts (%)

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LIS2L02AL Package Information

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6 Package Information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 15. LGA-8 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

DIM. mm inch

MIN. TYP. MAX. MIN. TYP. MAX.

A1 1.460 1.520 1.600 0.0574 0.0598 0.0629

A2 1.330 0.0523

A3 0.180 0.220 0.260 0.007 0.0086 0.0102

D1 4.850 5.000 5.150 0.190 0.1968 0.2027

E1 4.850 5.000 5.150 0.190 0.1968 0.2027

L 1.270 0.05

L1 2.540 0.1

M 1.225 0.0482

M1 0.875 0.900 0.925 0.0344 0.0354 0.0364

N 2.000 0.0787

N1 1.225 0.0482

N2 1.170 0.046

P1 1.300 1.350 1.400 0.0511 0.0531 0.0551

P2 0.740 0.790 0.840 0.0291 0.0311 0.033

T1 1.170 0.046

T2 0.615 0.640 0.665 0.0242 0.0251 0.0261

R 1.200 1.600 0.0472 0.0629

h 0.150 0.0059

k 0.050 0.0019

j 0.100 0.0039

LGA8 (5x5x1.6mm)

Land Grid Array Package

7669231 C

K D

DETAIL A

(4x)

Detail A

seating plane

= =

N1N2 N

hAC B

jAC B

SOLDER MASK

OPENING

METAL PAD

K C

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Revision history LIS2L02AL

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7 Revision history

Table 6. Document revision history

Date Revision Changes

26-Sep-2005 1Initial release.

03-May-2006 2 Corrected typo errors. Applied new corporate template layout.

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LIS2L02AL

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