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1. Product profile
1.1 General description
NPN Resistor-Equipped Transistor (RET) family in Surface-Mounted Device (SMD)
plastic packages.
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
PDTC143X series
NPN resistor-equipped transistors;
R1 = 4.7 k, R2 = 10 k
Rev. 11 — 9 December 2011 Product data sheet
Table 1. Product overview
Type number Package PNP
complement Package
configuration
NXP JEITA JEDEC
PDTC143XE SOT416 SC-75 - PDTA143XE ultra small
PDTC143XM SOT883 SC-101 - PDTA143XM leadless ultra small
PDTC143XT SOT23 - TO-236AB PDTA143XT small
PDTC143XU SOT323 SC-70 - PDTA14 3XU very small
100 mA output current capability Reduces component count
Built-in bias resistors Reduces pick and place costs
Simplifies circuit design AEC-Q101 qualified
Digital applications in automotive and
industrial segments
Cost-saving alternative for BC847/857
series in digital applications
Control of IC inputs Switching loads
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 50 V
IOoutput current - - 100 mA
R1 bias resistor 1 (input) 3.3 4.7 6.1 k
R2/R1 bias resistor ratio 1.7 2.1 2.6
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 2 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
2. Pinning information
3. Ordering information
4. Marking
[1] * = placeholder for manufacturing site code
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
SOT23; SOT323; SOT416
1 input (base)
2 GND (emitter)
3 output (collector)
SOT883
1 input (base)
2 GND (emitter)
3 output (collector)
006aaa144
12
3
sym007
3
2
1R1
R2
3
1
2
Transparent
top view
sym007
3
2
1R1
R2
Table 4. Ordering information
Type number Package
Name Description Version
PDTC143XE SC-75 plastic surface-mounted package; 3 leads SOT416
PDTC143XM SC-101 leadless ultra small plastic package; 3 solder lands;
body 1.0 0.6 0.5 mm SOT883
PDTC143XT - plastic surface-mounted package; 3 leads SOT23
PDTC143XU SC-70 plastic surface-mounted package; 3 leads SOT323
Table 5. Marking codes
Type number Marking code[1]
PDTC143XE 34
PDTC143XM E2
PDTC143XT *32
PDTC143XU *53
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 3 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 7 V
VIinput voltage
positive - +20 V
negative - 7V
IOoutput current - 100 mA
ICM peak collector current single pulse;
tp1ms -100mA
Ptot total power dissipation Tamb 25 C
PDTC143XE (SOT416) [1][2] -150mW
PDTC143XM (SOT883) [2][3] -250mW
PDTC143XT (SOT23) [1] -250mW
PDTC143XU (SOT323) [1] -200mW
Tjjunction temperature - 150 C
Tamb ambient temperature 65 +150 C
Tstg storage temperature 65 +150 C
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 4 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 70 m copper strip line, standard footprint.
(1) SOT23; FR4 PCB, standard footprint
SOT883; FR4 PCB with 70 m copper strip line, standard footprint
(2) SOT323; FR4 PCB, standard footprint
(3) SOT416; FR4 PCB, standard footprint
Fig 1. Power derating curves
Tamb (°C)
-75 17512525 75-25
006aac778
100
200
300
Ptot
(mW)
0
(1)
(2)
(3)
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from junction
to ambient in free air
PDTC143XE (SOT416) [1][2] --830K/W
PDTC143XM (SOT883) [2][3] --500K/W
PDTC143XT (SOT23) [1] --500K/W
PDTC143XU (SOT323) [1] --625K/W
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 5 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTC143XE (SOT416); typical values
FR4 PCB, 70 m copper strip line
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTC143XM (SOT883); typical values
006aac781
10-5 1010-2
10-4 102
10-1 tp (s)
10-3 103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle = 1
0.75 0.5
0.33 0.2
0.1
0.05
0.02 0.01
0
006aac782
10-5 1010-2
10-4 102
10-1 tp (s)
10-3 103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle = 1
0.75 0.5
0.33 0.2
0.1 0.05
0.02
0.01
0
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 6 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTC143XT (SOT23); typical values
FR4 PCB, standard footprint
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration for
PDTC143XU (SOT323); typical values
006aac779
10-5 1010-2
10-4 102
10-1 tp (s)
10-3 103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle = 1
0.75 0.5
0.33 0.2
0.1
0.05
0.02 0.01
0
006aac780
10-5 1010-2
10-4 102
10-1 tp (s)
10-3 103
1
102
10
103
Zth(j-a)
(K/W)
1
duty cycle = 1
0.75 0.5
0.33 0.2
0.1
0.05
0.02 0.01
0
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 7 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
7. Characteristics
[1] Characteristics of built-in transistor
Table 8. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off
current VCB =50V; I
E= 0 A - - 100 nA
ICEO collector-emitter
cut-off current VCE =30V; I
B=0A - - 1 A
VCE =30V; I
B=0A;
Tj= 150 C--5A
IEBO emitter-base cut-off
current VEB =5V; I
C=0A - - 600 A
hFE DC current gain VCE =5V; I
C=10mA 50 - -
VCEsat collector-emitter
saturation voltage IC=10mA; I
B=0.5mA - - 100 mV
VI(off) off-state input voltage VCE =5V; I
C=100A-0.90.3V
VI(on) on-state input voltage V CE = 0.3 V; IC=20mA 2.5 1.5 - V
R1 bias resistor 1 (input) 3.3 4.7 6.1 k
R2/R1 bias resistor ratio 1.7 2.1 2.6
Cccollector capacitance VCB =10V; I
E=i
e=0A;
f=1MHz --2.5pF
fTtransition frequency VCE =5V; I
C=10mA;
f = 100 MHz [1] -230-MHz
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 8 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
VCE =5V
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =40 C
IC/IB=20
(1) Tamb = 100 C
(2) Tamb =25C
(3) Tamb =40 C
Fig 6. DC current gain as a function of collector
current; typical values Fig 7. Collec tor-emitter saturation voltage as a
