DATA SH EET
Product specification
Supersedes data of 2001 Nov 02 2001 Nov 27
DISCRETE SEMICONDUCTORS
BGD702
750 MHz, 18.5 dB gain
power doubler amplifier
dbook, halfpage
M3D252
2001 Nov 27 2
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
FEATURES
Excellent linearity
Extremely low nois e
Silicon nitride passivation
Rugged construction
Gold metallization ensures excellent reliability.
APPLICATIONS
CATV systems operating in the 40 to 750 MHz
frequency ra nge.
DESCRIPTION
Hybrid amplifie r module in a SOT115J pa ckage ope rating
at a supply voltage of 24 V (DC).
PINNING - SOT115J
PIN DESCRIPTION
1 input
2, 3 common
5+V
B
7, 8 common
9 output
Fig.1 Simplified outline.
handbook, halfpage
789
2351
Side view
MSA319
QUICK REFERENCE DATA
LIMITING VALUES
In accordance with the Absolute Maximum Ra ting System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Gppower gain f = 50 MHz 18 19 dB
f=750MHz 18.5 dB
Itot total current consumption (DC) VB=24V 435 mA
SYMBOL PARAMETER MIN. MAX. UNIT
ViRF input voltage 65 dBmV
Tstg storage temperature 40 +100 C
Tmb operating mounting base temperature 20 +100 C
2001 Nov 27 3
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
CHARACTERISTICS
Table 1 Bandwidth 40 to 750 MHz; VB=24V; T
mb =35C; ZS=Z
L=75
Notes
1. fp= 55.25 MHz; Vp= 44 dBmV;
fq=691.25MHz; V
q=44dBmV;
measured at fp+f
q= 746.5 MHz.
2. Measured according to DIN45004B:
fp=740.25MHz; V
p=V
o;
fq=747.25MHz; V
q=V
o6dB;
fr= 749.25 MHz; Vr=V
o6dB;
measured at fp+f
qfr= 738.25 MHz.
3. The modules normally op erate at VB= 24 V, but are able to withstand supply transients up to VB=30V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Gppower gain f = 50 MHz 18 18.5 19 dB
f = 750 MHz 18.5 19.7 dB
SL slope cable equivalent f = 40 to 750 MHz 0.2 1.3 2 dB
FL flatness of frequency response f = 40 to 750 MHz 0.2 0.5 dB
s11 input return losses f = 40 to 80 MHz 20 27 dB
f = 80 to 160 MHz 19 30 dB
f=160to320MHz 18 29 dB
f=320to640MHz 17 22 dB
f=640to750MHz 16 21 dB
s22 output return losses f = 40 to 80 MHz 20 23 dB
f = 80 to 160 MHz 19 24 dB
f=160to320MHz 18 23 dB
f=320to640MHz 17 21 dB
f=640to750MHz 16 21 dB
s21 phase response f = 50 MHz 45 +45 deg
CTB composite triple beat 110 channels flat; Vo=44dBmV;
measured at 745.25 MHz
59 58 dB
Xmod cross modulation 110 channels flat; Vo=44dBmV;
measured at 55.25 MHz
64 62 dB
CSO composite second order distortion 110 channels flat; Vo=44dBmV;
measured at 746.5 MHz
63 58 dB
d2second order dist ortion note 1 78 68 dB
Vooutput volt a ge dim =60 dB; note 2 61 64 dBmV
NF noise figure f = 50 MHz 4.5 5.5 dB
f=450MHz 6.5 dB
f=550MHz 6.5 dB
f=600MHz 7dB
f=750MHz 6.5 8.5 dB
Itot total current consumption (DC) note 3 425 435 mA
2001 Nov 27 4
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
Table 2 Bandwidth 40 to 6 00 M Hz ; V B=24V; T
mb =35C; ZS=Z
L=75
Notes
1. fp= 55.25 MHz; Vp= 44 dBmV;
fq=541.25MHz; V
q=44dBmV;
measured at fp+f
q= 596.5 MHz.
2. Measured according to DIN45004B:
fp=590.25MHz; V
p=V
o;
fq= 597.25 MHz; Vq=V
o6dB;
fr= 599.25 MHz; Vr=V
o6dB;
measured at fp+f
qfr= 588.25 MHz.
3. The modules normally op erate at VB= 24 V, but are able to withstand supply transients up to VB=30V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Gppower gain f = 50 MHz 18 18.5 19 dB
f = 600 MHz 18.5 19.4 dB
SL slope cable equivalent f = 40 to 600 MHz 0.2 2dB
FL flatness of frequency response f = 40 to 600 MHz 0.3 dB
s11 input return losses f = 40 to 80 MHz 20 27 dB
f = 80 to 160 MHz 19 30 dB
f=160to320MHz 18 29 dB
f=320to600MHz 17 22 dB
s22 output return losses f = 40 to 80 MHz 20 23 dB
f = 80 to 160 MHz 19 24 dB
f=160to320MHz 18 23 dB
f=320to600MHz 17 21 dB
s21 phase resp onse f = 50 MHz 45 +45 deg
CTB composite triple beat 85 channels flat; Vo=44dBmV;
measured at 595.25 MHz
66 65 dB
Xmod cross modulation 85 channels flat; Vo=44dBmV;
measured at 55.25 MHz
66 65 dB
CSO composite second order distortion 85 channels flat; Vo=44dBmV;
measured at 596.5 MHz
68 60 dB
d2second order distortion note 1 80 70 dB
Vooutput voltage dim =60 dB; note 2 64 67 dBmV
NF noise figure see Table 1 dB
Itot total current consumption (DC) note 3 425 435 mA
2001 Nov 27 5
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
Table 3 Bandwidth 40 to 5 50 M Hz ; V B=24V; T
mb =35C; ZS=Z
L=75
Notes
1. fp= 55.25 MHz; Vp= 44 dBmV;
fq=493.25MHz; V
q=44dBmV;
measured at fp+f
q= 548.5 MHz.