function of collector current; typical values
VCE =0.3V
(1) Tamb =40 C
(2) Tamb =25C
(3) Tamb = 100 C
VCE =5V
(1) Tamb =40 C
(2) Tamb =25C
(3) Tamb = 100 C
Fig 8. On-state input voltag e as a function of
collector current; typical valu es Fig 9. Off-state input voltage as a function of
collector current; typical values
IC (mA)
10-1 102
101
006aac841
102
10
103
hFE
1
(1)
(2) (3)
IC (mA)
110
2
10
006aac842
10-1
1
VCEsat
(V)
10-2
(1) (2) (3)
006aac843
IC (mA)
10-1 102
101
1
10
VI(on)
(V)
10-1
(1)
(2)
(3)
IC (mA)
10-1 101
006aac844
1
10
VI(off)
(V)
10-1
(1)
(2)
(3)
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 9 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
f=1MHz; T
amb =25CV
CE =5V; T
amb =25C
Fig 10. Collector capacitance as a fun ction of
collector-base voltage; typical values Fig 11. Transition frequen cy a s a fu nc tio n o f c oll e cto r
current; typical values of built-in transistor
VCB (V)
0504020 3010
006aac845
1
2
3
Cc
(pF)
0
006aac757
IC (mA)
10-1 102
101
102
103
fT
(MHz)
10
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 10 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
Fig 12. Package outline PDTC143XE (SOT416/SC-75) Fig 13. Package outline PDTC143XM (SOT883/SC-101)
Fig 14. Package outline PDTC143XT (SOT23) F ig 15. Package outline PDTC1 43XU (SOT323/SC-70)
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 5000 10000
PDTC143XE SOT416 4 mm pitch, 8 mm tape and reel -115 - -135
PDTC143XM SOT883 2 mm pitch, 8 mm tape and reel - - -315
PDTC143XT SOT23 4 mm pitch, 8 mm tape and reel -215 - -235
PDTC143XU SOT323 4 mm pitch, 8 mm tape and reel -115 - -135
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 11 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
11. Soldering
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering footprint PDTC143XE (SOT416/SC-75)
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering footprint PDTC143XM (SOT883/SC-101)
solder lands
solder resist
occupied area
solder paste
sot416_fr
0.85
1.7
2.2
2
0.5
(3×)
0.6
(3×)
1
1.3
Dimensions in mm
solder lands
solder resist
occupied area
solder paste
sot883_fr
1.3
0.3
0.6 0.7
0.4
0.9
0.3
(2×)
0.4
(2×)
0.25
(2×)
R0.05 (12×)
0.7
Dimensions in mm
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 12 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
Fig 18. Reflow soldering footprint PDTC143XT (SOT23)
Fig 19. Wave soldering footprint PDTC143XT (SOT23)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 13 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
Fig 20. Reflow soldering footprint PDTC143XU (SOT323/SC-70)
Fig 21. Wave soldering footprint PDTC143XU (SOT323/SC-70)
solder lands
solder resist
occupied area
solder paste
sot323_fr
2.65
2.35 0.6
(3×)
0.5
(3×)
0.55
(3×)
1.325
1.85
1.3
3
2
1
Dimensions in mm
sot323_fw
3.65 2.1
1.425
(3×)
4.6
09
(2×)
2.575
1.8
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 14 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PDTC143X_SER v.11 20111209 Product data sheet - PDTC143X_SERIES v.10
Modifications: •Type numbers PDTC143XEF, PDTC143XK and PDTC143XS removed.
•Section 1 “Product profile”: updated
•Section 2 “Pinning informa tion”: updated
•Section 4 “Marking”: updated
•Figure 1 to 5, 10 and 11: added
•Section 6 “Thermal characteristics”: updated
•Figure 6 to 9: updated
•Table 8 “Characteristics”: VI(on) and VI(off) updated, ICEO up dated, fT added
•Section 8 “Test in f ormation”: added
•Section 11 “Soldering”: added
•Section 13 “Legal information”: updated
PDTC143X_SERIES v.10 200 91116 Product data sheet - PDTC143X_SERIES v.9
PDTC143X_SERIES v.9 20050726 Product data sheet - PDTC143X_SERIES v.8
PDTC143X_SERIES v.8 20040806 Product specification - PDTC143X_SERIES v.7
PDTC143X_SERIES v.7 20040323 Product specification - PDTC143X_SERIES v.6
PDTC143X_SERIES v.6 20040112 Product specification - PDTC143X_SERIES v.5
PDTC143X_SERIES v.5 20031112 Product specification - PDTC143X_SERIES v.4
PDTC143X_SERIES v.4 20030910 Product specification - PDTC143X_SERIES v.3
PDTC143X_SERIES v.3 20030410 Product specification - -
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 15 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agr eed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect , incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
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Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
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Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors pro duct can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applic ations that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with t heir
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessa ry
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
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agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyri ghts, patents or
other industrial or intellectual property right s.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
PDTC143X_SER All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 11 — 9 December 2011 16 of 17
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PDTC143X series
NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 December 2011
Documen t identifier: PDTC143X_SER
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Packing information . . . . . . . . . . . . . . . . . . . . 10
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
14 Contact information. . . . . . . . . . . . . . . . . . . . . 16
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17