2. Measured according to DIN45004B:
fp=540.25MHz; V
p=V
o;
fq=547.25MHz; V
q=V
o6dB;
fr= 549.25 MHz; Vr=V
o6dB;
measured at fp+f
qfr= 538.25 MHz.
3. The modules normally op erate at VB= 24 V, but are able to withstand supply transients up to VB=30V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Gppower gain f = 50 MHz 18 18.5 19 dB
f = 550 MHz 18.5 19.3 dB
SL slope cable equivalent f = 40 to 550 MHz 0.2 2dB
FL flatness of frequency response f = 40 to 550 MHz 0.3 dB
s11 input return losses f = 40 to 80 MHz 20 27 dB
f = 80 to 160 MHz 19 30 dB
f=160to320MHz 18 29 dB
f=320to550MHz 17 22 dB
s22 output return losses f = 40 to 80 MHz 20 23 dB
f = 80 to 160 MHz 19 24 dB
f=160to320MHz 18 23 dB
f=320to550MHz 17 21 dB
s21 phase response f = 5 0 MHz 45 +45 deg
CTB composite triple beat 77 channels flat; Vo=44dBmV;
measured at 547.25 MHz
68 67 dB
Xmod cross modulation 77 chan nels flat; Vo=44dBmV;
measured at 55.25 MHz
68 67 dB
CSO composite second order distortion 77 channels flat ; Vo=44dBmV;
measured at 548.5 MHz
68 62 dB
d2second order distortion note 1 81 72 dB
Vooutput voltage dim =60 dB; note 2 64.5 68 dBmV
NF noise figure see Table 1 dB
Itot total current consumption (DC) note 3 425 435 mA
2001 Nov 27 6
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
Table 4 Bandwidth 40 to 4 50 M Hz ; V B=24V; T
mb =35C; ZS=Z
L=75
Notes
1. fp= 55.25 MHz; Vp= 46 dBmV;
fq=391.25MHz; V
q=46dBmV;
measured at fp+f
q= 446.5 MHz.
2. Measured according to DIN45004B:
fp=440.25MHz; V
p=V
o;
fq=447.25MHz; V
q=V
o6dB;
fr= 449.25 MHz; Vr=V
o6dB;
measured at fp+f
qfr= 438.25 MHz.
3. The modules normally op erate at VB= 24 V, but are able to withstand supply transients up to VB=30V.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Gppower gain f = 50 MHz 18 18.5 19 dB
f = 450 MHz 18.5 19.2 dB
SL slope cable equivalent f = 40 to 450 MHz 0.2 2dB
FL flatness of frequency response f = 40 to 450 MHz 0.3 dB
s11 input return losses f = 40 to 80 MHz 20 27 dB
f = 80 to 160 MHz 19 30 dB
f=160to320MHz 18 29 dB
f=320to450MHz 17 22 dB
s22 output return losses f = 40 to 80 MHz 20 23 dB
f = 80 to 160 MHz 19 24 dB
f=160to320MHz 18 23 dB
f=320to450MHz 17 21 dB
s21 phase response f = 5 0 MHz 45 +45 deg
CTB composite triple beat 60 channels flat; Vo=46dBmV;
measured at 445.25 MHz
68 dB
Xmod cross modulation 60 chan nels flat; Vo=46dBmV;
measured at 55.25 MHz
65 dB
CSO composite second order distortion 60 channels flat ; Vo=46dBmV
measured at 446.5 MHz
65 dB
d2second order distortion note 1 75 dB
Vooutput voltage dim =60 dB; note 2 67 dBmV
NF noise figure see Table 1 dB
Itot total current consumption (DC) note 3 425 435 mA
2001 Nov 27 7
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
PACKAGE OUTLINE
UNIT A2
max. cee
1q
Q
max. q1q2U2
U1W
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 20.8 9.5 0.51
0.38 0.25 27.2 2.04
2.54 13.75 2.54 5.08 12.7 8.8 4.15
3.85 2.4 38.1 25.4 10.2 4.2 44.75
44.25 8.2
7.8 0.25 0.1 3.8
bF
p
6-32
UNC
yw
0.7
x
S
DIMENSIONS (mm are the original dimensions)
SOT115J
0 5 10 mm
scale
A
max. D
max. L
min.
E
max. Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads SOT115J
D
U1q
q2
q1
b
F
S
A
Z p
E
A2
L
c
d
Q
U2
M
w
78923
Wee1
5
p
1
d
xMB
yMB
B
04-02-04
10-06-18
yMB
2001 Nov 27 8
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
DATA SHEET STATUS
Notes
1. Please consult the most rec ently issued document befor e initiating or completing a design.
2. The product s tatus of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This doc ume nt contains data from the objective specification for pro duc t
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the pr oduct specification.
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2001 Nov 27 9
NXP Semiconductors Product specification
750 MHz, 18.5 dB gain power doubler
amplifier BGD702
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operat ion of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
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reliability of the device.
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Printed in The Netherlands 613518/07/pp10 Date of release: 2001 Nov 27 Document order number: 9397 750 09068